Charger IC Multi-Chemistry 36-VQFN (5x6) The BQ25750RRVR is a highly integrated switch-mode battery charge controller and power-path management device designed for single-cell to multi-cell lithium-ion and lithium-polymer battery-powered systems. The device supports bidirectional power conversion, enabling both battery charging and system power delivery through USB Type-C and other DC power sources. It integrates high-efficiency buck-boost charging architecture to maintain optimal charging performance across a wide input voltage range. The device is intended for portable electronics, industrial handheld equipment, USB Power Delivery applications, embedded systems, and battery-powered computing platforms requiring advanced power management and flexible charging capability. Integrated power-path management allows simultaneous system operation and battery charging while maintaining battery protection and system stability. The BQ25750RRVR supports programmable charging parameters through an I2C interface, including charge voltage, charge current, input current limit, and system power regulation. The device includes comprehensive protection functions such as overvoltage protection, overcurrent protection, thermal regulation, battery temperature monitoring, and fault reporting. High switching frequency operation enables reduced external component size and compact PCB implementation. Features Integrated synchronous buck-boost battery charger Supports USB Power Delivery and wide DC input sources Bidirectional power conversion capability I2C programmable charging and system parameters Integrated power-path management High-efficiency charging operation Supports multi-cell lithium-ion and lithium-polymer batteries Programmable input current and charge current limits Dynamic power management and system voltage regulation Integrated ADC monitoring for voltage, current, and temperature Battery supplement mode during adapter removal OTG boost mode support Thermal regulation and thermal shutdown protection Input overvoltage and overcurrent protection Battery overvoltage protection Safety timer and watchdog timer support NTC thermistor interface for battery temperature monitoring Interrupt and fault status reporting Compact WQFN package suitable for space-constrained designs Electrical Characteristics Wide input operating voltage range Programmable battery charge voltage High charge current capability Integrated low RDS(on) MOSFET drivers High switching frequency operation High conversion efficiency across operating range Low standby and shutdown current consumption Accurate input and charge current regulation Integrated analog-to-digital converter telemetry Interface and Control I2C serial communication interface Programmable charging profiles Configurable protection thresholds Status and interrupt reporting ADC telemetry reporting Enable and control pins for system integration Protection Features Input overvoltage protection Input overcurrent protection Battery overvoltage protection Thermal shutdown protection Thermal regulation control Short-circuit protection Watchdog timer protection Safety charging timer Battery temperature qualification support Package Information Package Type: WQFN Package Suffix: RRV Compact thermally enhanced package Surface-mount device Suitable for automated PCB assembly processes Applications USB Type-C charging systems Portable computers and tablets Industrial handheld devices Power banks and battery packs Embedded battery-powered systems Portable instrumentation Consumer electronics Smart battery charging platforms #commonpartslibrary #integratedcircuit #powermanagement #batterycharger

Temperature Sensor Digital, Local -40°C ~ 125°C 10 b 8-MSOP The MCP9808T-E/MS is a high-accuracy digital temperature sensor developed by Microchip Technology for precision thermal monitoring applications. The device communicates through a standard I²C-compatible serial interface and is optimized for low-power embedded systems requiring accurate ambient temperature measurement. It integrates internal temperature sensing, analog-to-digital conversion, programmable alert functionality, and configurable power management within a compact MSOP package. The sensor is designed for applications including industrial monitoring, consumer electronics, IoT devices, thermal management systems, medical instrumentation, and battery-powered portable equipment. Its low operating current and shutdown capability make it suitable for energy-efficient systems where thermal accuracy and minimal power consumption are critical. The device supports programmable temperature limits and interrupt generation for over-temperature events, enabling autonomous thermal supervision without continuous host processor intervention. The MCP9808T-E/MS maintains high measurement accuracy across a wide operating temperature range and offers stable digital output without requiring external calibration components. Electrical Characteristics Supply voltage operation supports low-voltage and standard logic systems. Low operating current enables efficient continuous monitoring. Shutdown mode significantly reduces power consumption during inactive periods. Digital I²C interface supports standard and fast communication modes. Integrated temperature conversion engine provides direct digital temperature output. Temperature Sensing Features High-accuracy ambient temperature measurement. Wide operating temperature range suitable for industrial environments. Programmable resolution for balancing conversion speed and precision. Configurable upper, lower, and critical temperature alert thresholds. Integrated hysteresis control for stable thermal event detection. Communication Interface I²C-compatible serial communication interface. Configurable slave addressing for multi-device bus operation. Supports read and write access to internal configuration registers. Compatible with common microcontrollers and embedded processors. Functional Features Integrated alert output for thermal event signaling. Programmable interrupt and comparator operating modes. Internal registers support temperature monitoring and device configuration. Power-on reset circuitry ensures predictable startup behavior. Device identification registers support system-level verification. Mechanical Characteristics Package type is MSOP with compact surface-mount footprint. Suitable for automated PCB assembly processes. RoHS-compliant and lead-free manufacturing. Typical Applications Industrial temperature monitoring systems. Portable battery-powered electronics. Embedded microcontroller systems. Thermal protection and supervision circuits. Consumer and IoT sensing devices. Medical and laboratory instrumentation. #CommonPartsLibrary #Sensor #Transducer #Temperature-Sensor #MCP9808

SMB, Fakra Connector Plug, Male Pin 50 Ohms Through Hole, Right Angle Solder The FA1-NDRP-PCB-8 is a PCB-mounted connector component typically used for reliable board-to-board or cable-to-board electrical interconnections in electronic systems. It is designed to provide stable mechanical retention and dependable signal or power transfer in compact PCB assemblies. Components in this series are commonly used in industrial equipment, consumer electronics, embedded systems, and communication devices. Key Features PCB-mount connector design for easy integration into electronic assemblies Supports secure electrical and mechanical connection Compact form factor suitable for space-constrained designs Durable housing and contact structure for repeated mating cycles Designed for stable signal and/or power transmission Typically used in control boards, interface modules, and embedded electronics Compatible with automated PCB assembly processes depending on package style Typical Applications Industrial control equipment Consumer electronics Embedded and IoT devices Communication hardware Interface and expansion boards #Connector #RF-connector #Coaxial

Mini 2.45 GHz Antenna The 2450AT18A100E is a high-frequency ceramic SMT antenna featuring a small 3.2 mm × 1.6 mm × 1.3 mm package, optimized for space-constrained RF designs. It operates from 2400 MHz to 2500 MHz with a 50 Ω impedance and provides a compact alternative to traditional PCB trace antennas while maintaining reliable RF performance. Key Features Operating Frequency: 2400 MHz – 2500 MHz (2.4 GHz ISM Band) Center Frequency: 2450 MHz Antenna Type: Mini Ceramic Chip Antenna / SMT RF Antenna Package Size: 3.2 mm × 1.6 mm × 1.3 mm Impedance: 50 Ω Peak Gain: Approximately +0.5 dBi (typical) Average Radiation Efficiency: Approximately 76% (based on Johanson evaluation board) Maximum Input Power: 2 W continuous wave (CW) Operating Temperature Range: -40 °C to +125 °C Mounting Type: Surface Mount Technology (SMT) Applications: Bluetooth / BLE devices Wi-Fi 2.4 GHz modules Zigbee / IEEE 802.15.4 systems IoT sensors and embedded wireless products #2450AT18A100E #JohansonTechnology #ChipAntenna #SMTAntenna #RFDesign #2GHzAntenna #Bluetooth #WiFi #Zigbee #IoT #WirelessCommunication #EmbeddedSystems #PCBDesign #RFAntenna #Antena #Chip #SurfaceMount

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

Resettable PTC Fuse – 3 A polymeric positive temperature coefficient (PPTC) resettable fuse for overcurrent and short-circuit protection in power supplies, automotive electronics, USB power lines, battery-powered devices, industrial equipment, and embedded systems. Features a 15 V maximum operating voltage, 3 A hold current, 5.2 A trip current, and 100 A maximum fault current. Provides 10 mΩ minimum initial resistance, 48 mΩ maximum post-trip resistance, and a 20 s maximum trip time under specified fault conditions. Designed in a 2920 (7351 Metric) surface-mount package, qualified to AEC-Q200, cURus, and TÜV standards, and specified for operation over a −40°C to +85°C temperature range. #BelFuse #0ZCF0300AF2C #ResettableFuse #PTCFuse #PPTCFuse #PolymericPTC #OvercurrentProtection #CircuitProtection #3A #2920 #AECQ200 #SurfaceMount #EmbeddedSystems

CY8C58LP PSOC® 5LP ARM® Cortex®-M3 MCU 32-Bit Embedded Evaluation Board #EvaluationBoard #MCU #DSP #CY8C5888

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 153 608256 22320 256-LBGA #CommonPartsLibrary #IntegratedCircuit #Embedded #FPGAs #EP4CE22

2 Position Wire to Board Terminal Block Horizontal with Board 0.375" (9.53mm) Through Hole # 1714971 ## General Description The 1714971 is a high-current printed circuit board terminal block manufactured by Phoenix Contact and designed for secure power and signal connections in industrial and commercial electronic equipment. The component utilizes a screw-clamp termination mechanism that provides reliable wire retention, low contact resistance, and long-term electrical stability. Its robust construction and through-hole mounting design make it suitable for applications requiring dependable field wiring, high-current handling capability, and resistance to mechanical stress. The terminal block is commonly used in power supplies, industrial automation systems, motor controllers, battery management systems, energy distribution equipment, instrumentation, and other applications requiring secure PCB-mounted power connections. ## Key Features ### Mechanical Characteristics * Through-hole PCB mounting * Screw-clamp wire termination * Side-entry wire connection * High-strength housing construction * Secure field-wire installation * Designed for repeated maintenance and servicing operations ### Electrical Characteristics * High-current carrying capability * Low contact resistance * Reliable electrical conductivity * Stable performance under demanding operating conditions * Suitable for power distribution and control applications ### Contact System * Corrosion-resistant conductive contacts * Screw-actuated clamping mechanism * Secure conductor retention * Reliable electrical connection during vibration and mechanical stress ### Material Construction * Industrial-grade thermoplastic housing * High-conductivity metal contacts * Flame-resistant insulation materials * RoHS-compliant construction ### Environmental Characteristics * Suitable for industrial environments * Resistant to mechanical wear * Durable under continuous operation * Designed for long service life ### Application Areas * Industrial Automation Equipment * Power Supply Systems * Motor Control Circuits * Battery Management Systems * Renewable Energy Equipment * Electrical Distribution Panels * Instrumentation Systems * Process Control Equipment * Embedded Power Electronics * Industrial Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade PCB Interconnect Solution ## Manufacturer Phoenix Contact ## Product Family COMBICON PCB Terminal Blocks #PhoenixContact #1714971 #COMBICON #TerminalBlock #PCBTerminalBlock #ScrewTerminal #PowerConnector #IndustrialElectronics #PowerDistribution #IndustrialAutomation #EmbeddedSystems #ControlSystems #ElectronicsDesign #PCBAssembly #ElectricalEngineering

22 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold The SSW-122-02-G-S is a surface-mount, single-row socket strip designed for reliable board-to-board or component interconnection in electronic assemblies. It is part of a standardized connector series intended for applications requiring compact form factor, consistent electrical performance, and ease of automated placement. The component features a low-profile design suitable for dense PCB layouts and is commonly used in prototyping, embedded systems, and production-level electronics. Design and Construction The connector is manufactured with precision-aligned contacts housed in a high-temperature thermoplastic body, enabling compatibility with standard reflow soldering processes. The contact system is engineered to ensure stable mechanical retention and consistent electrical conductivity, supporting repeated mating cycles without significant degradation. The materials used provide durability, resistance to thermal stress, and compliance with common industry standards for electronic components. Electrical Characteristics The device is intended to provide reliable signal transmission with minimal contact resistance. It supports low to moderate current applications typical of signal-level interconnections. The contact plating is designed to reduce oxidation and maintain stable electrical performance over time. Mechanical Features The connector is configured as a single-row socket with a defined pitch spacing suitable for standard header interfaces. Its surface-mount termination allows for secure attachment to printed circuit boards while minimizing required board space. The structure supports proper alignment during assembly and ensures consistent engagement with corresponding mating connectors. Applications This component is widely used in applications such as microcontroller boards, communication modules, sensor interfaces, and general-purpose electronic systems. It is suitable for both development environments and final product integration where dependable and space-efficient connectivity is required. Compliance and Reliability The SSW-122-02-G-S is designed to meet common industry requirements for environmental and mechanical reliability. It is typically compliant with RoHS standards and suitable for use in a variety of operating conditions encountered in commercial and industrial electronics. #commonpartslibrary #connector #header

Accelerometer, Gyroscope, 6 Axis Sensor I2C, I3C, SPI Output The BMI323 is a low-power, high-performance inertial measurement unit developed by Bosch Sensortec. It integrates a three-axis accelerometer and a three-axis gyroscope within a compact surface-mount package intended for motion sensing applications requiring precise movement detection, orientation tracking, vibration monitoring, and activity recognition. The device is optimized for wearable electronics, industrial sensing, robotics, navigation systems, IoT devices, and consumer electronics where low power consumption and high motion accuracy are critical. The sensor includes advanced digital signal processing, configurable motion-detection features, programmable interrupts, and integrated FIFO buffering to reduce host processor workload and improve system efficiency. Communication is supported through standard digital interfaces, enabling straightforward integration with microcontrollers and embedded platforms. The BMI323 is designed for robust environmental performance and supports flexible power management modes suitable for battery-operated systems. Engineering Specifications Device Type Six-axis inertial measurement unit consisting of: Three-axis accelerometer Three-axis gyroscope Manufacturer Bosch Sensortec Package Compact LGA surface-mount package suitable for automated assembly processes. Accelerometer Characteristics Supports multiple selectable full-scale measurement ranges for motion and acceleration sensing applications. Provides high-resolution digital output with configurable filtering and sampling parameters for low-noise operation and accurate motion analysis. Gyroscope Characteristics Integrated three-axis angular rate sensor with programmable measurement ranges and digital filtering capabilities. Designed for rotational movement tracking, stabilization, gesture recognition, and inertial navigation applications. Digital Interfaces Supports: I²C serial communication SPI serial communication I3C compatible operation Power Features Designed for ultra-low power operation with multiple configurable power modes to optimize energy consumption for portable and battery-powered devices. Embedded Features Includes integrated: FIFO data buffering Motion detection engine Activity and inactivity detection Tap and gesture detection Orientation and tilt sensing Interrupt generation Self-test functionality Output Data Handling Provides configurable output data rates, oversampling settings, and digital filtering options for balancing performance, bandwidth, and power consumption. Temperature Performance Integrated temperature sensing and compensation support for improved measurement stability across varying environmental conditions. Interrupt System Programmable interrupt outputs support event-driven system architectures and allow efficient host wake-up functionality. Operating Environment Designed for operation across industrial and consumer temperature ranges with stable sensor performance under dynamic motion conditions. Applications Suitable for: Wearable devices Smart watches Fitness trackers Industrial motion monitoring Robotics Drones Navigation systems Gaming controllers AR/VR systems IoT motion sensing Human-machine interfaces #commonpartslibrary #integratedcircuit #accelerometer #sensor

QFN-68(7x7) Power Management - Specialized ROHS The RK806-1 is a multi-channel PMIC designed to deliver and manage power for modern embedded platforms. It integrates multiple high-efficiency DC-DC buck converters, LDO regulators, and a configurable power sequencing controller in a compact QFN-68 package. It is tightly coupled with Rockchip SoCs and is responsible for generating stable voltage rails for CPU cores, GPU, DDR memory, and peripheral blocks. ⭐ Key Features ⚡ 1. High-Integration Power Architecture Multiple synchronous buck converters (high-current rails for CPU/GPU) Several LDO regulators for low-noise analog and IO domains Supports dynamic voltage scaling (DVS) for performance optimization 🔌 2. Wide Output Capability Output voltage range: ~0.5 V to 3.4 V per channel Designed for modern low-voltage SoC power domains Supports both high-current and low-noise power rails 🧠 3. Programmable Power Sequencing OTP / register-configurable power-up & power-down sequence Ensures safe startup for multi-rail SoCs Supports synchronized sequencing with multiple PMICs 📡 4. Digital Control Interface I²C and SPI interface for configuration and control Real-time voltage adjustment per processor demand Register-based control for power modes and telemetry 🛡️ 5. Protection & Reliability Features Over-voltage protection (OVP) Over-current protection (OCP) Thermal shutdown protection Soft-start for inrush current control ⚙️ 6. Efficiency & Performance Optimizations High-frequency switching (~MHz range) for smaller external components Fast transient response for CPU load changes Low standby current for power-sensitive designs 📦 7. Package & Integration QFN-68 (7×7 mm) compact package High thermal efficiency for dense PCB layouts Minimal external components required 📌 Typical Applications Single-board computers (SBCs) AI edge computing devices Tablets and industrial embedded systems Consumer electronics using Rockchip SoCs (e.g., RK3588 platforms) #commonpartslibrary #integratedcircuit #powermanagement

Non-Isolated PoL Module DC DC Converter 1 Output 0.8 ~ 6V 10A 6V - 20V Input The LMZ22010TZ/NOPB is a compact, high-efficiency step-down (buck) DC-DC power module from Texas Instruments. It integrates a switching regulator, power MOSFETs, inductor, and compensation components into a single package, simplifying power supply design. This module is capable of delivering up to 10A output current with excellent thermal performance and minimal external components. It is intended for high power density applications such as industrial systems, telecommunications equipment, and embedded processing platforms. Manufacturer Information Manufacturer: Texas Instruments Part Number: LMZ22010TZ/NOPB Product Type: DC-DC Buck Power Module Key Features Integrated power module with inductor and controller Output current up to 10A Wide input voltage range High efficiency operation Adjustable output voltage Built-in protection features (thermal shutdown, overcurrent protection) Power-good output and enable control Requires minimal external components Electrical Characteristics Parameter Value Input Voltage Range 6 V to 20 V Output Voltage Range 0.8 V to 6 V (adjustable) Output Current Up to 10 A Switching Frequency ~500 kHz Efficiency Up to ~95% Operating Temperature Range -40°C to +125°C Package Information Package Type: TO-PMOD (Power Module) Mounting Type: Surface Mount Integrated inductor and power components Optimized for thermal performance Pin Configuration (Typical) Pin Name Description VIN Input supply voltage VOUT Regulated output voltage GND Ground EN Enable input FB Feedback for output adjustment PGOOD Power-good indicator Typical Applications Industrial automation systems Telecom and networking equipment FPGA / DSP / processor power rails Embedded systems Point-of-load regulation Design Considerations Ensure proper PCB layout for heat dissipation Use appropriate input/output capacitors External resistors required to set output voltage Consider airflow for high-current operation #commonpartslibrary #powersupply #dcdc #converter

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.5Hz ~ 625Hz 16-LGA (3x3) # LIS3DHTR ## General Description The LIS3DHTR is an ultra-low-power three-axis digital accelerometer manufactured by STMicroelectronics. It is designed to provide accurate motion, orientation, tilt, vibration, and acceleration sensing for a wide range of embedded and portable electronic applications. The device integrates advanced MEMS sensor technology, configurable measurement ranges, embedded motion-detection functions, and digital communication interfaces within a compact surface-mount package. Its low power consumption and high measurement accuracy make it suitable for wearable devices, industrial monitoring systems, asset tracking equipment, smart sensors, consumer electronics, medical devices, Internet of Things products, and battery-powered embedded systems. ## Key Features ### Sensor Architecture * Three-axis digital accelerometer * MEMS sensing technology * High-resolution motion measurement * Multi-axis acceleration detection * Real-time movement monitoring * Precision orientation sensing ### Measurement Capabilities * Motion detection functionality * Tilt sensing capability * Free-fall detection support * Vibration monitoring * Orientation recognition * Impact and shock detection * Activity and inactivity monitoring ### Electrical Characteristics * Ultra-low-power operation * Low current consumption * High measurement stability * Fast response capability * Reliable sensor performance * Optimized for battery-powered systems ### Embedded Processing Features * Integrated interrupt generation * Event detection capability * Motion recognition support * Threshold-based monitoring * Embedded motion-processing functions * Autonomous event reporting ### Communication Interfaces * SPI digital communication interface * I²C digital communication interface * Easy microcontroller integration * Reliable data transfer capability * Flexible system connectivity ### Package Characteristics * Compact surface-mount package * Low-profile design * Automated assembly compatible * High-density PCB layout support * Suitable for space-constrained applications ### Material Construction * Advanced MEMS sensor technology * High-reliability semiconductor integration * RoHS-compliant materials * Lead-free package construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Reliable operation under industrial conditions * Stable sensor performance over time * Resistant to mechanical stress and vibration * Suitable for continuous monitoring applications ### Application Areas * Wearable Electronics * Internet of Things Devices * Smart Sensors * Asset Tracking Systems * Industrial Monitoring Equipment * Consumer Electronics * Medical Devices * Portable Electronics * Motion Detection Systems * Vibration Monitoring Equipment * Fitness and Activity Tracking Devices * Embedded Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade MEMS Motion Sensor Solution ## Manufacturer STMicroelectronics ## Product Family LIS3DH Three-Axis Digital Accelerometer Series #LIS3DHTR #STMicroelectronics #Accelerometer #MEMSSensor #MotionSensor #ThreeAxisAccelerometer #IoT #WearableDevices #EmbeddedSystems #IndustrialMonitoring #AssetTracking #VibrationMonitoring #ConsumerElectronics #ElectronicsEngineering #SensorTechnology

# SAM-M10Q-00B Engineering Specifications **General Description** The SAM-M10Q-00B is a compact, ultra-low-power Global Navigation Satellite System receiver module manufactured by u-blox. It is designed to provide highly accurate positioning, navigation, and timing information for battery-powered and space-constrained applications. Built on the u-blox M10 positioning platform, the module supports concurrent reception of multiple satellite constellations, enabling improved positioning accuracy, faster acquisition times, and enhanced reliability in challenging environments such as urban canyons and partially obstructed outdoor locations. Its optimized power architecture significantly reduces energy consumption while maintaining continuous navigation performance. The integrated antenna architecture and compact system-in-package design simplify hardware development by reducing external component requirements. The module is suitable for asset tracking, wearable devices, Internet of Things systems, industrial monitoring equipment, smart city infrastructure, agricultural applications, and portable navigation products. Designed for high-volume embedded applications, the SAM-M10Q-00B combines advanced GNSS technology, low power consumption, and robust positioning performance in a miniature surface-mount package. **Engineering Specifications** **Manufacturer:** u-blox **Manufacturer Part Number:** SAM-M10Q-00B **Component Type:** GNSS receiver module **Technology:** Multi-constellation satellite positioning receiver **GNSS Platform:** u-blox M10 positioning technology **Navigation Function:** Global positioning, navigation, and timing **Satellite Reception:** Concurrent multi-constellation GNSS tracking **Supported Systems:** GPS, Galileo, GLONASS, BeiDou and regional augmentation services **Receiver Architecture:** High-sensitivity GNSS receiver **Positioning Capability:** Real-time location tracking and navigation **Acquisition Performance:** Fast satellite acquisition and reacquisition **Tracking Performance:** Continuous satellite tracking under dynamic conditions **Position Accuracy:** High-precision navigation performance **Sensitivity:** Optimized for weak-signal environments **Power Consumption:** Ultra-low-power operation **Power Supply Configuration:** Single-supply operation **Data Interface:** Serial communication interface for host processor integration **Communication Protocols:** Standard GNSS navigation messaging support **Integrated Features:** Embedded antenna solution and RF front-end integration **Startup Modes:** Cold start, warm start and hot start operation **Timing Capability:** Precision timing and synchronization support **Interference Mitigation:** Advanced signal-processing algorithms for improved reception **System Integration:** Designed for compact embedded applications **Environmental Performance:** Reliable operation in outdoor and industrial environments **Operating Temperature Range:** Industrial temperature range **Package Type:** System-in-package GNSS module **Mounting Style:** Surface mount technology **Package Construction:** Compact low-profile module **Environmental Compliance:** RoHS compliant and lead-free **Reliability Features:** Designed for long-term embedded operation and high-volume production **Typical Applications** Asset tracking devices Internet of Things systems Wearable electronics Portable navigation equipment Fleet management systems Smart city infrastructure Industrial monitoring equipment Agricultural positioning systems Environmental data loggers Personal tracking devices Drone navigation systems Geolocation-enabled sensors Telematics systems Logistics and transportation tracking Battery-powered embedded products #SAMM10Q00B #SAMM10Q #uBlox #GNSS #GPSModule #SatelliteNavigation #PositioningSystem #IoT #AssetTracking #WearableTechnology #EmbeddedSystems #NavigationModule #Telematics #LocationTracking #ElectronicComponents #EngineeringSpecifications

ARM® Cortex®-M0+ STM32G0 Microcontroller IC 32-Bit Single-Core 64MHz 128KB (128K x 8) FLASH 64-LQFP (10x10) #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #STM32G071

Linear Voltage Regulator IC Positive Fixed 1 Output 1A SOT-223-3 General Description The AP2114H-3.3TRG1 is a low dropout linear voltage regulator designed to provide a stable fixed output voltage for low-noise and power-sensitive electronic applications. The device is optimized for high current capability, low quiescent current operation, and reliable thermal performance. It is suitable for portable electronics, embedded systems, communication equipment, consumer devices, and industrial control applications where stable power regulation is required. The regulator incorporates internal protection functions including over-current protection and thermal shutdown to improve operational reliability and system safety. The component is supplied in a surface-mount SOT-223 package suitable for automated PCB assembly processes. Device Type Low Dropout Linear Voltage Regulator with Enable Function Output Configuration Positive Fixed Output Nominal Output Voltage 3.3 V Maximum Output Current 1 A minimum continuous load current capability Input Voltage Range Operates from low-voltage DC input supplies up to 6 V maximum Dropout Voltage Low dropout operation suitable for battery-powered and low-headroom applications Output Accuracy High precision regulated output voltage with tight tolerance characteristics Quiescent Current Low standby current for power-efficient system operation Power Supply Rejection High ripple rejection performance for low-noise output regulation Protection Features Integrated over-current protection Thermal shutdown protection Short-circuit protection Operating Temperature Range Suitable for industrial temperature operating conditions from negative forty degrees Celsius to positive eighty-five degrees Celsius Package Information Surface-mount SOT-223 package Mounting Method Surface Mount Technology Applications LCD monitors LCD televisions Set-top boxes Portable electronics Embedded controllers Industrial electronic systems Low-noise power supply applications #CommonPartsLibrary #IntegratedCircuit #PowerManagement

SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering. As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years. The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller. Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components. Spec Sheet Identification Part Number: AS4C32M16SB-7TCN Device Family: AS4C32M16SB Manufacturer: Alliance Memory, Inc. Die Revision: B-die Functional Classification Device Type: Synchronous DRAM (SDR SDRAM) Memory Organization: Multi-bank array architecture Interface Type: Parallel, clock-synchronous command interface Refresh Capability: Supports auto-refresh and self-refresh modes Electrical Characteristics Supply Voltage: Standard 3.3V-class SDRAM supply rating Clock Frequency: Mid-range SDR SDRAM clock speed class Access Timing: Standard SDR SDRAM access time class for its speed grade Environmental & Qualification Temperature Grade: Commercial ("C" suffix designation) RoHS Compliance: Yes Product Positioning: Long-lifecycle, drop-in replacement memory device Package Package Type: Thin Small Outline Package, TSOP-II style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tray packaging #AS4C32M16SB #AllianceMemory #SDRAM #SDRSDRAM #MemoryIC #EmbeddedMemory #TSOP #SurfaceMount #LegacyMemory #DropInReplacement #DRAM #EmbeddedSystems #IndustrialElectronics #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #MemoryComponent #PCBDesign #CommonPartsLibrary #IntegratedCircuit #Memory #AS4C32

STM32G474 Nucleo-64 STM32G4 ARM® Cortex®-M4 MCU 32-Bit Embedded Evaluation Board #Module #part #STM32G4

Power Supply Controller Digital Power Monitor 10-VSSOP The INA228AIDGSR is a high-precision digital power monitor and current-sense amplifier designed for accurate measurement of shunt voltage, bus voltage, current, power, energy, and charge in DC power systems. The device integrates a low-offset differential amplifier with high-resolution analog-to-digital converters and supports bidirectional current sensing across a wide common-mode voltage range. Communication is provided through an I²C- and SMBus-compatible digital interface, enabling direct telemetry integration into embedded control and battery management systems. The device is optimized for high-accuracy power monitoring applications requiring low drift, low offset, and high dynamic range. Integrated mathematical computation functions reduce host processor overhead by internally calculating current, power, accumulated energy, and charge values. Programmable conversion timing and averaging modes allow optimization between measurement speed and noise performance. The INA228AIDGSR is suitable for server power distribution, industrial automation, telecom infrastructure, automotive subsystems, battery-powered equipment, and precision instrumentation requiring real-time power analytics and fault monitoring. Engineering Specification Device Type Digital power monitor with integrated current-sense amplifier and high-resolution ADC. Measurement Functions Supports measurement of: Differential shunt voltage Bus voltage Current Power Energy accumulation Charge accumulation Temperature through external sensing methods Current Sensing Supports bidirectional current measurements using an external shunt resistor with programmable calibration scaling. ADC Architecture Incorporates high-resolution delta-sigma analog-to-digital converters with programmable conversion time and averaging configuration. Interface Uses I²C- and SMBus-compatible serial communication interface with programmable device addressing. Voltage Monitoring Supports high-side and low-side sensing across a wide common-mode input voltage range suitable for multi-rail power systems. Accuracy Features Includes: Low input offset voltage Low offset drift Precision gain architecture High measurement linearity Integrated calibration engine Power Computation Internally computes: Instantaneous power Average power Energy accumulation over time Charge accumulation over time Alert and Protection Features Provides programmable alert functionality for: Overcurrent Undervoltage Overvoltage Power threshold violations Conversion-ready indication Operating Modes Supports: Continuous conversion mode Triggered conversion mode Low-power shutdown mode Package Information Supplied in a compact VSSOP surface-mount package suitable for automated PCB assembly and space-constrained applications. Temperature Range Designed for operation across industrial temperature environments suitable for embedded and power-management systems. Typical Applications Battery management systems Power supply monitoring Server and telecom power rails Industrial control systems DC energy metering Embedded power analytics Automotive electronics Portable instrumentation #commonpartslibrary #integratedcircuit #powermanagement #powersupplycontroller

BergStak 0.40mm, 100 position, Receptacle, 4mm stack height 100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold 10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs. This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies. Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment #AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

Battery Retainer Coin, 24.5mm 1 Cell SMD (SMT) Tab BAT-HLD-006-SMT is a surface-mount coin-cell battery holder designed for secure retention of a single CR2450 lithium coin battery in compact PCB applications. Manufactured by TE Connectivity, it provides a low-profile, reliable power solution for embedded systems, wireless sensors, IoT devices, medical electronics, and backup power circuits. The holder features a horizontal battery orientation, phosphor bronze construction, and nickel-plated contacts for durability and dependable electrical performance. Key Features Supports one CR2450 coin-cell battery Surface-mount (SMT) PCB installation Horizontal battery orientation for low-profile designs Nickel-plated contacts for reliable conductivity and corrosion resistance Phosphor bronze construction for mechanical durability Maximum contact current rating of 1 A Compact design with approximately 6.88 mm height above PCB Suitable for automated assembly and reflow soldering processes Ideal for RTC backup, wireless modules, portable electronics, and IoT devices #BatteryHolder #CR2450 #CoinCellHolder #SMT #SurfaceMount #TEConnectivity #PowerManagement #EmbeddedSystems #IoT #PCBDesign #Electronics #BatteryRetainer #HardwareDesign #ElectronicComponents

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Through Hole The USB4960-00-C is a vertical USB Type-C® USB 2.0 receptacle connector manufactured by GCT (Global Connector Technology). It is designed for compact embedded systems, consumer electronics, industrial equipment, and IoT devices requiring a reliable USB Type-C interface for USB 2.0 data transfer and power delivery. The connector features a hybrid Surface Mount Technology (SMT) and Through-Hole (TH) shell stake design, providing excellent PCB retention and mechanical durability. It supports up to 240 W (48 V DC) power capability and is rated for 10,000 mating cycles, making it suitable for demanding applications. Key Features USB Type-C® USB 2.0 vertical receptacle 16 active contacts with 8 dummy contacts (24-position mechanical interface) Hybrid SMT signal pins with through-hole shell stakes for enhanced mechanical strength Supports up to 48 V DC and 240 W power capability Rated for 10,000 mating cycles Gold-plated copper alloy contacts for reliable electrical performance Shielded metal shell for improved EMI protection Operating temperature: -25°C to +85°C Features locating pegs, board guide, pick-and-place cap, and solder retention for automated assembly Ideal for embedded systems, industrial electronics, consumer devices, and USB charging applications. #USBTypeC #USB20 #ReceptacleConnector #VerticalConnector #SMT #ThroughHole #GCT #PowerConnector #DataConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics

Archer: 2 Pos Plug SIL Straight SMT Connector 3mm pin (T+R) Connector Header Surface Mount 2 position 0.050" (1.27mm) The M50-3630242R is a compact 2-position surface-mount male header connector from the Archer M50 series by Harwin. It is designed for high-reliability board-to-board interconnection applications where space saving, durability, and reliable signal transmission are important. The connector features a 1.27 mm pitch, gold-plated contacts, and SMT mounting, making it suitable for compact embedded, industrial, communication, medical, and automotive electronics. Key Features 2-position male header connector 1.27 mm (0.05") pitch compact design Surface-mount (SMT) mounting style Board-to-board connection configuration Gold-plated mating contacts for improved conductivity and corrosion resistance Tin-plated SMT terminations 1 A current rating per contact Operating temperature: -40°C to +105°C Unshrouded single-row vertical header Pick-and-place compatible for automated assembly Polyamide (Nylon 9T) UL94 V-0 housing Brass contact material Compatible with multiple mating stack heights in the Archer M50 series #CommonPartsLibrary #Connector

STM32H753ZI Nucleo-144 STM32H7 ARM® Cortex®-M7 MCU 32-Bit Embedded Evaluation Board #Module #Part