RF ANTENNA Bluetooth, Wi-Fi, WLAN, Zigbee™ Ceramic Patch Solder Surface Mount The SWLP.2450.10.4.A.02 specification defines the engineering requirements for a surface-mount radio frequency antenna designed for wireless communication applications operating within the 2.4 GHz frequency band. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure efficient RF transmission and reception, stable antenna performance, and long-term operational reliability in embedded electronic systems. The antenna is intended for use in wireless communication devices supporting technologies such as Bluetooth, Wi-Fi, Zigbee, Thread, and other 2.4 GHz ISM band protocols. It is optimized for compact PCB integration while providing efficient radiation characteristics, stable impedance matching, and dependable performance in space-constrained electronic products including IoT devices, industrial controllers, consumer electronics, and smart sensing platforms. Engineering Requirements The antenna shall be manufactured using qualified conductive and dielectric materials with controlled production processes to ensure consistent RF performance, mechanical durability, and long-term reliability. The construction shall maintain stable electrical characteristics throughout the specified operating temperature and environmental conditions. Electrical characteristics shall provide efficient radiation efficiency, stable impedance matching, low return loss, and reliable signal transmission and reception across the intended operating frequency range. The antenna shall maintain consistent performance when integrated according to the recommended PCB layout and grounding practices. The RF structure shall minimize insertion losses and support reliable wireless communication while maintaining acceptable gain, bandwidth, and radiation pattern characteristics. The antenna shall exhibit stable performance under normal operating conditions without significant degradation caused by thermal variation or environmental exposure. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand vibration, thermal cycling, mechanical handling, and environmental stress without degradation of electrical or structural performance. Workmanship shall be free from defects including cracks, contamination, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, impedance matching recommendations, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFAntenna #WirelessCommunication #Antenna #Bluetooth #WiFi #IoT #EmbeddedSystems #QualityAssurance #EngineeringDocumentation

Samacsys Import 400KB 22 3V~3.6V RISC-V 160MHz QFN-32-EP(5x5) Microcontroller Units (MCUs/MPUs/SOCs) ROHS QFN50P500X500X90-33N-D https://www.espressif.com/sites/default/files/documentation/esp32-c3_datasheet_en.pdf Ultra-Low-Power SoC with RISC-V Single-Core CPU 0.9 Espressif Systems ESP32-C3 356-ESP32-C3 https://www.mouser.co.uk/ProductDetail/Espressif-Systems/ESP32-C3?qs=iLbezkQI%252BsiMXe7tMG%252Bo%2FA%3D%3D #IoT #WiFi #Bluetooth #esp32 #riscv #part

802.15.4, Bluetooth, WiFi 802.11ax, Bluetooth v5.0, Zigbee® Transceiver Module 2.4GHz PCB Trace Surface Mount #WiFi #bluetooth #Zigbee #MCU #IoT #ARM

802.15.4 Bluetooth, Wi-Fi Bluetooth v5.0, ZigBee® Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N4 is based on the ESP32-C6 single-core RISC-V microcontroller, integrating advanced wireless standards and secure connectivity in a small module format. It is designed for next-generation IoT devices that require Wi-Fi 6 efficiency, mesh networking, and Bluetooth Low Energy support. Processor: 32-bit RISC-V single-core CPU (up to 160 MHz) Wireless Connectivity: Wi-Fi 6 (802.11ax, 2.4 GHz) Bluetooth LE 5.0 IEEE 802.15.4 (Thread / Zigbee support) Memory (N4 variant): 4 MB Flash Security: Secure boot Flash encryption Cryptographic hardware acceleration #commonpartslibrary #rf #wireless #transceiver #module #zigbee

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount #WiFi #Bluetooth #ESP32 #MCU #ARM #IoT #S3

Bluetooth, WiFi 802.11b/g/n, Bluetooth v4.2 +EDR, Class 1, 2 and 3 Transceiver Module 2.4GHz ~ 2.5GHz Antenna Not Included, U.FL Surface Mount #Module #RF-Transceiver #Modem

Bluetooth, WiFi 802.11b/g/n, Bluetooth v4.2 +EDR, Class 1, 2 and 3 Transceiver Module 2.4GHz ~ 2.5GHz PCB Trace Surface Mount #Module #RF #Transceiver #ESP32

IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.1, Thread, Zigbee® 2.4GHz 94-VFQFN Dual Rows, Exposed Pad #CommonPartsLibrary #IntegratedCircuit #RF #Transceiver #Bluetooth

The Wio-WM1110 is a fusion positioning module for developing low-power, long-range IoT applications. It's embedded with Semtech LR1110 and Nordic nRF52840, features Semtech's LoRa technology for long-range wireless communication, GNSS, Wi-Fi, and Bluetooth for location tracking services.

802.15.4, Bluetooth, WiFi Bluetooth v5.0, Zigbee Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C6-WROOM-1-N8 integrates a 32-bit RISC-V single-core processor running up to 160 MHz, along with 8 MB of embedded SPI flash memory. It supports multiple wireless communication protocols, including: Wi-Fi 6 (802.11ax) in the 2.4 GHz band for improved efficiency and lower latency Bluetooth Low Energy (BLE 5) for short-range communication IEEE 802.15.4 for protocols such as Thread and Zigbee The module features a built-in PCB antenna, RF circuitry, crystal oscillator, and passive components, making it a complete solution that simplifies hardware design. It provides a wide range of GPIO pins and peripheral interfaces such as UART, SPI, I2C, PWM, ADC, and more, enabling flexible integration with sensors and external devices. Designed for low power consumption, it includes multiple power-saving modes, making it suitable for battery-powered applications. Typical Applications Smart home and IoT devices Wireless sensors and control systems Industrial automation Smart lighting and energy management Matter-compatible devices (via Thread support)

802.15.4, Bluetooth Bluetooth v5.2, Zigbee® Transceiver Module 2.36GHz ~ 2.5GHz Integrated, Chip Surface Mount #CommonPartsLibrary #RF #Bluetooth #Transceiver #Module

- ESP32, WT32-ETH01 Transceiver; 802.11 b/g/n/e/i (Wi-Fi, WiFi, WLAN), Bluetooth® Smart 4.x Low Energy (BLE) 2.4GHz ~ 2.5GHz Evaluation Board #CommonPartsLibrary #DevelopmentBoard #RF #EvaluationBoard #Wifi #Bluetooth #Module

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mountt #RF #wifi #ESP32S2 #CommonPartsLibrary #MCU #module

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz Antenna Not Included, U.FL Surface Mount #bluetooth #WiFi #ESP32 #IoT #part

The Wio Terminal is a SAMD51-based microcontroller with Wireless Connectivity powered by Realtek RTL8720DN that’s compatible with Arduino and MicroPython. Currently, wireless connectivity is only supported by Arduino. It runs at 120MHz (Boost up to 200MHz), 4MB External Flash and 192KB RAM. It supports both Bluetooth and Wi-Fi providing backbone for IoT projects. This repository contains all the necessary documentation you need to manufacture Wio Terminal: https://github.com/Seeed-Studio/OSHW-WioTerminal

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-2-N32R16V is a powerful dual-core microcontroller module that integrates wireless connectivity, large memory, and hardware acceleration for AI and signal processing tasks. It is particularly suited for applications requiring edge AI, voice recognition, and high-speed data processing, while still maintaining low power consumption. Dual-core Xtensa LX7 CPU Up to 240 MHz Includes vector instructions for AI and DSP workloads Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE) N32 → 32 MB external Flash R16 → 16 MB PSRAM Built for memory-intensive applications #commonpartslibrary #transceiver #wireless #rf

Bluetooth, WiFi 802.11b/g/n, Bluetooth v4.2 +EDR Transceiver Module 2.4GHz ~ 2.5GHz Antenna Not Included, I-PEX Surface Mount

2.45GHz Bluetooth, ISM, Wi-Fi, Zigbee™ Chip RF Antenna 2.4GHz ~ 2.5GHz 5.05dBi Solder Surface Mount #RF #Antenna #3216

802.15.4, Bluetooth, WiFi 802.11b/g/n/ac/ax, Bluetooth v5.0, Thread, Zigbee® Transceiver Module 2.412GHz ~ 2.484GHz, 5.18GHz ~ 5.885GHz PCB Trace Surface Mount #Module #ESP32-C5 #part

Bluetooth, WiFi Transceiver Module 2.4GHz ~ 2.5GHz - Surface Mount #Microcontrollers

Bluetooth, WiFi 802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 Transceiver Module 2.4GHz PCB Trace Surface Mount Wi-Fi + Bluetooth module designed for wireless connectivity in embedded applications, integrating the ESP32 dual-core 32-bit LX6 microprocessor with 2.4 GHz Wi-Fi (802.11 b/g/n) and Bluetooth v4.2 BR/EDR + BLE. It operates from a 3.0 V to 3.6 V supply, features 8 MB SPI flash and 2 MB PSRAM, and provides multiple peripheral interfaces including UART, SPI, I²C, I²S, SD/SDIO, PWM, ADC, DAC, CAN (TWAI®), and Ethernet MAC. #WiFiModule #BluetoothModule #ESP32 #Espressif #2_4GHz #BluetoothLE #BluetoothBR_EDR #DualCore #Embedded #IoT #SPIFlash #PSRAM #UART #SPI #I2C #I2S #SDIO #PWM #ADC #DAC #TWAI #EthernetMAC