Part Information Review and Cross-Check

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The part already has an Amphenol datasheet URL set, so I’ll use that as the source of truth and continue with the cross-check.

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The datasheet OCR only exposed the product-structure page, so I’m doing a broader official/source search before finalizing the mismatch list.

flux

Completed the part audit. The existing Datasheet URL is already an official Amphenol drawing, so no property update was needed; the symbol has pins 1–100 and the footprint has 100 pads, with no hard pin-count mismatch found.
Open items:
  • Pin descriptions are missing for all contacts.
  • Pin Type is Unspecified for every terminal.
  • Exact footprint pad dimensions could not be fully machine-verified from the available structured output/OCR.
I created the detailed report here: Part Review: Amphenol 10164227-1004A1RLF. Suggested next steps: add standardized contact descriptions, change pin types to Passive if desired, and manually compare land pattern dimensions against the Amphenol drawing/application spec before release.
Add pin descriptions
Verify footprint dimensions
Update reference URLs
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10164227-1004A1RLF

10164227-1004A1RLF thumbnail
BergStak 0.40mm, 100 position, Receptacle, 4mm stack height
100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold
10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs.
This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies.
Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment
#AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

Properties

10164227-1004A1RLF

Amphenol

Connector

cdn.amphenol-cs.com/media/wysiwyg/files/drawing/10164227.pdf

J

parametric-v1

creativecommons.org/licenses/by/4.0/

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