Infrared (IR) Emitter 840nm~870nm 1.4V~1.8V 700mA 60° Surface Mount,3.9x3.9mm The SE03-EMC3838A-B60 is a high-power surface-mount infrared (IR) LED emitter designed for applications requiring efficient 850 nm infrared illumination. It uses a compact black EMC package for improved thermal performance and reliability, making it suitable for SMT assembly and high-current operation. This component is commonly used in surveillance camera IR illumination, infrared sensing, and IR data transmission systems. Key Features 850 nm peak infrared wavelength (840–870 nm range) High-efficiency IR emission Surface-mount 2-SMD no-lead package Wide 60° viewing angle Typical forward voltage: 1.6 V Supports up to 700 mA forward current Black EMC package for enhanced heat dissipation Operating temperature range: -30°C to +85°C Suitable for automated SMT reflow assembly Compact approximately 3.9 mm × 3.9 mm footprint #commonpartslibrary #led #Infrared

20 Position Connector Header, Center Strip Contacts Surface Mount Gold DF30FC-20DP-0.4V(81) is a 20-position, 0.4 mm pitch, surface-mount (SMT) board-to-board mezzanine connector from the Hirose DF30 series. It is the plug/header (DP) side of the connector pair and is designed for ultra-low-profile, high-density PCB stacking applications commonly found in compact embedded systems, cameras, wireless modules, industrial electronics, and portable devices. The connector features gold-plated contacts for reliable electrical performance and supports a mating height of approximately 0.9 mm when paired with the corresponding receptacle. 20 contacts / positions 0.4 mm fine pitch for high-density designs Board-to-board (mezzanine) connector Surface-mount (SMT) mounting Ultra-low mating height (~0.9 mm) Gold-plated contacts for improved reliability Straight orientation Compact footprint for space-constrained applications Rated for approximately 50 mating cycles Operating temperature range: -35°C to +85°C RoHS compliant Typical Applications Embedded computing modules Camera and imaging systems Industrial control equipment IoT devices Portable electronics Wireless communication modules #Hirose #DF30Series #BoardToBoardConnector #MezzanineConnector #SMTConnector #HighDensityConnector #0p4mmPitch #EmbeddedSystems #IoT #ElectronicsDesign #PCBDesign #CompactElectronics #ConnectorSolutions

OV5640 Omnivision Technologies Camera Sensor. OV5640 provides full-frame, sub-sampled, scaled or windowed 8-bit/10-bit images in a wide range of formats, controlled through the Serial Camera Control Bus (SCCB) interface.

WR-FPC SMT ZIF Horizontal Hinge FFC/FPC Connector, 22 positions, 0.50 mm pitch, bottom-contact type with flip-lock (ZIF) actuator. Surface-mount connector designed for flexible flat cable (FFC) and flexible printed circuit (FPC) connections in compact electronic devices. Horizontal cable entry, low-profile design, halogen-free and RoHS compliant. Suitable for displays, touch panels, cameras, embedded systems, consumer electronics, industrial devices, and PCB interconnect applications. Search Keywords: WR-FPC, WR-FPC SMT ZIF, 687122149022, FFC Connector, FPC Connector, 22 Pin FFC Connector, 22 Pin FPC Connector, 0.5mm Pitch Connector, Bottom Contact Connector, ZIF Connector, Flip Lock Connector, Horizontal FFC Connector, SMT FFC Connector, Würth Elektronik Connector, Flexible Flat Cable Connector, LCD Connector, Display Connector, Camera Connector Hashtags: #WRFPC #687122149022 #WurthElektronik #FFCConnector #FPCConnector #ZIFConnector #FlipLockConnector #SMTConnector #BottomContact #22PinConnector #05mmPitch #FlexibleFlatCable #FlexiblePrintedCircuit #DisplayConnector #EmbeddedHardware #PCBDesign #ElectronicsDesign #HardwareEngineering #IndustrialElectronics #ConsumerElectronicsWR-FPC 0.50mm SMT Horiz. Bot. Contact Hinge type WR-FPC 0.50mm 22pins Hinge type SMT Horizontal Bottom Contact

This project is a IR camera sensor module based on the TSL25911FN sensor, equipped with I2C communication technique. The module features a 3.3V regulator, I2C level shifter, LEDs, capacitors, resistors, and JST connectors for easy interfacing. #Module #Template #sensor #IR #reusable #module #industrialsensing #sublayout

ESP32 S3 Development Board with 2.4G Extend Wifi Module for Camera Module OV2640 8MB PSRAM 16MB FLASH ESP32 S3 N16R8 CAM Type-C #Module #part

The ESP32-CAM Ai-Thinker is a compact, low-cost Wi-Fi and Bluetooth-enabled camera development module based on the ESP32-S dual-core microcontroller. It integrates an OV2640 2MP camera sensor, onboard Flash memory, PSRAM, and a MicroSD card slot, making it suitable for IoT vision applications, wireless surveillance, image capture, video streaming, face recognition, and smart home projects. The module combines wireless connectivity and image processing capabilities in a small form factor while maintaining low power consumption. Key Features ESP32-S Dual-Core Processor Tensilica Xtensa LX6 dual-core 32-bit CPU Operating frequency up to 240 MHz Computing performance up to 600 DMIPS Integrated Camera Equipped with OV2640 CMOS image sensor Maximum image resolution: 1600 × 1200 (UXGA, 2MP) Supports JPEG image compression and video streaming Memory 4 MB Flash memory External PSRAM for frame buffering and image processing 520 KB internal SRAM Wireless Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 4.2 BR/EDR and BLE support Storage Built-in MicroSD/TF card slot Supports local storage of images, videos, and data logs Peripheral Interfaces UART SPI I²C PWM ADC DAC GPIO expansion pins Power Supply Operating voltage: 5 V Low-power operation with deep-sleep capability for battery-powered applications Compact Design Module size approximately 27 mm × 40.5 mm PCB antenna onboard Optional external antenna connection on some variants

ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

Dual-Core Crossover MCU with Arm® Cortex®-M7 and Cortex®-M4 Cores – High-performance crossover microcontroller designed for industrial automation, edge AI, HMI, motor control, robotics, audio processing, IoT gateways, medical devices, and advanced embedded systems. The NXP MIMXRT1173CVM8A integrates an Arm® Cortex®-M7 core running up to 800 MHz and an Arm® Cortex®-M4 core running up to 400 MHz, delivering real-time performance without an external operating system. It features 2 MB on-chip SRAM with support for external program memory, making it suitable for graphics, audio, and complex control applications. The device includes 20-channel 12-bit SAR ADCs, 12-bit DAC, 10/100 Ethernet, USB 2.0 OTG, CAN FD, SD/MMC, I²C, SPI, UART/USART, SAI, SPDIF, LCD interface, camera interface, PWM, DMA, watchdog timers, temperature sensor, and extensive external memory interfaces (SEMC/FlexSPI). It also provides Secure Boot, AES, SHA, TRNG, tamper detection, and other hardware security features for secure embedded applications. Operates from 1.65–1.95 V core and 3.0–3.6 V I/O supplies, over a −40°C to +105°C junction temperature range, and is housed in a 289-ball MAPBGA (14 × 14 mm) package. The MIMXRT1173CVM8A is currently Not Recommended for New Designs (NRND), with MIMXRT1173CVM8B listed as the recommended replacement. #NXP #MIMXRT1173CVM8A #iMXRT1170 #CortexM7 #CortexM4 #DualCoreMCU #CrossoverMCU #IndustrialAutomation #EdgeAI #MotorControl #EmbeddedSystems

CMOS with Processor Image Sensor 1296H x 976V 1.9µm x 1.9µm 55-ODCSP (4.65x3.85) #CommonPartsLibrary #Sensor #Transducer #Optical-Sensor #Image-Sensor #Camera #MT9M114

CMOS Image Sensor, Digital, Global Shutter, 1.0 MP, 1/4-Inch #CMOS #camera #matrix #sensor

MAX98357A Series 5.5V 3.2W PCM Input Class D Audio Power Amplifier - TQFN-16 The MAX98357A/MAX98357B is an easy-to-use, low-cost, digital pulse-code modulation (PCM) input Class D amplifier that provides industry-leading Class AB audio performance with Class D efficiency. The digital audio interface automatically recognizes up to 35 different PCM and TDM clocking schemes which eliminates the need for I2C programming. Operation is further simplified by eliminating the need for an external MCLK signal that is typically used for PCM communication. Simply supply power, LRCLK, BCLK, and digital audio to generate audio! Furthermore, a novel pinout allows customers to use the cost-effective WLP package with no need for expensive vias (refer to Application Note 6643: Optimize Cost, Size, and Performance with MAX98357 WLP for more information). The digital audio interface is highly flexible with the MAX98357A supporting I2S data and the MAX98357B supporting left-justified data. Both ICs support 8 channel time division multiplexed (TDM) data. The digital audio interface accepts specified sample rates between 8kHz and 96kHz for all supported data formats. The ICs can be configured to produce a left channel, right channel, or (left/2 + right/2) output from the stereo input data. The ICs operate using 16/24/32-bit data for I2S and left-justified modes as well as 16-bit or 32-bit data using TDM mode. The ICs eliminate the need for the external MCLK signal that is typically used for PCM communication. This reduces EMI and possible board coupling issues in addition to reducing the size and pin count of the ICs. The ICs also feature a very high wideband jitter tolerance (12ns typ) on BCLK and LRCLK to provide robust operation. Active emissions-limiting, edge-rate limiting, and overshoot control circuitry greatly reduce EMI. A filterless spread-spectrum modulation scheme eliminates the need for output filtering found in traditional Class D devices and reduces the component count of the solution. The ICs are available in 9-pin WLP (1.345mm x 1.435mm x 0.64mm) and 16-pin TQFN (3mm x 3mm x 0.75mm) packages and are specified over the -40°C to +85°C temperature range. ● Single-Supply Operation (2.5V to 5.5V) ● 3.2W Output Power into 4Ω at 5V ● 2.4mA Quiescent Current ● 92% Efficiency (RL = 8Ω, POUT = 1W) ● 22.8μVRMS Output Noise (AV = 15dB) ● Low 0.013% THD+N at 1kHz ● No MCLK Required ● Sample Rates of 8kHz to 96kHz ● Supports Left, Right, or (Left/2 + Right/2) Output ● Sophisticated Edge Rate Control Enables Filterless Class D Outputs ● 77dB PSRR at 1kHz ● Low RF Susceptibility Rejects TDMA Noise from GSM Radios ● Extensive Click-and-Pop Reduction Circuitry ● Robust Short-Circuit and Thermal Protection ● Available in Space-Saving Packages: 1.345mm x 1.435mm WLP (0.4mm Pitch) and 3mm x 3mm TQFN ● Solution Size with Single Bypass Capacitor is 4.32mm2 Applications ● Single Li-ion Cell/5V Devices ● Smart Speakers ● Notebook Computers ● IoT Devices ● Gaming Devices (Audio and Haptics) ● Smartphones ● Tablets ● Cameras #commonpartslibrary #integratedcircuit #linearamplifier #mono

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Audio Transformers / Signal Transformers POE70P Flyback 7uH 5.0 V 1.4 A SMD,12.7x10.5mm Pulse Transformers RoHS The POE70P-50LD, manufactured by Coilcraft, is a magnetic component designed for PoE applications, where electrical power is delivered together with data over Ethernet cables. It is optimized for isolated DC-DC conversion in network-powered devices. Key Characteristics Part Type: PoE transformer / flyback transformer Technology: Magnetic (ferrite core) transformer Mounting: Surface-mount (SMT) Power Rating: ~7 W Isolation Voltage: up to 1500 Vrms Input Range: typically 36–72 V (PoE standard range) Output Example: ~5 V / 1.4 A (depending on design) Core Material: Ferrite Operating Temp: −40 °C to +85 °C Function (How it works) Converts high-voltage PoE input into low-voltage DC output Provides galvanic isolation between Ethernet line and device Works in a flyback converter topology Supports efficient energy transfer and EMI control Typical Applications IP cameras VoIP phones Wireless access points Network switches Industrial IoT devices #CommonPartsLibrary #Transformer

Shielded RJ45 Connector with Integrated Magnetics (PoE) – Single-port RJ45 Ethernet connector with integrated 10/100Base-T magnetics for industrial Ethernet, embedded networking, IoT gateways, automation equipment, IP cameras, networking devices, and Power over Ethernet (PoE) applications. Features a through-hole, right-angle PCB mount, CAT5e-compliant interface, and supports 10/100Base-T Ethernet, Auto-MDIX, and PoE operation. Includes integrated isolation transformers, common-mode chokes, yellow and green status LEDs, shielded metal housing, board guide for secure mounting, and gold-plated contacts (30 µin / 0.76 µm) for reliable long-term performance. Designed with a tab-down RJ45 orientation, 90° entry, and operates over a −40°C to +85°C temperature range, making it suitable for rugged industrial and embedded networking applications. #WurthElektronik #7499210121A #RJ45Connector #EthernetConnector #IntegratedMagnetics #MagJack #CAT5e #PoE #10100BaseT #IndustrialEthernet #EmbeddedNetworking #IoT #EmbeddedSystems