3.9 nH Unshielded Wirewound Inductor 700 mA 80mOhm Max 0603 (1608 Metric)
Engineering Specification
General Description
The 0603CS-3N9XJRW is a Coilcraft 0603CS series ceramic-core chip inductor designed for RF, microwave, and high-frequency circuit applications. It provides low-value inductance in a compact surface-mount package and is suitable for impedance matching, RF filtering, tuning networks, resonant circuits, and general high-frequency signal-path designs. The component is commonly used in wireless modules, RF front-end circuits, communication equipment, test hardware, and compact printed circuit board assemblies requiring stable high-frequency inductive performance.
Device Identification
Manufacturer Part Number: 0603CS-3N9XJRW
Manufacturer: Coilcraft
Product Series: 0603CS
Device Category: Passive Electronic Component
Device Type: Fixed Inductor
Inductor Type: RF Chip Inductor
Construction Type: Unshielded Wirewound Ceramic-Core Inductor
Mounting Type: Surface Mount
Functional Description
The device functions as a fixed-value RF inductor used to store magnetic energy and provide frequency-dependent impedance in electronic circuits. It is designed for high-frequency performance where low inductance value, compact size, and predictable RF behavior are required. The component can be used in matching networks, RF filters, oscillators, resonant circuits, and signal conditioning paths.
Electrical Description
The inductor has a nominal inductance of three point nine nanohenries with five percent tolerance. It is rated for seven hundred milliamps current and has a maximum DC resistance of eighty milliohms. The part provides a minimum self-resonant frequency of six point nine gigahertz and a minimum Q value suitable for RF circuit applications. It should be operated within the manufacturer’s specified current, temperature, and electrical limits.
Mechanical Description
The component is supplied in an 0603 surface-mount package, also known as 1608 metric size. It is designed for compact PCB layouts and automated pick-and-place assembly. The unshielded chip construction is suitable for high-frequency signal applications where board layout and nearby component placement are carefully controlled.
Material and Construction Description
The device uses a ceramic-core wirewound construction, which supports stable high-frequency inductance characteristics. The specified configuration includes RoHS-compliant matte tin over nickel over silver-platinum-glass frit termination, suitable for standard surface-mount soldering processes.
Mounting and Assembly Description
The 0603CS-3N9XJRW is intended for surface-mount PCB assembly. Proper land pattern design, solder paste control, placement accuracy, and reflow soldering profile should follow Coilcraft recommendations. RF layout practices should be observed, including short trace lengths, controlled impedance routing, proper grounding, and minimized parasitic capacitance.
Application Suitability
The device is suitable for RF matching networks, wireless communication circuits, antenna tuning, filters, oscillators, resonant circuits, broadband RF designs, cellular modules, Wi-Fi and Bluetooth hardware, test equipment, and high-frequency embedded electronics.
Design Considerations
The design should account for inductance tolerance, Q factor, self-resonant frequency, DC resistance, current rating, operating temperature, layout parasitics, solder joint reliability, and interaction with nearby magnetic or conductive structures. For RF applications, the final performance should be validated in the actual PCB layout because trace geometry and component placement can affect impedance and resonance behavior.
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