Ultra-Low-Power Voltage Supervisor (Reset IC) – Single-channel voltage supervisor designed for microcontrollers, processors, IoT devices, industrial control systems, automotive electronics, battery-powered equipment, and embedded systems requiring reliable power-on reset and brownout detection. The Texas Instruments TLV803EA30DBZR monitors a 3.0 V supply rail with a 3.08 V reset threshold, providing an active-low open-drain RESET output to ensure proper system initialization and recovery during undervoltage conditions. Features 250 nA typical quiescent current, 130 ms minimum reset timeout, supply voltage operation from 0.7 V to 6 V, and open-drain output for easy interfacing with multiple voltage domains. Includes power-on reset, brownout protection, and low-power operation, making it ideal for energy-efficient embedded applications. Operates over a −40°C to +125°C temperature range and is housed in a compact 3-pin SOT-23 (DBZ) package for surface-mount designs. #TexasInstruments #TLV803EA30DBZR #TLV803E #VoltageSupervisor #ResetIC #PowerOnReset #BrownoutDetection #LowPower #OpenDrain #PowerManagement #EmbeddedSystems #IndustrialElectronics

4/4 Transceiver Full MII, RMII 32-VQFN (5x5) ## Engineering Specification ## General Description The **LAN8770M-I/PRA** is a Microchip Technology single-port **100BASE-T1 Ethernet physical layer transceiver** designed for automotive, industrial, and embedded networking applications. It provides Ethernet communication over a single balanced twisted pair and is suitable for compact systems requiring reliable network connectivity, low-power operation, and standard MAC interface support. The device is commonly used in automotive electronic control units, infotainment systems, telematics modules, sensor nodes, industrial control systems, and embedded Ethernet hardware. ## Device Identification Manufacturer Part Number: **LAN8770M-I/PRA** Manufacturer: **Microchip Technology** Product Family: **LAN8770** Device Category: **Integrated Circuit** Device Type: **Ethernet PHY Transceiver** Ethernet Standard: **100BASE-T1** Interface Type: **MII and RMII** Mounting Type: **Surface Mount** Package Type: **VQFN** ## Functional Description The device functions as an Ethernet physical layer transceiver that connects a host controller or microcontroller MAC interface to a single-pair Ethernet physical medium. It handles the analog and digital PHY functions required for 100BASE-T1 communication, allowing embedded systems to transmit and receive Ethernet data over a single twisted pair cable. ## Network and Interface Description The **LAN8770M-I/PRA** supports 100 Mb/s single-pair Ethernet communication and provides MII and RMII host interface options. This allows integration with microcontrollers, processors, gateways, and network controllers that support standard Ethernet MAC interfaces. The device is intended for applications where compact Ethernet connectivity and reduced cabling complexity are required. ## Electrical Description The device is designed for low-voltage operation and supports multiple supply domains according to the manufacturer’s recommended operating conditions. Proper power sequencing, decoupling, reset handling, clocking, and reference layout should be implemented to maintain stable PHY operation and signal integrity. ## Package and Mechanical Description The component is supplied in a compact surface-mount **VQFN package**, suitable for dense printed circuit board assemblies. The package supports automated assembly and is appropriate for space-constrained automotive and industrial electronic designs. ## Control and Diagnostic Description The PHY supports management and configuration through standard control interfaces used in Ethernet designs. It provides status monitoring and configuration capability for link management, operating mode selection, and system-level diagnostics. These features allow the host controller to configure and monitor Ethernet link behavior during operation. ## Automotive and Industrial Suitability The **LAN8770M-I/PRA** is suitable for embedded systems requiring robust single-pair Ethernet communication. It is applicable to automotive networking, telematics, infotainment, advanced driver assistance systems, industrial Ethernet nodes, building automation, control modules, and other connected embedded platforms. ## Mounting and Assembly Description The component is intended for surface-mount PCB assembly using standard reflow soldering processes. PCB layout should follow Microchip’s hardware design guidance, including proper power supply decoupling, controlled impedance routing, short signal paths, grounding, and separation of sensitive analog and digital sections where applicable. ## Design Considerations The design should account for Ethernet signal integrity, single-pair cable interface requirements, common-mode noise control, EMC performance, supply filtering, oscillator or clock source requirements, reset timing, thermal performance, and package solderability. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Application Suitability The device is suitable for automotive Ethernet nodes, electronic control units, telematics modules, infotainment systems, sensor interfaces, industrial controllers, embedded gateways, connected equipment, and compact network-enabled hardware requiring 100BASE-T1 Ethernet PHY functionality. ## Hashtags #commonpartslibrary #integratedcircuit #ethernetphy #microchip #microchiptechnology #lan8770 #lan8770mipra #singlepairethernet #100baset1 #automotiveethernet #ethernettransceiver #phytransceiver #embeddednetworking #mii #rmii #vqfnpackage #smdcomponent #surfacemount #automotiveelectronics #industrialethernet #telematics #infotainment #embeddedhardware #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

3 Channel AFE 24 Bit 28-WQFN (5x5) ADS1293CISQ/NOPB is a highly integrated, low-power 3-channel ECG Analog Front-End (AFE) from Texas Instruments. It is designed for portable and battery-powered medical devices, fitness monitors, heart-rate monitoring systems, Holter monitors, and other electrocardiogram (ECG) applications. The device integrates signal acquisition, filtering, lead-off detection, right-leg drive generation, and high-resolution analog-to-digital conversion into a single IC, reducing external component count and system cost. Key Features Three high-resolution ECG acquisition channels 24-bit analog-to-digital conversion Simultaneous pace detection support Ultra-low power consumption of approximately 0.3 mW per channel Low input-referred noise of 7 µVpp (40 Hz bandwidth) Programmable sample rates up to 25.6 ksps Differential input voltage range of ±400 mV Integrated EMI-hardened input filters Flexible input routing matrix Built-in Right-Leg Drive (RLD) amplifier AC and DC lead-off detection Integrated Wilson and Goldberger terminal generation Battery voltage monitoring capability Internal oscillator and voltage reference ALARMB pin for interrupt-driven diagnostics and fault reporting Multiple power-down and standby modes for battery-powered systems SPI-compatible digital interface Operating temperature range: –20°C to +85°C 28-pin WQFN package (5 mm × 5 mm) Typical Applications Portable 1-, 3-, 5-, 6-, 7-, 8-, and 12-lead ECG systems Holter monitors Event recorders Telemedicine devices Patient vital-sign monitoring equipment Automated External Defibrillators (AEDs) Sports and fitness heart-rate monitors Wearable medical devices Hashtags #commonpartslibrary #integratedcircuit #TexasInstruments #ADS1293 #AFE #AnalogFrontEnd #ECG #Electrocardiogram #MedicalElectronics #HealthTech #WearableDevices #HeartRateMonitor #PatientMonitoring #BiomedicalEngineering #24BitADC #LowPowerDesign #SPI #SignalConditioning #PortableMedicalDevices #HolterMonitor #Telemedicine #VitalSignsMonitoring #EmbeddedSystems #MixedSignalIC #WQFN28 #BatteryPoweredDevices #MedicalInstrumentation

Ethernet Controller 10/100 Base-T/TX Bus Interface 80-TQFP-EP (12x12) The LAN9254-I/JRX is an EtherCAT SubDevice (slave) controller developed by Microchip Technology, designed to serve as the communication backbone for industrial automation devices participating in an EtherCAT network. The device integrates dual Ethernet physical layer transceivers directly on-chip, eliminating the need for external PHY components and simplifying the design of EtherCAT-enabled equipment such as servo drives, sensors, I/O modules, and other field devices used in real-time industrial control systems. Architecturally, the controller can operate as either a two-port or three-port node, depending on the network topology required. In its standard configuration it functions as a two-port device supporting daisy-chain connections typical of EtherCAT line topologies. When configured as a three-port device, it gains an additional management interface port that can connect to an external PHY or to another LAN9254, enabling star or tree network topologies and allowing the device to act as a branching point within a larger EtherCAT installation. Each integrated Ethernet PHY operates in full-duplex mode and supports automatic crossover detection, so the device can use either straight-through or crossover cabling without requiring manual configuration. Beyond pure protocol handling, the LAN9254 includes a substantial set of general-purpose digital input and output lines, allowing it to be used in simple field devices without requiring a separate microcontroller. For more complex applications, the device communicates with an external host processor through an integrated host bus interface that behaves like simple memory-mapped SRAM, supporting both 8-bit and 16-bit data widths along with multiple byte-ordering conventions, which makes it straightforward to interface with a wide range of microcontroller and microprocessor architectures. Internally, dual process data RAM buffers manage the exchange of real-time process data between the host application and the EtherCAT communication engine, while a dedicated interrupt line notifies the host of relevant internal events. A key feature of the device is its built-in distributed clock mechanism, which provides high-precision timing synchronization across all nodes in an EtherCAT network. This capability is essential for motion control and other applications where multiple devices must act in tight temporal coordination. The controller also provides configurable status indication through standard network activity and link LEDs, along with optional error and run-state indicators that give visibility into the health and operational state of the device at a glance. Power architecture on the LAN9254 is simplified through an integrated linear regulator, allowing the device to be operated from a single primary supply rail while internally generating the lower voltage needed for its core logic. This reduces the external power supply complexity that would otherwise be required to support separate core and I/O voltage domains. The "-I" designation on this particular part number indicates an industrial-grade temperature rating, making it suitable for deployment in factory floor and other demanding industrial environments where extended thermal range and long-term reliability are required. The device is housed in a surface-mount package consistent with dense industrial control board layouts and is compliant with RoHS material restrictions. Spec Sheet Identification Part Number: LAN9254-I/JRX Device Family: LAN9254 Manufacturer: Microchip Technology Functional Classification Device Type: EtherCAT SubDevice (slave) controller Network Role: Two/three-port configurable node Integrated PHYs: Dual Ethernet physical layer transceivers, on-chip Auto-MDIX Support: Yes, supports direct and crossover cabling Communication & Protocol Features Protocol: EtherCAT Topology Support: Daisy-chain (line), star, and tree topologies Additional Port Mode: Optional third port for branching/tap configurations Clock Synchronization: Integrated distributed clock for high-precision timing Host Interface Interface Type: SRAM-like host bus interface Data Width Support: Selectable bit-width host bus operation Endianness Support: Multiple byte-ordering modes Process Data Handling: Dual process data RAM buffers Interrupt Support: Configurable host interrupt line Digital I/O General-Purpose I/O: Integrated digital I/O lines for microcontroller-less operation Standalone Mode: Supports operation without external microcontroller for simple device designs Power Architecture Supply Configuration: Single primary supply rail Internal Regulation: Integrated linear regulator for core voltage generation Status Indication LED Support: Standard run and link/activity indicators per port Optional Indicators: Configurable error and run-state status indicators Environmental & Qualification Temperature Grade: Industrial ("-I" suffix) RoHS Compliance: Yes Package Package Type: Surface-mount, quad flat package style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel, per part suffix designation #LAN9254 #Microchip #EtherCAT #SlaveController #SubDeviceController #IndustrialEthernet #IndustrialAutomation #MotionControl #EmbeddedSystems #FieldDevice #DigitalIO #HostBusInterface #DistributedClock #TQFP #RoHSCompliant #IndustrialGrade #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #SemiconductorIC

All details fully confirmed from Azoteq's official IQS7222B datasheet and multiple verified distributor sources. Here's the complete spec. Engineering Specification — IQS7222B102QNR Manufacturer: Azoteq (Pty) Ltd Device Family: IQ Switch® ProxFusion® Series — IQS7222B General Description The IQS7222B102QNR is a high-channel-count capacitive touch and proximity sensing controller integrated circuit manufactured by Azoteq, belonging to the ProxFusion series of intelligent human interface sensing devices. The IQS7222B is a sensor fusion device for various multi-button applications that is fully I²C compatible, with on-chip calculations that enable the IC to respond effectively even in the lowest-power modes. It represents an expanded-channel evolution within Azoteq's IQS7222 family, offering a substantially higher mutual capacitance channel count than the IQS7222A variant while maintaining the same ProxFusion design philosophy of combining sophisticated on-chip sensing intelligence with a minimal external component requirement and a compact surface-mount package. Molex The IQS7222B is a highly flexible ProxFusion device that can configure up to eighteen mutual capacitance buttons or up to eight self-capacitance buttons, with nine external sensor pad connections available in the QFN package variant. Alternatively, it can configure up to twenty mutual capacitance buttons or eighteen mutual capacitance buttons with a proximity wake-up function. This high degree of channel configurability makes the device adaptable to a very broad range of physical interface configurations, from simple multi-button panels to complex touch arrays with simultaneous proximity wake-up capability, all within a single fixed-footprint IC that does not require a change of device between product variants with different button counts. MolexAmazon Target applications for the IQS7222B include remote control user interfaces, home automation device user interfaces, and wireless speaker controls. These application domains share common requirements for robust touch detection through cosmetic overlay materials such as glass, plastic, or painted surfaces, reliable operation in environments where the device may be exposed to moisture or contamination, and power efficiency sufficient to support battery-powered or always-on operation without significantly impacting battery life. The device's on-chip power management architecture, which features automated system power modes for optimal response versus consumption, directly addresses these requirements by allowing the device to spend the majority of its time in a low-current sleep or ultra-low-power state while still waking promptly in response to proximity or touch events. MolexMolex Built-in basic functions include automatic tuning, noise filtering, debounce and hysteresis, and dual direction trigger indication. The automatic tuning capability, implemented through Azoteq's proprietary ATI algorithm, compensates for variations in electrode capacitance that arise from PCB manufacturing tolerances, overlay thickness variation, and environmental factors such as temperature and supply voltage drift. This self-calibration eliminates the need for individual unit factory calibration and ensures consistent touch sensitivity across the full production run of any product built around this device. The noise filtering and debounce functions further improve the reliability of touch event detection in electrically noisy environments, preventing false triggers from electrical interference or mechanical vibration that could otherwise cause spurious button events in poorly filtered designs. Molex Both mutual capacitance and self-capacitance designs are possible with the IQS7222B, giving system designers the flexibility to choose the sensing modality most appropriate for their electrode layout and overlay configuration. Mutual capacitance sensing offers better noise immunity and the ability to detect touch through thicker overlay materials, while self-capacitance sensing allows a simpler single-electrode layout per button with potentially higher raw sensitivity. The I²C communication interface supports IRQ/RDY signaling at speeds up to Fast-Plus mode, providing efficient, low-latency event notification to the host microcontroller without requiring continuous polling of the device. The "QNR" suffix in the part number designates the QFN twenty-pin package variant, which offers the maximum external pad count for mutual capacitance configurations. MolexMolex Spec Sheet Identification Part Number: IQS7222B102QNR Device Family: IQ Switch ProxFusion Series — IQS7222B Manufacturer: Azoteq (Pty) Ltd Part Number Decode IQS7222B: Base device family, B-variant expanded channel count 102: Firmware/configuration variant designation QNR: QFN twenty-pin package, tape-and-reel Functional Classification Device Type: Multi-channel capacitive touch and proximity sensing controller IC Sensing Architecture: ProxFusion sensor fusion engine with on-chip processing Application Class: Multi-button, slider, and wheel human interface controller Channel Configuration Mutual Capacitance Buttons: Up to twenty configurable buttons Mutual Capacitance with Proximity Wake-Up: Up to eighteen mutual capacitance buttons with simultaneous proximity wake function Self-Capacitance Buttons: Up to eight self-capacitance buttons External Sensor Pad Connections: Nine pads available in QFN package Sensing Modalities Mutual Capacitance: Full channel array for high noise immunity and overlay penetration Self-Capacitance: Simplified single-electrode per button layout option Proximity Detection: Pre-touch proximity wake-up capability Built-In Processing Functions Automatic Tuning: Proprietary ATI algorithm for self-calibration and baseline normalization Noise Filtering: Integrated digital filtering for EMI and environmental noise rejection Debounce and Hysteresis: Per-channel configurable debounce and release hysteresis Dual Direction Trigger: Positive and negative delta event detection Host Interface Communication Protocol: I²C fully compatible Speed Grade: Up to Fast-Plus mode Event Signaling: IRQ/RDY interrupt output for host notification I²C Address: Configurable; additional address options available on special request Power Management Operating Modes: Active sensing, idle, and ultra-low-power modes Automated Power Mode Control: System-managed transitions for optimized response versus current consumption ULP Wake Capability: Proximity or touch event wake-up from ultra-low-power state Layout & Application Notes VREG Decoupling: Capacitor required at each VREG pin, placed as close as possible to IC Tx Series Resistance: Nominal series resistance recommended on Rx electrodes to reduce EMI coupling ESD Rating: Pins rated to high HBM ESD performance per JEDEC JEP155 Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active production Package Package Type: QFN — Quad Flat No-Lead, twenty-pin Package Designation: QNR variant per Azoteq ordering suffix Mounting Method: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel Target Applications Remote control user interfaces Home automation device controls Wireless speaker and audio device interfaces Multi-button consumer appliance panels IoT device touch interfaces Industrial HMI panels with overlay #IQS7222B #IQS7222B102QNR #Azoteq #ProxFusion #IQSwitch #CapacitiveTouchController #MutualCapacitance #SelfCapacitance #ProximityController #MultiButtonHMI #TouchSensor #ATICalibration #SmartHMI #HomeAutomation #RemoteControl #WirelessSpeaker #IoTDesign #LowPowerSensing #QFN20 #SurfaceMount #EmbeddedHMI #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

Ultra Efficient Dual Sources Energy Manager with Ratio/Constant Voltage Regulation, Regulated Buck Output and 5 V Charger, 120 mV, 135 mA The AEM13921 is a fully integrated and compact power management circuit that extracts DC power from two harvesting sources to store energy in a rechargeable storage element and supply an application circuit. A 5 V input can also be used to charge the storage element (e.g., if it gets depleted). This compact and ultra-efficient PMIC allows for extending battery lifetime and eliminating the primary energy storage in a large range of applications. Both sources implement Maximum Power Point Tracking (MPPT) based on open-circuit voltage ratio as well as constant source voltage regulation features, allowing for harvesting the maximum power available from each source to charge the storage element. With its unique cold-start circuit, it can start operating with an input voltage as low as 275 mV (min. 1.5 µW power). The configurable protection thresholds prevent overcharging and overdischarging the storage element. No external components are required to set those thresholds. The thermal monitoring prevents charging and discharging the storage element outside a configurable temperature range. The Average Power Monitoring (APM) allows the application circuit to get an estimate of the energy harvested from each source to the battery and from the battery to the application circuit. A shipping mode is available to avoid charging and discharging the storage element during shipping or storage. A buck regulator with selectable output voltage allows an application circuit to be supplied with high efficiency. I²C communication allows users to control every setting of the AEM13921 from the application circuit MCU. Features and Benefits Dual sources inputs - Boost operation optimized for each source. - Conversion efficiency above 90 % on each source. - Harvests from 120 mV after cold start. - Simultaneous harvesting from both sources. - Up to 135 mA current extracted from the harvester. Maximum Power Point Tracking - Both sources configurable to constant voltage mode or to open-circuit voltage ratio mode. - Optimal harvesting from a multiple combinations of harvesters (PV cells, RF, vibration, pulsed sources...). Cold start from 275 mV / 1.5 µW input - Startup at ultra-low power from each harvesting source input. Configurable overdischarge & overcharge protection - Supports various types of rechargeable storage elements (LiC, Li-ion, LiPo, Li-ceramic pouch...). Regulated output for application circuit - Buck regulator conversion efficiency up to 96 %. - Selectable output voltage between 0.6 V and 3.3 V. - Output current up to 100 mA. Thermal monitoring - Storage element protection against overtemperature and under-temperature during charging and discharging, independently. Average Power Monitoring - Provides data to determine how much energy has been transferred to the storage from each source and from the 5 V charger, as well as the energy drained from the storage to supply the application circuit. System configuration by GPIO or I²C communication - All settings dynamically configurable through GPIO or I²C (Fast Mode Plus). - System data available through I²C. Shipping mode - Storage element charge and discharge disabling during shipment. External 5 V charging capability - Extra charging input for 5 V power supplies. - Configurable CC and CV modes (max. 135 mA). - Provides a fast charging alternative when no source is available for a long time. #AEM13921 #EnergyHarvesting #PowerManagementIC #PMIC #MPPT #BatteryCharging #EnergyAutonomous #IoT #WirelessSensor #IndustrialMonitoring #EmbeddedSystems #QFN #epeas #LowPowerDesign

Digital Potentiometer 10k Ohm 4 Circuit 257 Taps I2C Interface 20-TSSOP # Engineering Specification ## Product Name MCP4461-103E/ST ## General Description MCP4461-103E/ST is a non-volatile digital potentiometer integrated circuit designed to provide electronically programmable resistance adjustment for analog and mixed-signal applications. The device enables precise digital control of resistance values through a serial communication interface, eliminating the need for manual potentiometer adjustments and enhancing system automation capabilities. The component integrates multiple resistor networks, non-volatile memory, and digital control logic within a compact package, making it suitable for signal conditioning, gain adjustment, calibration, offset trimming, volume control, and configuration management applications. The design supports reliable operation in embedded systems, industrial electronics, instrumentation equipment, communication devices, and consumer products requiring programmable analog control. The device is optimized for ease of integration, low power consumption, repeatable performance, and long-term reliability. Non-volatile memory functionality allows resistance settings to be retained during power interruptions, supporting consistent system behavior and simplified startup configuration. ## Functional Requirements ### Digital Resistance Control The device shall provide programmable resistance adjustment through a digital communication interface. ### Non-Volatile Memory Operation The device shall retain programmed resistance settings when power is removed and restore stored values upon power-up. ### Multi-Channel Adjustment The device shall support independent control of multiple resistance channels for flexible system configuration. ### Analog Signal Conditioning The device shall support use in gain control, calibration, bias adjustment, offset correction, and signal tuning applications. ## Electrical Requirements ### Power Supply Compatibility The device shall operate from standard low-voltage electronic power supply rails suitable for embedded and industrial systems. ### Digital Communication The device shall support serial communication for configuration, programming, and control of internal resistance networks. ### Resistance Network Performance The device shall provide repeatable and stable resistance adjustment characteristics throughout normal operating conditions. ### Low Power Operation The device shall minimize power consumption while maintaining functional performance and memory retention capability. ### Noise and Signal Integrity The design shall support accurate analog signal processing with minimal impact on system performance. ## Mechanical Requirements ### Package Construction The component shall be supplied in a surface-mount package suitable for automated PCB assembly processes. ### Board Integration The device shall support standard printed circuit board mounting practices and electronic manufacturing workflows. ### Structural Reliability The package shall maintain electrical and mechanical integrity during handling, assembly, and operational service. ## Environmental Requirements ### Operating Environment The device shall operate reliably within environmental conditions commonly encountered in commercial and industrial electronic equipment. ### Storage Conditions The component shall maintain functional and physical integrity during storage, transportation, and inventory management activities. ### Environmental Robustness The design shall support stable operation under expected temperature and humidity variations within specified application environments. ## Quality Requirements ### Reliability The device shall provide consistent long-term performance with stable resistance characteristics and memory retention capability. ### Verification Electrical functionality, communication performance, memory operation, and resistance adjustment behavior shall be validated through applicable testing procedures. ### Compliance The product shall conform to relevant semiconductor manufacturing, quality assurance, and electronic component standards. ## Documentation Requirements Technical documentation shall include device functionality, communication interface requirements, programming guidelines, application recommendations, electrical characteristics, package information, and reliability considerations. ## Classification Tags #MCP4461 #MCP4461103EST #DigitalPotentiometer #NonVolatileMemory #IntegratedCircuit #ICComponent #AnalogElectronics #MixedSignalDesign #SignalConditioning #GainControl #CalibrationCircuit #EmbeddedSystems #ElectronicComponents #ElectricalEngineering #PCBDesign #CircuitDesign #IndustrialElectronics #Instrumentation #CommonPartsLibrary #EngineeringSpecification #ComponentLibrary #TechnicalDocumentation #SystemIntegration #HardwareDevelopment #ReliabilityEngineering

Half Bridge (2) Driver DC Motors, General Purpose NMOS, Power MOSFET 24-VQFN (4x4) The DRV8770RGER is a high-voltage brushed DC motor gate driver integrated circuit manufactured by Texas Instruments, designed to drive external N-channel power MOSFETs configured in a dual half-bridge topology for use in brushed DC motor control, stepper motor drive, solenoid actuation, and other inductive load switching applications. Rather than integrating the power stage transistors directly within the IC, the DRV8770 functions as a gate driver, providing the gate voltage and current needed to fully and rapidly switch external discrete power MOSFETs, which allows the designer to choose power devices appropriate to the specific voltage and current requirements of their motor or load without being constrained by the internal power stage of an integrated motor driver. The DRV8770 delivers two half-bridge gate drivers, each capable of driving high-side and low-side N-channel power MOSFETs. The integrated bootstrap diode and external capacitor generate the correct gate drive voltages for the high-side MOSFETs, while the GVDD rail drives the gates of the low-side MOSFETs. This bootstrap architecture eliminates the need for an external isolated gate drive power supply for the high-side switch, simplifying the overall power stage design significantly compared to approaches that require separate high-side power supply generation. This device decreases system component count, reduces PCB area, and saves cost by integrating two independent half-bridge gate drivers and bootstrap diodes. digikeyTME The high-side and low-side gate drivers can drive source and sink currents sufficient for fast, efficient switching of external power MOSFETs, with total average output current capability defined in the datasheet. The asymmetric source and sink current capability is a deliberate design choice reflecting the typical requirements of power MOSFET switching, where rapid turn-off is often more critical than turn-on speed for preventing shoot-through and managing switching losses in bridge circuits. Small propagation delay and delay matching specifications minimize the dead-time requirement, which further improves efficiency. TMEFarnell The high voltage tolerance of the gate drive pins improves system robustness. The SHx phase pins can tolerate significant negative voltage transients, while the high-side gate driver supply can support higher positive voltage transients on the BSTx and GHx pins. This enhanced transient tolerance is essential in motor drive applications where inductive switching generates voltage spikes and negative voltage excursions on the switch node that would damage less robust gate driver designs. An input deglitcher prevents high-frequency noise on the input pins from affecting the output state of the gate drivers, protecting against inadvertent switching caused by electrical noise on the control interface lines. FarnellAllDataSheet The device can drive one or two DC brush motors, one stepper motor, solenoids, or other inductive loads. This versatility makes it suitable across a broad range of actuator types within the same hardware platform, allowing a single PCB design to serve multiple product variants by simply changing the connected load and the firmware control scheme. Undervoltage protection is provided for both low-side and high-side through GVDD and BST undervoltage lockout, preventing the external power MOSFETs from operating with insufficient gate drive voltage, which would cause them to enter a linear operating region with excessive power dissipation and potential thermal damage. digikeyFarnell The DRV8770RGER is housed in a compact VQFN twenty-four-pin surface-mount package, suited to space-constrained motor drive PCB layouts, and is rated for operation across an extended industrial temperature range. Spec Sheet Identification Part Number: DRV8770RGER Device Family: DRV8770 Manufacturer: Texas Instruments Functional Classification Device Type: Dual half-bridge N-channel MOSFET gate driver IC Topology: Two independent half-bridge gate drivers Application Class: Brushed DC motor, stepper motor, solenoid, and inductive load drive Gate Drive Architecture High-Side Driver: Bootstrap-based gate drive with integrated bootstrap diode Low-Side Driver: GVDD-referenced direct gate drive Gate Drive Current — Source: High source current capability for rapid MOSFET turn-on Gate Drive Current — Sink: Higher sink current capability for rapid MOSFET turn-off Voltage Ratings Maximum Operating Voltage: High-voltage class, suited to industrial motor supply rails Phase Pin Transient Tolerance: Rated for negative voltage transients on SHx switch node pins Bootstrap Pin Transient Tolerance: Elevated absolute maximum on BSTx and GHx pins for spike immunity Timing & Switching Performance Propagation Delay: Small and tightly specified for minimal dead-time requirement Delay Matching: High-side to low-side delay matching for improved bridge efficiency Input Deglitching: Built-in input deglitch filter to suppress high-frequency noise on control inputs Protection Features GVDD Undervoltage Lockout: Protects low-side gate drive from insufficient supply BST Undervoltage Lockout: Protects high-side gate drive from insufficient bootstrap voltage Negative Transient Tolerance: Phase pins rated for switch-node negative voltage excursions Load Compatibility Supported Load Types: Brushed DC motors, stepper motors, solenoids, and general inductive loads Drive Configurations: Single or dual brushed DC motor, single stepper motor, or independent half-bridge loads Environmental & Qualification Operating Temperature Range: Extended industrial temperature range RoHS Compliance: Yes Lifecycle Status: Active production Package Package Type: VQFN — Very thin Quad Flat No-Lead, twenty-four-pin Package Suffix: RGER designation Mounting Method: Surface mount technology (SMT) Package Pitch: Fine pitch, compact footprint Packaging Format Supply Format: Tape-and-reel, cut-tape, and custom reel options available #DRV8770 #DRV8770RGER #TexasInstruments #GateDriver #HalfBridgeDriver #BrushedDCMotor #MotorDriver #StepperMotorDriver #SolenoidDriver #NChannelMOSFET #BootstrapDriver #HighVoltageDriver #PowerElectronics #MotorControl #InductiveLoad #VQFN #SurfaceMount #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #IndustrialMotorDrive

4 Channel AFE 12 Bit 36-WLCSP (2.8x2.56) The ADPD7000 is a highly integrated analog front end (AFE) designed for measuring various vital signals. The optical channel is designed as an optical transceiver, stimulating up to eight light emitting diodes (LEDs) and measuring the return signal on up to four separate current inputs. The signal chain rejects signal offsets and corruption from asynchronous modulated interference, typically from ambient light, eliminating the need for optical filters or externally controlled DC cancellation circuitry. The electrocardiography (ECG) signal acquisition is designed to support low noise, diagnostic level measurement in the presence of a variety of interferers. The ECG signal chain has a number of complementary features supporting ECG measurement, such as driven reference for common-mode rejection and lead off detection to identify a fallen electrode. The body impedance analysis (BIA) signal chain is designed for body impedance measurement with a configurable excitation path and measurement path. A 12-bit digital-to-analog converter (DAC) is used in the excitation path to generate the sinusoid wave and high precision measurement, with configurable filters used to measure the body response of the stimulus. The electrodermal activity (EDA) signal chain is designed for electrodermal activity. By multiplexing BIA and ECG peripheral circuits, the ADPD7000 supports high precision AC and DC measurement with 1 nS resolution. The data output and functional configuration use a serial port interface (SPI) on the ADPD7000. The control circuitry includes flexible LED signaling and synchronous detection, digital filters, digital wave generators, and configurable filters. The ADPD7000 is available in a 2.795 mm × 2.560 mm, 0.40 mm pitch, 36-ball WLCSP. ► Multimodal analog front end ► Optical channel ► 4 input channels with multiple operation modes for various sensor measurements ► 4-channel processing with simultaneous sampling ► 12 programmable time slots for synchronized sensor measurements ► Flexible input multiplexing to support single-ended sensor measurements ► 8 LED drivers, 2 of which can be driven simultaneously ► Flexible sampling rate from 0.004 Hz to 9 kHz using internal oscillators ► AC ambient light rejection: 78 dB up to 100 Hz ► 400 mA total LED peak drive current ► Individual ambient cancellation DAC at TIA input with 9-bit control up to 300 μA ► Individual LED DC cancellation DAC at TIA input with 7-bit control up to 190 μA ► ECG channel ► <1 µV RMS RTI noise at diagnosis bandwidth ► High input impedance 20 GΩ ► Accepts up to ±1.2 V of DC differential input range ► CMRR: 115 dB ► Flexible 4 electrode configurations to support various applications ► Both AC lead off detection and DC lead off detection ► Support always on, low power, lead on detection ► BIA channel ► Low power, high accuracy excitation path ► Configurable excitation frequency up to 250 kHz ► Sine wave excitation with a 12-bit DAC ► High accuracy with large imbalance contact impedance ≤20 kΩ ► Configurable receive filters with low noise design ► Complex impedance measurement engine ► Integrated current-limit resistors ► EDA channel ► Support both voltage excitation and current excitation ► 10 kΩ to100 MΩ measurement range with 1 nS resolution ► DFT and decimation for high accuracy measurement result ► SPI communications supported ► 704-byte FIFO

32 Bit Analog to Digital Converter 5, 10 Input 1 Sigma-Delta 28-TSSOP The ADS1263IPW is a high-precision, low-noise analog-to-digital converter designed for demanding industrial, instrumentation, and sensor measurement applications. Manufactured by Texas Instruments, this device integrates a delta-sigma ADC architecture with programmable gain amplification, precision voltage reference support, sensor biasing functions, and extensive diagnostic capabilities. It is optimized for applications requiring extremely high resolution and accuracy when measuring low-level analog signals. The device supports direct interfacing to bridge sensors, thermocouples, RTDs, pressure sensors, strain gauges, and other precision transducers. Integrated system monitoring and fault detection features simplify implementation in safety-critical and high-reliability systems. Flexible input multiplexing and multiple data-rate options allow the converter to be used across a wide range of precision data acquisition applications. The ADS1263IPW communicates through a standard SPI-compatible serial interface and operates from low-voltage analog and digital supplies. The device is packaged in a thermally efficient TSSOP package suitable for compact embedded system designs. Electrical Characteristics The converter utilizes a delta-sigma ADC core with extremely high effective resolution and low input-referred noise performance. It supports differential and single-ended analog input configurations with programmable gain settings for low-level sensor measurements. The integrated programmable gain amplifier supports multiple gain selections for direct amplification of small analog signals. The converter includes internal offset and gain calibration functions to improve system-level measurement accuracy. The device provides low drift characteristics and high common-mode rejection performance suitable for precision industrial environments. Analog Features The converter supports multiple analog input channels through an integrated input multiplexer. Internal sensor bias current sources are available for RTD and resistive sensor excitation applications. Integrated digital filtering options allow optimization between noise performance and conversion speed. Simultaneous rejection of power-line interference frequencies is supported for industrial measurement systems. The device includes internal temperature sensing and diagnostic monitoring functions for enhanced system reliability. Digital Interface Communication is implemented through an SPI-compatible serial interface supporting flexible host controller integration. The interface supports command-based register access, data readback, and configuration management. Programmable data rates allow balancing between throughput and precision requirements. Power Requirements The device operates from separate analog and digital supply rails to improve noise isolation and measurement accuracy. Low-power operating modes are supported for energy-sensitive applications. Protection and Diagnostics Integrated fault detection and monitoring functions include sensor open-circuit detection, reference monitoring, supply monitoring, and internal self-test capability. These features improve reliability in industrial and safety-oriented systems. Package Information The ADS1263IPW is supplied in a TSSOP package with fine-pitch lead spacing suitable for high-density PCB layouts and automated assembly processes. Typical Applications Industrial process control systems Precision data acquisition equipment Temperature measurement systems Pressure and bridge sensor interfaces Weigh scale and load-cell instrumentation Laboratory and test instrumentation Medical instrumentation Energy monitoring and metering systems #commonpartslibrary #integratedcircuit #analog #digital #converter

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

Pressure Sensor ±0.04PSI (±0.25kPa) Differential Male - 0.08" (1.93mm) Tube, Dual 12 b 8-DIP (0.524", 13.30mm), Dual Ports, Same Side Excellent — full picture confirmed from multiple sources. The HSCDRRN001ND2A5 is a TruStability HSC Series high accuracy digital I²C sensor with address 0x28, DIP package, dual radial barbed ports on the same side, differential pressure type, rated for ±1 inH₂O, operating on a 5.0 Vdc supply. Here's the complete spec. HIROSE Electric Engineering Specification — HSCDRRN001ND2A5 Manufacturer: Honeywell Sensing and Productivity Solutions Device Family: TruStability HSC Series General Description The HSCDRRN001ND2A5 is a high-accuracy, fully compensated and amplified differential pressure sensor manufactured by Honeywell, belonging to the TruStability HSC Series of board-mount pressure sensing devices. The device is built around a piezoresistive silicon sensing element housed within a ceramic package, combining a mature and proven sensing principle with advanced on-chip signal conditioning that makes the device ready for direct interfacing with a host microcontroller or processor without requiring extensive external analog signal processing circuitry. The defining characteristic of the TruStability HSC series, and of this device in particular, is its fully calibrated and temperature-compensated output, achieved through an integrated application-specific integrated circuit that corrects for sensor offset, sensitivity drift, temperature effects, and pressure nonlinearity across the device's rated operating range. This level of factory compensation allows the device to maintain its specified accuracy across the full compensated temperature range without requiring individual board-level calibration, significantly simplifying the design and production process for equipment that relies on precise low-pressure measurement. This particular configuration uses a digital I²C output interface, communicating pressure readings as high-resolution digital data words over a standard two-wire bus using a fixed I²C device address. This digital output makes it highly compatible with modern embedded system architectures where analog-to-digital conversion resources may be limited or where noise immunity and data integrity over longer trace runs are priorities. The device offers both high resolution and high accuracy within a tight total error band, making it suitable for applications where small differential pressure differences must be resolved reliably over time and temperature variation. The sensor is configured as a differential pressure measurement device, meaning it produces an output proportional to the difference in pressure between its two pneumatic ports rather than to absolute or gauge pressure relative to atmosphere. This makes it particularly well suited to airflow measurement, filter condition monitoring, liquid level detection, spirometry and respiratory measurement, HVAC duct pressure sensing, and other applications where the pressure difference across two points in a system is the relevant physical quantity. The device is housed in a through-hole dual in-line package with two radial barbed pneumatic port fittings located on the same side of the package body, allowing small-bore flexible tubing to be connected directly to each port without requiring additional adapter fittings. The barbed port design provides a secure, friction-held tube connection that resists accidental disconnection during normal handling and operation. The package is designed for standard through-hole PCB mounting, and the device is intended for use with non-corrosive, non-ionic dry gases only, consistent with the silicon and ceramic wetted materials used in its construction. Spec Sheet Identification Part Number: HSCDRRN001ND2A5 Series: TruStability HSC Series Manufacturer: Honeywell Sensing and Productivity Solutions Functional Classification Device Type: Board-mount piezoresistive silicon pressure sensor Sensing Type: Differential pressure Compensation: Fully calibrated and temperature compensated via integrated ASIC Accuracy Class: High accuracy, tight total error band class Output Interface Output Type: Digital I²C I²C Device Address: Fixed address 0x28 Output Resolution: High-resolution digital pressure word Applicable Interface Standards: I²C-compatible digital output Pressure Port Configuration Port Style: Dual radial barbed ports Port Orientation: Same side, both ports on the same face of the package Tubing Connection: Direct small-bore flexible tube connection via barbed fittings Media Compatibility: Non-corrosive, non-ionic dry gases only Pressure Characteristics Pressure Type: Differential Pressure Range: Very low differential pressure class, sub-inch water column range Overpressure Capability: Rated overpressure withstand above operating range Power Supply Supply Voltage: Standard logic-level supply rail class Environmental & Mechanical Operating Temperature Range: Commercial/industrial extended temperature range Compensated Temperature Range: Subset of the full operating temperature range, within which calibrated accuracy is maintained Mount Type: Through-hole Package: DIP (Dual In-line Package), standard pin pitch Application Suitability Target Applications: Airflow measurement, HVAC duct pressure sensing, filter monitoring, respiratory and spirometry equipment, liquid level detection, low-pressure process monitoring Environmental & Qualification RoHS Compliance: Yes Media Restriction: Dry, non-corrosive, non-ionic gases only; no liquid media on Port #HSCDRRN001ND2A5 #Honeywell #TruStability #HSCSeries #PressureSensor #DifferentialPressure #PiezoresistiveSensor #I2CSensor #BoardMountSensor #LowPressureSensor #AirflowSensor #HVACSensor #RespiratoryMedical #ThroughHole #DIPPackage #CompensatedSensor #TemperatureCompensated #SensorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

Monostable Multivibrator 11 ns TSOT-23-6 #Timer #commonpartslibrary

Mid-Range Relays, 2 Form C, DPDT, 2 C/O, Coil Suppression Diode, Gold Terminal Plating, 5 A, 28 VDC Coil Voltage, CII FCB-205 Series The M83536/2-024M is a hermetically sealed electromechanical power relay built to comply with the MIL-PRF-83536 military specification family, a standard governing high-reliability relays intended for use in demanding military, aerospace, and defense electronic systems. Devices manufactured under this specification series are designed to meet stringent requirements for mechanical ruggedness, electrical performance consistency, and long-term reliability under the extreme vibration, shock, temperature cycling, and altitude conditions typically encountered in airborne, shipboard, and ground military platforms. This relay is configured as a double-pole, double-throw switching device, meaning it provides two independently switched sets of contacts that can each connect to one of two possible circuit paths, controlled by a single energized coil. This configuration is commonly used in applications requiring simultaneous switching of two separate circuits, such as redundant power path switching, dual-channel signal routing, or coordinated control of multiple subsystems from a single control signal. The relay operates on momentary, non-latching actuation, meaning the contacts return to their de-energized state as soon as coil power is removed, rather than remaining in their last-commanded position. The coil is designed for direct-current control voltage typical of military and aerospace 28-volt electrical systems, a standard power bus voltage used extensively in aircraft, military vehicles, and shipboard electrical systems. The device's flange-style mounting construction allows it to be securely fastened to a chassis or panel, providing the mechanical stability needed to maintain reliable contact performance under the sustained vibration and shock loading common in military platform environments. Internal contact construction uses a silver-cadmium-oxide contact material, chosen for its strong arc-resistance and resistance to contact welding under repeated switching of inductive or resistive loads. As a hermetically sealed device manufactured to a formal military specification, the relay undergoes rigorous qualification and lot-acceptance testing to verify long-term mechanical and electrical performance, including extended life-cycle switching tests, vibration and shock qualification, and environmental exposure testing. This makes the part suitable for use in flight-critical, mission-critical, or other high-reliability electromechanical switching applications where field failure is not an acceptable risk. The relay is supplied with through-hole solder-pin terminations for both coil and contact connections, supporting traditional through-hole assembly methods consistent with the conservative, well-proven manufacturing processes favored in military and aerospace hardware production. Spec Sheet Identification Part Number: M83536/2-024M Specification Family: MIL-PRF-83536 Manufacturer: TE Connectivity (CII) Functional Classification Device Type: Electromechanical power/signal relay Contact Configuration: Double-pole, double-throw (DPDT) Actuation Type: Momentary, non-latching Coil Input Type: DC control Electrical Characteristics Coil Voltage: Military-standard 28V DC class Coil Resistance: Moderate coil resistance class Contact Rating: Mid-range current switching class Contact Voltage Rating: Compatible with 28V DC and standard AC switching voltages Output Type: AC/DC switching capable Contact & Construction Details Contact Material: Silver-cadmium-oxide (AgCdO) Contact Form: 2 Form C (DPDT, normally open/normally closed) Sealing: Hermetically sealed construction Mounting Style: Flange mount, through-hole Environmental & Qualification Specification Compliance: MIL-PRF-83536 military relay specification Application Class: Military and aerospace electromechanical switching Export Classification: EAR99 export control classification RoHS Compliance: Yes Mechanical Specifications Termination: Solder pin, through-hole Mounting Type: Through-hole, flange-mounted Build Style: Mid-range relay form factor consistent with the M83536 family Packaging Supply Format: Individually packaged per military relay handling and ESD protection standards #M83536 #TEConnectivity #MilitaryRelay #AerospaceRelay #MILPRF83536 #DPDTRelay #ElectromechanicalRelay #HermeticallySealed #PowerRelay #SignalRelay #DefenseElectronics #AviationElectronics #FlangeMount #ThroughHole #MilAeroComponent #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #HighReliabilityRelay

Audio D/A Converter ICs SABRE 8 Channel DAC with Line Drivers, 5mmx5mm, 40-QFN The ES9081Q is a high-performance stereo digital-to-analog converter developed by ESS Technology and based on the SABRE audio DAC architecture. It is designed for premium audio applications requiring ultra-low distortion, high dynamic range, and high-resolution audio playback. The device integrates ESS HyperStream architecture and advanced jitter elimination technology to deliver accurate and transparent audio reproduction across a wide range of consumer and professional audio systems. The ES9081Q supports high-resolution PCM and DSD audio formats, making it suitable for portable audio devices, USB DACs, home audio systems, automotive infotainment platforms, digital media players, and professional audio equipment. The integrated digital processing and low-noise analog output stages simplify system design while maintaining excellent audio fidelity. The device supports multiple digital audio interfaces and provides flexible clocking configurations for compatibility with modern audio processors and SoCs. Its low power consumption and compact package make it suitable for space-constrained and thermally sensitive designs. Key Features SABRE HyperStream DAC architecture Integrated Time Domain Jitter Eliminator Stereo audio DAC implementation High dynamic range audio performance Ultra-low total harmonic distortion plus noise Support for high-resolution PCM audio streams Support for native DSD audio playback Multiple digital audio input interface support Integrated digital interpolation filters Configurable audio processing functions Low-noise analog output stage Low power consumption operation Flexible master clock configurations Hardware and software control support Compact surface-mount package Electrical Characteristics Wide digital core supply voltage support Separate analog and digital power domains Low standby power consumption High signal-to-noise ratio performance Low output noise floor Excellent channel separation characteristics Precision clock synchronization capability Audio Performance High-resolution audio conversion capability Support for elevated PCM sampling frequencies Native DSD decoding support Low latency audio path High linearity across audio bandwidth Low jitter sensitivity High-fidelity stereo playback performance Digital Interface Support I2S audio interface compatibility Left-justified digital audio format support Multiple word length compatibility Master and slave clock operation modes Serial control interface support Package Information Surface-mount QFN package Compact footprint for embedded audio applications RoHS compliant package option Optimized thermal performance package design Typical Applications High-resolution USB DACs Portable digital audio players Wireless audio receivers Home theater systems Automotive infotainment systems Professional audio interfaces Premium headphone amplifiers Network audio streaming devices #commonpartslibrary #integratedcircuit #audio #dac #stereodac #highresolutionaudio #ess #sabredac #consumeraudio #professionalaudio

24 Position Receptacle Connector 0.039" (1.00mm) Surface Mount Gold CLM-112-02-L-D-A is a 24-position, dual-row, 1.00 mm pitch surface-mount female socket connector from the Samtec CLM series. It is designed for high-density board-to-board interconnections and features Samtec's Tiger Claw™ dual-wipe contact system, providing reliable electrical performance and secure mating in compact electronic designs. The low-profile construction makes it ideal for space-constrained applications such as embedded systems, industrial controls, communication equipment, and portable electronics. Key Features 1.00 mm pitch, dual-row socket connector 24 positions (2 × 12 contacts) Surface-mount (SMT) termination Low-profile design for compact PCB layouts Tiger Claw™ dual-wipe contacts for enhanced connection reliability Gold-plated contacts for improved conductivity and corrosion resistance Suitable for board-to-board applications Available with multiple plating and packaging options Operating temperature range suitable for industrial environments RoHS compliant and UL recognized Applications Embedded computing systems Industrial automation equipment IoT devices Communication and networking hardware Test and measurement instruments Consumer electronics #Samtec #CLMSeries #BoardToBoardConnector #SMTConnector #FemaleSocket #HighDensityConnector #TigerClawContact #ElectronicsDesign #PCBConnector #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions

11 Position Connector Receptacle, Outer Shroud Contacts Surface Mount Gold or Gold, GXT™ 91921-31111LF is a 1.00 mm pitch board-to-board mezzanine connector from the Conan™ / MezzSelect™ series by Amphenol ICC. It is an 11-position vertical receptacle designed for compact, high-density PCB interconnect applications such as embedded systems, industrial electronics, and compact computing devices. Key Features 1.00 mm fine-pitch board-to-board connector 11-position vertical receptacle Surface-mount (SMT) termination Dual-row configuration Gold/GXT™ contact plating for reliable electrical performance Multiple stacking height support (4.15 mm to 7.52 mm) Solder retention tabs for improved mechanical stability Operating temperature range: −55 °C to +125 °C Current rating: 1 A per contact Designed for industrial and compact embedded applications Compatible with IR reflow and vapor-phase soldering processes RoHS compliant and low-halogen material construction Typical Applications Embedded computing modules Industrial control boards Compact SBCs and SOMs Communication equipment Consumer electronics requiring low-profile mezzanine interconnects

Monostable Multivibrator 43 ns 16-CDIP #commonpartslibrary #integratedcircuit #logic #multivibrator

Hot Swap Controller 1 Channel General Purpose 23-LQFN-CLIP (6x5) The TPS16851VMAR is an automotive-grade integrated electronic fuse device designed to provide advanced power path protection and monitoring for low-voltage DC power distribution systems. The device integrates multiple protection mechanisms including overvoltage protection, undervoltage protection, overcurrent protection, reverse current blocking, and inrush current control within a compact package optimized for space-constrained applications. It is intended for use in automotive, industrial, and embedded electronic systems requiring robust hot-swap capability, fault isolation, and controlled power sequencing. The device incorporates precision current sensing and programmable fault management functions that enable reliable protection of downstream circuitry against abnormal operating conditions. Adjustable protection thresholds and timing parameters allow flexible system-level configuration while maintaining fast fault response and high reliability. Integrated MOSFET control minimizes external component count and simplifies PCB implementation. The TPS16851VMAR supports wide input operating ranges suitable for automotive battery-powered environments and transient-prone supply rails. The device is qualified for harsh operating conditions and includes thermal shutdown and fault reporting features to improve system safety and diagnostics. Engineering Specification Device Type Automotive electronic fuse with integrated protection and power management functionality Manufacturer Texas Instruments Package Type VQFN-HR surface-mount package Mounting Type Surface mount Application Category Automotive power distribution and protection Protection Features Overvoltage protection Undervoltage protection Overcurrent protection Short-circuit protection Reverse current blocking Thermal shutdown Inrush current limiting Control Features Programmable fault thresholds Adjustable current limit Programmable timing and retry behavior Enable and shutdown control Fault indication and monitoring Power Management Features Integrated MOSFET control Hot-swap capability Controlled startup sequencing Load disconnect functionality Interface Characteristics Analog control interface Diagnostic fault reporting Current sense monitoring Operating Environment Automotive-qualified operating conditions High transient immunity Designed for harsh electrical environments PCB Integration Compact footprint Thermally enhanced package Low external component requirement Typical Applications Automotive electronic control units Infotainment systems ADAS power distribution Industrial control systems Embedded power management Protected DC supply rails #commonpartslibrary #integratedcircuit #powermanagement #hotswapcontrollers

Monostable Multivibrator 11 ns TSOT-23-7 #Timer #commonpartslibrary

CH32V003 series is an industrial-grade general-purpose microcontroller designed based on QingKe RISC-V2A core, which supports 48MHz system main frequency in the product function. The series features wide voltage, single-wire serial debug interface, low-power consumption and ultra-small package. It provides commonly used peripheral functions, built-in 1 group of DMA controller, 1 group of 10-bit analog-to-digital conversion ADC, 1 group of op-amp comparator, multiple timers, standard communication interfaces such as USART, I2C, SPI, etc. The rated operating voltage of the product is 3.3V or 5V, and the operating temperature range is -40℃～85℃ industrial- grade. #CommonPartsLibrary #Microcontroller #CH32V003F4P6.

10 Position Connector Header, Outer Shroud Contacts Surface Mount Gold The BM23PF0.8-10DP-0.35V(51) is a surface-mount plug-type connector in the BM23 series, featuring an ultra-fine 0.35 mm pitch and low-profile 0.8 mm stacking height. It is engineered for space-constrained applications while supporting high-speed signal transmission and stable electrical performance. Connector Type: Board-to-board (mezzanine), plug (male header) Number of Positions: 10 pins (dual-row configuration) Pitch: 0.35 mm (fine pitch for compact layouts) Mated Height: 0.8 mm (ultra-low profile) Mounting Type: Surface Mount (SMT) Orientation: Straight / vertical connection Contact Plating: Gold (for reliable signal integrity) High-Speed Capability: Up to 10 Gbps data transmission Rated Current: up to 5 A Rated Voltage: 30 V (AC/DC) Contact Resistance: ≤ 90 mΩ Operating Temperature: -55 °C to +85 °C Durability: Designed for multiple mating cycles with stable contact performance #CommonPartsLibrary #Connector #BM23

QFN-68-EP(7x7) Power Management - Specialized RoHS The RK809-5 is a highly integrated Power Management Integrated Circuit (PMIC) from Rockchip designed for multi-core processor systems and embedded applications. It provides a complete power management solution by integrating multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, battery fuel gauging, RTC functionality, and audio codec capabilities into a single device. The RK809-5 is commonly used alongside Rockchip SoCs in single-board computers, tablets, AIoT devices, and industrial embedded systems. Key Features Five high-efficiency synchronous buck converters with fast transient response. Nine low-dropout (LDO) voltage regulators for powering sensitive analog and digital circuits. Integrated battery fuel gauge for battery capacity monitoring. Configurable power-up and power-down sequencing (OTP programmable). Dynamic Voltage Scaling (DVS/DVFS) support via I²C interface. Integrated Real-Time Clock (RTC) with 32.768 kHz crystal oscillator support. Two integrated load switches for peripheral power control. Over-current, over-voltage, and thermal protection features. Built-in audio CODEC with headphone driver and Class-D amplifier support. Designed to minimize external component count and simplify power system design. QFN-68-EP (7 mm × 7 mm) package. #RK8095 #RK809 #Rockchip #PMIC #PowerManagementIC #BatteryManagement #AudioCodec #RTC #DVFS #EmbeddedSystems #SingleBoardComputer #IoT #IndustrialElectronics #PowerSupplyDesign #ElectronicsEngineering

Monostable Multivibrator 100 ns 16-SOIC #CommonPartsLibrary #IntegratedCircuit #Logic #Multivibrator #CD14538

Monostable Multivibrator 95 ns 16-SOIC #CommonPartLibrary #IntegratedCircuits #Logic #Multivibrator #MC14538