Buck Switching Regulator IC Positive Adjustable 0.8V 1 Output 3.5A SOT-23-6 Thin, TSOT-23-6 The LMR51635YFDDCR specification defines the engineering requirements for a synchronous step-down DC-DC converter integrated circuit designed for high-efficiency power regulation in embedded and industrial electronic systems. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure stable voltage conversion, efficient power management, and long-term operational reliability. The device is intended for use in industrial automation, telecommunications equipment, consumer electronics, test and measurement instruments, distributed power systems, and embedded applications requiring regulated low-voltage power rails from higher-voltage DC sources. It integrates high-performance switching circuitry to provide efficient voltage conversion while minimizing external component count and overall system power loss. Engineering Requirements The DC-DC converter shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and reliable long-term operation. The device shall maintain stable functionality under specified input voltage, output load, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate output voltage regulation, high conversion efficiency, low output ripple, and fast transient response during load and input voltage variations. The converter shall maintain stable switching operation while supporting continuous and dynamic power delivery with minimal performance degradation. The integrated control architecture shall ensure reliable startup, controlled shutdown, and stable operation under varying load conditions. Built-in protection mechanisms shall support safe operation during abnormal conditions, including overload, overcurrent, thermal stress, and short-circuit events, thereby enhancing overall system reliability. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect device functionality or reliability. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, thermal characterization reports, qualification records, inspection reports, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #DCDCConverter #BuckConverter #PowerManagement #PowerElectronics #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #QualityAssurance #EngineeringDocumentation

EEPROM Memory IC 256Kbit I2C 1 MHz 450 ns 8-SO The M24256E-FMN6TP is a 256-Kbit (32 Kbyte) I²C-compatible serial EEPROM from STMicroelectronics. It is designed for reliable, non-volatile data storage in a wide range of electronic applications including consumer, industrial, and automotive systems. The device supports standard (100 kHz), fast (400 kHz), and fast-mode plus (1 MHz) I²C communication, enabling efficient data transfer. It features byte and page write operations, low power consumption, and a high endurance of write cycles, making it suitable for frequent data logging and configuration storage. Housed in a compact SO8 package, the device is optimized for space-constrained PCB designs while maintaining robust performance and data retention capabilities. Key Features Memory size: 256 Kbit (32 Kbyte) Interface: I²C (2-wire serial interface) Clock frequency: Standard mode: 100 kHz Fast mode: 400 kHz Fast-mode Plus: 1 MHz Supply voltage range: 1.7 V to 5.5 V Page write capability: up to 64 bytes Write cycle time: ~5 ms (typical) Data retention: > 200 years Endurance: > 4 million write cycles Hardware write protection available ESD protection and latch-up immunity Functional Description The device operates as a slave on the I²C bus and supports: Byte write and read Page write (up to 64 bytes) Random and sequential read operations Memory addressing is internally managed using a 16-bit address pointer, allowing access to the full 32 KB memory array. The device includes an internal write cycle controller, eliminating the need for external timing management. Pin Configuration (SO8 Package) A0, A1, A2: Device address inputs VSS: Ground SDA: Serial data line SCL: Serial clock line WC: Write control (hardware write protection) VCC: Supply voltage Absolute Maximum Ratings Supply voltage (VCC): -0.3 V to 6.5 V Input voltage: -0.3 V to VCC + 0.6 V Storage temperature: -65°C to +150°C Operating temperature (industrial grade): -40°C to +85°C Electrical Characteristics Low standby current: < 1 µA (typical) Operating current: < 1 mA Input/output compatible with CMOS logic levels Schmitt trigger inputs for noise immunity Timing Characteristics Write cycle time: 5 ms (typical) Fast-mode Plus support up to 1 MHz Sequential read supports continuous data streaming Package Information Package type: SO8 (8-lead Small Outline) Mounting: Surface-mount (SMD) Tape & reel packaging (TP suffix) Applications Configuration storage Calibration data storage Data logging systems Industrial control systems Consumer electronics Embedded systems requiring non-volatile memory Advantages High endurance and long data retention Wide voltage range (ideal for mixed-voltage systems) Compact footprint High-speed I²C compatibility (up to 1 MHz) #commonpartslibrary #integratedcircuit #memory

27.12 MHz ±10ppm Crystal 10pF 50 Ohms 4-SMD, No Lead # 7M-27.120MEEQ-T Crystal Unit Engineering Specification ## General Description The 7M-27.120MEEQ-T is a surface-mount quartz crystal resonator designed to provide a stable and accurate frequency reference for digital, wireless, communication, NFC, RFID, microcontroller, and embedded system applications. Manufactured by TXC Corporation, this crystal offers reliable frequency stability, low equivalent series resistance, and compact packaging suitable for space-constrained designs. Its surface-mount construction enables automated assembly while maintaining excellent electrical performance across a wide range of operating conditions. ## Features * Fundamental mode quartz crystal resonator * Surface-mount device package for automated PCB assembly * High frequency accuracy and stability * Low equivalent series resistance * Low power consumption * Suitable for clock generation and timing circuits * RoHS compliant construction * Reliable performance for industrial and consumer electronics applications ## Electrical Characteristics * Nominal Frequency: 27.120 MHz * Crystal Type: Fundamental Mode * Load Capacitance: 10 pF * Frequency Tolerance: ±20 ppm * Frequency Stability: ±20 ppm * Equivalent Series Resistance: 60 Ω Maximum * Drive Level: Low-power operation * Operating Temperature Range: Industrial grade * Storage Temperature Range: Extended environmental capability ## Mechanical Characteristics * Package Type: Surface-Mount Crystal * Mounting Style: SMD/SMT * Compact footprint optimized for high-density PCB layouts * Four-pad no-lead package construction ## Applications * PN532 NFC Controllers * RFID Readers and Writers * Microcontroller Clock Sources * Wireless Communication Modules * Embedded Systems * Industrial Control Electronics * Consumer Electronic Devices * IoT and Smart Device Platforms ## Compliance * RoHS Compliant * Lead-Free Construction * Suitable for Automated Assembly Processes #7M27_120MEEQT #TXC #CrystalResonator #SMDCrystal #QuartzCrystal #27_120MHz #PN532 #NFC #RFID #EmbeddedSystems #TimingReference #ElectronicsDesign

3A 125V 125V Fuse Board Mount (Cartridge Style Excluded) Surface Mount 2-SMD, Square End Block The CB61F3A-TR1 is a surface-mount fast-acting fuse from Eaton designed for overcurrent protection in compact electronic circuits. It belongs to the CB61F series of SMD “Brick” fuses and is commonly used in power supplies, battery management systems, consumer electronics, servers, and industrial equipment. Key Features Fast-acting fuse for rapid overcurrent protection Current rating: 3 A Voltage rating: 125 VAC / 125 VDC Surface-mount (SMD) package with compact 2410 footprint High interrupt rating: 100 A AC / 300 A DC Low cold resistance: approximately 0.025 Ω Reflow and wave solder compatible Lead-free, halogen-free, and RoHS compliant UL and safety agency approved (cULus, CQC, PSE) Suitable for: Power supplies Battery management systems (BMS) Consumer electronics Medical equipment Industrial electronics #CommonPartsLibrary #Fuse CB61F

39 mH @ 10 kHz 2 Line Common Mode Choke Through Hole 300mA DCR The 744821039 is a common mode choke (CMC) designed for power line filtering. It is used to suppress electromagnetic interference (EMI), particularly common-mode noise in AC/DC power circuits and switching power supplies. Type: Common mode choke (power line filter) Inductance: 39 mH @ 10 kHz Rated current: 300 mA Number of lines: 2-line configuration Mounting: Through-hole (radial/vertical, 4 pins) AC voltage rating: up to 250 V DC resistance: ~3 Ω max Operating temperature: −40°C to +125°C Blocks high-frequency noise on power lines Allows normal differential current (useful signal) to pass Improves EMC compliance of electronic systems Reduces radio interference (RFI) in circuits AC/DC power supply input filters Switch-mode power supplies (SMPS) Industrial electronics and motor drives Household appliances and embedded systems Devices without proper grounding (noise suppression) #CommonPartsLibrary #Inductor #WE-CMB

Voltage Level Translator Unidirectional 1 Circuit 2 Channel 200Mbps 8-X1SON (1.95x1) The TXU0202DTTR specification defines the engineering requirements for a dual-bit voltage level translator integrated circuit designed for bidirectional logic-level conversion between digital interfaces operating at different supply voltages. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable signal translation, high-speed communication, and long-term operational stability in embedded electronic systems. The device is intended for use in embedded controllers, microprocessor and microcontroller systems, communication interfaces, industrial automation equipment, consumer electronics, and portable devices requiring voltage compatibility between digital subsystems. It enables seamless signal transfer while preserving logic integrity, minimizing propagation delay, and supporting low-power operation in compact electronic designs. Engineering Requirements The voltage level translator shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure consistent electrical performance, low power consumption, and dependable long-term reliability. The device shall maintain stable operation under specified voltage, temperature, and environmental operating conditions. Electrical characteristics shall provide accurate bidirectional logic-level translation with low propagation delay, high noise immunity, and reliable input and output switching performance. The device shall maintain signal integrity during continuous operation, power sequencing, and dynamic switching conditions without introducing excessive distortion or timing errors. The integrated translation architecture shall support independent voltage domains while ensuring reliable communication between connected digital devices. The device shall maintain stable performance across varying supply voltages and logic frequencies while minimizing leakage current and preserving overall system efficiency. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical integrity and long-term reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of electrical or mechanical performance. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect functionality or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, timing diagrams, application guidelines, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #VoltageLevelTranslator #LogicLevelShifter #DigitalInterface #EmbeddedSystems #Semiconductor #SignalIntegrity #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

1.5µH Shielded Drum Core, Wirewound Inductor 1.9 A 137mOhm Max 0806 (2016 Metric) The Bourns SRP2010-1R5M is a 1.5 µH wirewound drum-core power inductor designed for high-current, low-loss power conversion applications such as buck/boost converters in compact electronics like smartphones, tablets, SSDs, and embedded systems. It uses a metal powder (iron powder) core with magnetic shielding, which helps reduce EMI (electromagnetic interference) and improves efficiency in high-frequency switching circuits. Key Features Inductance: 1.5 µH Tolerance: ±20% Current Rating (Irms): ~1.9 A Saturation Current (Isat): ~2.5 A Low DCR: ~137 mΩ max Shielded construction (reduces magnetic radiation) Wirewound drum core design Surface-mount package (0806 / 2016 metric) Operating temperature: -40°C to +125°C RoHS compliant Typical Applications DC-DC converters (buck / boost regulators) Power management circuits in mobile devices Laptops, tablets, smartphones SSD/HDD power filtering Embedded systems and IoT devices #CommonPartsLibrary #Inductor #Coil #Choke #Fixed-Inductor #SRP2010

IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.4, Matter, Thread, Zigbee® 47-XFBGA, WLCSP # NRF54L15-CAAA-R7 ## General Description The NRF54L15-CAAA-R7 is an ultra-low-power wireless System-on-Chip (SoC) developed by [Nordic Semiconductor](https://www.nordicsemi.com?utm_source=chatgpt.com) for advanced Internet of Things (IoT), industrial, medical, smart home, and wireless sensing applications. The device integrates a high-performance Arm Cortex-M33 processor, a dedicated RISC-V coprocessor, large embedded memory resources, and a multiprotocol 2.4 GHz radio subsystem into a compact package. It is designed to provide exceptional energy efficiency, robust wireless connectivity, and enhanced security while supporting modern wireless standards including Bluetooth® Low Energy, Matter, Thread, Zigbee®, Bluetooth Mesh, Amazon Sidewalk, and proprietary 2.4 GHz protocols. The device is optimized for battery-powered applications requiring extended operating life, high processing capability, and scalable connectivity solutions. ## Key Features ### Processing Architecture * 128 MHz Arm® Cortex®-M33 application processor * Integrated 128 MHz RISC-V coprocessor * TrustZone® security architecture ### Memory Resources * 1.5 MB Non-Volatile Memory (NVM) * 256 KB RAM ### Wireless Connectivity * Multiprotocol 2.4 GHz RF transceiver * Bluetooth® Low Energy support * Matter support * Thread support * Zigbee® support * Bluetooth Mesh support * Amazon Sidewalk support * Proprietary 2.4 GHz protocol support * Bluetooth Channel Sounding capability * Compatible with Wi-Fi companion devices ### RF Performance * Data rates up to 4 Mbps * Output power up to +8 dBm * High receiver sensitivity for extended wireless range ### Security Features * Hardware cryptographic engine * Side-channel attack protection * Tamper detection mechanisms * Secure boot and secure firmware update support ### Peripheral Interfaces * SPI * I²C (TWI) * UART * I²S * GPIO * ADC * PWM * PDM * NFC * QDEC ### Power Characteristics * Ultra-low-power operation * Optimized sleep modes * Battery-powered application support * Operating supply voltage from 1.7 V to 3.6 V ### Package Information * WLCSP package * Surface-mount technology * Industrial operating temperature support ## Applications * Smart Home Devices * Industrial IoT Systems * Wearable Electronics * Medical and Healthcare Devices * Asset Tracking Solutions * Wireless Sensors * Building Automation Systems * Smart Lighting Controls * Consumer Electronics * Connected Peripheral Devices #NordicSemiconductor #nRF54L15 #NRF54L15CAAAR7 #BluetoothLE #Matter #Thread #Zigbee #IoT #WirelessSoC #EmbeddedSystems #IndustrialIoT #SmartHome #LowPowerDesign #CortexM33 #RISCV

680 kOhms ±5% 0.25W, 1/4W Through Hole Resistor Axial Automotive AEC-Q200 Carbon Film The CFR-25JB-52-680K is a carbon film through-hole resistor designed for general-purpose electronic applications requiring stable resistance characteristics, reliable long-term performance, and cost-effective implementation. This resistor is commonly used in signal conditioning, voltage division, pull-up and pull-down networks, biasing circuits, and low-power analog or digital systems. Its axial leaded construction supports automated insertion and conventional through-hole assembly methods, making it suitable for consumer electronics, industrial controls, instrumentation, and embedded systems. The device utilizes carbon film resistive technology to provide dependable electrical performance with moderate noise characteristics and good environmental stability. The flame-retardant coating enhances mechanical durability and improves resistance against moisture and environmental exposure. The component is optimized for standard operating environments where compact size, stable operation, and economical design are required. Electrical Characteristics Resistance Value: 680 kΩ Resistance Tolerance: ±5% Resistor Technology: Carbon Film Rated Power Dissipation: 1/4 W Maximum Working Voltage: 250 V Maximum Overload Voltage: 500 V Temperature Coefficient: ±350 ppm/°C Insulation Resistance: High reliability insulation structure suitable for general electronic equipment Mechanical Characteristics Package Type: Axial Through-Hole Mounting Style: Through Hole Body Style: Cylindrical Flame-Retardant Coated Body Lead Material: Tin-Plated Copper Lead Configuration: Axial Leads for PCB insertion Environmental Characteristics Operating Temperature Range: −55°C to +155°C Moisture Resistance: Suitable for standard humidity environments Flame Resistance: Flame-retardant protective coating compliant with general safety requirements Applications Signal Conditioning Circuits Voltage Divider Networks Pull-Up and Pull-Down Resistors Industrial Control Electronics Consumer Electronic Products General Analog and Digital Circuitry Embedded Systems and Microcontroller Interfaces #commonpartslibrary #passivecomponents #resistor #carbonfilm #throughhole #axialresistor #powermanagement #analog #digital #industrialelectronics

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Ultra-Low-Power Voltage Supervisor (Reset IC) – Single-channel voltage supervisor designed for microcontrollers, processors, IoT devices, industrial control systems, automotive electronics, battery-powered equipment, and embedded systems requiring reliable power-on reset and brownout detection. The Texas Instruments TLV803EA30DBZR monitors a 3.0 V supply rail with a 3.08 V reset threshold, providing an active-low open-drain RESET output to ensure proper system initialization and recovery during undervoltage conditions. Features 250 nA typical quiescent current, 130 ms minimum reset timeout, supply voltage operation from 0.7 V to 6 V, and open-drain output for easy interfacing with multiple voltage domains. Includes power-on reset, brownout protection, and low-power operation, making it ideal for energy-efficient embedded applications. Operates over a −40°C to +125°C temperature range and is housed in a compact 3-pin SOT-23 (DBZ) package for surface-mount designs. #TexasInstruments #TLV803EA30DBZR #TLV803E #VoltageSupervisor #ResetIC #PowerOnReset #BrownoutDetection #LowPower #OpenDrain #PowerManagement #EmbeddedSystems #IndustrialElectronics

Connector Header Surface Mount, Right Angle 15 position 0.049" (1.25mm) The 0532611571 is a wire-to-board crimp housing connector manufactured by Molex, belonging to the Mini-Lock series. It is designed for compact, high-reliability connections in power and signal applications. This connector supports secure mating with corresponding headers and is commonly used in consumer electronics, industrial equipment, and automotive systems where space-saving and reliable contact are required. Key Features Compact wire-to-board connector system Positive locking mechanism for secure mating Designed for crimp terminal insertion Suitable for both power and signal transmission Polarized housing to prevent misalignment Friction lock for retention stability Mechanical Characteristics Number of positions: 15 Pitch: 2.50 mm Mounting type: Free-hanging (in-line) Contact termination: Crimp Housing material: Thermoplastic (UL-rated) Color: Natural (typical) Electrical Characteristics Rated voltage: Up to 250 V Current rating: Up to 3 A per contact (dependent on wire gauge and terminals used) Contact resistance: Low resistance design for reliable conduction Insulation resistance: High insulation performance Environmental Characteristics Operating temperature range: -40°C to +105°C RoHS compliant Suitable for standard environmental conditions in electronic assemblies Compatible Components Mating headers: Molex Mini-Lock series headers (2.50 mm pitch) Crimp terminals: Molex Mini-Lock crimp terminals (e.g., 50212 series) Applications Consumer electronics Industrial control systems Automotive electronics Power distribution within compact devices #commonpartslibrary #connector

USB-C (USB TYPE-C) USB 3.2 Gen 2 (USB 3.1 Gen 2, Superspeed + (USB 3.1)) Plug Connector 24 Position Board Edge, Surface Mount; Through Hole, Right Angle Global Connector Technology (GCT) USB4155-03-C is a USB Type-C Plug Connector designed for USB 3.2 Gen 2 (USB 3.1 Gen 2 SuperSpeed+) high-speed data applications. It is a right-angle, horizontal SMT connector with a 24-contact configuration, suitable for PCB edge mounting. The connector supports high-speed signal transmission, power delivery, and durable mechanical connection for embedded systems, portable devices, and consumer electronics. Key Features: Connector Type: USB Type-C Plug Connector USB Standard: USB 3.2 Gen 2 / USB 3.1 Gen 2 SuperSpeed+ Number of Contacts: 24 positions Mounting Type: Surface Mount Technology (SMT), right-angle horizontal PCB mounting Data Transfer Rate: Supports high-speed USB 3.2 Gen 2 communication (up to 10 Gbps) Current Rating: Up to 5 A for power delivery applications Voltage Rating: Up to 48 VDC Durability: Rated for approximately 10,000 mating cycles Shielding: Metal shielded housing for EMI protection Contact Finish: Gold-plated contacts for reliable conductivity Operating Temperature: -30°C to +85°C Application: Embedded systems, laptops, tablets, mobile devices, storage devices, and USB-C interface boards Component Classification: Category: Connector / Interconnect Component Subcategory: USB Type-C Connector Not an IC or semiconductor component PCB Footprint Required: Yes Mechanical Part: No (it is an electromechanical connector with soldered electrical terminals) #CommonPartsLibrary #Connector #USBTypeC #USBConnector #USB32Gen2 #USB31Gen2 #SuperSpeedPlus #GCT #BoardMountConnector #SMTConnector #HighSpeedInterface #PCBDesign #ElectronicComponents #InterconnectTechnology

Automotive 6.6 kW Surface-Mount TVS Diode – Unidirectional transient voltage suppressor (TVS) diode designed for automotive electronics, industrial power supplies, DC power rails, telecom equipment, battery protection, load dump suppression, and embedded circuit protection applications. The Littelfuse SM8S33A features a 33 V reverse standoff voltage (VRWM), 36.7 V minimum breakdown voltage, and 53.3 V maximum clamping voltage at a 132 A peak pulse current (10/1000 µs). Rated for 6.6 kW peak pulse power dissipation, it provides robust protection against ESD, lightning-induced surges, inductive switching transients, and automotive load dump events. Features AEC-Q101 qualification, low leakage current (2 µA typical), fast response time, and high surge capability for demanding environments. Packaged in a SMTO-263 (DO-218AB-compatible) surface-mount package, it operates over a −55°C to +175°C junction temperature range, making it ideal for high-reliability automotive and industrial designs. #Littelfuse #SM8S33A #TVSDiode #TransientVoltageSuppressor #CircuitProtection #ESDProtection #SurgeProtection #LoadDumpProtection #AECQ101 #AutomotiveElectronics #IndustrialElectronics #EmbeddedSystems

Red 630nm LED Indication - Discrete 1.95V 1206 (3216 Metric) APTR3216SURCK – Surface-mount RGB light-emitting diode in a compact 3528 package with a common-cathode configuration. Integrates red, green, and blue emitters within a single package, enabling full-color indication, color mixing, and visual status signaling. Suitable for consumer electronics, embedded systems, control panels, backlighting, decorative lighting, and user-interface applications. Designed for reliable operation, consistent brightness, and efficient PCB assembly in space-constrained designs. #RGBLED #CommonCathode #3528LED #SMDLED #IndicatorLED #ColorMixing #EmbeddedSystems #ConsumerElectronics #LightingDesign #PCBAssembly

10 µH Shielded Drum Core, Wirewound Inductor 7.5 A 30mOhm Max Nonstandard # Engineering Specification ## Product Name SRP1038A-100M ## General Description SRP1038A-100M is a shielded surface mount power inductor designed for use in high-efficiency DC-DC conversion and power management applications. The device is intended to support energy storage and current smoothing functions in switching regulator circuits, where stable inductance performance and low power loss are critical. The inductor utilizes a ferrite core construction with a shielded magnetic structure to minimize electromagnetic interference and reduce magnetic flux leakage. This enables improved circuit density and reduced noise coupling in compact electronic assemblies. The design is optimized for use in high current power conversion systems, including buck converters, point-of-load regulators, and distributed power architectures. The component is widely used in industrial, automotive, telecommunications, and embedded systems where reliable energy transfer, thermal stability, and efficient power delivery are required. Its surface mount form factor supports automated PCB assembly and compact system integration while maintaining mechanical robustness under thermal and electrical stress. The design emphasizes low direct current resistance, high current handling capability, and stable inductance behavior under load conditions. It is suitable for applications requiring efficient power conversion with minimal energy loss and stable electromagnetic performance. ## Functional Requirements ### Energy Storage The device shall store energy in a magnetic field during switching operation in power conversion circuits. ### Current Filtering The device shall smooth current ripple in switching regulator applications to maintain stable output conditions. ### Electromagnetic Shielding The device shall reduce electromagnetic interference through a shielded magnetic structure. ### Power Conversion Support The component shall support efficient operation in DC-DC conversion systems. ## Electrical Requirements ### Inductive Performance The device shall provide stable inductance characteristics suitable for power conversion and filtering applications. ### Low Loss Operation The inductor shall minimize resistive and core losses to improve overall system efficiency. ### High Current Capability The device shall support operation under elevated current conditions typical of switching power supplies. ### Thermal Stability The inductor shall maintain performance consistency under thermal loading and temperature variation. ## Mechanical Requirements ### Surface Mount Package The device shall be supplied in a surface mount configuration suitable for automated PCB assembly processes. ### Structural Integrity The component shall withstand mechanical stress during assembly, operation, and thermal cycling. ### PCB Integration The design shall support compact layout integration in multilayer printed circuit board systems. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under conditions typical of industrial and embedded electronic systems. ### Thermal Performance The component shall maintain stable operation under continuous power cycling and heat generation. ### Storage and Handling The device shall retain structural and electrical integrity during storage, transportation, and handling. ## Quality Requirements ### Reliability The inductor shall provide consistent long-term performance under continuous electrical and thermal stress. ### Verification Electrical and thermal characteristics shall be validated through appropriate qualification and testing procedures. ### Compliance The product shall conform to applicable standards for magnetic components used in power electronics applications. ## Documentation Requirements Technical documentation shall include application guidance, layout recommendations for switching power designs, thermal considerations, electrical characteristics, and integration practices for DC-DC converter systems. ## Classification Tags #SRP1038A100M #PowerInductor #ShieldedInductor #SMDInductor #MagneticComponent #EnergyStorageInductor #DCDCConverter #BuckConverter #PowerElectronics #SMPSDesign #ElectromagneticCompatibility #EMIShielding #PCBDesign #ElectricalEngineering #EmbeddedPower #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #PowerManagement #CircuitDesign #HighCurrentInductor

33µH Shielded Drum Core, Wirewound Inductor 8 A 58mOhm Max Nonstandard The SRP1265A-330M is a shielded wirewound power inductor from the Bourns SRP1265A series, designed for high-current DC-DC converters, voltage regulator modules, and power supply applications. It features a carbonyl powder core construction that provides high saturation current capability, low electromagnetic interference (EMI), and stable inductance characteristics in compact surface-mount packaging. The device is AEC-Q200 qualified, making it suitable for automotive and industrial environments. Key Features 33 µH inductance Shielded construction for reduced EMI High saturation current capability Carbonyl powder core Low DC resistance Surface-mount package Wirewound drum-core structure AEC-Q200 qualified RoHS compliant and halogen free Operating temperature up to +150 °C Suitable for high-current switching regulators and DC-DC converters Electrical Characteristics Inductance: 33 µH Tolerance: ±20% Current Rating: 8 A Saturation Current (Isat): 11 A DC Resistance (Max): 58 mΩ Self-Resonant Frequency: 5 MHz Typical Applications DC-DC converters Switching power supplies Automotive electronics EMI filtering Industrial power systems LED drivers Battery-powered equipment #CommonPartsLibrary #Inductor #SMD

Red, Green, Blue (RGB) 626nm Red, 528nm Green, 465nm Blue LED Indication - Discrete 2.15V Red, 2.65V Green, 2.85V Blue 6-PLCC The LRTBGWSR-4U4V-JW+8A8B-D8-3S4U-7Z is an automotive-grade RGB surface-mount LED from the OSIRE® E3635 family by ams OSRAM. It integrates independently controllable red, green, and blue LED chips within a compact 6-PLCC package, enabling precise color mixing and dynamic lighting effects. The device is designed for high-reliability applications requiring full-color illumination, status indication, ambient lighting, and display backlighting. Its wide viewing angle, high luminous intensity, and AEC-Q102 qualification make it suitable for automotive interior lighting, industrial controls, consumer electronics, and advanced human-machine interface applications. Features - Package: white PLCC-6 package, silicone resin - Chip technology: Thinfilm / Volume emitter on Sapphire (AlInGaN) - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 626 nm (● red); λdom = 528 nm (● true green); λdom = 465 nm (● blue) - Corrosion Robustness Class: 3B - Qualifications: AEC-Q102 Qualified - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) Applications - Ambient Lighting - Automotive Aftermarket #CommonPartsLibrary #LED #RGBLED #OSRAM #amsOSRAM #OSIREE3635 #AutomotiveLED #AECQ102 #SMDLED #PLCC6 #IndicatorLED #AmbientLighting #ColorMixing #LRTBGWSR_4U4V_JW_8A8B_D8_3S4U_7Z

ARM® Cortex®-M33 RA6E1 Microcontroller IC 32-Bit 200MHz 1MB (1M x 8) FLASH 64-LFQFP (10x10) ## Engineering Specification ## General Description The **R7FA6E10F2CFM#AA0** is a Renesas Electronics **RA6E1 series microcontroller** designed for embedded control, industrial electronics, IoT edge devices, automation systems, and general-purpose connected applications. It is built around an **Arm Cortex-M33 processor with TrustZone support**, providing high performance, secure execution capability, and flexible integration for modern embedded designs. ## Device Identification Manufacturer Part Number: **R7FA6E10F2CFM#AA0** Manufacturer: **Renesas Electronics** Product Family: **RA Family** Series: **RA6 Series** Group: **RA6E1 Group** Device Category: **Integrated Circuit** Device Type: **Microcontroller Unit** ## Core and Processing The device uses an **Arm Cortex-M33 core** and is intended for high-performance embedded processing. It supports secure application development through TrustZone technology and is suitable for systems requiring reliable control, fast response, and efficient software execution. ## Memory Configuration The microcontroller includes program flash memory, data flash memory, and SRAM resources suitable for embedded firmware, application code, configuration storage, and runtime processing requirements. ## Package and Mechanical Description The component is supplied in an **LQFP surface-mount package**, making it suitable for compact printed circuit board layouts and standard automated assembly processes. ## Electrical and Operating Description The device is designed for low-voltage embedded systems and supports operation across an industrial temperature range. It is suitable for products requiring stable performance in controlled, commercial, or industrial operating environments. ## Communication and Interface Support The device supports common embedded communication interfaces such as USB, UART, SPI, I²C, QSPI, and CAN, allowing integration with sensors, displays, external memory, communication modules, and other peripheral devices. ## Analog and Control Features The microcontroller includes analog conversion capability, timer functions, PWM support, watchdog protection, reset monitoring, and low-voltage detection features. These functions make it suitable for control systems, monitoring equipment, and mixed-signal embedded applications. ## Security and Debug Features The device supports embedded security functions including TrustZone, unique device identification, and true random number generation. Debug and development access is supported through standard JTAG and SWD interfaces. ## Application Suitability This device is suitable for embedded controllers, IoT devices, industrial automation, metering equipment, appliance control, USB-connected products, sensor-based systems, and general electronic control applications requiring a compact and secure microcontroller solution. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #renesas #renesaselectronics #ra6e1 #ra6series #armcortexm33 #embeddedsystems #electronicscomponents #semiconductor #mcu #iotdevices #industrialautomation #pcbdesign #electronicparts #componentlibrary #engineeringparts #hardwaredesign #electronicsengineering

1000 pF ±10% 2000V (2kV) Ceramic Capacitor X7R 1808 (4520 Metric) ## Engineering Specification ## General Description The **C4520X7R3D102K130KE** is a TDK multilayer ceramic chip capacitor designed for high-voltage surface-mount applications. It uses X7R dielectric material and is suitable for circuits requiring stable ceramic capacitance, compact PCB mounting, and reliable high-voltage performance. The component is commonly used in power supplies, filtering circuits, coupling circuits, snubber networks, voltage multiplier circuits, and general electronic assemblies requiring a high-voltage MLCC solution. ## Device Identification Manufacturer Part Number: **C4520X7R3D102K130KE** Manufacturer: **TDK Corporation** Product Series: **C Series** Device Category: **Passive Electronic Component** Device Type: **Multilayer Ceramic Chip Capacitor** Capacitor Type: **Surface-Mount MLCC** Application Grade: **Commercial Grade** ## Functional Description The device functions as a fixed-value ceramic capacitor for energy storage, noise suppression, coupling, decoupling, and filtering applications. It is designed to provide capacitance in a compact surface-mount package while supporting high-voltage operation. The X7R dielectric provides usable capacitance stability across a wide operating temperature range, making the component suitable for many general-purpose and power-related electronic designs. ## Electrical Description The capacitor has a nominal capacitance of **1000 pF** with **±10% tolerance** and a rated voltage of **2000 V DC**. It uses **X7R dielectric characteristics**, making it suitable for applications where moderate capacitance stability and high-voltage capability are required. The device should be operated within the manufacturer’s specified electrical limits to maintain reliability and performance. ## Mechanical Description The component is supplied in a **C4520 metric package**, equivalent to **EIA 1808** chip size. It is designed for surface-mount PCB installation using reflow soldering. The package includes soft termination construction, which helps reduce mechanical stress on the ceramic body and solder joints during board flexing or thermal cycling. ## Material and Construction Description The device is constructed as a multilayer ceramic capacitor using ceramic dielectric layers and internal electrode structures. The soft termination design improves board-level reliability by helping absorb mechanical strain between the PCB and capacitor body. This construction is useful in applications where vibration, thermal expansion, or board bending may affect component reliability. ## Mounting and Assembly Description The capacitor is intended for surface-mount assembly using reflow soldering. PCB land pattern, solder paste volume, component placement, and reflow profile should follow TDK recommendations. Proper spacing, voltage clearance, and creepage considerations should be applied because the component is used in high-voltage circuits. ## Application Suitability The **C4520X7R3D102K130KE** is suitable for high-voltage filtering, DC blocking, coupling, decoupling, power supply circuits, snubber circuits, inverter circuits, lighting equipment, industrial electronics, measurement equipment, and general PCB assemblies requiring a compact high-voltage ceramic capacitor. ## Design Considerations The design should account for rated voltage, capacitance tolerance, DC bias behavior, temperature characteristics, insulation resistance, soldering conditions, mechanical stress, board flex, creepage distance, and clearance distance. For high-voltage applications, PCB layout should provide adequate spacing and avoid contamination paths that may reduce insulation performance. The capacitor should not be used beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #capacitor #ceramiccapacitor #mlcc #tdk #tdkcapacitor #cseries #c4520 #x7r #highvoltagecapacitor #smdcapacitor #surfacemount #passivecomponent #electronicparts #electronicscomponents #pcbdesign #hardwaredesign #powersupply #filteringcircuit #snubbercircuit #decouplingcapacitor #industrialelectronics #componentlibrary #engineeringparts #electronicsengineering

Digital Potentiometer 10k Ohm 4 Circuit 257 Taps I2C Interface 20-TSSOP # Engineering Specification ## Product Name MCP4461-103E/ST ## General Description MCP4461-103E/ST is a non-volatile digital potentiometer integrated circuit designed to provide electronically programmable resistance adjustment for analog and mixed-signal applications. The device enables precise digital control of resistance values through a serial communication interface, eliminating the need for manual potentiometer adjustments and enhancing system automation capabilities. The component integrates multiple resistor networks, non-volatile memory, and digital control logic within a compact package, making it suitable for signal conditioning, gain adjustment, calibration, offset trimming, volume control, and configuration management applications. The design supports reliable operation in embedded systems, industrial electronics, instrumentation equipment, communication devices, and consumer products requiring programmable analog control. The device is optimized for ease of integration, low power consumption, repeatable performance, and long-term reliability. Non-volatile memory functionality allows resistance settings to be retained during power interruptions, supporting consistent system behavior and simplified startup configuration. ## Functional Requirements ### Digital Resistance Control The device shall provide programmable resistance adjustment through a digital communication interface. ### Non-Volatile Memory Operation The device shall retain programmed resistance settings when power is removed and restore stored values upon power-up. ### Multi-Channel Adjustment The device shall support independent control of multiple resistance channels for flexible system configuration. ### Analog Signal Conditioning The device shall support use in gain control, calibration, bias adjustment, offset correction, and signal tuning applications. ## Electrical Requirements ### Power Supply Compatibility The device shall operate from standard low-voltage electronic power supply rails suitable for embedded and industrial systems. ### Digital Communication The device shall support serial communication for configuration, programming, and control of internal resistance networks. ### Resistance Network Performance The device shall provide repeatable and stable resistance adjustment characteristics throughout normal operating conditions. ### Low Power Operation The device shall minimize power consumption while maintaining functional performance and memory retention capability. ### Noise and Signal Integrity The design shall support accurate analog signal processing with minimal impact on system performance. ## Mechanical Requirements ### Package Construction The component shall be supplied in a surface-mount package suitable for automated PCB assembly processes. ### Board Integration The device shall support standard printed circuit board mounting practices and electronic manufacturing workflows. ### Structural Reliability The package shall maintain electrical and mechanical integrity during handling, assembly, and operational service. ## Environmental Requirements ### Operating Environment The device shall operate reliably within environmental conditions commonly encountered in commercial and industrial electronic equipment. ### Storage Conditions The component shall maintain functional and physical integrity during storage, transportation, and inventory management activities. ### Environmental Robustness The design shall support stable operation under expected temperature and humidity variations within specified application environments. ## Quality Requirements ### Reliability The device shall provide consistent long-term performance with stable resistance characteristics and memory retention capability. ### Verification Electrical functionality, communication performance, memory operation, and resistance adjustment behavior shall be validated through applicable testing procedures. ### Compliance The product shall conform to relevant semiconductor manufacturing, quality assurance, and electronic component standards. ## Documentation Requirements Technical documentation shall include device functionality, communication interface requirements, programming guidelines, application recommendations, electrical characteristics, package information, and reliability considerations. ## Classification Tags #MCP4461 #MCP4461103EST #DigitalPotentiometer #NonVolatileMemory #IntegratedCircuit #ICComponent #AnalogElectronics #MixedSignalDesign #SignalConditioning #GainControl #CalibrationCircuit #EmbeddedSystems #ElectronicComponents #ElectricalEngineering #PCBDesign #CircuitDesign #IndustrialElectronics #Instrumentation #CommonPartsLibrary #EngineeringSpecification #ComponentLibrary #TechnicalDocumentation #SystemIntegration #HardwareDevelopment #ReliabilityEngineering

Connector Header Surface Mount 20 position 0.100" (2.54mm) The 3020-20-0300-00 is a shrouded rectangular male header connector manufactured by CNC Tech for board-to-cable interconnection applications. It features a dual-row, surface-mount design with a standard 2.54 mm pitch, making it suitable for signal and low-power connections in industrial, consumer, and embedded electronic systems. The connector incorporates gold-plated brass contacts for reliable electrical performance and a high-temperature nylon housing that provides excellent mechanical durability and insulation characteristics. The integrated keying slot and fully shrouded construction help ensure proper mating orientation and secure connections during assembly and operation. Key Features Dual-row male header connector Surface-mount (SMT) termination Standard 2.54 mm contact pitch 20-position configuration Shrouded four-wall housing for mating protection Integrated keying slot for polarization Gold-plated contact surfaces for improved conductivity and corrosion resistance Brass contact material for mechanical strength High-temperature PA9T nylon insulator UL94 V-0 flame-retardant housing material Operating temperature range suitable for industrial environments Board-to-cable/wire interconnection design Square contact geometry for reliable mating RoHS-compliant construction Rated for up to 3 A current per contact under specified conditions #CommonPartsLibrary #Connector #Header #MaleHeader #SMT #BoardToCable #CNCTech #Interconnect #ShroudedHeader #2p54mmPitch #Electronics #EmbeddedSystems #3020_20_0300_00

ADC, Audio 32 b 7.35k ~ 768k I2C, I2S, TDM 20-WQFN (3x3) The TLV320ADC3120IRTER is a low-power, high-performance stereo audio analog-to-digital converter designed for voice, audio capture, and digital signal processing applications. The device integrates programmable microphone bias generation, low-noise input amplifiers, digital filtering, automatic gain control, and high-resolution audio conversion into a compact package. It supports a wide range of analog microphone and line-level input configurations while delivering excellent audio fidelity and power efficiency. The converter is optimized for portable electronics, smart devices, industrial audio systems, communication equipment, and embedded voice-processing applications requiring high-quality audio digitization. Engineering Specifications Manufacturer: Texas Instruments Part Number: TLV320ADC3120IRTER Device Type: Stereo Audio Analog-to-Digital Converter Audio Channels: Stereo Input Architecture Converter Type: Sigma-Delta Analog-to-Digital Converter Resolution: High-Resolution Audio Conversion Input Configuration: Differential and Single-Ended Inputs Microphone Support: Integrated Microphone Bias Generation Programmable Gain: Integrated Low-Noise Programmable Gain Amplifiers Digital Processing: Integrated Digital Filters Automatic Gain Control: Supported Audio Interface: Digital Audio Serial Interface Power Consumption: Low Power Operation Clocking Support: Flexible Audio Clock Configuration Noise Performance: Low Noise Audio Acquisition Dynamic Range: High Dynamic Range Package Type: WQFN Package Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Voice Capture Systems, Smart Speakers, Audio Recording Equipment, Industrial Audio Devices, Communication Systems, Embedded Audio Platforms, Human Machine Interfaces, Portable Electronics Key Features High-performance stereo audio conversion Integrated microphone bias circuitry Low-noise programmable gain amplifiers Automatic gain control functionality Flexible digital audio interface support Optimized for voice and audio capture applications Low power consumption for portable devices Integrated digital signal processing features High audio fidelity and dynamic range Compact surface-mount package for space-constrained designs #TLV320ADC3120IRTER #TexasInstruments #AudioADC #AudioConverter #StereoADC #DigitalAudio #VoiceCapture #AudioProcessing #EmbeddedAudio #MicrophoneInterface #AudioElectronics #DSP #IndustrialElectronics #SmartDevices #PortableElectronics #SignalProcessing #SurfaceMount #ElectronicComponents #PCBDesign #AudioSystemDesign

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A 8-SOIC (0.154", 3.90mm Width) # L6982N33DR ## General Description The L6982N33DR is a high-efficiency synchronous step-down switching regulator manufactured by STMicroelectronics. It is designed to provide a fixed regulated output voltage from a wide input voltage range while maintaining excellent conversion efficiency and low power dissipation. The device integrates high-side and low-side power MOSFETs, control circuitry, protection features, and compensation functions within a compact package, reducing external component count and simplifying power supply design. Its robust architecture makes it suitable for industrial automation systems, distributed power architectures, telecommunications equipment, embedded systems, consumer electronics, smart devices, and battery-powered applications requiring efficient DC-to-DC voltage conversion. ## Key Features ### Power Conversion Architecture * Synchronous buck regulator topology * Fixed output voltage regulation * Integrated power MOSFETs * High-efficiency power conversion * Optimized switching performance * Reduced external component requirements ### Electrical Characteristics * Wide input voltage operating range * Stable output voltage regulation * High conversion efficiency * Low standby power consumption * Fast transient response * Low output ripple performance ### Control Features * Current-mode control architecture * Internal compensation circuitry * Soft-start functionality * Frequency synchronization capability * Stable operation under varying load conditions ### Protection Features * Overcurrent protection * Short-circuit protection * Thermal shutdown protection * Undervoltage lockout protection * Safe startup operation * Enhanced system reliability ### Power Management * Low-power operating modes * Energy-efficient design * Suitable for battery-powered systems * Optimized thermal performance * Reduced power dissipation ### Package Characteristics * Surface-mount package * Compact footprint * Automated assembly compatible * High-density PCB design support * Industrial-grade packaging ### Material Construction * Monolithic integrated power management solution * Lead-free package materials * RoHS-compliant construction * High-reliability semiconductor technology ### Environmental Characteristics * Suitable for industrial operating environments * Long operational service life * Reliable continuous operation * Robust thermal performance ### Application Areas * Industrial Automation Equipment * Embedded Systems * Microcontroller Power Supplies * FPGA and Processor Power Rails * Telecommunications Equipment * Smart Metering Systems * Consumer Electronics * Building Automation Systems * Distributed Power Architectures * Battery-Powered Devices * IoT Products * Power Management Modules ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Management Solution ## Manufacturer STMicroelectronics ## Product Family L6982 Synchronous Step-Down Switching Regulator Series #L6982N33DR #STMicroelectronics #BuckConverter #DCtoDCConverter #SwitchingRegulator #PowerManagement #PowerSupplyDesign #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #PowerElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SMPS

2.2µH Unshielded Molded Inductor 17 A 3.7mOhm 2-SMD, J-Lead The MPL-AY1265-2R2 is a 2.2 µH surface-mount molded power inductor from Monolithic Power Systems (MPS). It is designed for high-current DC-DC switching power supplies and power management applications requiring low DC resistance (DCR), high efficiency, and stable inductance over a wide operating temperature range. Its molded construction minimizes audible noise and provides excellent mechanical reliability for compact, high-performance electronic designs. Key Features 2.2 µH inductance with ±20% tolerance High rated current: up to 17 A Low DC resistance: 3.7 mΩ typ. (4.3 mΩ max.) Soft saturation characteristics for improved reliability Molded construction for enhanced durability and reduced EMI Low audible noise during switching operation Stable performance across a wide temperature range Operating temperature: −40°C to +155°C Compact SMD package: 13.5 × 12.6 × 6.2 mm RoHS/REACH compliant and halogen-free Typical Applications Battery-powered devices Portable electronics Embedded computing systems High-current switching mode power supplies (SMPS) High-frequency DC-DC converters Point-of-load (POL) converters FPGA power rails #MoldedInductor #PowerInductor #2_2uH #HighCurrent #LowDCR #SMPS #DCDCConverter #PowerManagement #SMD #MonolithicPowerSystems #RoHS #EmbeddedSystems