February 15, 2024

Essential Tips for Utilizing SMD in PCB Manufacturing

Jharwin Barrozo

Electronics Engineer at Flux

Detailed view of a circuit board utilizing surface mount technology, with a soldering iron applying a component. Various SMT components like capacitors, resistors, and integrated circuits are visible, showcasing their compact size and dense configuration.

Illustration of a resistor with its color bands

A schematic diagram of parallel resistors and showing the equation how to calculate the total resistance for multiple parallel resistors

A schematic diagram of series resistors and showing the equation how to calculate the total resistance for multiple series resistors

Surface Mount Devices (SMDs) are electronic components mounted directly onto the surface of a printed circuit board (PCB). Their small size has become integral to the efficiency of electronic devices.

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Let’s start by exploring the benefits of SMDs, as opposed to traditional through-holes:

| Benefit | Description | | :=== | :=== | | Miniaturization | SMDs enable electronic miniaturization, crucial for space-constrained applications. | | High-Density Assembly | SMDs allow for high-density PCB assembly, optimizing component placement for increased overall density. | | Improved Electrical Performance | Shorter lead lengths in SMDs reduce parasitic elements, enhancing high-frequency performance and signal integrity. | | Reduced Signal Interference | Compact size and direct PCB placement minimize loop areas, reducing electromagnetic interference EMI. | | Automated Manufacturing | SMDs are compatible with automated pick-and-place, ensuring efficient and precise mass production with cost savings. | | Lower Weight and Cost | SMDs contribute to lighter devices, and automated assembly reduces manufacturing costs.| | Enhanced Thermal Performance | SMDs with exposed metal pads improve thermal dissipation, enhancing overall thermal performance. | | Better Mechanical Stability | SMDs, soldered directly to PCBs, provide superior mechanical stability, making them more resistant to shocks, vibrations, and mechanical stresses. |

SMD Packaging for Passive Components

Surface Mount Device (SMD) packaging for passive components, such as resistors, capacitors, and inductors, involves a variety of package types:

Chip Resistors and Capacitors (Standard Ceramic Packages)

Packages: The most common SMD package for chip resistors and capacitors is the ceramic chip package. It comes in various standardized sizes, such as 0402, 0603, 0805, and 1206.
Materials: Typically made of ceramic materials with conductive layers for electrodes and dielectric layers for capacitors.
Advantages: Compact size, suitable for high-density applications.

Tantalum Capacitors

Packages: Tantalum capacitors come in SMD packages like the molded tantalum chip (MTC) and molded tantalum leadframe (MTL) packages.
Materials: Tantalum-based dielectric material with a metal case for encapsulation.
Advantages: Higher capacitance values in a compact size, suitable for applications requiring stable capacitance over a wide temperature range.

Aluminum Electrolytic Capacitors

Packages: SMD aluminum electrolytic capacitors are available in various configurations, including cylindrical and chip-type packages.
Materials: Aluminum-based electrolyte with a metallic case.
Advantages: Larger capacitance values compared to ceramic capacitors, suitable for applications requiring higher energy storage.

Multilayer Ceramic Capacitors (MLCC)

Packages: MLCCs are available in various standard sizes, including 0402, 0603, 0805, 1206, and larger.
Materials: Multilayered ceramic structure with alternating layers of ceramic and conductive material.
Advantages: High capacitance density, suitable for high-frequency applications and decoupling.

SMD Packaging for Active Components

Close-up of an electronic motherboard with various components such as capacitors, diodes, and chips, including a central processing unit under a copper heat sink. — Motherboard utilizing surface mount technology

Challenges with Surface Mount Devices

SMDs come with their own set of challenges during assembly and use:

Tombstoning: Tombstoning occurs when one end of a passive SMD component is vertically displaced during reflow soldering, resembling a tombstone. This anomaly may arise from uneven heating profiles, inadequacies in solder paste deposition, or irregularities in component placement precision.

Solder Bridging: Solder bridging involves unintended connections between adjacent pads, leading to short circuits. Root causes include excessive solder paste application, suboptimal stencil design, or inadequate implementation of solder mask features.

Skew and Misalignment: Skew and misalignment issues materialize when SMD components deviate from precise placement on PCB pads during the pick-and-place process. These discrepancies can result in compromised solder joints and consequential performance degradation.

Insufficient Solder Joints: Incomplete or inadequate solder joints may occur due to factors such as insufficient solder paste deposition, suboptimal reflow soldering conditions, or inaccuracies in component placement. These deficient joints can yield intermittent electrical connections or outright failures.

Jharwin Barrozo

Jharwin is an electronics engineer mainly focused on satellites. He built his own ground station using Flux to monitor RF activities on the International Space Station. Find him on Flux @jharwinbarrozo

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