Electronic Fuse Regulator 5.3A 20-WQFN (3x4) The TPS25940LRVCR is a compact eFuse (electronic fuse) power management IC from Texas Instruments designed to provide advanced power-path protection and load management for systems such as SSDs, servers, storage devices, and embedded electronics. It integrates protection features like overcurrent limiting, reverse current blocking, overvoltage protection, and controlled startup sequencing into a single chip. Wide input voltage range: 2.7 V to 18 V Adjustable current limit: 0.6 A to 5.3 A Low ON resistance: 42 mΩ typical True reverse current blocking using back-to-back MOSFETs Programmable output slew rate (dV/dt control) for inrush current management Overvoltage and undervoltage protection Fault and Power-Good outputs for system monitoring Current monitor (IMON) output Low-power DevSleep support for SSD applications Fast reverse voltage shutdown (~1 µs) Operating temperature: −40°C to +125°C junction temperature Available in a compact 20-pin WQFN package Typical Applications PCIe / SATA / SAS SSDs and HDDs Enterprise servers and storage systems RAID controller cards Smart load switches Set-top boxes and gaming systems Backup power and holdup capacitor systems Component Category This component belongs to: Power Management IC (PMIC) More specifically: eFuse / Hot-swap / Load Switch IC Package Information Package type: 20-WQFN (3 mm × 4 mm) Mounting type: Surface Mount (SMD) #commonpartslibrary #integratedcircuit #powermanagement #currentregulation

52 Position Female Connector PCI Express Mini Card Gold 0.031" (0.80mm) Black Generic Mini PCIe 52-pin add-in card edge connector Card edge connector for board-to-board Mini PCI Express and mSATA interfaces, featuring 52 contacts on a 0.8 mm pitch with a 7.0 mm stack height. This surface-mount, right-angle female socket is designed for Mini PCI Express cards and uses gold-flash contacts with matte-tin solder tails. #CardEdgeConnector #MiniPCIExpress #mSATA #BoardToBoard #52Position #0p8mmPitch #SurfaceMount #RightAngle #TEConnectivity #commonpartslibrary #connector #femaleconnector #pci

Application Processor integrating a quad-core Arm Cortex-A55 64-bit CPU operating at up to 2.0 GHz, an Arm Mali-G52 2EE GPU, and a 1 TOPS INT8 NPU. Supports DDR3/DDR3L/DDR4/LPDDR3/LPDDR4/LPDDR4X memory, 4K H.264/H.265/VP9 video decoding, 1080p60 H.264/H.265 video encoding, and interfaces including PCIe 3.0, SATA 3.0, USB 3.0/2.0, Gigabit Ethernet, HDMI 2.0, eDP 1.3, MIPI-CSI, MIPI-DSI, CAN, SDIO/eMMC, UART, SPI, I²C, and PWM. Packaged in a FCBGA636L (19 × 19 mm) package. Hashtags: #ApplicationProcessor #SoC #Rockchip #RK3568 #CortexA55 #MaliG52 #NPU #EmbeddedProcessor #AIoT #FCBGA636 #BGA636 #DDR4 #LPDDR4X #PCIe3 #USB3 #HDMI2 #GigabitEthernet

MPU with Dual Arm Cortex-A35 @1.5GHz, Cortex-M33 @400MHz, 3xEthernet (2+1 switch), 3xFD-CAN, LVDS/DSI, H.264, 3D GPU, AI/NN, Secure Boot, Cryptography, DRAM enc/dec, PKA The STM32MP257FAI3 is a high-performance microprocessor from STMicroelectronics' STM32MP2 series, integrating dual 64-bit Arm Cortex-A35 cores running at up to 1.5 GHz, a Cortex-M33 real-time core, and a Cortex-M0+ low-power management core. It is designed for advanced industrial, edge AI, machine vision, HMI, IoT gateway, and multimedia applications requiring Linux-class processing alongside deterministic real-time control. The device features AI acceleration, 3D graphics, video encoding/decoding, extensive connectivity, advanced security, and support for high-speed external memory. Key Features Dual-core 64-bit Arm Cortex-A35 CPU operating up to 1.5 GHz Arm Cortex-M33 real-time processor with TrustZone and FPU support Arm Cortex-M0+ low-power coprocessor for autonomous operation Integrated NPU (Neural Processing Unit) delivering up to 1.35 TOPS AI performance 3D GPU and hardware video encoder/decoder acceleration Supports DDR3L, DDR4, and LPDDR4 external memory up to 4 GB Multiple display interfaces including MIPI-DSI, LVDS, and parallel RGB USB 2.0 Host and USB 3.0 Dual-Role with embedded PHYs PCI Express interface with integrated 5 Gbps PHY Up to three Gigabit Ethernet interfaces with TSN and IEEE 1588 support Extensive connectivity: I2C, I3C, SPI, UART, USART, CAN FD, SDMMC, SAI, and SPDIF Hardware cryptographic accelerators including AES, SHA, RSA, ECC, PKA, and True RNG Secure boot, TrustZone security, tamper detection, and resource isolation framework Multiple low-power operating modes for energy-efficient designs Available in fine-pitch BGA packages for high-density embedded systems. #STM32MP257FAI3 #STM32MP2 #STMicroelectronics #CortexA35 #CortexM33 #EdgeAI #EmbeddedLinux #IndustrialAutomation #MachineVision #HMI #IoTGateway #MPU #PCIe #USB3 #GigabitEthernet #TrustZone #EmbeddedSystems #ArtificialIntelligence #LinuxProcessor #IndustrialIoT #CommonPartsLibrary #IntegratedCircuit #Microprocessor #STM32MP2

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold It is a 100-pin surface-mount receptacle connector used to connect two PCBs in a stacked configuration. The DF40HC series is known for ultra-fine pitch and high-speed signal capability, making it suitable for modern embedded and communication systems. Connector type: Board-to-board (mezzanine), receptacle Number of contacts: 100 positions (2-row layout) Pitch: 0.4 mm (very fine pitch for high-density routing) Stacking height: 3.0 mm (fixed mated height) Mounting: Surface-mount (SMT) Orientation: Straight Contact plating: Gold (for reliable conductivity and corrosion resistance) Rated current: 0.3 A per contact Rated voltage: 50 V AC/DC Contact resistance: ≤ 90 mΩ Withstanding voltage: 150 V max High-speed capability: up to 20 Gbps, supports interfaces like: USB 3.1 / USB 3.0 PCIe SATA MIPI Connector size: Length: ~22.6 mm Width: ~3.38 mm Height: ~2.9 mm Mating durability: ~30 cycles Operating temperature: -55°C to +85°C #CommonPartsLibrary #Connector #Mezzanine-connector #DF40

BGA-565(15.5x14.4) Microcontrollers, Quad-core ARM Cortex-A55 processor The RK3566 is a high-performance, low-power 64-bit application processor developed by Rockchip for AIoT, industrial control, smart displays, tablets, embedded systems, and single-board computers. It integrates a quad-core ARM Cortex-A55 CPU, Mali-G52 GPU, AI acceleration engine (NPU), advanced multimedia processing, and a rich set of connectivity interfaces, making it suitable for Linux- and Android-based applications requiring efficient performance and multimedia capabilities. Key Features Quad-core 64-bit ARM Cortex-A55 processor operating up to 2.0 GHz. ARM Mali-G52 2EE GPU with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1. Integrated NPU delivering up to 1 TOPS AI computing performance. Supports DDR3, DDR3L, DDR4, LPDDR3, LPDDR4, and LPDDR4X memory. Hardware video decoding up to 4K@60fps for H.264, H.265, and VP9 formats. Hardware video encoding up to 1080p@60fps for H.264 and H.265. Built-in 8MP ISP with HDR image processing support. Multiple display interfaces including HDMI 2.0, eDP, MIPI-DSI, LVDS, RGB, and E-Ink. High-speed connectivity with USB 3.0, USB 2.0, PCIe, SATA, Gigabit Ethernet, SDIO, and eMMC 5.1. Rich peripheral support including UART, SPI, I²C, PWM, ADC, I²S, PDM, and GPIO. Optimized for Android, Linux, industrial HMI, smart home, edge computing, and AIoT applications. Manufactured using a 22 nm process for improved power efficiency. #RK3566 #Rockchip #ARMCortexA55 #MaliG52 #AIoT #EmbeddedSystems #SingleBoardComputer #Linux #Android #IndustrialControl #SmartDisplay #EdgeComputing #SoC #Processor #NPU #4KVideo #IoT #Electronics #HardwareDesign #PCBDesign

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40C-100DS-0.4V(51) is a board-to-board and board-to-FPC receptacle connector manufactured by Hirose Electric. It belongs to the DF40 series, a family of fine-pitch stacking connectors intended for compact, high-density interconnect applications such as mobile devices, cameras, wearables, and other space-constrained electronics. The connector functions as the receptacle (socket) half of a mating pair, designed to stack with a corresponding DF40 plug header to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile vertical arrangement. This particular part number represents the full-position, low-profile variant within the series, configured without a reinforcing metal fitting and without a locating boss or mechanical holddown feature, meaning it relies on the contact array itself rather than additional structural hardware for mechanical retention during reflow and handling. The connector is supplied in straight, surface-mount form and is non-polarized, so it can be inserted in either orientation relative to its mating counterpart. Contacts are arranged in parallel rows along the connector body, with gold plating in the contact mating area to ensure reliable signal continuity and resistance to oxidation over repeated use. The series is positioned by Hirose as a general-purpose, high-speed-capable interconnect, suitable for a range of differential and single-ended signaling standards used in consumer and industrial electronics, with the broader DF40 family supporting interfaces such as USB, MIPI, SATA, and PCIe. Its low stacking height and fine contact pitch make it well suited to applications where board-to-board spacing must be minimized, such as camera modules, display modules, or stacked daughterboard architectures in handheld and wearable products. The connector is packaged on embossed carrier tape for automated pick-and-place assembly, and its construction is compliant with RoHS material restrictions. Mechanically, the connector body is built to support repeated mating cycles typical of consumer electronics assembly and rework, while maintaining stable electrical contact under vibration and thermal cycling across its rated environmental range. As a stacking-style connector rather than a card-edge or cable-mount type, it is intended to be soldered directly to a host PCB pad pattern, with the mating plug soldered to the corresponding board or FPC, allowing the two assemblies to be joined and separated as needed during manufacturing, test, or service operations. Spec Sheet Identification Part Number: DF40C-100DS-0.4V(51) Series: DF40 Variant: "C" type — without reinforcing metal fitting Connector Type / Configuration Type: Receptacle (socket), board-to-board / board-to-FPC Gender: Female Orientation: Straight Row Arrangement: Dual row Polarization: Non-polarized Locking/Retention Feature: None (no metal holddown or locating boss) Electrical Ratings Current Rating: Low-current signal class Voltage Rating: Standard signal-level rating typical of fine-pitch board-to-board connectors Applicable High-Speed Protocols: USB, MIPI, SATA, PCIe (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Stacking/Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics rework Contact & Material Properties Contact Material: Phosphor bronze Contact Plating (Mating Area): Gold Insulator Color: Black Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings Operating Temperature Range: Extended consumer/industrial range RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding DF40 series plug/header connector Application Note: Intended for mezzanine-style stacking between two PCBs or between a PCB and FPC #DF40 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #StackingConnector #CommonPartsLibrary #Connector #SMTConnector #FinePitchConnector #MezzanineConnector #ElectronicComponents #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #ConsumerElectronics #HighSpeedConnector #RoHSCompliant #ComponentLibrary

64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black The PCIE-064-02-X-D-TH is a high-density PCI Express edge connector designed for reliable board-to-board and card-to-host connections in high-speed data communication applications. Manufactured by Samtec, this connector supports PCI Express signaling standards while providing robust mechanical and electrical performance for high-frequency, high-bandwidth systems. Its through-hole mounting and dual-row design ensure secure attachment to the PCB, high mating retention, and long operational life. The connector is ideal for computer peripherals, server systems, embedded computing platforms, networking devices, and industrial electronic equipment where signal integrity, mechanical reliability, and high-density interconnects are critical. Engineering Specifications Manufacturer: Samtec Part Number: PCIE-064-02-X-D-TH Series: PCI Express Edge Connector Connector Type: Board-to-Board / Card Edge Connector Contact Configuration: Dual-Row High-Density Contacts Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Surface Housing Material: High-Temperature Thermoplastic Signal Performance: PCI Express Standard Compliant Electrical Performance: High-Speed Data Transmission Mechanical Durability: High Mating Cycle Life Orientation: Right Angle / Standard Edge Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: PCI Express Expansion Cards, High-Speed Computing Systems, Server and Data Center Hardware, Embedded Platforms, Networking Equipment, Industrial Computing, High-Bandwidth Digital Interfaces, Board-Level Interconnects Key Features High-density dual-row PCIe edge contacts Through-hole mounting for robust PCB attachment Gold-plated contact interface for reliable signal transmission Supports high-speed PCI Express signaling Compact, high-density design for space-constrained PCBs Long mechanical life with repeated mating cycles Compatible with standard PCI Express cards and connectors Reliable operation in industrial and commercial environments Ideal for embedded computing, server, and networking applications Ensures signal integrity for high-bandwidth data communication #PCIE06402XDTH #Samtec #PCIeConnector #EdgeConnector #BoardToBoard #HighSpeedInterconnect #HighDensityConnector #ThroughHole #IndustrialElectronics #EmbeddedSystems #ServerHardware #NetworkingEquipment #ElectronicComponents #PCBDesign #HighBandwidth #DataCommunication #PCIExpress #ExpansionCardConnector #MechanicalReliability #ElectronicInterconnect

DisplayPort, PCIe, USB Switch IC 2 Channel 20-DHVQFN (4.5x2.5) #CommonPartsLibrary #IntegradedCircuits #Interface #AnalogSwitches #CBTL02043

70 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold It is a 70-position, surface-mount receptacle connector with a 0.4 mm pitch, intended for stacking two PCBs with a 3.0 mm mated height. The connector belongs to the DF40 series, which is optimized for miniaturized, high-speed, and reliable interconnections in space-constrained applications. Connector type: Receptacle (female), board-to-board / mezzanine Number of contacts: 70 pins (2 rows) Pitch: 0.4 mm (fine pitch, high density) Mounting: Surface Mount Technology (SMT) Stacking height: 3.0 mm Contact plating: Gold (ensures reliable conductivity and durability) Rated current: ~0.3 A per contact Rated voltage: up to 50 V AC/DC Operating temperature: approx. –55 °C to +85 °C Durability: ~30 mating cycles Compact, low-profile design for thin devices High-speed signal capability (supports interfaces like USB, MIPI, PCIe) Self-alignment feature to improve mating accuracy Strong contact force with wipe action for stable electrical connection Shock absorption and solder wicking prevention for reliability #CommonPartsLibrary #Connector #DF40

Compute Module 5 is a powerful and scalable system on module with a 64-bit Arm processor @ 2.4GHz, an I/O controller, video and PCIe interfaces, and a range of wireless, SDRAM and eMMC options. raspberry pi5 #rpi #pi

Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 228 5347738 170100 676-BBGA, FCBGA Field-programmable gate array (FPGA) designed for implementing configurable digital logic and embedded system functions. The AMD XCAU15P-2FFVB676I is an UltraScale+™ architecture FPGA featuring programmable logic, integrated block RAM, DSP slices, high-speed serial transceivers, and hardened PCI Express® support, operating from a 0.85 V core supply and housed in a 676-ball FFVB package. It is part of the AMD UltraScale+ FPGA family, which supports high-performance and power-efficient programmable logic applications. #AMD #XCAU15P #UltraScalePlus #FPGA #ProgrammableLogic #BlockRAM #DSP #PCIe #HighSpeedTransceivers #FFVB676 #EmbeddedSystems #PCBComponents

ARM® Cortex®-A53 Microprocessor IC i.MX8ML 2 Core, 64-Bit 1.8GHz 548-LFBGA (15x15) Application Processor for embedded multimedia and industrial systems, integrating dual Arm® Cortex®-A53 cores operating up to 1.8 GHz and a Cortex®-M4 real-time core up to 400 MHz. It supports LPDDR4/DDR4/DDR3L memory, Gigabit Ethernet, PCIe, USB 2.0, MIPI-CSI/DSI, SAI audio interfaces, and 1080p video encode/decode, and is housed in a 0.8 mm pitch 486-ball FCBGA package. #ApplicationProcessor #NXP #iMX8MMini #ARMCortexA53 #CortexM4 #EmbeddedProcessor #MultimediaProcessor #FCBGA486 #LPDDR4 #DDR4 #PCIe #USB2 #GigabitEthernet #MIPI #SAI #EmbeddedSystems

M.2 PCIe Gen4 Edge Card Connector – 67-position M.2 Key E edge card connector for PCI Express® Gen4 module interconnection. Features a 0.50 mm pitch, right-angle surface-mount solder termination, 67 contacts, 16 Gb/s data rate, and 1 A current rating. Supports 0.80 mm PCB/module thickness and includes board guides, 30 µin (0.76 µm) gold-plated copper alloy contacts, and a liquid crystal polymer (LCP) housing. Specified for an operating temperature range of −40°C to +85°C. #Amphenol #AmphenolICC #MDT420E01411 #M2Connector #PCIeGen4 #KeyE #EdgeCardConnector #67Position #0_5mmPitch #SurfaceMount #HighSpeedConnector #EmbeddedSystems

LTE Cat 4 Cellular Module – LTE Cat 4 wireless communication module in a Mini PCIe form factor supporting LTE-FDD, LTE-TDD, UMTS/HSPA+, and GSM/GPRS/EDGE networks. Operates from a 3.0 V to 3.6 V supply and provides data rates of up to 150 Mbps downlink and 50 Mbps uplink over LTE. Features USB 2.0, UART, I²C, and PCM interfaces, optional multi-constellation GNSS (GPS, GLONASS, BeiDou, Galileo, and QZSS), and supports an operating temperature range of −35°C to +75°C. Packaged in a standard Mini PCIe card (51.0 × 30.0 × 4.9 mm). #Quectel #EG25GGBMINIPCIE #EG25G #LTECat4 #CellularModule #MiniPCIe #LTE #4G #GNSS #GPS #GLONASS #BeiDou #Galileo #QZSS #USB2_0 #UART #I2C #PCM #EmbeddedSystems

M.2 CONN.P=0.5 6.7mm H conn The 91302-67-067R2M is a 67-position M.2 (NGFF) card-edge connector manufactured by UMAX. It is designed for connecting M.2 SSDs and PCIe-based expansion modules to a host PCB. The connector features an M-Key interface, making it suitable for high-speed PCIe storage applications such as NVMe solid-state drives. It is a surface-mount, right-angle receptacle with a 0.5 mm contact pitch and a 6.7 mm height above the PCB. Key Features M.2 M-Key connector Supports M-Key M.2 modules, commonly used for PCIe/NVMe SSDs. 67 contacts (67P) Standard pin count for M-Key M.2 card-edge connections. 0.5 mm pitch Fine-pitch design suitable for compact, high-density PCB layouts. Surface-mount, right-angle mounting Optimized for automated PCB assembly and low-profile system designs. 6.7 mm connector height Provides compatibility with standard M.2 card installation requirements. Female card-edge receptacle Accepts M.2 modules directly without additional adapters. RoHS compliant Meets environmental requirements for lead-free electronic assemblies. Typical Applications NVMe SSD sockets PCIe M.2 storage devices Embedded computing systems Industrial PCs Networking equipment Edge AI and IoT gateways Single-board computers requiring M.2 expansion #CommonPartsLibrary #Connector

Electronic Fuse Regulator 5.3A 20-WQFN (3x4) The TPS25940 is a compact, feature-rich eFuse (electronic fuse) power switch from Texas Instruments designed to provide advanced power-path protection and management for SSDs, storage systems, servers, telecom equipment, and other DC-powered applications. It integrates back-to-back MOSFETs for true reverse-current blocking, programmable current limiting, overvoltage/undervoltage protection, and controlled output slew-rate management in a small 20-pin WQFN package. Key Features Wide operating voltage range: 2.7 V to 18 V (20 V maximum input) Low 42 mΩ typical on-resistance (RDS(on)) Adjustable current limit from 0.6 A to 5.3 A True reverse-current blocking using integrated back-to-back FETs Fast reverse-voltage shutdown response of 1 µs Programmable output ramp-up (dV/dt control) for inrush-current management Programmable overvoltage (OVP) and undervoltage (UVP) protection thresholds Integrated IMON analog current-monitor output PGOOD and FLT status outputs for system monitoring Low-power DevSleep™ mode for SATA SSD applications Typical operating quiescent current of 200 µA Typical disabled current of 15 µA Operating junction temperature range from −40°C to +125°C UL 2367 recognized and designed for fault-safe operation under single-point failure conditions. Typical Applications PCIe, SATA, and SAS SSD/HDD storage devices Enterprise servers and storage systems RAID controller cards with holdup-power management Telecom switches and routers Set-top boxes, DTVs, and gaming consoles Adapter-powered equipment General-purpose smart load-switch and power-protection circuits. Package Information Package: 20-pin WQFN (RVC) Temperature range: −40°C to +85°C ambient operation Tape-and-reel packaging for automated assembly. #CommonPartsLibrary #IntegratedCircuit # TPS25940

PCI / PCIe Connector 21650-11013T CONN-SMD_164P-P1.00_2EH5827-D29BN-3H LCSC Part Number: C22464457 JLCPCB Part Class: Extended Part Manufactured by UMaxconn(友贸)