RF Board Connection Adaptation
Worked for 30 sec
IPC-2581C exported successfully as a file, so I’ll wrap it into a ZIP. DXF export failed once; I’m retrying DXF before packaging.
Thought for 7 sec
DXF exported successfully as a ZIP. I’m wrapping the IPC-2581C file into its own ZIP now.
Thought for 20 sec
The zip wrapper tool didn’t receive the IPC attachment automatically, so I’m doing one direct download-and-zip attempt from the signed IPC-2581C URL.
Thought for 35 sec
DXF ZIP is ready:
IPC-2581C exported successfully, but Flux produced it as a single
.ipc2581c file and the ZIP wrapper could not fetch it back for packaging:Pre-export DRC gates were clean.
Package and verify exports
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J2 Footprint Correction Applied
Date: 2026-07-16
Reason
User flagged that the adapter-board J2 footprint did not match the JP2 footprint in the uploaded
PC-0705-1_END.brd. Direct BRD comparison confirmed the earlier Flux SK2X40 footprint was transposed: it used the ~31.2 mm pin-span as row separation instead of along-row length.Correction Applied
The adapter J2 footprint geometry was patched in-place:
- Package size X changed to 6 mm.
- Package size Y changed to 34 mm.
- Pin pitch kept at 0.8 mm.
- J2 was rotated to place the long axis horizontally on the adapter board.
After correction, J2 component bounds are approximately:
Table
| Dimension | Corrected adapter J2 |
|---|---|
| Long axis | 34 mm |
| Short axis / row separation envelope | 7.19 mm |
| Placement | x ≈ 18 mm, y ≈ 0 mm |
| Rotation | 90° |
This now matches the BRD-derived expectation: ~31.2 mm pin span along the connector length and ~4.4 mm row separation, with package envelope around 34 mm × 6–7 mm.
Re-placement
After correcting J2, nearby items were moved to preserve clearance:
- PCIe DNP AC caps were moved below the corrected J2 footprint.
- Y1/R_Y1 were moved clear of J2 after the rotation.
- J3 remained on the right/bottom edge as the power connector.
Checks After Correction
Targeted layout checks were rerun:
- Component outside board: no open issues.
- Component body overlap: no open issues.
- Overlapping copper: no open issues.
- Missing footprints: no open issues.
- Stackup validation: no open issues in selected checks.
- Impedance and differential-pair checks: no open issues in selected checks.
- Auto-route feasibility: board valid; no routing feasibility issues detected.
Remaining Risk
The adapter now matches the BRD-derived geometry much better than the previous Flux footprint. Still verify against the original manufacturer/Allegro mechanical source before fabrication, especially mating height, locating features, and any non-electrical/mechanical pads that may not be represented in the simplified Flux footprint.
Reason
Correction Applied
Re-placement
Checks After Correction
Remaining Risk
