2.4 GHz Wi-Fi® + Bluetooth® 5 SoC – High-performance dual-core Xtensa® LX7 wireless System-on-Chip (SoC) for IoT devices, smart home products, industrial automation, AIoT, wearable electronics, HMI systems, and embedded wireless applications. Operates at up to 240 MHz with 512 KB on-chip SRAM and supports external SPI Flash and PSRAM. Integrates Wi-Fi 802.11 b/g/n (2.4 GHz) and Bluetooth® 5 (LE) with Long Range and 2 Mbps PHY, delivering up to +21 dBm transmit power and 150 Mbps maximum Wi-Fi data rate. Features native USB 2.0 OTG, AI vector instructions for machine learning acceleration, 30 GPIOs, SPI, I²C, I²S, UART, RMT, LCD/Camera interface, TWAI® (CAN-compatible), PWM, ADC, capacitive touch sensing, AES-128/256, SHA, RSA, ECC, HMAC, Flash encryption, Secure Boot, and a True Random Number Generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +105°C temperature range, and is housed in a 56-pin QFN (7 × 7 mm) package.