Thermal Image Sensor 32H x 24V TO-39
MLX90640ESF-BAB-000-TU Engineering Specifications
General Description
The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact.
The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment.
The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements.
Engineering Specifications
Manufacturer: Melexis
Manufacturer Part Number: MLX90640ESF-BAB-000-TU
Component Type: Infrared thermal imaging sensor
Sensor Technology: Microbolometer thermal sensor array
Measurement Method: Non-contact infrared temperature sensing
Output Type: Digital thermal image data
Communication Interface: I²C-compatible serial interface
Temperature Measurement Capability: Object temperature monitoring and thermal imaging
Thermal Imaging Function: Real-time thermal map generation
Integrated Processing: On-chip signal processing and calibration management
Calibration: Factory calibrated with stored calibration parameters
Power Supply Configuration: Single-supply operation
Power Consumption: Optimized for low-power embedded applications
Refresh Rate: Programmable thermal frame refresh operation
Thermal Sensitivity: High-sensitivity infrared detection
Field of View Variant: Wide-angle thermal imaging configuration
Accuracy Characteristics: High-precision temperature measurement with integrated compensation algorithms
Memory Features: Internal EEPROM for calibration coefficients
Operating Mode: Continuous and programmable thermal acquisition
Data Output Format: Digital temperature and thermal pixel information
Environmental Stability: Designed for reliable operation across varying ambient conditions
Electromagnetic Compatibility: Suitable for embedded and industrial electronic systems
Package Type: Surface-mount package with infrared-transparent window
Mounting Style: Surface mount technology
Package Construction: Reflow-solderable assembly
Lead Finish: Lead-free finish
Environmental Compliance: RoHS compliant and halogen-free
Reliability Features: Factory-tested and production-calibrated thermal imaging device
Typical Applications
Thermal cameras
Human presence detection systems
Occupancy monitoring
Industrial predictive maintenance
Electrical equipment inspection
Smart building automation
HVAC monitoring systems
Medical screening devices
Consumer electronics
Robotics and autonomous systems
Fire detection and prevention systems
Industrial process monitoring
Energy management systems
Automotive thermal sensing applications
Security and surveillance equipment