5.6 nH Unshielded Wirewound Inductor 700 mA 75mOhm Max 0603 (1608 Metric)
Engineering Specification
General Description
The 0603CS-5N6XJRW is a Coilcraft 0603CS series ceramic-core chip inductor designed for RF, microwave, and high-frequency electronic circuit applications. It provides low-value inductance in a compact surface-mount package and is suitable for impedance matching, RF filtering, tuning networks, resonant circuits, oscillators, and general high-frequency signal-path designs. The component is commonly used in wireless modules, communication equipment, RF front-end circuits, test hardware, and compact printed circuit board assemblies requiring stable inductive performance at high frequencies.
Device Identification
Manufacturer Part Number: 0603CS-5N6XJRW
Manufacturer: Coilcraft
Product Series: 0603CS
Device Category: Passive Electronic Component
Device Type: Fixed Inductor
Inductor Type: RF Chip Inductor
Construction Type: Unshielded Wirewound Ceramic-Core Inductor
Mounting Type: Surface Mount
Functional Description
The device functions as a fixed-value RF inductor used to provide frequency-dependent impedance, energy storage, resonance control, and impedance transformation in electronic circuits. It is designed for high-frequency operation where compact size, low inductance value, and stable RF behavior are required. The component is suitable for use in matching networks, filters, resonant circuits, oscillators, and RF signal conditioning stages.
Electrical Description
The inductor has a nominal inductance of five point six nanohenries with five percent tolerance. It is rated for seven hundred milliamps current and has a maximum DC resistance of seventy-five milliohms. The device is intended for RF applications requiring low resistance, high self-resonant frequency, and predictable inductive behavior. It should be operated within the manufacturer’s specified electrical, thermal, and current limits.
Mechanical Description
The component is supplied in an 0603 surface-mount package, also known as 1608 metric size. Its compact chip construction supports dense PCB layouts and automated pick-and-place assembly. The unshielded construction is suitable for RF signal applications where board layout, component spacing, and parasitic effects are properly controlled.
Material and Construction Description
The device uses a ceramic-core wirewound construction to support stable high-frequency inductance characteristics. The termination system is designed for standard surface-mount soldering processes and is suitable for compact RF circuit board assemblies.
Mounting and Assembly Description
The 0603CS-5N6XJRW is intended for surface-mount PCB assembly using standard reflow soldering processes. Proper land pattern design, solder paste control, placement accuracy, and reflow profile should follow Coilcraft recommendations. RF layout practices should be applied, including short trace lengths, controlled impedance routing, minimized parasitic capacitance, and appropriate spacing from nearby conductive or magnetic structures.
Application Suitability
The device is suitable for RF matching networks, antenna tuning, wireless communication circuits, RF filters, resonant circuits, oscillators, broadband RF designs, cellular modules, Wi-Fi and Bluetooth hardware, test equipment, and compact high-frequency embedded electronics.
Design Considerations
The design should account for inductance tolerance, Q factor, self-resonant frequency, DC resistance, current rating, operating temperature, PCB layout parasitics, solder joint reliability, and interaction with nearby components. For RF applications, final performance should be validated in the actual PCB layout because trace geometry, grounding, and component placement can affect impedance and resonance behavior.
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