Optical Sensor Ambient I2C 6-UDFN Exposed Pad ## Engineering Specification ## General Description The **MAX44009EDT+T** is an Analog Devices / Maxim Integrated digital ambient light sensor designed for portable electronics, display brightness control, industrial sensors, embedded systems, and low-power optical sensing applications. It integrates an ambient light photodiode, signal conditioning, analog-to-digital conversion, and an I²C digital output interface in a compact surface-mount package. The device is suitable for systems requiring automatic brightness adjustment, low current consumption, and light measurement behavior that closely follows human-eye response. ## Device Identification Manufacturer Part Number: **MAX44009EDT+T** Manufacturer: **Analog Devices / Maxim Integrated** Product Series: **MAX44009** Device Category: **Sensor Integrated Circuit** Device Type: **Digital Ambient Light Sensor** Sensor Interface: **I²C Digital Output** Mounting Type: **Surface Mount** Package Type: **UTDFN-Opto / UDFN** ## Functional Description The device functions as a digital ambient light sensor that measures surrounding light intensity and reports the measurement through an I²C interface. It is designed to help electronic systems adjust display brightness, conserve power, improve user visibility, and respond to changes in lighting conditions. The integrated optical sensing and digital conversion circuitry reduce the need for external analog signal-conditioning components. ## Optical Sensing Description The sensor includes an on-chip photodiode with spectral response optimized to approximate human-eye sensitivity. It also incorporates infrared and ultraviolet blocking capability to improve ambient light measurement accuracy. The adaptive gain function automatically selects the appropriate measurement range, allowing the device to operate across very low-light and bright-light conditions. ## Electrical Description The **MAX44009EDT+T** operates from a low-voltage supply range and is optimized for ultra-low power consumption. It supports digital communication through an I²C interface and is suitable for battery-powered and energy-sensitive systems. Proper supply decoupling, pull-up resistor selection, and bus voltage compatibility should be considered during circuit design. ## Package and Mechanical Description The component is supplied in a compact surface-mount optical package suitable for space-constrained printed circuit board designs. The package is intended for placement where the optical sensing window has access to ambient light while maintaining proper mechanical protection from contamination, shadowing, and enclosure obstruction. ## Interface and Control Description The device communicates with a host microcontroller or processor through an I²C digital interface. The host can read ambient light data and configure device behavior through register-based communication. The selectable I²C addressing feature supports flexible integration in systems that may include multiple I²C peripherals. ## Mounting and Assembly Description The **MAX44009EDT+T** is intended for surface-mount PCB assembly using standard reflow soldering processes. PCB layout should follow the manufacturer’s recommended footprint and assembly guidance. The optical sensing area should remain unobstructed, clean, and aligned with the product enclosure opening or light pipe when used. ## Application Suitability The device is suitable for smartphones, tablets, notebooks, wearable electronics, handheld devices, display brightness control, industrial light sensing, smart home devices, battery-powered equipment, sensor modules, and embedded systems requiring digital ambient light detection. ## Design Considerations The design should account for sensor placement, optical window design, enclosure transparency, light pipe geometry, I²C bus pull-up values, supply voltage compatibility, ambient interference, temperature conditions, and contamination protection. The sensor should not be blocked by opaque materials or placed where shadows, reflections, or nearby LEDs may distort the measured ambient light level. ## Hashtags #commonpartslibrary #integratedcircuit #sensor #ambientlightsensor #digitalsensor #opticalsensor #analogdevices #maximintegrated #max44009 #max44009edt #i2csensor #lightmeasurement #brightnesscontrol #lowpowersensor #portableelectronics #displaycontrol #embeddedhardware #embeddeddesign #smdcomponent #surfacemount #utdfnpackage #uDFNpackage #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

4/4 Transceiver Full MII, RMII 32-VQFN (5x5) ## Engineering Specification ## General Description The **LAN8770M-I/PRA** is a Microchip Technology single-port **100BASE-T1 Ethernet physical layer transceiver** designed for automotive, industrial, and embedded networking applications. It provides Ethernet communication over a single balanced twisted pair and is suitable for compact systems requiring reliable network connectivity, low-power operation, and standard MAC interface support. The device is commonly used in automotive electronic control units, infotainment systems, telematics modules, sensor nodes, industrial control systems, and embedded Ethernet hardware. ## Device Identification Manufacturer Part Number: **LAN8770M-I/PRA** Manufacturer: **Microchip Technology** Product Family: **LAN8770** Device Category: **Integrated Circuit** Device Type: **Ethernet PHY Transceiver** Ethernet Standard: **100BASE-T1** Interface Type: **MII and RMII** Mounting Type: **Surface Mount** Package Type: **VQFN** ## Functional Description The device functions as an Ethernet physical layer transceiver that connects a host controller or microcontroller MAC interface to a single-pair Ethernet physical medium. It handles the analog and digital PHY functions required for 100BASE-T1 communication, allowing embedded systems to transmit and receive Ethernet data over a single twisted pair cable. ## Network and Interface Description The **LAN8770M-I/PRA** supports 100 Mb/s single-pair Ethernet communication and provides MII and RMII host interface options. This allows integration with microcontrollers, processors, gateways, and network controllers that support standard Ethernet MAC interfaces. The device is intended for applications where compact Ethernet connectivity and reduced cabling complexity are required. ## Electrical Description The device is designed for low-voltage operation and supports multiple supply domains according to the manufacturer’s recommended operating conditions. Proper power sequencing, decoupling, reset handling, clocking, and reference layout should be implemented to maintain stable PHY operation and signal integrity. ## Package and Mechanical Description The component is supplied in a compact surface-mount **VQFN package**, suitable for dense printed circuit board assemblies. The package supports automated assembly and is appropriate for space-constrained automotive and industrial electronic designs. ## Control and Diagnostic Description The PHY supports management and configuration through standard control interfaces used in Ethernet designs. It provides status monitoring and configuration capability for link management, operating mode selection, and system-level diagnostics. These features allow the host controller to configure and monitor Ethernet link behavior during operation. ## Automotive and Industrial Suitability The **LAN8770M-I/PRA** is suitable for embedded systems requiring robust single-pair Ethernet communication. It is applicable to automotive networking, telematics, infotainment, advanced driver assistance systems, industrial Ethernet nodes, building automation, control modules, and other connected embedded platforms. ## Mounting and Assembly Description The component is intended for surface-mount PCB assembly using standard reflow soldering processes. PCB layout should follow Microchip’s hardware design guidance, including proper power supply decoupling, controlled impedance routing, short signal paths, grounding, and separation of sensitive analog and digital sections where applicable. ## Design Considerations The design should account for Ethernet signal integrity, single-pair cable interface requirements, common-mode noise control, EMC performance, supply filtering, oscillator or clock source requirements, reset timing, thermal performance, and package solderability. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Application Suitability The device is suitable for automotive Ethernet nodes, electronic control units, telematics modules, infotainment systems, sensor interfaces, industrial controllers, embedded gateways, connected equipment, and compact network-enabled hardware requiring 100BASE-T1 Ethernet PHY functionality. ## Hashtags #commonpartslibrary #integratedcircuit #ethernetphy #microchip #microchiptechnology #lan8770 #lan8770mipra #singlepairethernet #100baset1 #automotiveethernet #ethernettransceiver #phytransceiver #embeddednetworking #mii #rmii #vqfnpackage #smdcomponent #surfacemount #automotiveelectronics #industrialethernet #telematics #infotainment #embeddedhardware #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

ARM® Cortex®-M33 RA6E1 Microcontroller IC 32-Bit 200MHz 1MB (1M x 8) FLASH 64-LFQFP (10x10) ## Engineering Specification ## General Description The **R7FA6E10F2CFM#AA0** is a Renesas Electronics **RA6E1 series microcontroller** designed for embedded control, industrial electronics, IoT edge devices, automation systems, and general-purpose connected applications. It is built around an **Arm Cortex-M33 processor with TrustZone support**, providing high performance, secure execution capability, and flexible integration for modern embedded designs. ## Device Identification Manufacturer Part Number: **R7FA6E10F2CFM#AA0** Manufacturer: **Renesas Electronics** Product Family: **RA Family** Series: **RA6 Series** Group: **RA6E1 Group** Device Category: **Integrated Circuit** Device Type: **Microcontroller Unit** ## Core and Processing The device uses an **Arm Cortex-M33 core** and is intended for high-performance embedded processing. It supports secure application development through TrustZone technology and is suitable for systems requiring reliable control, fast response, and efficient software execution. ## Memory Configuration The microcontroller includes program flash memory, data flash memory, and SRAM resources suitable for embedded firmware, application code, configuration storage, and runtime processing requirements. ## Package and Mechanical Description The component is supplied in an **LQFP surface-mount package**, making it suitable for compact printed circuit board layouts and standard automated assembly processes. ## Electrical and Operating Description The device is designed for low-voltage embedded systems and supports operation across an industrial temperature range. It is suitable for products requiring stable performance in controlled, commercial, or industrial operating environments. ## Communication and Interface Support The device supports common embedded communication interfaces such as USB, UART, SPI, I²C, QSPI, and CAN, allowing integration with sensors, displays, external memory, communication modules, and other peripheral devices. ## Analog and Control Features The microcontroller includes analog conversion capability, timer functions, PWM support, watchdog protection, reset monitoring, and low-voltage detection features. These functions make it suitable for control systems, monitoring equipment, and mixed-signal embedded applications. ## Security and Debug Features The device supports embedded security functions including TrustZone, unique device identification, and true random number generation. Debug and development access is supported through standard JTAG and SWD interfaces. ## Application Suitability This device is suitable for embedded controllers, IoT devices, industrial automation, metering equipment, appliance control, USB-connected products, sensor-based systems, and general electronic control applications requiring a compact and secure microcontroller solution. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #renesas #renesaselectronics #ra6e1 #ra6series #armcortexm33 #embeddedsystems #electronicscomponents #semiconductor #mcu #iotdevices #industrialautomation #pcbdesign #electronicparts #componentlibrary #engineeringparts #hardwaredesign #electronicsengineering

SDRAM - Mobile LPDDR4X Memory IC 8Gbit Parallel 2.133 GHz 200-FBGA (10x15) The IM8G32L4JCBG-046I is an 8Gb (1GB) LPDDR4X SDRAM memory device designed for high-performance, low-power embedded applications. Organized as 256M × 32 bits, it delivers data rates up to 4266 MT/s, making it suitable for industrial computing, AI edge devices, networking equipment, automotive systems, and other memory-intensive applications. The LPDDR4X architecture reduces power consumption while maintaining high bandwidth and reliable operation across industrial temperature ranges. Key Features 8Gb (Gigabit) LPDDR4X SDRAM Memory organization: 256M × 32 bits High-speed operation up to 4266 MT/s Low-power LPDDR4X interface for reduced energy consumption 32-bit data bus width Industrial operating temperature range: –40°C to +95°C 200-ball FBGA package (10 mm × 15 mm) High bandwidth for demanding embedded applications Optimized for low-power and thermally constrained designs Suitable for industrial, automotive, networking, and edge AI systems #LPDDR4X #SDRAM #MemoryIC #EmbeddedSystems #IndustrialElectronics #EdgeComputing #AIoT #HighSpeedMemory #LowPowerDesign #AutomotiveElectronics #NetworkingHardware #FBGA #HardwareDesign #ElectronicsEngineering #PCBDesign #IntelligentMemory

Headers & Wire Housings HEADER 2POS 2.5MM Connector Header Through Hole, Right Angle 2 position 0.098" (2.50mm) IL-2P-S3FP2-1 is a 2-position, 2.50 mm pitch right-angle through-hole header connector from the IL Series by JAE Electronics. It is designed for board-to-wire connections in compact electronic equipment and features a friction-lock mechanism to ensure reliable cable retention. The connector uses gold-plated brass contacts for enhanced conductivity and corrosion resistance, making it suitable for industrial, consumer, and embedded electronic applications. Key Features 2-position male header connector 2.50 mm pitch Right-angle through-hole mounting Board-to-wire connection style Friction-lock mating system for secure connection Gold-plated brass contacts for reliable electrical performance Shrouded design with one protective wall Polyamide (PA66/Nylon 6/6) housing UL94 V-0 flame-retardant material Compact single-row configuration Operating temperature range: -40°C to +85°C RoHS compliant and lead-free version available Suitable for power and signal connections in electronic equipment #CommonPartsLibrary #JAE #Connector #HeaderConnector #WireToBoard #ThroughHole #RightAngleConnector #ILSeries #2p50mmPitch #FrictionLock #ElectronicComponents #EmbeddedSystems #PCBDesign #HardwareDesign #RoHSCompliant

Tactile Switch SPST-NO Top Actuated Surface Mount ## Engineering Specification ## General Description The **MSLPT5252AG2TR** is a TE Connectivity ALCOSWITCH low-profile tactile switch designed for compact electronic devices, printed circuit board assemblies, portable electronics, control panels, and user-input interface applications. It provides momentary tactile feedback when pressed and returns to its normal open state when released. The device is suitable for applications requiring a small surface-mount switch with reliable actuation, compact board footprint, and low-profile mechanical construction. ## Device Identification Manufacturer Part Number: **MSLPT5252AG2TR** Manufacturer: **TE Connectivity** Brand Series: **ALCOSWITCH** Product Family: **LPT Low-Profile Tactile Switches** Device Category: **Electromechanical Component** Device Type: **Tactile Switch** Switch Function: **Single Pole Single Throw, Normally Open** ## Functional Description The device functions as a momentary user-input switch. When the actuator is pressed, the internal contacts close and allow an electrical signal path. When the actuator is released, the switch returns to its normally open condition. This makes the component suitable for button input, menu control, reset functions, mode selection, and general human-machine interface designs. ## Mechanical Description The switch uses a compact low-profile construction with a top-actuated flush actuator. It is intended for surface-mount installation on printed circuit boards and is suitable for space-constrained designs where low height and small board area are required. ## Electrical Description The MSLPT5252AG2TR is designed for low-current DC switching applications. It should be used within the manufacturer’s specified voltage and current ratings to ensure reliable operation and long service life. The switch is intended for signal-level control applications rather than high-power load switching. ## Contact and Material Description The switch includes stainless steel contact base material with silver contact plating. This construction supports reliable contact performance for tactile input applications and helps provide stable electrical switching behavior during normal operation. ## Mounting and Assembly Description The component is supplied as a surface-mount tactile switch suitable for automated PCB assembly. Proper land pattern design, soldering profile control, and mechanical clearance should be followed according to the manufacturer’s recommended layout and assembly guidelines. ## Application Suitability The device is suitable for portable electronic devices, consumer electronics, handheld equipment, control buttons, reset switches, interface panels, communication devices, instrumentation, remote controls, and compact PCB-based user-input systems. ## Design Considerations The switch should be placed in a location that allows direct actuator access without excessive mechanical side loading. PCB layout should provide proper solder pad support and mechanical stability. The design should avoid overtravel, excessive actuation force, contamination, and use beyond the rated electrical limits. ## Hashtags #commonpartslibrary #electromechanicalcomponent #tactileswitch #pushbuttonswitch #momentaryswitch #spstswitch #normallyopen #teconnectivity #alcoswitch #mslpt5252ag2tr #lptseries #smtcomponent #surfacemount #pcbdesign #electronicscomponents #electronicparts #switchcomponent #hardwaredesign #userinterface #embeddedhardware #consumer electronics #portableelectronics #componentlibrary #engineeringparts #electronicsengineering

RF Amplifier IC 5G, TDD 600MHz ~ 2.8GHz 20-QFN (4x4) ## Engineering Specification ## General Description The **QPA9442TR13** is a Qorvo high-linearity RF pre-driver amplifier designed for wireless infrastructure, cellular communication systems, and high-performance RF transmit chain applications. It is intended for use in systems requiring wideband operation, strong linearity, stable gain performance, and compact surface-mount integration. The device is suitable for 5G, TDD, FDD, mobile infrastructure, massive MIMO, and general-purpose wireless designs. ## Device Identification Manufacturer Part Number: **QPA9442TR13** Manufacturer: **Qorvo** Device Category: **RF and Wireless Integrated Circuit** Device Type: **RF Amplifier** Functional Type: **High-Linearity RF Pre-Driver Amplifier** Application Class: **Wireless Infrastructure and 5G RF Front-End** ## Functional Description The device operates as a transmit-chain pre-driver amplifier, providing RF signal amplification before the final power amplification stage. It is designed to deliver high gain and high output linearity while supporting cellular-band tuning requirements. The amplifier includes shutdown control through a dedicated power-down function, allowing system-level power management in RF transmit applications. ## RF Performance Description The QPA9442TR13 supports wideband RF amplification for cellular and wireless infrastructure applications. It provides high linearity performance, strong compression-point capability, and output third-order intercept performance suitable for demanding transmit signal chains. The device is optimized for applications where signal quality, gain stability, and RF output performance are critical. ## Electrical Description The device is designed for single-supply operation and is suitable for low-voltage RF circuit designs. It requires proper RF matching, biasing, grounding, and thermal layout practices to achieve the intended performance. The part should be used according to the manufacturer’s recommended operating conditions and reference design guidance. ## Package and Mounting Description The component is supplied as a surface-mount RF integrated circuit in a compact QFN package with exposed pad construction. The package is intended for high-frequency printed circuit board layouts requiring controlled impedance routing, short RF signal paths, proper ground via placement, and effective thermal connection to the PCB ground plane. ## Protection and Control Features The amplifier includes internal RF overdrive protection and internal DC overvoltage protection. It also includes a DC power shutdown feature for power control and system-level enable or disable operation. ## Application Suitability The QPA9442TR13 is suitable for 5G base station equipment, massive MIMO radio systems, mobile infrastructure, TDD and FDD transmit systems, cellular RF front-end designs, general-purpose wireless equipment, and RF driver amplifier stages requiring high linearity and compact board-level integration. ## Design Considerations The device should be implemented with proper RF layout techniques, impedance-controlled traces, recommended matching networks, adequate grounding, and appropriate thermal management. Performance may vary depending on frequency tuning, PCB design, matching component selection, supply quality, and operating conditions. ## Hashtags #commonpartslibrary #integratedcircuit #rfamplifier #qorvo #qpa9442tr13 #qpa9442 #wirelesscomponents #rfic #semiconductor #electronicscomponents #rfdesign #wirelessinfrastructure #fiveg #tdd #fdd #massivemimo #mobileinfrastructure #preDriverAmplifier #rfpreDriver #smtcomponents #qfnpackage #pcbdesign #hardwaredesign #electronicsengineering #componentlibrary

2 Position Wire to Board Terminal Block Horizontal with Board 0.200" (5.08mm) Through Hole ## Engineering Specification ## General Description The **1726040** is a Phoenix Contact **MKKDSN series PCB terminal block** designed for wire-to-board electrical connections in printed circuit board assemblies. It is used to provide a secure screw-clamp interface between external wiring and PCB circuitry. The component is suitable for control systems, industrial electronics, power distribution circuits, automation equipment, and general electronic assemblies requiring reliable field wiring termination. ## Device Identification Manufacturer Part Number: **1726040** Manufacturer: **Phoenix Contact** Product Series: **MKKDSN** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Mounting Type: **Through-Hole PCB Mount** Termination Method: **Screw Connection** ## Functional Description The device functions as a fixed printed circuit board terminal block that allows external conductors to be connected directly to a PCB. The screw-clamp mechanism secures the wire mechanically and electrically, providing a stable connection for signal or power circuits. The terminal block is intended for applications where field wiring must be removable, serviceable, and mechanically secure. ## Mechanical Description The component uses a compact green housing suitable for PCB-mounted assemblies. It is designed for side-entry conductor connection and horizontal board installation. The terminal block construction supports organized wire routing and convenient access for installation, maintenance, and service work. ## Electrical Description The terminal block is intended for low-voltage power and signal applications within the manufacturer’s specified current and voltage ratings. It provides reliable conductor contact when properly installed with compatible wire sizes and appropriate tightening torque. ## Material and Contact Description The connector housing is typically made from insulating material suitable for electrical safety and PCB assembly use. The internal conductive elements provide the electrical path between the inserted wire and the soldered PCB connection. Proper conductor preparation and screw tightening are required to maintain stable electrical performance. ## Mounting and Assembly Description The component is intended for through-hole solder mounting on a printed circuit board. Proper PCB hole sizing, pad layout, soldering process control, and mechanical clearance should be followed according to the manufacturer’s recommended design and assembly guidance. The terminal block should be mounted in a position that allows safe wire insertion and screw access. ## Application Suitability The **1726040** is suitable for industrial control boards, automation equipment, interface modules, power supply circuits, instrumentation, building control systems, relay boards, sensor wiring interfaces, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for wire gauge compatibility, current rating, voltage rating, tightening torque, creepage and clearance requirements, solder joint strength, and accessibility for field wiring. The terminal block should not be used beyond the manufacturer’s specified electrical, thermal, and mechanical limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkkdsn #wiretoboard #connector #interconnect #fixedterminalblock #screwterminal #throughholecomponent #pcbmount #industrialelectronics #automationequipment #controlsystems #powerdistribution #fieldwiring #electronicscomponents #electronicparts #hardwaredesign #pcbdesign #engineeringparts #componentlibrary #electronicsengineering

8 Position Card Connector Micro SIM Surface Mount, Right Angle Gold ## Engineering Specification ## General Description The **693022010811** is a Würth Elektronik **WR-CRD Micro SIM card connector** designed for compact electronic devices requiring secure SIM card retention and reliable board-level electrical connection. It is intended for surface-mount printed circuit board assembly and is suitable for communication modules, wireless devices, embedded systems, IoT hardware, and networking equipment. The connector uses a hinged lid mechanism to hold the Micro SIM card in place during operation. ## Device Identification Manufacturer Part Number: **693022010811** Manufacturer: **Würth Elektronik** Product Series: **WR-CRD** Device Category: **Connector and Interconnect Component** Device Type: **Micro SIM Card Connector** Connector Style: **Hinge Type** Mounting Type: **Surface Mount, Right Angle** ## Functional Description The device functions as a board-mounted Micro SIM card interface. It provides mechanical retention and electrical contact between the SIM card and the host printed circuit board. The hinged lid design allows the SIM card to be placed into the connector and secured during operation, helping maintain contact stability in compact electronic assemblies. ## Mechanical Description The connector is designed with a low-profile surface-mount construction suitable for space-constrained PCB layouts. It uses a hinged card-retention mechanism and is intended for horizontal or right-angle card installation. The mechanical structure supports reliable insertion, retention, and removal of the Micro SIM card during normal use. ## Electrical Description The connector is intended for signal-level SIM card interface applications. It provides multiple gold-plated contact positions for stable electrical connection between the SIM card and the host circuit. The device should be used within the manufacturer’s specified voltage, current, contact resistance, and insulation limits. ## Material and Contact Description The connector uses copper alloy contacts with gold plating for reliable signal transfer and corrosion resistance. The housing and mechanical retention structure are designed for surface-mount assembly and repeated card handling within the rated operating conditions. ## Mounting and Assembly Description The component is suitable for automated surface-mount PCB assembly. Proper land pattern design, soldering profile control, and mechanical clearance should be followed according to the manufacturer’s recommended layout and assembly guidance. The PCB design should provide stable grounding, correct pad alignment, and adequate clearance for SIM card insertion and lid operation. ## Application Suitability The **693022010811** is suitable for cellular communication devices, IoT modules, wireless routers, embedded modems, tracking systems, smart meters, industrial communication equipment, portable electronics, and other products requiring a Micro SIM card interface. ## Design Considerations The connector should be placed in an accessible area of the PCB to allow SIM card installation and removal. Designers should avoid excessive mechanical stress on the hinged lid, improper solder joint loading, contamination of the contact area, and operation beyond the specified environmental and electrical ratings. ## Hashtags #commonpartslibrary #connector #simconnector #microsimconnector #wurthelektronik #wrcrd #cardconnector #memoryconnector #interconnect #pcbconnector #surfacemount #rightangleconnector #smtcomponent #goldplatedcontacts #embeddedhardware #iotdevices #wirelessmodules #communicationdevices #networkingequipment #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering