225k ~ 1.4M Modem PSK 32-QFN (5x5) The DCB1M is a device for multiplex communication over noisy power lines, at speed up to 1.4Mbit/s. The DCB1M is based on the DC-BUS™ technology for network communication between modules sharing a common DC or AC powerline. The device avoids complex cabling, saves weight, and simplifies installation. The DCB1M supports UART, SPI, DMX512, RDM, and I 2C protocols, enabling the user to meet this application protocol. Sleep mode allows low power consumption when the device is not used. A QFN32 5x5 mm package provides a small PCB footprint The DCB1M is beneficial for many applications ranging from LED, Aerospace, Automotive, Industrial, and even Toys. Features • Noise robust UART, SPI, DMX512, RDM, and I2C transceiver over DC powerline. • Bitrate up to 1.4Mbit/s over the powerline. • Multiple networks may operate over a single powerline. • 251 selectable carrier frequencies (5MHz to 30MHz). • Built-in CSMA/CA (powerline arbitration) mechanism. • Operates as Multi-master Transceiver in a multiplex network. • Channel interference detection. • Communicates over a wide range of DC voltages. • Power management (Sleep modes) for low power consumption.

Battery Power Management IC Lithium Ion/Polymer 24-QFN (4x4) nPM1100 is an integrated Power Management IC (PMIC) with a linear-mode lithium-ion/lithium-polymer battery charger in a compact 2.1x2.1 mm WLCSP package. It has a highly efficient, dual-mode configurable output DC/DC buck regulator. nPM1100 is an extremely compact PMIC device, created for space constrained applications with a small lithium-ion or lithium-polymer battery. It is compatible with all nRF52 and nRF53 Series SoCs and supports charging batteries at up to 500 mA through USB, and also delivers up to 150 mA of current to power external components with regulated voltage. A minimum of five passive components are required for operation and the device functions without a control interface. It is the perfect companion for nRF52 and nRF53 multiprotocol SoCs in battery powered designs. Low quiescent current (IQ) extends battery life during shipping and storage with Ship mode, or in operation using auto-controlled hysteretic buck mode for high efficiency down to 1 µA loads. Charge and error indication LED drivers are built in. Charge profile limits are configurable and VBUS current limits can be fixed or auto-controlled with on-chip USB port detection. • 400 mA linear battery charger • Linear charger for lithium-ion/lithium-polymer batteries • Adjustable charge current from 20 mA to 400 mA • Selectable termination voltage of 4.1 V or 4.2 V • Automatic trickle, constant current, and constant voltage charging • Battery thermal protection • Discharge current limitation • JEITA compliant • Li-ion/Li-polymer USB battery charger with a high efficiency buck regulator • 800 nA - Typical quiescent current • 460 nA - Shipping mode quiescent current • Thermal protection • Input regulator • USB compatible current limit of 100 mA and 500 mA • 4.1 V to 6.7 V input voltage range for normal operation • 20 V overvoltage protection • Reverse current protection • 3.0 V to 5.5 V system voltage output • USB port detection supporting the following types: • SDP • CDP/DCP • 1.8 V to 3.0 V, 150 mA step-down buck regulator • Step-down buck regulator with up to 92% efficiency • Automatic transition between hysteretic and pulse width modulation (PWM) modes • Forced PWM mode for clean power operation • Pin-selectable output voltage (1.8 V, 2.1 V, 2.7 V, 3.0 V) • Soft start-up • LED drivers for charger state indication • 5 mA low side LED driver for charging indication • 5 mA low side LED driver for error indication • 2.3 V to 4.35 V battery operating input range • 2.1x2.1 mm WLCSP package • Suitable for two layer PCB design #CommonPartsLibrary #IntegratedCircuit #NordicSemiconductor #nPM1100 #PMIC #BatteryCharger #PowerManagement #LiIon #LiPolymer #BuckConverter #Wearables #IoT #WirelessSensor #LowPowerDesign #USBCharging #EmbeddedSystems #nRF52 #nRF53 #PortableElectronics

LORA-CC68-915MHz-TCXO is a compact, high-performance LoRa wireless transceiver module from NiceRF based on the Semtech LLCC68 chipset. Operating in the 915 MHz ISM band, it features a high-precision TCXO (Temperature-Compensated Crystal Oscillator) for improved frequency stability, making it ideal for long-range, low-power IoT and industrial wireless communication applications. The module supports LoRa, FSK, and GFSK modulation schemes, provides up to +22 dBm (160 mW) transmit power, and achieves receiver sensitivity as low as -129 dBm for extended communication range. It communicates through an SPI interface and is optimized for battery-powered and low-power systems. Key Features Based on Semtech LLCC68 LoRa transceiver chip 915 MHz ISM band operation High-precision TCXO for enhanced frequency stability Supports LoRa, FSK, and GFSK modulation Up to +22 dBm (160 mW) RF output power Receiver sensitivity up to -129 dBm SPI communication interface Operating voltage: 1.8 V to 3.7 V Low receive current (~6.5 mA typical) Integrated antenna switching circuitry Compact 16 mm × 16 mm SMD package Suitable for long-range and low-power wireless applications FCC-certified 915 MHz version RoHS compliant Typical Applications Smart Metering Industrial Automation Agricultural Monitoring Smart Cities Environmental Sensors Asset Tracking Warehouse Management Remote Control Systems Street Lighting Control Battery-Powered IoT Devices #CommonPartsLibrary #Module #LoRa #LLCC68 #915MHz #TCXO #WirelessModule #RFModule #IoT #IndustrialAutomation #SmartMetering #LongRangeCommunication #LowPowerDesign #SPI #EmbeddedSystems #NiceRF

Phase Lock Loop (PLL) IC 2.4MHz 1 16-DIP (0.300", 7.62mm) CD4046BE is a CMOS Micropower Phase-Locked Loop (PLL) integrated circuit that combines a linear Voltage-Controlled Oscillator (VCO), two phase comparators, a source follower, and a Zener diode in a single package. It is designed for frequency synthesis, frequency detection, FM demodulation, clock recovery, motor speed control, and other synchronization applications. The device operates over a wide supply voltage range and offers low power consumption, high noise immunity, and excellent VCO linearity. Key Features Wide operating supply voltage range: 3 V to 18 V Integrated Voltage-Controlled Oscillator (VCO) Two selectable phase comparators for flexible PLL design Operating frequency range up to approximately 1.4 MHz Very low power consumption High VCO linearity (typically <1%) Low frequency drift with temperature VCO inhibit control for ON/OFF keying applications Built-in source follower output for demodulation applications High noise immunity characteristic of CMOS technology Available in 16-pin PDIP (CD4046BE) package Typical Applications Frequency synthesis and multiplication FM modulation and demodulation Frequency discrimination Clock recovery and data synchronization Tone decoding Voltage-to-frequency conversion FSK modulation/demodulation Motor speed control systems Signal tracking and phase synchronization circuits Hashtags #CD4046BE #PLL #PhaseLockedLoop #VCO #ClockRecovery #FrequencySynthesizer #FMDemodulator #FSKModulation #CMOS #TexasInstruments #AnalogIC #TimingIC #SignalProcessing #EmbeddedSystems #ElectronicsDesign

Vicor DCM3623T75H13C2T00 isolated regulated DC/DC converter module. 36–75 Vdc input, 12 Vdc nominal output, 26.67 A / 320 W continuous output, up to 92.4% efficiency, 2250 Vdc input-to-output isolation, through-hole 3623 ChiP package, -40°C to +125°C T-grade internal operating temperature.

IP5407 is a multi-function power management soc with integrated boost converter, lithium battery charge management, and battery power indication, providing a complete power solution for mobile power. IP5407 has high integration and rich functions, so it only needs few peripheral devices in application，effectively reduce the size of the overall solution and reduce BOM cost. IP5407's synchronous boost system provides 2.1A / 2.4A output current, and the conversion efficiency is as high as 93%. At light load, it automatically turns off the LED power indicator and maintains the 5V voltage output to sleep, and the quiescent current drops below 150uA. IP5407 uses switch charging technology to provide 2.0a current at the input, with charging efficiency up to 91%.Built-in IC internal temperature and input voltage detection and intelligent adjustment of charging current. IP5407 supports 4, 2, 1 LED power display and lighting functions. IP5407 is available in ESOP8 package.  Charge and discharge of synchronous switch  2.1A / 2.4A synchronous boost conversion, 2.0A synchronous switch charging  Boost efficiency up to 93%  Charging efficiency up to 91%  Built-in power supply path management, supporting charging and discharging at the same time  Double click to turn on the Output supports linear compensation of 60mV  charging  Automatically adjust the charging current to match the output capability of the adapter  Support 4.20V,4.35V batteries  Power display  Support 4/2/1 LED power display Supports 4 light models: IP5407 Support 2/1 light models: IP5407_2D1D  Multifunction  Built-in floodlight driver  Automatically detect phone insertion and removal  Integrated mobile phone charging current intelligent identification DCP  Support battery NTC temperature protection.  Low power consumption  Output fixed normally open 5V  Standby power consumption is less than 150uA  BOM are simple and few  Built-in power MOS, single inductor realizes charging and discharging  Multiple protections and high reliability  Output over-current, over-voltage, short-circuit protection  Input overvoltage, overcharge, overdischarge, overcurrent discharge protection  over-temperature protection #IP5407 #Injoinic #PowerBankSOC #BatteryCharger #BoostConverter #PowerManagementIC #LithiumBattery #USBCharging #PortablePower #EmbeddedSystems

High-Side Gate Driver IC Non-Inverting 19-VSSOP The TPS48100QDGXRQ1 is an automotive-grade dual high-side gate driver integrated circuit manufactured by Texas Instruments. It is designed to drive external N-channel power MOSFETs configured as high-side switches, providing the gate-drive voltage and current needed to turn the switches fully on and off with controlled timing. The device targets automotive and other harsh-environment power switching applications where a robust, low quiescent current solution is needed to control loads such as motors, relays, solenoids, lighting, and other inductive or resistive loads powered from a vehicle battery rail. As a member of TI's automotive low-IQ high-side driver portfolio, the device is built to tolerate the wide voltage swings and transient conditions characteristic of automotive electrical systems, including load dump events and cold-crank voltage sags, while maintaining very low standby current draw when the driven loads are not active. This low quiescent current characteristic is particularly valuable in always-on automotive modules, where minimizing parasitic battery drain during vehicle-off states is a key design requirement. The device's two independent driver channels operate synchronously, allowing coordinated control of dual high-side switches from a shared set of control and protection circuitry, which is useful in applications such as dual-channel load switching, H-bridge-adjacent driver stages, or redundant power path control. The non-inverting input structure means that the gate driver outputs follow the logic state of the input control signals directly, simplifying integration with microcontroller-based control logic without requiring additional inverting stages. Internally, the device manages the charge pump or bootstrap circuitry needed to generate a gate voltage above the battery rail, which is necessary to fully enhance an N-channel MOSFET configured in the high-side position. This internal voltage generation simplifies the external bill of materials compared to discrete charge-pump driver implementations. The device is qualified to automotive electronics reliability standards, reflecting the rigorous stress testing and quality requirements expected of components used in vehicle electrical and powertrain-adjacent systems. It is housed in a small-outline surface-mount package suited to space-constrained automotive control module designs, and it is supplied in tape-and-reel or cut-tape packaging formats to support both high-volume automated assembly and lower-volume prototyping needs. Spec Sheet Identification Part Number: TPS48100QDGXRQ1 Device Family: TPS48100-Q1 Manufacturer: Texas Instruments Functional Classification Device Type: Dual high-side gate driver IC Driven Configuration: High-side Channel Type: Synchronous, dual independent drive channels Gate Type Driven: N-channel power MOSFET Input Logic: Non-inverting Electrical Characteristics Supply Voltage Range: Wide automotive-class supply range Quiescent Current: Low-IQ class, optimized for always-on automotive modules Output Drive Current: Symmetric source and sink peak output current Internal Gate Drive Generation: Integrated charge pump/bootstrap-style high-side gate drive generation Protection & Diagnostics Application Context: Suited for protected high-side switching designs typical of the automotive driver family Robustness: Designed to tolerate automotive transient and load-dump conditions Environmental & Qualification Temperature Grade: Extended automotive operating temperature range Automotive Qualification: AEC-Q100 qualified RoHS Compliance: Yes Package Package Type: Small-outline surface-mount package, VSSOP style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel, cut-tape, or reel-on-demand packaging options #TPS48100 #TexasInstruments #GateDriver #HighSideDriver #AutomotiveIC #AECQ100 #PowerManagement #MOSFETDriver #LowIQ #VSSOP #SurfaceMount #AutomotiveElectronics #PowerSwitching #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #VehicleElectronics #PCBDesign

SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering. As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years. The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller. Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components. Spec Sheet Identification Part Number: AS4C32M16SB-7TCN Device Family: AS4C32M16SB Manufacturer: Alliance Memory, Inc. Die Revision: B-die Functional Classification Device Type: Synchronous DRAM (SDR SDRAM) Memory Organization: Multi-bank array architecture Interface Type: Parallel, clock-synchronous command interface Refresh Capability: Supports auto-refresh and self-refresh modes Electrical Characteristics Supply Voltage: Standard 3.3V-class SDRAM supply rating Clock Frequency: Mid-range SDR SDRAM clock speed class Access Timing: Standard SDR SDRAM access time class for its speed grade Environmental & Qualification Temperature Grade: Commercial ("C" suffix designation) RoHS Compliance: Yes Product Positioning: Long-lifecycle, drop-in replacement memory device Package Package Type: Thin Small Outline Package, TSOP-II style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tray packaging #AS4C32M16SB #AllianceMemory #SDRAM #SDRSDRAM #MemoryIC #EmbeddedMemory #TSOP #SurfaceMount #LegacyMemory #DropInReplacement #DRAM #EmbeddedSystems #IndustrialElectronics #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #MemoryComponent #PCBDesign #CommonPartsLibrary #IntegratedCircuit #Memory #AS4C32

22 (20 + 2 Power) Position Connector Header, Outer Shroud Contacts Surface Mount Gold The BM24-20DP/2-0.35V(51) is a board-to-board and board-to-FPC header connector manufactured by Hirose Electric. It belongs to the BM24 series, a family of fine-pitch hybrid power and signal connectors designed for applications that require both data signaling and supplementary power delivery within the same compact interconnect, eliminating the need for a separate dedicated power connector alongside the signal interface. The connector functions as the plug (header) half of a mating pair, intended to mate with a corresponding BM24 receptacle to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile board-to-board arrangement. This part number designates a configuration with a defined signal contact count supplemented by additional dedicated power contacts, reflecting the series' hybrid design philosophy in which the majority of positions handle signal or data lines while a smaller subset of positions is reserved for carrying higher current to support onboard power rails. This arrangement is particularly useful in compact consumer devices such as smartphones, wearables, and camera modules, where both data interfaces and local power distribution must be routed across a board-to-board junction without dedicating separate connectors to each function. The series is positioned by Hirose as supporting high-speed signaling standards including USB interfaces, making it suitable for applications that combine high-speed data transmission with power delivery in a single compact connector footprint. The connector's fine contact pitch and low mated height make it well suited to thin, space-constrained form factors where minimizing both footprint area and stack height is a priority. As with other Hirose board-to-board offerings, the connector is non-polarized in its base mechanical design, and it is supplied on embossed carrier tape for automated pick-and-place assembly, with construction compliant to RoHS material restrictions. Mechanically, the header is built to withstand the repeated mating cycles typical of consumer electronics manufacturing, rework, and field service, while maintaining stable, low-resistance contact across both its signal and power contact paths under realistic vibration and thermal conditions. As a header-style connector, it is intended to be soldered directly to a host PCB, with its mating receptacle counterpart soldered to the opposing board or FPC, allowing the assemblies to be joined and separated as needed throughout the product lifecycle. Spec Sheet Identification Part Number: BM24-20DP/2-0.35V(51) Series: BM24 Connector Style: Hybrid power/signal board-to-board and board-to-FPC connector Connector Type / Configuration Type: Header (plug) Gender: Male Orientation: Straight, surface mount Contact Arrangement: Hybrid configuration combining signal contacts and dedicated power contacts Polarization: Non-polarized Electrical Ratings Applicable High-Speed Protocols: USB2.0, USB3.0, USB3.1 (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Power Contacts: Dedicated higher-current contacts integrated alongside signal contacts Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics assembly and rework Contact & Material Properties Contact Plating (Mating Area): Gold Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding BM24 series receptacle connector Application Note: Intended for hybrid power and signal board-to-board or board-to-FPC interconnection in compact consumer electronics #BM24 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #HybridConnector #PowerAndSignal #Connector #SMTConnector #FinePitchConnector #USB #HighSpeedConnector #ConsumerElectronics #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #RoHSCompliant #ComponentLibrary #CommonPartsLibrary

N-Channel 30 V 161A (Tc) 140W (Tc) Surface Mount TO-252AA (DPAK) The IRLR7843TRPBF is an N-channel power MOSFET built on Infineon's HEXFET technology platform, originally developed by International Rectifier. It is designed as a low-voltage, high-current switching device intended for applications where minimizing conduction loss and maximizing efficiency are primary design goals. The part is particularly well suited to synchronous switching topologies, where pairs or arrays of MOSFETs alternately conduct to regulate power flow with minimal energy dissipation. This device targets high-density power conversion applications where board space is limited but current demands are substantial, such as notebook computer power delivery, point-of-load converters used in servers, and advanced telecom and datacom equipment. It is commonly found supporting synchronous buck converter stages that step down a higher input rail to a lower output voltage suitable for powering processors, memory, and other low-voltage digital logic. Its low on-resistance characteristic allows it to carry significant current while generating comparatively little resistive heating, which is essential in compact enclosures with constrained thermal budgets. The transistor is fabricated using a refined trench gate process that improves upon earlier HEXFET generations, offering reduced gate charge and lower switching losses alongside its low conduction resistance. This combination makes it effective in both the high-side and low-side positions of a synchronous switching cell, where fast, clean transitions reduce overlap losses and improve overall converter efficiency. The device also offers well-characterized avalanche energy ratings, giving designers confidence in its ruggedness when exposed to transient overvoltage events that can occur during switching, and it presents a very low gate impedance, allowing it to be driven efficiently by standard gate driver circuitry. Mechanically, the part is housed in a surface-mount power package with an exposed tab for enhanced thermal conduction to the host PCB, allowing heat generated during operation to be efficiently transferred away from the silicon die. This package style is widely used in power-dense designs where through-hole packages would be impractical. The device is supplied in a tape-and-reel format suitable for automated assembly and is compliant with RoHS material restrictions, reflecting current environmental and regulatory standards for electronic components. Spec Sheet Identification Part Number: IRLR7843TRPBF Device Family: HEXFET Power MOSFET Manufacturer: Infineon Technologies Functional Classification Device Type: Power MOSFET Channel Type: N-channel Technology: Trench-gate HEXFET (IR MOSFET legacy technology) Logic Level Compatibility: Logic-level gate drive compatible Electrical Characteristics Drain-to-Source Voltage Rating: Low-voltage class, optimized for sub-30V rail applications On-Resistance: Ultra-low on-resistance class Drain Current Capability: High continuous current class Gate Charge: Low gate charge, optimized for fast switching Gate Impedance: Ultra-low gate impedance Avalanche Characteristics: Fully characterized avalanche voltage and current rating Switching & Application Behavior Primary Application: Synchronous buck converter switching stages Suitable Position: High-side and low-side switch positions Target Use Cases: Point-of-load conversion, notebook power delivery, telecom/datacom power systems Thermal & Mechanical Package Type: Surface-mount power package with exposed thermal tab (DPAK-style) Mounting: Surface mount technology (SMT) Thermal Path: Tab-based conduction to PCB for heat dissipation Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active production Packaging Format Supply Format: Tape-and-reel, per part suffix designation #IRLR7843 #Infineon #HEXFET #PowerMOSFET #NChannelMOSFET #SynchronousBuck #PowerElectronics #DCDCConverter #PointOfLoad #PowerConversion #DPAK #SMTPackage #RoHSCompliant #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #PowerDensity #LowRDSon #DiscreteSemiconductor #commonpartslibrary #transistor

Ethernet Controller 10/100 Base-T/TX Bus Interface 80-TQFP-EP (12x12) The LAN9254-I/JRX is an EtherCAT SubDevice (slave) controller developed by Microchip Technology, designed to serve as the communication backbone for industrial automation devices participating in an EtherCAT network. The device integrates dual Ethernet physical layer transceivers directly on-chip, eliminating the need for external PHY components and simplifying the design of EtherCAT-enabled equipment such as servo drives, sensors, I/O modules, and other field devices used in real-time industrial control systems. Architecturally, the controller can operate as either a two-port or three-port node, depending on the network topology required. In its standard configuration it functions as a two-port device supporting daisy-chain connections typical of EtherCAT line topologies. When configured as a three-port device, it gains an additional management interface port that can connect to an external PHY or to another LAN9254, enabling star or tree network topologies and allowing the device to act as a branching point within a larger EtherCAT installation. Each integrated Ethernet PHY operates in full-duplex mode and supports automatic crossover detection, so the device can use either straight-through or crossover cabling without requiring manual configuration. Beyond pure protocol handling, the LAN9254 includes a substantial set of general-purpose digital input and output lines, allowing it to be used in simple field devices without requiring a separate microcontroller. For more complex applications, the device communicates with an external host processor through an integrated host bus interface that behaves like simple memory-mapped SRAM, supporting both 8-bit and 16-bit data widths along with multiple byte-ordering conventions, which makes it straightforward to interface with a wide range of microcontroller and microprocessor architectures. Internally, dual process data RAM buffers manage the exchange of real-time process data between the host application and the EtherCAT communication engine, while a dedicated interrupt line notifies the host of relevant internal events. A key feature of the device is its built-in distributed clock mechanism, which provides high-precision timing synchronization across all nodes in an EtherCAT network. This capability is essential for motion control and other applications where multiple devices must act in tight temporal coordination. The controller also provides configurable status indication through standard network activity and link LEDs, along with optional error and run-state indicators that give visibility into the health and operational state of the device at a glance. Power architecture on the LAN9254 is simplified through an integrated linear regulator, allowing the device to be operated from a single primary supply rail while internally generating the lower voltage needed for its core logic. This reduces the external power supply complexity that would otherwise be required to support separate core and I/O voltage domains. The "-I" designation on this particular part number indicates an industrial-grade temperature rating, making it suitable for deployment in factory floor and other demanding industrial environments where extended thermal range and long-term reliability are required. The device is housed in a surface-mount package consistent with dense industrial control board layouts and is compliant with RoHS material restrictions. Spec Sheet Identification Part Number: LAN9254-I/JRX Device Family: LAN9254 Manufacturer: Microchip Technology Functional Classification Device Type: EtherCAT SubDevice (slave) controller Network Role: Two/three-port configurable node Integrated PHYs: Dual Ethernet physical layer transceivers, on-chip Auto-MDIX Support: Yes, supports direct and crossover cabling Communication & Protocol Features Protocol: EtherCAT Topology Support: Daisy-chain (line), star, and tree topologies Additional Port Mode: Optional third port for branching/tap configurations Clock Synchronization: Integrated distributed clock for high-precision timing Host Interface Interface Type: SRAM-like host bus interface Data Width Support: Selectable bit-width host bus operation Endianness Support: Multiple byte-ordering modes Process Data Handling: Dual process data RAM buffers Interrupt Support: Configurable host interrupt line Digital I/O General-Purpose I/O: Integrated digital I/O lines for microcontroller-less operation Standalone Mode: Supports operation without external microcontroller for simple device designs Power Architecture Supply Configuration: Single primary supply rail Internal Regulation: Integrated linear regulator for core voltage generation Status Indication LED Support: Standard run and link/activity indicators per port Optional Indicators: Configurable error and run-state status indicators Environmental & Qualification Temperature Grade: Industrial ("-I" suffix) RoHS Compliance: Yes Package Package Type: Surface-mount, quad flat package style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel, per part suffix designation #LAN9254 #Microchip #EtherCAT #SlaveController #SubDeviceController #IndustrialEthernet #IndustrialAutomation #MotionControl #EmbeddedSystems #FieldDevice #DigitalIO #HostBusInterface #DistributedClock #TQFP #RoHSCompliant #IndustrialGrade #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #SemiconductorIC

USB 3.0 high-definition video capture chip MacroSilicon Technology Co., Ltd. MS2130 is a USB 3.0 high-definition video and audio capture IC designed to convert HDMI/DVI input signals into USB video and audio streams. It integrates a USB 3.0 device controller, data transceiver, and audio/video processing modules, allowing HD video capture and preview on PCs, smartphones, and tablets through a USB interface. The device supports UVC/UAC standards and provides YUV422 and MJPEG video output formats for broad operating system compatibility. Key Features: HDMI 1.4b receiver with DVI 1.0 compatibility Supports HDCP 1.4 Maximum HDMI input resolution up to 4K (3840 × 2160) @ 30Hz Supports RGB444, YCbCr422, YCbCr444, and YCbCr420 color formats Supports deep color modes (24/30/36-bit) Integrated USB 3.0 device controller and transceiver USB 2.0 device mode compatibility Supports USB Video Class (UVC 1.0) and USB Audio Class (UAC 1.0) Video output supports YUV422 and MJPEG formats Default USB video output up to 1920 × 1080 @ 60Hz USB audio output with 48 kHz stereo support Compatible with Windows, Android, Linux, and macOS systems Requires external 24 MHz crystal oscillator Integrated PLL and power-on reset circuitry Available in QFN-64-EP (9 mm × 9 mm) package RoHS compliant Applications: HDMI to USB capture devices Video streaming equipment Online conferencing devices Embedded video acquisition systems Portable multimedia devices Hashtags: #MS2130 #MacroSilicon #USB30 #HDMICapture #VideoCaptureIC #HDMIToUSB #USBVideo #EmbeddedSystems #VideoProcessing #UVC #UAC #QFN64 #ElectronicsDesign #PCBDesign

Serial Port to HID Keyboard and Mouse Chip CH9329 is a UART to standard USB HID device (keyboard, mouse, custom HID) chip. According to different operating modes, it can be identified as the standard USB keyboard device, USB mouse device or custom HID device on the computer. CH9329 receives serial port data sent from the client and according to the HID device specification, the data will be packaged and then transmitted to the computer via USB port. Though the provided computer software, users can also configure the chip operating mode, serial communication mode, serial communication baud rate, various timeout periods, VID, PID, and various USB string descriptors. Features l Supports 12Mbps full-speed USB transmission, USB 2.0compatible, built-in crystal oscillator. l Default serial baud rate is 9600bps, which supports various common baud rates. l Supports 5V and 3.3V power voltage. l Multiple chip operating modes to adapt to different application requirements. l Flexible switching among multiple serial communication modes. l Supports normal keyboard and multimedia keyboard function, and supports full keyboard function. l Supports absolute mouse and relative mouse functions. l Supports custom HID device functions, which can be used for pure data transmission. l Supports ASCII code characters input and section-position code Chinese characters input. l Supports remote computer wake-up function. l Supports to configure VID, PID, and various USB string descriptors of chip. l Supports to configure default baud rate of chip. l Supports to configure communication address of chip to realize multiple chips hanged on the same serial port. l Supports to configure “Enter” character. l Supports to configure filter string to filter invalid characters conveniently. l Complies with USB related specifications and HID device related specifications. l RoHS compliant SOP-16 lead-free package.

The W25Q02JVSFIM from Winbond Electronics is a 2G-bit (256M x 8) Serial NOR Flash Memory device designed for high-density non-volatile data storage applications. It supports high-speed SPI, Dual/Quad SPI, QPI, and DTR interfaces, providing fast data transfer and efficient memory access for embedded systems. The device operates from a 2.7V to 3.6V supply voltage and is available in a 16-pin SOIC surface-mount package. It is suitable for applications such as firmware storage, boot code memory, industrial controllers, IoT devices, automotive electronics, and embedded systems requiring large-capacity reliable flash memory. Key Features Memory Density: 2G-bit Serial NOR Flash (256M x 8) Flash Technology: Single-Level Cell (SLC) NOR Flash Interface Support: Standard SPI, Dual SPI, Quad SPI, QPI, and DTR modes High-Speed Clock Frequency: Up to 133 MHz operation Fast Access Time: Approximately 7.5 ns Supply Voltage Range: 2.7V to 3.6V Non-Volatile Data Storage: Retains stored data without power Memory Organization: 256M x 8-bit architecture Package Type: 16-pin SOIC (7.50 mm width) surface-mount package Operating Temperature Range: -40°C to +85°C Page Program Time: Approximately 3.5 ms Applications: Embedded firmware storage, BIOS/boot memory, industrial equipment, IoT devices, and consumer electronics Hashtags #W25Q02JVSFIM #Winbond #SerialFlashMemory #NORFlash #SPIFlash #QuadSPI #QPI #DTR #EmbeddedSystems #NonVolatileMemory #FlashMemory #FirmwareStorage #IoT #IndustrialElectronics #Semiconductor #MemoryIC

2242460440 is a Molex Micro-Fit+ Versa Color Vertical Header, a 4-circuit, dual-row, through-hole PCB connector designed for reliable wire-to-board power and signal connections. It features a 3.00 mm pitch, shrouded housing, locking ramp retention, and tin-plated contacts for secure mating and dependable performance in industrial, consumer, and power-distribution applications. The connector is built with high-temperature LCP insulation and supports operation in demanding environments. Key Features 4-position (2×2) vertical header 3.00 mm pitch Micro-Fit+ Versa series Through-hole PCB mounting Male pin contacts with tin plating Shrouded design with locking ramp Board-to-wire connection style Copper alloy contacts Glass-filled LCP housing Operating temperature: -40°C to +105°C Voltage rating up to 600 VAC/DC UL94 V-0 flammability rating Features board guide and pick-and-place compatibility Yellow housing for visual circuit identification and polarization management #Molex #MicroFitPlus #MicroFitVersa #Connector #WireToBoard #HeaderConnector #ThroughHole #PowerConnector #PCBConnector #Interconnect #ElectronicComponents #ElectronicsDesign

Connector Header Through Hole 4 position 0.118" (3.00mm) 2242460430 is a Molex Micro-Fit+ Versa Color Vertical Header, a 4-circuit, dual-row, through-hole wire-to-board power connector designed for reliable power and signal connections in industrial, consumer, and power distribution applications. It features a 3.00 mm pitch, shrouded housing, polarized mating interface, and high-current copper alloy contacts for secure and robust connectivity. The connector supports up to 12.5 A per contact and 600 V AC/DC operation, making it suitable for compact high-power designs. Key Features 4-position dual-row vertical PCB header 3.00 mm pitch (Micro-Fit+ Versa series) Through-hole mounting with solder termination Male pin contacts with tin plating Up to 12.5 A current rating per contact Up to 600 V AC/DC voltage rating Shrouded and polarized design for mating protection Locking and keying features for secure connection High-strength copper alloy contacts Glass-filled LCP housing, UL94 V-0 rated Operating temperature range: -40°C to +125°C Glow-wire capable construction Suitable for power and wire-to-board applications #Molex #MicroFitPlus #WireToBoard #PowerConnector #PCBHeader #ThroughHole #IndustrialElectronics #HighCurrentConnector #Connector #ElectronicsDesign

STM32WLE5JC is an ultra-low-power wireless microcontroller from STMicroelectronics that combines an Arm Cortex-M4 processor with an integrated Sub-GHz radio transceiver in a single chip. Designed for long-range, low-power IoT and LPWAN applications, it supports LoRa®, (G)FSK, (G)MSK, and BPSK modulation schemes, making it ideal for smart metering, industrial monitoring, agriculture, asset tracking, and remote sensing applications. The device offers a high level of integration, robust security features, and extensive peripheral support while maintaining very low power consumption. Key Features Arm Cortex-M4 32-bit MCU running at up to 48 MHz Integrated Sub-GHz radio transceiver (150 MHz to 960 MHz) Supports LoRa®, LoRaWAN®, (G)FSK, (G)MSK, and BPSK modulations Up to 256 KB Flash memory and 64 KB SRAM Ultra-low-power operation with multiple low-power modes Programmable RF output power up to +22 dBm High receiver sensitivity down to -148 dBm (LoRa mode) Hardware AES-256 encryption and True Random Number Generator (RNG) Public Key Accelerator (PKA) for enhanced security 12-bit ADC, 12-bit DAC, comparators, and DMA controllers Multiple communication interfaces: USART, LPUART, SPI, I²C Operating voltage range: 1.8 V to 3.6 V Operating temperature range: -40°C to +105°C Available in compact UFQFPN, UFBGA, and WLCSP packages #STM32WLE5JC #STM32WL #LoRa #LoRaWAN #SubGHz #WirelessMCU #CortexM4 #LPWAN #IoT #SmartMetering #IndustrialIoT #EmbeddedSystems #STMicroelectronics

Ethernet Controller 10/100 Base-T/TX PHY SPI Interface 48-LQFP (7x7) W5500 is a hardwired TCP/IP embedded Ethernet controller from WIZnet that enables microcontrollers to add reliable 10/100 Mbps Ethernet connectivity through a high-speed SPI interface. By integrating a TCP/IP protocol stack, Ethernet MAC, and PHY into a single chip, the W5500 offloads network processing from the host MCU, simplifying the development of Internet-connected embedded systems and IoT applications. It supports multiple simultaneous socket connections and provides internal buffer memory for efficient network communication. Hardwired TCP/IP stack supporting TCP, UDP, ICMP, IPv4, ARP, IGMP, and PPPoE Integrated 10Base-T / 100Base-TX Ethernet MAC and PHY Supports up to 8 independent hardware sockets simultaneously 32 KB internal TX/RX buffer memory High-speed SPI interface up to 80 MHz Wake-on-LAN (WOL) and Power-Down modes for reduced power consumption Auto-negotiation for 10/100 Mbps Ethernet operation 3.3 V operation with 5 V I/O tolerance LED status outputs for Link, Speed, Activity, and Duplex indication Available in a 48-pin LQFP package #W5500 #WIZnet #EthernetController #TCPIP #EmbeddedEthernet #IoT #SPI #Networking #EthernetPHY #EmbeddedSystems #commonpartslibrary #integratedcircuit #controllers #ethernet

IXYS Integrated Circuits brings OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays. As part of this family, the CPC1709J single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output, constructed with an efficient MOSFET switch and photovoltaic die, uses IXYS Integrated Circuits’ patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.3 °C/W). Features • 22.8ADC Load Current with 5°C/W Heat Sink • Low 0.05 On-Resistance • 60VP Blocking Voltage • 2500Vrms Input/Output Isolation • Low Thermal Impedance: JC = 0.3 °C/W • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications • Low Drive Power Requirements • No EMI/RFI Generation Applications • Industrial Controls / Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment #CPC1709J #IXYS #Littelfuse #SolidStateRelay #SSR #OptoMOS #PowerRelay #DCRelay #MOSFETRelay #HighCurrentSwitching #ElectricalIsolation #IndustrialElectronics #PowerManagement #BatterySystems #AutomationControl

General ISM < 1GHz LoRa™, LoRaWAN Transceiver Module 863MHz ~ 870MHz, 902MHz ~ 928MHz Antenna Not Included Surface Mount 453-00139R is a compact LoRaWAN® and LoRa® RF transceiver module from Ezurio (formerly Laird Connectivity), designed for long-range, low-power wireless communication in Industrial IoT, smart agriculture, asset tracking, smart cities, and remote monitoring applications. Based on Semtech's SX1262 LoRa transceiver, the module provides excellent RF sensitivity and robust wireless performance while simplifying integration through multiple peripheral interfaces and a surface-mount package. Key Features LoRa® and LoRaWAN® wireless communication support Frequency bands: 863–870 MHz and 902–928 MHz Up to 22 dBm transmit power High receiver sensitivity down to -139.2 dBm Data rates up to 1 Mbps Wide supply voltage range: 2.0 V to 3.7 V Multiple interfaces: UART, SPI, I²C, I²S, ADC, GPIO, PWM, and IrDA Low receive current consumption (typically 7.6–8.1 mA) Operating temperature range: -40°C to +85°C Compact 47-pad surface-mount module Suitable for battery-powered and long-range IoT applications Hashtags #LoRa #LoRaWAN #Ezurio #LairdConnectivity #SX1262 #RFModule #WirelessCommunication #IndustrialIoT #SmartAgriculture #AssetTracking #RemoteMonitoring #SubGHz #IoTModule #EmbeddedSystems #LongRangeWireless

Connector Header Through Hole 4 position 0.118" (3.00mm) 2068320401 is a 4-position vertical PCB header from the Micro-Fit+ series by Molex. It is a shrouded, through-hole wire-to-board power connector designed for applications requiring compact size, secure mating, and high current capability. The connector features a 3.00 mm pitch, locking ramp retention, and robust construction suitable for industrial, telecommunications, medical, and general-purpose power distribution systems. Key Features 4-position (2×2) vertical header 3.00 mm pitch (Micro-Fit+ family) Through-hole PCB mounting Shrouded design with locking ramp for secure mating Current rating up to 12.5 A per contact Voltage rating up to 600 VAC/DC Tin-plated copper alloy contacts Operating temperature range: -40°C to +105°C Glass-filled LCP housing with UL94 V-0 flammability rating Board guide feature for improved PCB assembly alignment Suitable for wire-to-board power and signal applications Hashtags #Molex #MicroFitPlus #2068320401 #WireToBoard #PowerConnector #PCBHeader #ThroughHoleConnector #IndustrialElectronics #TelecomEquipment #MedicalDevices #ConnectorDesign #ElectronicComponents

16 Position Header Spacer Connector 0.079" (2.00mm) Gold Through Hole TW-08-02-L-D-185-100 is a 16-position, dual-row board-to-board stacking header from the Samtec TW series. Designed for elevated board stacking applications, it features a 2.00 mm pitch, a 0.185" (4.70 mm) stack height, and gold-plated contacts for reliable electrical performance. The connector uses a through-hole mounting style with solder termination and is suitable for embedded systems, industrial controls, communications equipment, and other high-density PCB interconnect applications. Its flexible stacking architecture allows designers to achieve custom board spacing while maintaining mechanical stability and signal integrity. Key Features 16-position (2 × 8) dual-row board stacking header 2.00 mm (0.079") contact pitch 0.185" (4.70 mm) board stack height Through-hole mounting with solder termination Gold-plated contacts for enhanced durability and conductivity Black insulating housing Flexible board-to-board stacking design Suitable for elevated PCB stacking applications High-speed performance capability up to 8 Gbps within the TW family Reliable mechanical and electrical connection for embedded and industrial systems #Samtec #BoardToBoardConnector #StackingHeader #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #ElectronicsDesign #ThroughHoleConnector #TWSeries

16 Position Receptacle Connector 0.079" (2.00mm) Surface Mount Gold CLT-108-02-L-D-A is a high-reliability, dual-row surface-mount receptacle connector from the Samtec CLT Series. It features 16 positions arranged in two rows with a 2.00 mm pitch, making it ideal for board-to-board interconnect applications requiring compact size, robust mechanical performance, and reliable signal and power transmission. The connector utilizes Samtec's Tiger Claw™ dual-wipe contact system, providing excellent contact retention and electrical integrity in demanding environments. 16-position dual-row female receptacle 2.00 mm (0.079") pitch and row spacing Surface-mount (SMT) termination Gold-plated mating contacts for enhanced durability and conductivity Tiger Claw™ dual-wipe contact system for reliable mating performance Current rating up to 4.1 A per contact Phosphor bronze contacts with tin-plated tails Liquid Crystal Polymer (LCP) insulator, UL94 V-0 rated Operating temperature range: -55°C to +125°C Integrated board guide for improved alignment during mating Suitable for board-to-board and mezzanine applications #Samtec #CLTSeries #BoardToBoardConnector #SMTConnector #ReceptacleConnector #TigerClaw #ElectronicComponents #InterconnectSolutions #PCBConnector #EmbeddedSystems

Six-channel low-side solenoid driver IC from Infineon Technologies. TLE92466EDXUMA1 integrates six constant-current low-side output channels, MOSFET power stages, current sensing, diagnostics, and a protected 32-bit SPI interface for automotive linear solenoid control in transmission, ESC, and active suspension applications. It uses a PG-DSO-36-72 exposed-pad package; per-channel programmed current is up to 1.5 A, dither operation supports up to 1.8 A, and 2.7 A applies to parallel-channel mode. #TLE92466EDXUMA1 #Infineon #AutomotiveIC #SolenoidDriver #CurrentControlIC #TransmissionControl #FunctionalSafety #ISO26262 #AECQ100 #AutomotiveElectronics #PowerManagement #EmbeddedSystems

FIXED IND 10uH 25A 7mΩ SMD,15.5x16.5mm FEXL1513A-100M is a high-current, shielded molded power inductor designed for DC-DC converters, voltage regulators, power supplies, and other high-efficiency power management applications. It features a monolithic metal composite construction that provides low DC resistance, excellent saturation characteristics, and reduced electromagnetic interference (EMI). The device offers an inductance value of 10 µH, supports up to 25 A rated current, and has a low 7 mΩ DCR, making it suitable for high-current switching regulator designs. Key Features 10 µH inductance value High rated current: 25 A Saturation current up to 30 A Low DC resistance (7 mΩ typical) Shielded monolithic metal composite construction Low core losses and high efficiency Excellent EMI suppression characteristics Compact SMD package: 16.5 mm × 15.5 mm × 13 mm RoHS compliant Suitable for DC-DC converters, POL regulators, industrial power supplies, automotive electronics, and high-current power circuits #PowerInductor #ShieldedInductor #HighCurrentInductor #DCDCConverter #PowerManagement #SMPS #ElectronicsDesign #EmbeddedSystems #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #Fixed-Inductor

Battery Retainer Coin, 24.5mm 1 Cell SMD (SMT) Tab BAT-HLD-006-SMT is a surface-mount coin-cell battery holder designed for secure retention of a single CR2450 lithium coin battery in compact PCB applications. Manufactured by TE Connectivity, it provides a low-profile, reliable power solution for embedded systems, wireless sensors, IoT devices, medical electronics, and backup power circuits. The holder features a horizontal battery orientation, phosphor bronze construction, and nickel-plated contacts for durability and dependable electrical performance. Key Features Supports one CR2450 coin-cell battery Surface-mount (SMT) PCB installation Horizontal battery orientation for low-profile designs Nickel-plated contacts for reliable conductivity and corrosion resistance Phosphor bronze construction for mechanical durability Maximum contact current rating of 1 A Compact design with approximately 6.88 mm height above PCB Suitable for automated assembly and reflow soldering processes Ideal for RTC backup, wireless modules, portable electronics, and IoT devices #BatteryHolder #CR2450 #CoinCellHolder #SMT #SurfaceMount #TEConnectivity #PowerManagement #EmbeddedSystems #IoT #PCBDesign #Electronics #BatteryRetainer #HardwareDesign #ElectronicComponents

4 Position FFC, FPC Connector Contacts, Top 0.039" (1.00mm) Surface Mount, Right Angle HFW4R-2STE1H1LF is a 4-position, 1.00 mm pitch FFC/FPC connector from the HFW-R series by Amphenol ICC. It is a right-angle, surface-mount, non-ZIF connector designed for reliable connection of flat flexible cables (FFC) and flexible printed circuits (FPC) in compact electronic devices. The connector features top-side contacts, tin-plated phosphor bronze terminals, and a low-profile housing, making it suitable for space-constrained applications such as consumer electronics, industrial equipment, and embedded systems. Key Features 4-position FFC/FPC connector 1.00 mm pitch Right-angle surface-mount (SMT) design Top-contact configuration Non-ZIF side-entry cable insertion Supports 0.30 mm cable thickness 1 A current rating 100 V AC/DC voltage rating Operating temperature range: -55°C to +105°C Tin-plated phosphor bronze contacts Halogen-free LCP housing UL94 V-0 flammability-rated material Compact 1.90 mm profile above PCB Rated for 30 mating cycles RoHS and REACH compliant Typical Applications LCD and display interfaces Consumer electronics Industrial control equipment Portable devices Embedded and IoT systems Instrumentation and control modules #CommonPartsLibrary #Connector #AmphenolICC #FFCConnector #FPCConnector #FlexConnector #SMTConnector #RightAngleConnector #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #InterconnectSolutions

Board to Board & Mezzanine Connectors .050\" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 400 Position Connector High Density Array, Male Surface Mount, Right Angle Gold SEAM-40-01-L-10-2-RA-K-TR is a high-speed, high-density board-to-board mezzanine connector from the Samtec SEARAY™ series. It features a right-angle, surface-mount design with 400 positions arranged in a 10-row open-pin-field array on a 1.27 mm (0.050") pitch. The connector utilizes Samtec's Edge Rate® contact system, providing excellent signal integrity, durability, and support for high-speed differential pair routing in demanding communication, networking, and embedded computing applications. Key Features High-density 400-position open-pin-field array connector 1.27 mm (0.050") contact pitch for compact board-to-board interconnects Right-angle, surface-mount termination Rugged Edge Rate® contact system for reliable high-speed performance Supports high-speed serial protocols and differential pair routing Suitable for power, ground, and signal connections within the same connector Gold-plated contacts for enhanced reliability and corrosion resistance Board-guide feature for improved mating alignment Current rating up to 1.9 A per contact Voltage rating up to 240 VAC / 339 VDC Tape-and-reel packaging for automated assembly processes RoHS compliant and designed for high-reliability applications #Samtec #SEARAY #SEAM4001L102RAKTR #BoardToBoardConnector #MezzanineConnector #HighSpeedConnector #HighDensityInterconnect #EdgeRate #SurfaceMount #RightAngleConnector #EmbeddedSystems #TelecomEquipment #NetworkingHardware #IndustrialElectronics #PCBDesign

Accelerometer, Gyroscope, Magnetometer, 9 Axis Sensor I2C, SPI, UART Output The BNO085 is a high-performance 9-axis absolute orientation sensor system-in-package (SiP) that integrates a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a low-power ARM Cortex-M0+ microcontroller running CEVA/Hillcrest SH-2 sensor fusion firmware. It provides accurate real-time orientation, motion tracking, and activity detection while offloading complex sensor fusion calculations from the host processor. The device is widely used in robotics, AR/VR systems, wearables, drones, IoT devices, and navigation applications. Key Features 9-axis motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in SH-2 sensor fusion engine for accurate orientation tracking ARM Cortex-M0+ processor for onboard motion processing Outputs quaternion, rotation vector, linear acceleration, gravity vector, angular velocity, and magnetic field data Advanced motion detection including tap, step, shake, and significant motion detection Activity classification and stability detection capabilities Low-latency rotation vectors optimized for AR/VR applications Supports I²C, SPI, and UART communication interfaces Configurable output data rates and timestamps Low-power operation suitable for battery-powered devices Compact 28-pin LGA package (5.2 mm × 3.8 mm) Operating temperature range: -40°C to +85°C Backward compatible with BNO080 designs while adding support for future application-specific libraries Applications Robotics and autonomous systems Virtual Reality (VR) and Augmented Reality (AR) Wearable devices and fitness trackers Drones and UAVs Head-mounted displays (HMDs) Industrial motion tracking IoT and smart devices Navigation and positioning systems #BNO085 #IMU #9AxisSensor #MotionTracking #SensorFusion #OrientationSensor #Robotics #AR #VR #IoT #Wearables #EmbeddedSystems #CEVA #HillcrestLabs #MotionDetection #Quaternion #InertialMeasurementUnit