Four-layer ESP32-S3 and 315 MHz CC1101 LiPo wireless node with remote USB, OLED, and controls.

Seeed Studio XIAO ESP32S3 leverages 240MHz Xtensa 32-bit LX7 dual-core processor, supporting both WiFi and BLE 5.0 wireless connectivities, a 2.4GHz Rod antenna, allows for deep sleep mode with power consumption as low as 14μA while supporting lithium battery charging management. Ideal for the Internet of Things, Smart Homes, Wireless wearable devices, Robotics, etc. #SeeedStudio #xiao

Seeed Studio XIAO ESP32S3 leverages dual-core ESP32S3 chip, supporting both Wi-Fi and BLE wireless connectivities, which allows battery charge. It integrates built-in camera sensor, digital microphone. It offers 8MB PSRAM, 8MB FLASH, and external SD card slot. All of these make it suitable for embedded ML, like intelligent voice and vision AI. #SeeedStudio #xiao

Seeed Studio XIAO ESP32S3 Plus, powered by ESP32-S3's 240MHz Xtensa 32-bit LX7 dual-core processor, brings more SMD pins to the tiny versatile XIAO ESP32S3. While maintaining all the powerful features including WiFi and BLE 5.0 wireless connectivities, 2.4GHz Rod antenna, and ultra-low power consumption of 14μA in deep sleep mode with lithium battery charging management, the Plus variant features redesigned castellations and pad layout on the back, offering 9 additional GPIOs specifically for advanced Bluetooth projects requiring expanded I/Os via SMD board-to-board soldering. It's ideal for advanced IoT projects, Smart Homes, and professional wireless devices requiring extra I/O connectivity.

2.4 GHz Wi-Fi® + Bluetooth® 5 SoC – High-performance dual-core Xtensa® LX7 wireless System-on-Chip (SoC) for IoT devices, smart home products, industrial automation, AIoT, wearable electronics, HMI systems, and embedded wireless applications. Operates at up to 240 MHz with 512 KB on-chip SRAM and supports external SPI Flash and PSRAM. Integrates Wi-Fi 802.11 b/g/n (2.4 GHz) and Bluetooth® 5 (LE) with Long Range and 2 Mbps PHY, delivering up to +21 dBm transmit power and 150 Mbps maximum Wi-Fi data rate. Features native USB 2.0 OTG, AI vector instructions for machine learning acceleration, 30 GPIOs, SPI, I²C, I²S, UART, RMT, LCD/Camera interface, TWAI® (CAN-compatible), PWM, ADC, capacitive touch sensing, AES-128/256, SHA, RSA, ECC, HMAC, Flash encryption, Secure Boot, and a True Random Number Generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +105°C temperature range, and is housed in a 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3 #WirelessSoC #WiFi #Bluetooth5 #DualCore #XtensaLX7 #USBOTG #AIoT #IoT #SecureBoot #FlashEncryption #EmbeddedSystems

Seeed Studio XIAO ESP32S3 leverages dual-core ESP32S3 chip, supporting both Wi-Fi and BLE wireless connectivities, which allows battery charge. It integrates built-in camera sensor, digital microphone. It offers 8MB PSRAM, 8MB FLASH, and external SD card slot. All of these make it suitable for embedded ML, like intelligent voice and vision AI.

Seeed Studio XIAO ESP32S3 leverages dual-core ESP32S3 chip, supporting both Wi-Fi and BLE wireless connectivities, which allows battery charge. It integrates built-in camera sensor, digital microphone. It offers 8MB PSRAM, 8MB FLASH, and external SD card slot. All of these make it suitable for embedded ML, like intelligent voice and vision AI.

Seeed Studio XIAO ESP32S3 Plus SMD No-DrillHole Version

ESP32-S3 interactive capacitive-touch multi-LED controller, 5V input with 3.3V regulation, SPI ILI9341 TFT, shared I2C touch plus 16x2 LCD, and exactly three NPN LED driver channels with test points and debug annotations

RF Transceiver ICs ESP32-S3 QFN-56_L7.0-W7.0-P0.40-TL-EP4.0 LCSC Part Number: C2913192 JLCPCB Part Class: Extended Part Manufactured by ESPRESSIF(乐鑫)

IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad #wifi #ble #rf #mcu

Microcontroller, Wi-Fi 802.11b/g/n, Bluetooth, 32bit Microcontroller Wi-Fi BT ESP ESP32 Espressif QFN*1EP*7x7mm*P0.4mm*

IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad #wifi #ble #rf #mcu

Automotive OBD2 data logger based on ESP32-S3-WROOM-2 with robust 12–24V input protection, USB-C, CAN transceiver, microSD storage, RTC, and expansion ports.

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32

ESP32-S3 Arduino Nano ESP32-S Xtensa® MPU Embedded Evaluation Board #commonpartslibrary #esp32 #evaluationboard

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount #Module #RF-Transceiver #ESP32-S3

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount #CommonPartsLibrary #RF #Bluetooth #Wifi #ESP32-S3

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount #RF #RF-Transceiver #ESP32-S3

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount #RF #Transceiver #ESP32-S3 #Wifi #Bluetooth #CommonPartsLibrary #IntegratedCircuit #

ESP32-S3-WROOM-1 is a 2.4 GHz Wi-Fi 802.11 b/g/n and Bluetooth 5 LE MCU module based on a dual-core Xtensa LX7 processor operating up to 240 MHz. It integrates up to 16 MB Quad-SPI flash, up to 16 MB PSRAM, 36 GPIOs, USB 2.0 OTG, UART, SPI, I²C, I²S, ADC, touch sensing, and other peripherals, with a 3.0–3.6 V supply and onboard PCB antenna. Suitable for IoT, smart home, industrial automation, audio, USB, AIoT, and wireless applications. #ESP32S3 #WiFi #BluetoothLE #MCU #IoT #AIoT

Wi-Fi® 4 + Bluetooth® 5 LE System-in-Package (SiP) MCU – Highly integrated 2.4 GHz wireless System-in-Package (SiP) featuring an ESP32-S3 dual-core Xtensa® LX7 microcontroller for IoT devices, smart home products, AIoT, edge computing, industrial automation, HMI, wearable devices, and embedded wireless applications. Operates at up to 240 MHz with 8 MB embedded Flash and 2 MB embedded PSRAM, eliminating the need for external memory and reducing PCB size. Supports Wi-Fi 802.11 b/g/n and Bluetooth® 5 LE (including Long Range and 2 Mbps PHY), with up to +20 dBm transmit power and 150 Mbps Wi-Fi data rate. Features native USB 2.0 OTG, vector instructions for AI acceleration, 45 programmable GPIOs, SPI, I²C, I²S, UART, USB, RMT, LCD/Camera interface, PWM, TWAI® (CAN), ADC, touch sensing, AES-XTS, SHA, RSA, ECC, HMAC, secure boot, Flash encryption, and a true random number generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +85°C temperature range, and is housed in a compact 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3PICO1N8R2 #ESP32S3 #WirelessMCU #SystemInPackage #WiFi #Bluetooth5LE #DualCore #XtensaLX7 #USBOTG #AIoT #EmbeddedSystems

ESP32-S3 ESP32-S 802.11 b/g/n (WiFi/WLAN/Wi-Fi 4), Bluetooth® 5.x (BLE) Transceiver 2.4GHz Evaluation Board Seeed Studio XIAO ESP32-S3 development board featuring an ESP32-S3R8 dual-core Xtensa LX7 processor up to 240 MHz, 8 MB PSRAM, 8 MB Flash, 2.4 GHz Wi-Fi and Bluetooth 5.0 BLE. Supports UART, I2C, SPI, GPIO/PWM, ADC, USB Type-C 5 V input, 3.7 V Li-ion battery input with onboard charging, and deep-sleep current as low as 14 µA. Suitable for IoT, smart home, wearable, robotics, health-monitoring, low-power networking, and rapid-prototyping applications. #SeeedStudio #XIAO #ESP32S3 #DevelopmentBoard #WiFi #Bluetooth #IoT #Wearables #Robotics

Bluetooth, General ISM < 1GHz, WiFi 802.11b/g/n, Bluetooth v5.0, LoRaWAN, LPWAN Transceiver Module 863MHz ~ 928MHz, 2.4GHz Antenna Not Included, I-PEX MHF4 Surface Mount #Module #RF-Transceiver #ESP32-S3