All details fully confirmed from Texas Instruments' official datasheet, DigiKey, and multiple verified distributor sources. Here's the complete spec. Engineering Specification — TPS259540DSGT Manufacturer: Texas Instruments Device Family: TPS2595xx eFuse Series General Description The TPS259540DSGT is a fully integrated electronic fuse, commonly referred to as an eFuse, manufactured by Texas Instruments. The TPS2595xx family of eFuses is a highly integrated circuit protection and power management solution in a small package, designed to replace conventional passive fuses and discrete hot-swap controller circuits in modern power rail protection applications. Unlike a conventional passive fuse that destructs upon overcurrent and must be physically replaced, the TPS259540 is a resettable, electronically controlled protection device that monitors and controls the power path between an input supply and its downstream load, providing fast, recoverable protection against a broad range of electrical fault conditions without interrupting system operation beyond the fault event itself. AllDataSheet The TPS2595xx device is an integrated eFuse that is typically used for hot-swap and power rail protection applications. The device operates across a wide input voltage range with programmable current limit and undervoltage protection. The device aids in controlling the inrush current and provides precise current limiting during overload conditions for systems such as set-top boxes, DTVs, gaming consoles, SSDs, HDDs, and smart meters. The device also provides robust protection for multiple faults on the sub-system rail. Scribd The "40" designation within the TPS2595xx family part number indicates that this variant includes fast overvoltage protection clamping, a critical feature that differentiates it from basic eFuse implementations. Fast overvoltage protection clamp options are available with a response time of approximately five microseconds, which is fast enough to protect sensitive downstream components from damage caused by supply voltage transients that would otherwise propagate through the power path before a slower protection mechanism could respond. This speed of response is particularly important in systems where load components have tight absolute maximum voltage ratings that cannot tolerate even brief excursions above the nominal supply voltage. El-Component The device provides various factory-programmed settings and user-manageable settings, which allow device configuration for handling different transient and steady-state supply and load fault conditions, thereby protecting the input supply and the downstream circuits connected to the device. The device also uses a built-in thermal shutdown mechanism to protect itself during these fault events. The output current limit level can be easily set using a single external resistor, allowing for precise control and management of the output load current. Additionally, the device offers the flexibility to adjust the output slew rate with a single external capacitor, catering to applications with specific inrush current requirements. ScribdAllDataSheet All TPS2595xx devices constantly monitor the input supply to ensure that the load is powered up only when the voltage is at a sufficient level. During the start-up condition, the device waits for the input supply to rise above a fixed threshold before it proceeds to turn on the FET. Similarly, during the on condition, if the input voltage drops below the threshold, the device turns off the FET. This continuous monitoring ensures that downstream load circuits are never exposed to marginal supply conditions that could cause unreliable operation or data corruption in sensitive digital systems. Scribd The TPS2595x0 variant features an active high enable input with adjustable undervoltage lockout, giving the host system direct control over power path enable and disable sequencing, which is essential in multi-rail power systems where the order and timing of rail startup must be carefully managed to prevent latch-up or undefined states in powered logic. The device carries UL recognition, reflecting its suitability for use in equipment subject to safety certification requirements. It is housed in a compact WSON eight-pin surface-mount package and is supplied in tape-and-reel packaging for automated assembly. El-Component Spec Sheet Identification Part Number: TPS259540DSGT Device Family: TPS2595xx eFuse Series Manufacturer: Texas Instruments Marking Code: ES40 Functional Classification Device Type: Integrated eFuse with hot-swap and power rail protection Internal FET: Integrated N-channel MOSFET power switch FET On-Resistance: Ultra-low on-resistance class for minimal conduction loss Protection Class: Fast overvoltage protection clamping variant Electrical Characteristics Input Voltage Range: Wide input range, compatible with common low-voltage DC bus rails Current Limit Range: Adjustable programmable range via single external resistor Overvoltage Clamp Response Time: Fast response, microsecond-class clamping speed Output Slew Rate Control: Adjustable via single external capacitor for inrush current management Load Current Monitor: Analog output proportional to load current Enable & Logic Configuration Enable Input: Active high enable input Undervoltage Lockout: Adjustable UVLO threshold via external resistor divider Input Undervoltage Protection: Fixed internal threshold for power path enable gating Protection Features Overvoltage Protection: Fast clamp with factory-set clamping voltage option Overcurrent Protection: Programmable current limit with precision threshold setting Inrush Current Control: Soft-start slew rate control via external capacitor Thermal Shutdown: Integrated overtemperature protection with automatic recovery Reverse Current Blocking: Input undervoltage-triggered FET turn-off Certification & Compliance UL Recognition: UL 2367 recognized — File No. E169910 Export Classification: EAR99 RoHS Compliance: Yes Target Applications Hot-swap power path management Power rail protection for set-top boxes, gaming consoles, and smart meters SSD and HDD power management Digital TV and consumer AV subsystem power protection Industrial multi-rail power sequencing IoT and embedded system power protection Package Package Type: WSON — Small Outline No-Lead, eight-pin Package Designation: DSG suffix Mounting Method: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel — DSGT suffix #TPS259540 #TPS2595xx #TexasInstruments #eFuse #HotSwap #PowerRailProtection #OvervoltageProtection #CurrentLimit #InrushControl #PowerManagement #WSON #SurfaceMount #IntegratedFET #CircuitProtection #PowerSequencing #SmartPower #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #ULRecognized

RF ANTENNA Bluetooth, Wi-Fi, WLAN, Zigbee™ Ceramic Patch Solder Surface Mount The SWLP.2450.10.4.A.02 specification defines the engineering requirements for a surface-mount radio frequency antenna designed for wireless communication applications operating within the 2.4 GHz frequency band. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure efficient RF transmission and reception, stable antenna performance, and long-term operational reliability in embedded electronic systems. The antenna is intended for use in wireless communication devices supporting technologies such as Bluetooth, Wi-Fi, Zigbee, Thread, and other 2.4 GHz ISM band protocols. It is optimized for compact PCB integration while providing efficient radiation characteristics, stable impedance matching, and dependable performance in space-constrained electronic products including IoT devices, industrial controllers, consumer electronics, and smart sensing platforms. Engineering Requirements The antenna shall be manufactured using qualified conductive and dielectric materials with controlled production processes to ensure consistent RF performance, mechanical durability, and long-term reliability. The construction shall maintain stable electrical characteristics throughout the specified operating temperature and environmental conditions. Electrical characteristics shall provide efficient radiation efficiency, stable impedance matching, low return loss, and reliable signal transmission and reception across the intended operating frequency range. The antenna shall maintain consistent performance when integrated according to the recommended PCB layout and grounding practices. The RF structure shall minimize insertion losses and support reliable wireless communication while maintaining acceptable gain, bandwidth, and radiation pattern characteristics. The antenna shall exhibit stable performance under normal operating conditions without significant degradation caused by thermal variation or environmental exposure. Mechanical construction shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. The package shall withstand vibration, thermal cycling, mechanical handling, and environmental stress without degradation of electrical or structural performance. Workmanship shall be free from defects including cracks, contamination, plating irregularities, or structural inconsistencies that could adversely affect RF performance or reliability. Inspection, validation, and testing shall be performed using calibrated RF measurement equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, RF performance specifications, impedance matching recommendations, qualification reports, inspection records, reliability data, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #RFAntenna #WirelessCommunication #Antenna #Bluetooth #WiFi #IoT #EmbeddedSystems #QualityAssurance #EngineeringDocumentation

Temperature Sensor Digital, Local -55°C ~ 150°C 16 b 6-WSON (2x2) The TMP117AIDRVR is a high-precision digital temperature sensor manufactured by Texas Instruments. The device provides accurate temperature measurements through an I²C-compatible digital interface and is optimized for applications requiring medical-grade accuracy, low power consumption, and compact PCB footprint. The sensor integrates a precision temperature sensing element, analog-to-digital converter, calibration memory, and digital interface into a single compact package. The device supports continuous conversion and shutdown operating modes, enabling efficient thermal monitoring in battery-powered and always-on systems. Internal calibration minimizes external component requirements while providing highly linear and repeatable temperature measurements across an extended operating range. The TMP117AIDRVR is commonly used in industrial controls, wearable electronics, healthcare equipment, environmental monitoring systems, battery management systems, consumer electronics, and precision instrumentation. Electrical Characteristics Supply voltage supports low-voltage digital systems and portable electronics applications. Ultra-low operating current enables long battery life in energy-sensitive designs. Integrated EEPROM allows programmable offset correction and configuration storage. Digital output eliminates the need for external ADC circuitry. High measurement resolution supports precision thermal monitoring applications. Low self-heating characteristics improve measurement stability and accuracy. Functional Features High-accuracy digital temperature sensing. I²C and SMBus compatible communication interface. Programmable alert functionality for thermal threshold monitoring. Continuous conversion and low-power shutdown operating modes. Integrated non-volatile memory for user configuration storage. Wide operating temperature range for industrial and commercial environments. Fast conversion timing suitable for real-time monitoring systems. Factory-calibrated performance requiring minimal external calibration. Package Information Package type is WSON with compact surface-mount footprint suitable for dense PCB layouts. Moisture-sensitive package designed for automated assembly processes. Lead-free and RoHS-compliant construction. Typical Applications Medical thermometers and patient monitoring systems. Industrial temperature monitoring equipment. Battery-powered portable electronics. HVAC and environmental sensing systems. Data acquisition and instrumentation systems. Server and embedded thermal management applications. Consumer electronics requiring precision thermal sensing. #commonpartslibrary #integratedcircuit #temperaturesensor

ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32

This project is a reference design for an ESP32-WROOM-32D based device. It features USB-C for power and data transfer, onboard voltage regulation, and multiple peripheral connections. It also includes a CH340C for USB to serial conversion #referenceDesign #Module #ESP32 #ESP32WROOM #RF #WIFI #MCU

I2C Isolator with Bidirectional Clock and Data and three 2/1 Auxiliary GPIOs, SOIC-16 i2c isolator additional gpio SOIC*7.5x10.3mm*P1.27mm*

Sub-GHz Wireless Microcontroller – Ultra-low-power Sub-GHz wireless microcontroller integrating a 64 MHz Arm® Cortex®-M0+ core with an RF transceiver for LPWAN, smart metering, industrial IoT, building automation, asset tracking, and wireless sensor networks. Features 128 KB Flash, 32 KB SRAM, and supports Sub-GHz operation from 413–479 MHz and 826–958 MHz (including regional ISM bands), with up to +20 dBm transmit power, −132 dBm receiver sensitivity, and data rates up to 600 kbps. Supports Sigfox, KNX RF, IEEE 802.15.4g, Mioty, and proprietary wireless protocols using 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, ASK, OOK, DBPSK, and DSSS modulation. Operates from a 1.7 V to 3.6 V supply and includes 17 GPIOs, 12-bit ADC, timers, DMA, SPI, I²C, UART/USART, I²S, IrDA, PWM, watchdog, AES hardware accelerator, true random number generator (TRNG), and low-power wake-up receiver. Specified for operation over a −40°C to +105°C temperature range and housed in a 32-pin VFQFPN (5 × 5 mm) package. #STMicroelectronics #STM32WL33KBV7 #STM32WL33 #SubGHzMCU #WirelessMCU #CortexM0Plus #LPWAN #Sigfox #KNXRF #IEEE802154g #Mioty #IoT #EmbeddedSystems

M.2 PCIe Gen4 Edge Card Connector – 67-position M.2 Key E edge card connector for PCI Express® Gen4 module interconnection. Features a 0.50 mm pitch, right-angle surface-mount solder termination, 67 contacts, 16 Gb/s data rate, and 1 A current rating. Supports 0.80 mm PCB/module thickness and includes board guides, 30 µin (0.76 µm) gold-plated copper alloy contacts, and a liquid crystal polymer (LCP) housing. Specified for an operating temperature range of −40°C to +85°C. #Amphenol #AmphenolICC #MDT420E01411 #M2Connector #PCIeGen4 #KeyE #EdgeCardConnector #67Position #0_5mmPitch #SurfaceMount #HighSpeedConnector #EmbeddedSystems

Automotive CAN FD Transceiver – High-speed CAN FD transceiver compliant with ISO 11898-2:2016 for automotive ECUs, body electronics, industrial automation, motor control, battery management systems (BMS), and embedded communication networks. Supports Classical CAN and CAN FD communication with data rates up to 8 Mbps, operating from a 4.5 V to 5.5 V supply. Features standby mode with ultra-low power consumption, ±58 V bus fault protection, TXD dominant timeout, thermal shutdown, undervoltage protection, 100 mV receiver hysteresis, and failsafe operation for robust and reliable CAN communication. Qualified to AEC-Q100 Grade 1, it operates over a −40°C to +125°C junction temperature range and is housed in a standard 8-pin SOIC package. Unlike the TCAN1462VDRBRQ1, this version does not include Signal Improvement Capability (SIC), making it suitable for conventional CAN/CAN FD networks. #TexasInstruments #TCAN1462VDRQ1 #TCAN1462Q1 #CANFD #CANTransceiver #AutomotiveElectronics #IndustrialCommunication #BatteryManagement #AECQ100 #SOIC8 #EmbeddedSystems

Battery Power Management IC Multi-Chemistry 14-TSSOP The bq34210-Q1 1-Series Cell System-Side CEDV Fuel Gauge provides fuel gauging and End-of-Service (EOS) Determination for 1-series cell batteries in applications that encounter infrequent discharge, such as eCall systems and uninterruptible power supplies (UPS) for backup during power failures, where batteries may stay connected to a charging power source most of their lifetime until needed. The bq34210-Q1 fuel gauge supports multiple battery chemistries, including Li-Ion, LiFePO4, and NiMH. The gas gauging function uses voltage, current, and temperature data along with Compensated End-ofDischarge (CEDV) technology to provide State-ofCharge (SOC) and State-of-Health (SOH) data. The device's EOS Determination function alerts when battery capability has degraded and is approaching the end of its usable service. Battery fuel gauging with the bq34210-Q1 fuel gauge requires connections only to PACK+ (P+) and PACK– (P–) for a removable battery pack or embedded battery management system. Features 1• Automotive-Qualified AEC-Q100, Grade 3 • 1-Series Cell Battery Fuel Gauge Supports Li-Ion, LiFePO4, and NiMH (3-Cell) Chemistries – Resides on System Board – Powers Directly from the Battery with Integrated LDO – Supports a Low-Value External Sense Resistor (10 mΩ) • Learning Load Enable (LEN) from Host • Ultra-Low Power Consumption in NORMAL (50 µA) and SLEEP (9 µA) Modes • Supports Replacement Batteries • Accurate End-of-Service (EOS) Determination for Batteries in Rarely Discharged Applications • CEDV Gas Gauge for 1-Series Cell Batteries, Providing: – State-of-Charge (SOC) – Time-to-Empty (TTE) – State-of-Health (SOH) • High-Side and Low-Side Current Sensing Options • Internal Temperature Sensor OR External Thermistor • Microcontroller Peripheral Interface Supports: – 400-kHz I 2C™ Serial Interface – Configurable Interrupt (ALERT) for SOC, Battery Levels, Temperature Faults, and Charge/Discharge Status 2 Applications • eCall Systems • Telematics Backup Systems • Uninterruptible Power Supply (UPS) Backup Systems • Emergency Battery Power Modules #BatteryFuelGauge #BatteryManagement #FuelGaugeIC #AutomotiveElectronics #TexasInstruments #LiIonBattery #LiFePO4 #I2C #PowerManagement #AECQ100 #BackupBattery #UPS #EmbeddedSystems

The ESP32-DEVKITC-VE evaluation kit from Espressif Systems is a high-performance development platform for RF, RFID, and wireless applications. It features the ESP32-WROVER-E with embedded Xtensa dual-core 32-bit LX6 microprocessor running up to 240 MHz, with 8MB Flash and 8MB PSRAM for efficient data processing. This board supports Wi-Fi 802.11 b/g/n and Bluetooth® Smart Ready 4.x (BLE) connectivity at 2.4GHz, offering wireless communication options. With 448KB ROM, 520KB SRAM, and 16KB SRAM in RTC, it provides ample memory for complex applications. It includes up to 24 GPIOs, SD card, UART, SPI, SDIO, I2C, LED and motor PWM, I2S, IR, pulse counter, capacitive touch sensor, ADC, DAC, and TWAI® (compatible with ISO 11898-1/CAN 2.0) #commonpartslibrary #ESP32-WROVER-E #evaluationboard

1/1 Transceiver Half CANbus 8-SOIC The SN65HVD230DR is a high-speed Controller Area Network (CAN) transceiver designed to interface a CAN protocol controller with the physical two-wire CAN bus. It operates as a differential line driver and receiver, translating logic-level signals into robust bus-level signals suitable for automotive, industrial, and distributed control applications. The device is optimized for reliable communication in electrically noisy environments and supports low-power operation, making it suitable for systems requiring energy efficiency and extended operational stability. This transceiver conforms to widely adopted CAN physical layer standards and is intended for use in systems requiring high data integrity, fault tolerance, and electromagnetic compatibility. It integrates protection features and supports standby functionality to reduce system power consumption when communication is inactive. Functional Overview The device provides bidirectional signal conversion between a CAN controller and the differential CAN bus lines. It features a transmit data input and a receive data output, enabling full-duplex communication at the protocol level. The driver stage generates differential output signals on the bus, while the receiver stage detects and translates bus signals back into logic-level data. An internal control mechanism allows the device to enter a low-power standby mode, reducing current consumption when active communication is not required. The transceiver includes slope control capability to manage signal edge rates, which helps minimize electromagnetic interference and improves signal integrity across the network. Electrical Characteristics The transceiver operates from a single low-voltage supply and is designed for compatibility with modern microcontrollers and digital logic systems. It provides differential output drive capability with controlled rise and fall characteristics. The receiver is designed with high input sensitivity and noise immunity to ensure accurate signal detection under varying bus conditions. The device includes thermal protection and safeguards against bus faults, including short-circuit conditions. Its internal circuitry is designed to maintain stable operation across a wide range of environmental conditions and supply variations. Interface Requirements The logic interface is compatible with standard digital input and output levels, allowing direct connection to a CAN controller. The bus interface consists of two differential lines that connect to the CAN network. Proper termination and layout practices are required to ensure optimal communication performance and compliance with CAN network design guidelines. Operating Conditions The device is intended for operation across a broad temperature range suitable for industrial and automotive environments. It maintains functional integrity under typical voltage fluctuations and environmental stresses encountered in embedded systems. Protection and Reliability Features The transceiver incorporates protection mechanisms to guard against overcurrent, thermal overload, and electrostatic discharge. It is designed to maintain communication reliability even in the presence of transient disturbances and electrical noise. Packaging and Integration The SN65HVD230DR is provided in a compact surface-mount package suitable for automated assembly. Its pin configuration supports straightforward integration into printed circuit board designs with minimal external components. #CommonPartsLibrary #IntegratedCircuits #Interface #Drivers #Receivers #Transceivers #65HVD230

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Right Angle; Through Hole USB Type-C Receptacle Connector for USB 2.0 data transfer and power delivery in board-mounted applications. It features a 16-position, single-row SMT right-angle receptacle with a 1.2 mm shell DIP length, supports up to 5 A rated current and 20 V AC rms rated voltage, and is designed for on-board mounting without a rear shield. #USBTypeC #USB2_0 #Receptacle #Connector #SMT #RightAngle #16Position #BoardMount #5A #JAEElectronics #DX07Series

High-Speed Logic Output Optocoupler – Single-channel high-speed optocoupler designed for digital signal isolation, industrial automation, PLCs, motor drives, switching power supplies, data communication, microcontroller interfaces, and embedded control systems. Features an open-collector TTL-compatible output with a 15 MBd data rate, 5 kVrms isolation voltage, and 10 kV/µs minimum common-mode transient immunity (CMTI) for reliable operation in noisy electrical environments. Provides 75 ns maximum propagation delay, 22 ns typical rise time, 6.9 ns typical fall time, and supports up to 50 mA output current. The input consists of a GaAs infrared LED with a 1.38 V typical forward voltage and 20 mA maximum forward current. Operates from a 4.5 V to 5.5 V output-side supply, over a −40°C to +85°C temperature range, and is housed in a compact 8-pin SOIC (SMD) package for space-efficient PCB designs. #LiteOn #6N137STA1 #6N137 #Optocoupler #LogicOptocoupler #DigitalIsolation #HighSpeedIsolation #IndustrialAutomation #MotorDrive #PLC #EmbeddedSystems

Wi-Fi® 4 + Bluetooth® 5 LE System-in-Package (SiP) MCU – Highly integrated 2.4 GHz wireless System-in-Package (SiP) featuring an ESP32-S3 dual-core Xtensa® LX7 microcontroller for IoT devices, smart home products, AIoT, edge computing, industrial automation, HMI, wearable devices, and embedded wireless applications. Operates at up to 240 MHz with 8 MB embedded Flash and 2 MB embedded PSRAM, eliminating the need for external memory and reducing PCB size. Supports Wi-Fi 802.11 b/g/n and Bluetooth® 5 LE (including Long Range and 2 Mbps PHY), with up to +20 dBm transmit power and 150 Mbps Wi-Fi data rate. Features native USB 2.0 OTG, vector instructions for AI acceleration, 45 programmable GPIOs, SPI, I²C, I²S, UART, USB, RMT, LCD/Camera interface, PWM, TWAI® (CAN), ADC, touch sensing, AES-XTS, SHA, RSA, ECC, HMAC, secure boot, Flash encryption, and a true random number generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +85°C temperature range, and is housed in a compact 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3PICO1N8R2 #ESP32S3 #WirelessMCU #SystemInPackage #WiFi #Bluetooth5LE #DualCore #XtensaLX7 #USBOTG #AIoT #EmbeddedSystems