ARM® Cortex®-M4F STM32G4 Microcontroller IC 32-Bit 170MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) The STM32G491RET6 from STMicroelectronics is a high-performance 32-bit microcontroller based on the Arm® Cortex®-M4 core with Floating Point Unit (FPU), designed for advanced embedded applications requiring high computational performance, precise analog processing, and real-time control. It belongs to the STM32G4 series and integrates enhanced analog peripherals, motor-control timers, communication interfaces, security features, and hardware accelerators such as CORDIC and FMAC. The device operates at up to 170 MHz, provides 512 KB Flash memory, and includes 96 KB SRAM, making it suitable for applications such as motor control, digital power conversion, industrial automation, robotics, and embedded control systems. Key Features Core: Arm® Cortex®-M4 32-bit CPU with FPU, DSP instructions, and MPU Maximum CPU Frequency: Up to 170 MHz (up to 213 DMIPS) Memory: 512 KB Flash memory with ECC support 96 KB SRAM with parity checking features Quad-SPI memory interface Operating Voltage: 1.71 V to 3.6 V Package: LQFP-64 Advanced Analog Features: 3 × 12-bit ADCs with high-speed conversion 4 × 12-bit DAC channels 4 × Rail-to-Rail operational amplifiers 4 × Fast analog comparators Internal voltage reference buffer Hardware Accelerators: CORDIC accelerator for trigonometric calculations FMAC (Filter Math Accelerator) for digital filtering applications Timers & Motor Control: Advanced PWM timers for motor-control applications Multiple 16-bit and 32-bit timers Support for encoder and PWM control Communication Interfaces: 2 × FDCAN interfaces 5 × USART/UART 3 × SPI interfaces 3 × I²C interfaces USB 2.0 Full-Speed interface SAI audio interface Security Features: True Random Number Generator (TRNG) CRC calculation unit Unique device ID Debug & Programming: SWD and JTAG debugging support Typical Applications Motor control and BLDC controllers Digital power converters Industrial automation equipment Robotics and motion control Smart sensors and embedded control systems Power management applications #STM32G491RET6 #STM32G4 #STMicroelectronics #ARM_CortexM4 #Microcontroller #MCU #EmbeddedSystems #MotorControl #DigitalPower #IndustrialAutomation #Robotics #IoT #ElectronicsDesign #PCBDesign

Buck Switching Regulator IC Positive, Isolation Capable Adjustable 0.596V 1 Output 3A SOT-563, SOT-666 The TPS543021DRLR is a compact, integrated power regulator that converts a wide input voltage (typically from batteries or power rails) into a regulated lower output voltage with high efficiency. It includes internal power switches and control circuitry, simplifying power supply design and reducing external component count. Key Features Topology: Synchronous buck converter Input Voltage Range: ~4.5 V to 28 V Output Voltage: Adjustable (via external resistors) Output Current: Up to 3 A continuous Switching Frequency: ~500 kHz (fixed) Efficiency: High efficiency (up to ~90%+) Quiescent Current: Low, suitable for power-sensitive designs Protection Features: Overcurrent protection (OCP) Thermal shutdown Undervoltage lockout (UVLO) Package & Physical Info Package Type: SOT-563 / VSON (compact, no-lead package) Mounting: Surface Mount (SMT) Packaging: Tape & reel (DRLR suffix) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #Voltage-regulator #Switching-regulator

ARM® Cortex®-M7 S32K3 Microcontroller IC 32-Bit 160MHz 4MB (4M x 8) FLASH 172-QFP (16x16) S32K344EHT1VPBST is an automotive-grade 32-bit microcontroller from NXP Semiconductors based on the Arm Cortex-M7 core architecture. The device is designed for high-performance real-time automotive body, chassis, powertrain, and domain control applications requiring functional safety, security, and advanced communication interfaces. It integrates high-speed processing capability, extensive peripheral integration, hardware security acceleration, and deterministic control functions suitable for safety-critical embedded systems. The microcontroller operates with an Arm Cortex-M7 CPU core running at high frequency with floating-point support and DSP extensions for computationally intensive applications. Integrated flash memory and SRAM provide embedded program and data storage optimized for automotive embedded control systems. The device supports hardware-assisted security features including secure boot, cryptographic acceleration, and tamper protection for secure automotive network communication and firmware integrity. The S32K344EHT1VPBST includes multiple communication peripherals supporting CAN FD, FlexCAN, LIN, SPI, UART, I2C, and Ethernet interfaces for distributed automotive networking and gateway applications. Advanced analog integration includes ADC modules, timers, PWM generators, watchdogs, and motor-control-oriented peripherals enabling precision sensing and control functionality. The device supports functional safety development aligned with ISO 26262 requirements and includes error correction, memory protection, fault monitoring, and safety management features. Power management functionality supports low-power operating modes for energy-efficient automotive electronic control units. The microcontroller is housed in a thermally enhanced LQFP package suitable for automotive operating environments with extended temperature capability and AEC-Q100 qualification for automotive reliability standards. #commonpartslibrary #integratedcircuit #microcontroller #arm #m7

The TPS54331 device is a 28-V, 3-A nonsynchronous buck converter that integrates a low RDS(on) high-side MOSFET. To increase efficiency at light loads, a pulse skipping Eco-mode feature is automatically activated. Furthermore, the 1-μA shutdown supply-current allows the device to be used in battery-powered applications. Current mode control with internal slope compensation simplifies the external compensation calculations and reduces component count while allowing the use of ceramic output capacitors. A resistor divider programs the hysteresis of the input undervoltage lockout. An overvoltage transient protection circuit limits voltage overshoots during start-up and transient conditions. A cycle-by-cycle current-limit scheme, frequency foldback and thermal shutdown protect the device and the load in the event of an overload condition. The TPS54331 device is available in an 8-pin SOIC package and 8-pin SO PowerPAD integrated circuit package that have been internally optimized to improve thermal performance. • 3.5 to 28-V input voltage range • Adjustable output voltage down to 0.8 V • Integrated 80-mΩ high-side MOSFET supports up to 3-A continuous output current • High efficiency at light loads with a pulse skipping Eco-mode • Fixed 570-kHz switching frequency • Typical 1-μA shutdown quiescent current • Adjustable slow-start limits inrush currents • Programmable UVLO threshold • Overvoltage transient protection • Cycle-by-cycle current limit, frequency foldback, and thermal shutdown protection • Available in easy-to-use SOIC8 package or thermally-enhanced SOIC8 PowerPAD™ integrated circuit package • Create a custom design using the TPS54331 with the WEBENCH® Power Designer • Use TPS62933 for a 30 VIN converter with higher frequency, lower IQ and improved EMI #CommonPartsLibrary #IntegratedCircuit #PowerManagement

Charger IC Lithium Ion/Polymer 29-VQFN-HR (4x4) The BQ25792 is a switch-mode synchronous buck-boost charger with full power-path management. It can automatically regulate power flow between the input source, system load, and battery. It supports a wide input range and is designed for USB Type-C™ / USB Power Delivery (USB-PD) systems, enabling both charging and OTG (power output from battery) operation. ⭐ Key Features ⚡ High-performance charging Up to 5 A charge current Supports 1S to 4S battery packs High efficiency (up to ~96% under typical conditions) Programmable switching frequency: 750 kHz or 1.5 MHz 🔋 Wide input support Input voltage range: 3.6 V to 24 V Absolute max rating up to 30 V Supports USB adapters and barrel jack sources Detects USB charging standards (BC1.2, DCP, CDP, HVDCP, etc.) 🔄 Buck-boost power conversion Seamless buck, boost, and buck-boost operation Maintains stable system voltage even when battery is low or input varies 🔌 USB-PD / OTG support USB Power Delivery (PD 3.0 compatible) Supports OTG output (battery powers USB port) OTG voltage range: 2.8 V to 22 V 🧠 Intelligent power management NVDC power path management (system can run without battery) Dual-input power mux controller (select between two power sources) Battery supplement mode (prevents input overload) 📊 Monitoring & control Integrated 16-bit ADC for voltage, current, temperature monitoring Fully I²C configurable Autonomous or host-controlled operation 🛡️ Protection & safety Input and battery over-voltage/over-current protection Thermal regulation and shutdown Charging safety timer MOSFET protection (internal switching FETs included) 📦 Package 29-pin VQFN (4 mm × 4 mm) package Industrial temperature range: -40°C to 85°C #CommonPartsLibrary #IntegratedCircuit #PowerManagement #Battery-charger

Buzzers Transducer, Externally Driven Piezo 3 V 3mA 4kHz 70dB @ 3V, 10cm Surface Mount Solder Pads The CMT-1603-SMT-TR is a compact, surface-mount piezoelectric buzzer transducer designed for applications requiring an externally driven audible indicator. Featuring a low-profile 16 × 16 mm package, it delivers reliable single-tone sound output with low current consumption, making it suitable for portable electronics, industrial equipment, consumer devices, medical instruments, and embedded systems where PCB space is limited. Key Features: Piezoelectric buzzer transducer (externally driven) Surface-mount (SMT) package with solder pad terminals Compact 16 × 16 × 2.8 mm low-profile design Low current consumption (~3 mA typical) Resonant frequency of 4 kHz Sound pressure level of 70 dB @ 3 V, 10 cm Rated voltage: 3 V Maximum input voltage: 25 Vp-p Single-tone acoustic output Operating temperature range: −30°C to +70°C Tape-and-reel (TR) packaging for automated assembly RoHS compliant #Hashtags: #PiezoBuzzer #AudioTransducer #SurfaceMount #SMTBuzzer #ExternallyDriven #LowProfile #LowCurrent #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #MedicalDevices #RoHS #commonpartslibrary #audio #buzzer

15µH Shielded Drum Core, Wirewound Inductor 5.45 A 25.8mOhm Max Nonstandard The 7447798151 is a 15 µH shielded wirewound drum core inductor optimized for high current power applications. It features low DC resistance and high saturation current capability, making it suitable for compact, high-frequency power designs. Key Features Inductance: 15 µH High current rating: up to 5.45 A (RMS) Saturation current: ~4 A Low DC resistance: 25.8 mΩ max Shielded construction for low EMI / magnetic leakage High self-resonant frequency: ~19 MHz Wide operating temperature: -40°C to +150°C Compact SMD package (~10.2 mm × 10.2 mm footprint) Typical Applications DC-DC converters (buck / boost) Power supply filtering Automotive and industrial power systems Point-of-load (POL) regulators High-frequency switching circuits #WurthElektronik #WEPDF #PowerInductor #15uH #SMDInductor #ShieldedInductor #PowerElectronics #ElectronicsComponents #SMTComponents #CommonPartsLibrary #Fixed-Inductor

Charger IC Multi-Chemistry 36-VQFN (5x6) The BQ25750RRVR is a highly integrated switch-mode battery charge controller and power-path management device designed for single-cell to multi-cell lithium-ion and lithium-polymer battery-powered systems. The device supports bidirectional power conversion, enabling both battery charging and system power delivery through USB Type-C and other DC power sources. It integrates high-efficiency buck-boost charging architecture to maintain optimal charging performance across a wide input voltage range. The device is intended for portable electronics, industrial handheld equipment, USB Power Delivery applications, embedded systems, and battery-powered computing platforms requiring advanced power management and flexible charging capability. Integrated power-path management allows simultaneous system operation and battery charging while maintaining battery protection and system stability. The BQ25750RRVR supports programmable charging parameters through an I2C interface, including charge voltage, charge current, input current limit, and system power regulation. The device includes comprehensive protection functions such as overvoltage protection, overcurrent protection, thermal regulation, battery temperature monitoring, and fault reporting. High switching frequency operation enables reduced external component size and compact PCB implementation. Features Integrated synchronous buck-boost battery charger Supports USB Power Delivery and wide DC input sources Bidirectional power conversion capability I2C programmable charging and system parameters Integrated power-path management High-efficiency charging operation Supports multi-cell lithium-ion and lithium-polymer batteries Programmable input current and charge current limits Dynamic power management and system voltage regulation Integrated ADC monitoring for voltage, current, and temperature Battery supplement mode during adapter removal OTG boost mode support Thermal regulation and thermal shutdown protection Input overvoltage and overcurrent protection Battery overvoltage protection Safety timer and watchdog timer support NTC thermistor interface for battery temperature monitoring Interrupt and fault status reporting Compact WQFN package suitable for space-constrained designs Electrical Characteristics Wide input operating voltage range Programmable battery charge voltage High charge current capability Integrated low RDS(on) MOSFET drivers High switching frequency operation High conversion efficiency across operating range Low standby and shutdown current consumption Accurate input and charge current regulation Integrated analog-to-digital converter telemetry Interface and Control I2C serial communication interface Programmable charging profiles Configurable protection thresholds Status and interrupt reporting ADC telemetry reporting Enable and control pins for system integration Protection Features Input overvoltage protection Input overcurrent protection Battery overvoltage protection Thermal shutdown protection Thermal regulation control Short-circuit protection Watchdog timer protection Safety charging timer Battery temperature qualification support Package Information Package Type: WQFN Package Suffix: RRV Compact thermally enhanced package Surface-mount device Suitable for automated PCB assembly processes Applications USB Type-C charging systems Portable computers and tablets Industrial handheld devices Power banks and battery packs Embedded battery-powered systems Portable instrumentation Consumer electronics Smart battery charging platforms #commonpartslibrary #integratedcircuit #powermanagement #batterycharger

Mini 2.45 GHz Antenna The 2450AT18A100E is a high-frequency ceramic SMT antenna featuring a small 3.2 mm × 1.6 mm × 1.3 mm package, optimized for space-constrained RF designs. It operates from 2400 MHz to 2500 MHz with a 50 Ω impedance and provides a compact alternative to traditional PCB trace antennas while maintaining reliable RF performance. Key Features Operating Frequency: 2400 MHz – 2500 MHz (2.4 GHz ISM Band) Center Frequency: 2450 MHz Antenna Type: Mini Ceramic Chip Antenna / SMT RF Antenna Package Size: 3.2 mm × 1.6 mm × 1.3 mm Impedance: 50 Ω Peak Gain: Approximately +0.5 dBi (typical) Average Radiation Efficiency: Approximately 76% (based on Johanson evaluation board) Maximum Input Power: 2 W continuous wave (CW) Operating Temperature Range: -40 °C to +125 °C Mounting Type: Surface Mount Technology (SMT) Applications: Bluetooth / BLE devices Wi-Fi 2.4 GHz modules Zigbee / IEEE 802.15.4 systems IoT sensors and embedded wireless products #2450AT18A100E #JohansonTechnology #ChipAntenna #SMTAntenna #RFDesign #2GHzAntenna #Bluetooth #WiFi #Zigbee #IoT #WirelessCommunication #EmbeddedSystems #PCBDesign #RFAntenna #Antena #Chip #SurfaceMount

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

Buck-Boost Regulator Positive Output Step-Up/Step-Down I2C DC-DC Controller IC 40-VQFN (6x6) The LM51772RHAR is a high-performance multi-phase bidirectional buck-boost controller designed for power conversion systems requiring efficient energy transfer between two voltage domains. The device supports seamless operation in both step-up and step-down modes and is optimized for battery-powered, automotive, industrial, and energy storage applications. The controller enables bidirectional current flow, making it suitable for battery charging, backup power systems, supercapacitor management, and high-power USB Type-C power delivery applications. The device integrates advanced control architecture for high efficiency across a wide operating range while supporting programmable current regulation, voltage regulation, and protection features. Multi-phase capability allows reduced input and output ripple currents, improved thermal distribution, and higher overall power capability. The controller supports external MOSFETs for scalable power design flexibility and includes comprehensive monitoring and fault management functions. The LM51772RHAR is designed for operation in demanding environments with robust protection features including overvoltage protection, undervoltage lockout, cycle-by-cycle current limiting, thermal shutdown, and fault reporting. Its flexible configuration and high integration level reduce external component count and simplify implementation in high-density power systems. Key Features Bidirectional synchronous buck-boost controller architecture Supports power transfer in both forward and reverse directions Multi-phase operation for increased power capability and reduced ripple Wide input and output voltage operating range High-efficiency synchronous control using external MOSFETs Programmable current and voltage regulation Peak and average current control capability Seamless transition between buck, boost, and buck-boost operating modes Integrated current sensing support Programmable switching frequency synchronization Phase interleaving support for thermal and ripple optimization External clock synchronization capability Soft-start and controlled startup sequencing Comprehensive fault detection and protection functions Overcurrent protection and short-circuit protection Overvoltage and undervoltage protection Thermal shutdown protection Fault status reporting and system monitoring support Designed for automotive and industrial power applications Compact thermally enhanced package Typical Applications Bidirectional battery charging systems Energy storage systems Automotive dual-battery architectures USB Type-C Power Delivery systems Backup power and UPS systems Supercapacitor charging and balancing Industrial DC power conversion Renewable energy power management High-power portable electronics Telecom and server power systems Electrical Characteristics Wide operating supply voltage range High switching frequency operation capability High-current multi-phase scalability Precision current regulation accuracy Low standby power consumption High-efficiency synchronous rectification support Programmable dead-time and switching parameters Stable operation across wide temperature range Package Information Package Type: VQFN Package Suffix: RHA Thermally enhanced exposed pad package Surface-mount implementation Suitable for automated assembly processes #commonpartslibrary #integratedcircuit #powermanagement #buckboost #dcdcswitchingcontrollers

Buck Switching Regulator IC Positive Adjustable 2.5V 1 Output 1A 14-PowerTSSOP (0.173", 4.40mm Width) The LM5010 step-down switching regulator features all the functions needed to implement a low-cost, efficient, buck bias regulator capable of supplying in excess of 1-A load current. This high-voltage regulator contains an N-Channel Buck Switch, and is available in thermally enhanced 10-pin WSON and 14-pin HTSSOP packages. The hysteretic regulation scheme requires no loop compensation, resulting in fast load transient response, and simplifies circuit implementation. The operating frequency remains constant with line and load variations due to the inverse relationship between the input voltage and the ON-time. The valley current limit detection is set at 1.25 A. Additional features include: VCC undervoltage lockout, thermal shutdown, gate drive undervoltage lockout, and maximum duty cycle limiter Features 1• Input Voltage Range: 8 V to 75 V • Valley Current Limit At 1.25 A • Switching Frequency Can Exceed 1 MHz • Integrated N-Channel Buck Switch • Integrated Start-Up Regulator • No Loop Compensation Required • Ultra-Fast Transient Response • Operating Frequency Remains Constant With Load and Line Variations • Maximum Duty Cycle Limited During Start-Up • Adjustable Output Voltage • Precision 2.5-V Feedback Reference • Thermal Shutdown • Exposed Thermal Pad for Improved Heat Dissipation 2 Applications • High Efficiency Point-of-Load (POL) Regulator • Non-Isolated Telecommunications Buck Regulator • Secondary High Voltage Post Regulator • Automotive Systems #TexasInstruments #LM5010MHXNOPB #BuckRegulator #DCDCConverter #SwitchingRegulator #PowerManagement #HighVoltage #StepDownConverter #IndustrialElectronics #EmbeddedSystems #PowerSupplyDesign #HTSSOP14 #PMIC #ElectronicsDesign #VoltageRegulator

USB Type C PMIC 40-TQFN (6x6) The MAX25432 combines an automotive-grade buckboost controller capable of full-range 3.3V to 21V programmable power supply (PPS) at up to 6.35A, USB Power Delivery (USB PD) analog front-end (AFE), legacy USB charging support, and USB Type-C® protection switches for automotive USB host or downstream-facing (DFP) applications. The USB TypeC protection switches provide automotive system-level ESD protection and 24V short-circuit protection for D+, D-, CC1, CC2, and VCONN. The device can optionally support legacy charging modes for older passenger phones including BC1.2, Apple® Charge, Apple CarPlay®, Apple MFi, and USB On-The-Go (OTG). The MAX25432B integrates a USB PD AFE, which supports the USB-IF Type-C Port Controller Interface (TCPCI) specification and can interface with any I2C controller in the application. The MAX25432A provides configuration channel (CC) signal pass-through protection for an external USB PD controller. P-suffix and G-suffix devices include intelligent detection and protection to avoid high short-circuit currents flowing from the car battery through the cable shield to ground during fault events, thus preventing car module damage. The MAX25432 is available in a small, 6mm x 6mm, 40- pin TQFN-EP package and requires very few external components. The MAX25432 evaluation (EV) kit and collateral provide a convenient platform to the design engineer for rapid evaluation with reduced test and firmware development time. Integrated I2C Buck-Boost Controller with PPS 4.5V to 36V Input Operating Range 3.3V to 21V Constant Voltage, 10mV LSB 1A to 6.35A Current Limit, 25mA LSB 220kHz, 300kHz, and 400kHz SwitchingFrequency VBUS Cable Compensation up to 516mΩ External Frequency Synchronization and SpreadSpectrum for Reduced EMI USB PD 3.1 Type-C Port Controller USB-IF Compliant - TID 9154 Up to 800mV Ground Offset Pairs with ADI TCPM for Turn-Key Solution MAX25432BATLP Enables: ADI TCPM Alternate Mode and Dual-Role Port Improved CC Detection Advanced Monitoring Algorithms (V, T) Dynamic Loop Control Highest Performance, Safest, and Lowest Cost Passenger Cable-Shield Short-to-Battery Protection Minimizes Short-Circuit Currents with a Small,Single-FET Solution Integrated Current-Sense Amplifiers, ADC and DAC Integrated 3.3V to 5.0V, 1.5W, Smart, Reliable VCONN Switches and Protection, 50mA to 500mA OCP Integrated 24V DC Protection on Protected HVD+, HVD-, HVCC1, HVCC2 Outputs Integrated Legacy USB 2.0 Charging Support Including BC1.2, Apple CarPlay, OTG, and Apple MFi Rev 3x Integrated ±15kV Air-Gap/±8kV Contact Discharge ISO 10605 and IEC 61000-4-2 ESD Protection -40°C to +125°C Operating Temperature Range 40-Pin, 6mm x 6mm, TQFN Package with EP AEC-Q100 and AEC-Q006 Qualified #CommonPartsLibrary #IntegratedCircuit #PowerManagement

SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering. As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years. The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller. Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components. Spec Sheet Identification Part Number: AS4C32M16SB-7TCN Device Family: AS4C32M16SB Manufacturer: Alliance Memory, Inc. Die Revision: B-die Functional Classification Device Type: Synchronous DRAM (SDR SDRAM) Memory Organization: Multi-bank array architecture Interface Type: Parallel, clock-synchronous command interface Refresh Capability: Supports auto-refresh and self-refresh modes Electrical Characteristics Supply Voltage: Standard 3.3V-class SDRAM supply rating Clock Frequency: Mid-range SDR SDRAM clock speed class Access Timing: Standard SDR SDRAM access time class for its speed grade Environmental & Qualification Temperature Grade: Commercial ("C" suffix designation) RoHS Compliance: Yes Product Positioning: Long-lifecycle, drop-in replacement memory device Package Package Type: Thin Small Outline Package, TSOP-II style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tray packaging #AS4C32M16SB #AllianceMemory #SDRAM #SDRSDRAM #MemoryIC #EmbeddedMemory #TSOP #SurfaceMount #LegacyMemory #DropInReplacement #DRAM #EmbeddedSystems #IndustrialElectronics #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #MemoryComponent #PCBDesign #CommonPartsLibrary #IntegratedCircuit #Memory #AS4C32

EEPROM Memory IC 256Kbit I2C 1 MHz 450 ns 8-SO The M24256E-FMN6TP is a 256-Kbit (32 Kbyte) I²C-compatible serial EEPROM from STMicroelectronics. It is designed for reliable, non-volatile data storage in a wide range of electronic applications including consumer, industrial, and automotive systems. The device supports standard (100 kHz), fast (400 kHz), and fast-mode plus (1 MHz) I²C communication, enabling efficient data transfer. It features byte and page write operations, low power consumption, and a high endurance of write cycles, making it suitable for frequent data logging and configuration storage. Housed in a compact SO8 package, the device is optimized for space-constrained PCB designs while maintaining robust performance and data retention capabilities. Key Features Memory size: 256 Kbit (32 Kbyte) Interface: I²C (2-wire serial interface) Clock frequency: Standard mode: 100 kHz Fast mode: 400 kHz Fast-mode Plus: 1 MHz Supply voltage range: 1.7 V to 5.5 V Page write capability: up to 64 bytes Write cycle time: ~5 ms (typical) Data retention: > 200 years Endurance: > 4 million write cycles Hardware write protection available ESD protection and latch-up immunity Functional Description The device operates as a slave on the I²C bus and supports: Byte write and read Page write (up to 64 bytes) Random and sequential read operations Memory addressing is internally managed using a 16-bit address pointer, allowing access to the full 32 KB memory array. The device includes an internal write cycle controller, eliminating the need for external timing management. Pin Configuration (SO8 Package) A0, A1, A2: Device address inputs VSS: Ground SDA: Serial data line SCL: Serial clock line WC: Write control (hardware write protection) VCC: Supply voltage Absolute Maximum Ratings Supply voltage (VCC): -0.3 V to 6.5 V Input voltage: -0.3 V to VCC + 0.6 V Storage temperature: -65°C to +150°C Operating temperature (industrial grade): -40°C to +85°C Electrical Characteristics Low standby current: < 1 µA (typical) Operating current: < 1 mA Input/output compatible with CMOS logic levels Schmitt trigger inputs for noise immunity Timing Characteristics Write cycle time: 5 ms (typical) Fast-mode Plus support up to 1 MHz Sequential read supports continuous data streaming Package Information Package type: SO8 (8-lead Small Outline) Mounting: Surface-mount (SMD) Tape & reel packaging (TP suffix) Applications Configuration storage Calibration data storage Data logging systems Industrial control systems Consumer electronics Embedded systems requiring non-volatile memory Advantages High endurance and long data retention Wide voltage range (ideal for mixed-voltage systems) Compact footprint High-speed I²C compatibility (up to 1 MHz) #commonpartslibrary #integratedcircuit #memory

27.12 MHz ±10ppm Crystal 10pF 50 Ohms 4-SMD, No Lead # 7M-27.120MEEQ-T Crystal Unit Engineering Specification ## General Description The 7M-27.120MEEQ-T is a surface-mount quartz crystal resonator designed to provide a stable and accurate frequency reference for digital, wireless, communication, NFC, RFID, microcontroller, and embedded system applications. Manufactured by TXC Corporation, this crystal offers reliable frequency stability, low equivalent series resistance, and compact packaging suitable for space-constrained designs. Its surface-mount construction enables automated assembly while maintaining excellent electrical performance across a wide range of operating conditions. ## Features * Fundamental mode quartz crystal resonator * Surface-mount device package for automated PCB assembly * High frequency accuracy and stability * Low equivalent series resistance * Low power consumption * Suitable for clock generation and timing circuits * RoHS compliant construction * Reliable performance for industrial and consumer electronics applications ## Electrical Characteristics * Nominal Frequency: 27.120 MHz * Crystal Type: Fundamental Mode * Load Capacitance: 10 pF * Frequency Tolerance: ±20 ppm * Frequency Stability: ±20 ppm * Equivalent Series Resistance: 60 Ω Maximum * Drive Level: Low-power operation * Operating Temperature Range: Industrial grade * Storage Temperature Range: Extended environmental capability ## Mechanical Characteristics * Package Type: Surface-Mount Crystal * Mounting Style: SMD/SMT * Compact footprint optimized for high-density PCB layouts * Four-pad no-lead package construction ## Applications * PN532 NFC Controllers * RFID Readers and Writers * Microcontroller Clock Sources * Wireless Communication Modules * Embedded Systems * Industrial Control Electronics * Consumer Electronic Devices * IoT and Smart Device Platforms ## Compliance * RoHS Compliant * Lead-Free Construction * Suitable for Automated Assembly Processes #7M27_120MEEQT #TXC #CrystalResonator #SMDCrystal #QuartzCrystal #27_120MHz #PN532 #NFC #RFID #EmbeddedSystems #TimingReference #ElectronicsDesign

Frequency to Voltage Converter IC 10 kHz ±0.3% 8-SOIC #commonpartslibrary #integratedcircuit #powermanagement #voltageconverter

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A 8-SOIC (0.154", 3.90mm Width) # L6982N33DR ## General Description The L6982N33DR is a high-efficiency synchronous step-down switching regulator manufactured by STMicroelectronics. It is designed to provide a fixed regulated output voltage from a wide input voltage range while maintaining excellent conversion efficiency and low power dissipation. The device integrates high-side and low-side power MOSFETs, control circuitry, protection features, and compensation functions within a compact package, reducing external component count and simplifying power supply design. Its robust architecture makes it suitable for industrial automation systems, distributed power architectures, telecommunications equipment, embedded systems, consumer electronics, smart devices, and battery-powered applications requiring efficient DC-to-DC voltage conversion. ## Key Features ### Power Conversion Architecture * Synchronous buck regulator topology * Fixed output voltage regulation * Integrated power MOSFETs * High-efficiency power conversion * Optimized switching performance * Reduced external component requirements ### Electrical Characteristics * Wide input voltage operating range * Stable output voltage regulation * High conversion efficiency * Low standby power consumption * Fast transient response * Low output ripple performance ### Control Features * Current-mode control architecture * Internal compensation circuitry * Soft-start functionality * Frequency synchronization capability * Stable operation under varying load conditions ### Protection Features * Overcurrent protection * Short-circuit protection * Thermal shutdown protection * Undervoltage lockout protection * Safe startup operation * Enhanced system reliability ### Power Management * Low-power operating modes * Energy-efficient design * Suitable for battery-powered systems * Optimized thermal performance * Reduced power dissipation ### Package Characteristics * Surface-mount package * Compact footprint * Automated assembly compatible * High-density PCB design support * Industrial-grade packaging ### Material Construction * Monolithic integrated power management solution * Lead-free package materials * RoHS-compliant construction * High-reliability semiconductor technology ### Environmental Characteristics * Suitable for industrial operating environments * Long operational service life * Reliable continuous operation * Robust thermal performance ### Application Areas * Industrial Automation Equipment * Embedded Systems * Microcontroller Power Supplies * FPGA and Processor Power Rails * Telecommunications Equipment * Smart Metering Systems * Consumer Electronics * Building Automation Systems * Distributed Power Architectures * Battery-Powered Devices * IoT Products * Power Management Modules ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Management Solution ## Manufacturer STMicroelectronics ## Product Family L6982 Synchronous Step-Down Switching Regulator Series #L6982N33DR #STMicroelectronics #BuckConverter #DCtoDCConverter #SwitchingRegulator #PowerManagement #PowerSupplyDesign #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #PowerElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SMPS

33µH Shielded Drum Core, Wirewound Inductor 8 A 58mOhm Max Nonstandard The SRP1265A-330M is a shielded wirewound power inductor from the Bourns SRP1265A series, designed for high-current DC-DC converters, voltage regulator modules, and power supply applications. It features a carbonyl powder core construction that provides high saturation current capability, low electromagnetic interference (EMI), and stable inductance characteristics in compact surface-mount packaging. The device is AEC-Q200 qualified, making it suitable for automotive and industrial environments. Key Features 33 µH inductance Shielded construction for reduced EMI High saturation current capability Carbonyl powder core Low DC resistance Surface-mount package Wirewound drum-core structure AEC-Q200 qualified RoHS compliant and halogen free Operating temperature up to +150 °C Suitable for high-current switching regulators and DC-DC converters Electrical Characteristics Inductance: 33 µH Tolerance: ±20% Current Rating: 8 A Saturation Current (Isat): 11 A DC Resistance (Max): 58 mΩ Self-Resonant Frequency: 5 MHz Typical Applications DC-DC converters Switching power supplies Automotive electronics EMI filtering Industrial power systems LED drivers Battery-powered equipment #CommonPartsLibrary #Inductor #SMD

1 µF ±10% 16V Ceramic Capacitor X7R 0603 (1608 Metric) The CGA3E1X7R1C105K080AC is a multilayer ceramic chip capacitor designed for high-reliability electronic applications requiring stable capacitance characteristics, compact form factor, and dependable performance under varying operating conditions. The component utilizes advanced ceramic dielectric technology to provide consistent electrical behavior with low losses and high insulation resistance suitable for signal filtering, decoupling, bypassing, and general-purpose circuit stabilization. The capacitor is constructed with a multilayer monolithic structure that enables high capacitance density while maintaining excellent mechanical integrity and thermal stability. Its surface-mount configuration supports automated assembly processes and high-density printed circuit board layouts commonly used in industrial, automotive, telecommunications, and consumer electronic systems. The dielectric system is engineered to maintain capacitance stability across a broad temperature range and varying electrical conditions while minimizing impedance and noise within electronic circuits. The component exhibits reliable frequency response characteristics and supports efficient suppression of voltage fluctuations and electromagnetic interference in high-speed and high-frequency applications. External terminations are designed to provide strong solderability, mechanical durability, and resistance to thermal cycling stresses during assembly and operation. The component is compatible with standard reflow soldering processes and is intended for long-term operation in environments subject to temperature variation, vibration, and electrical loading. The CGA3E1X7R1C105K080AC is suitable for use in power management circuits, communication equipment, embedded control systems, automotive electronics, and other applications requiring compact passive components with stable electrical performance and high reliability. #CommonPartsLibrary #CeramicCapacitors

PSRAM (Pseudo SRAM) Memory IC 512Mbit HyperBus 166 MHz 36 ns 24-TFBGA (6x8) The IS66/67WVH64M8DALL/BLL are 512Mb Dual Die device containing two units of 256Mbit Pseudo Static Random Access Memory, organized as 64M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation, designed especially for Mobile and Automotive applications Key Features 512-Mbit (64M × 8) HyperRAM™ PSRAM High-speed HyperBus interface Clock frequency up to 166 MHz Fast 36 ns access time Single-ended clock architecture with reduced pin count Operating voltage range: 2.7 V to 3.6 V Industrial temperature range: −40°C to +85°C Low-power volatile memory solution Surface-mount 24-TFBGA (6 mm × 8 mm) package Suitable for graphics, AI edge devices, networking, and embedded systems requiring large external memory capacity. #CommonPartsLibrary #IntegratedCircuit #HyperRAM #PSRAM #ISSI #MemoryIC #HyperBus #EmbeddedSystems #IndustrialElectronics #IoT #HighSpeedMemory #BGA #VolatileMemory #EdgeComputing #HMI #ElectronicsDesign

4 Channel AFE 12 Bit 36-WLCSP (2.8x2.56) The ADPD7000 is a highly integrated analog front end (AFE) designed for measuring various vital signals. The optical channel is designed as an optical transceiver, stimulating up to eight light emitting diodes (LEDs) and measuring the return signal on up to four separate current inputs. The signal chain rejects signal offsets and corruption from asynchronous modulated interference, typically from ambient light, eliminating the need for optical filters or externally controlled DC cancellation circuitry. The electrocardiography (ECG) signal acquisition is designed to support low noise, diagnostic level measurement in the presence of a variety of interferers. The ECG signal chain has a number of complementary features supporting ECG measurement, such as driven reference for common-mode rejection and lead off detection to identify a fallen electrode. The body impedance analysis (BIA) signal chain is designed for body impedance measurement with a configurable excitation path and measurement path. A 12-bit digital-to-analog converter (DAC) is used in the excitation path to generate the sinusoid wave and high precision measurement, with configurable filters used to measure the body response of the stimulus. The electrodermal activity (EDA) signal chain is designed for electrodermal activity. By multiplexing BIA and ECG peripheral circuits, the ADPD7000 supports high precision AC and DC measurement with 1 nS resolution. The data output and functional configuration use a serial port interface (SPI) on the ADPD7000. The control circuitry includes flexible LED signaling and synchronous detection, digital filters, digital wave generators, and configurable filters. The ADPD7000 is available in a 2.795 mm × 2.560 mm, 0.40 mm pitch, 36-ball WLCSP. ► Multimodal analog front end ► Optical channel ► 4 input channels with multiple operation modes for various sensor measurements ► 4-channel processing with simultaneous sampling ► 12 programmable time slots for synchronized sensor measurements ► Flexible input multiplexing to support single-ended sensor measurements ► 8 LED drivers, 2 of which can be driven simultaneously ► Flexible sampling rate from 0.004 Hz to 9 kHz using internal oscillators ► AC ambient light rejection: 78 dB up to 100 Hz ► 400 mA total LED peak drive current ► Individual ambient cancellation DAC at TIA input with 9-bit control up to 300 μA ► Individual LED DC cancellation DAC at TIA input with 7-bit control up to 190 μA ► ECG channel ► <1 µV RMS RTI noise at diagnosis bandwidth ► High input impedance 20 GΩ ► Accepts up to ±1.2 V of DC differential input range ► CMRR: 115 dB ► Flexible 4 electrode configurations to support various applications ► Both AC lead off detection and DC lead off detection ► Support always on, low power, lead on detection ► BIA channel ► Low power, high accuracy excitation path ► Configurable excitation frequency up to 250 kHz ► Sine wave excitation with a 12-bit DAC ► High accuracy with large imbalance contact impedance ≤20 kΩ ► Configurable receive filters with low noise design ► Complex impedance measurement engine ► Integrated current-limit resistors ► EDA channel ► Support both voltage excitation and current excitation ► 10 kΩ to100 MΩ measurement range with 1 nS resolution ► DFT and decimation for high accuracy measurement result ► SPI communications supported ► 704-byte FIFO

ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment