N-Channel 30 V 5.7A (Ta) 1.4W (Ta) Surface Mount SOT-23-3 The AO3400A N-Channel MOSFET is a 30V N-channel enhancement-mode MOSFET designed using trench MOSFET technology. It is widely used for load switching, DC-DC converters, motor driving, and PWM control applications due to its very low on-resistance and compact SOT-23 package. It is especially popular in small electronics and embedded systems because it can be driven directly by 3.3V or 5V logic signals, making it ideal for microcontroller-based designs. Key Features Drain-Source Voltage (VDS): 30V Continuous Drain Current (ID): up to 5.7A (at 25°C) Ultra-low RDS(on): ~26.5 mΩ @ VGS = 10V ~32 mΩ @ VGS = 4.5V ~48 mΩ @ VGS = 2.5V Logic-level gate drive (works well with MCU GPIOs) Fast switching performance (ns-range switching times) Low gate charge (~6–7 nC) → efficient switching Compact SOT-23 package for space-saving PCB design Low power dissipation (~1.4W typical at 25°C ambient) Operating temperature: −55°C to +150°C Typical Applications Load switching (LEDs, sensors, small motors) Power management in battery-powered devices DC-DC converters PWM control circuits Fan and heater control in embedded systems #AO3400A #MOSFET #NChannelMOSFET #PowerElectronics #SOT23 #LoadSwitch #EmbeddedSystems #ElectronicsComponents #TrenchMOSFET #Commonpartslibrary #Transistor #FET

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A SOT-23-6 Thin, TSOT-23-6 The AP63200/AP63201/AP63203/AP63205 is a 2A, synchronous buck converter with a wide input voltage range of 3.8V to 32V and fully integrates a 125mΩ high-side power MOSFET and a 68mΩ low-side power MOSFET to provide high-efficiency step-down DC/DC conversion. The AP63200/AP63201/AP63203/AP63205 device is easily used by minimizing the external component count due to its adoption of peak current mode control along with its integrated compensation network. The AP63200/AP63201/AP63203/AP63205 has optimized designs for Electromagnetic Interference (EMI) reduction. The converter features Frequency Spread Spectrum (FSS) with a switching frequency jitter of ±6%, which reduces EMI by not allowing emitted energy to stay in any one frequency for a significant period of time. It also has a proprietary gate driver scheme to resist switching node ringing without sacrificing MOSFET turn-on and turn-off times, which further erases highfrequency radiated EMI noise caused by MOSFET switching. The device is available in a low-profile, TSOT26 package. • VIN 3.8V to 32V • 2A Continuous Output Current • 0.8V ±1% Reference Voltage • 22µA Ultralow Quiescent Current • Switching Frequency o 500kHz: AP63200 and AP63201 o 1.1MHz: AP63203 and AP63205 • Pulse Width Modulation (PWM) Regardless of Output Load o AP63201 • Supports Pulse Frequency Modulation (PFM) o AP63200, AP63203, and AP63205 o Up to 80% Efficiency at 1mA Light Load o Up to 88% Efficiency at 5mA Light Load • Fixed Output Voltage o 3.3V: AP63203 o 5.0V: AP63205 • Proprietary Gate Driver Design for Best EMI Reduction • Frequency Spread Spectrum (FSS) to Reduce EMI • Precision Enable Threshold to Adjust UVLO • Protection Circuitry o Overvoltage Protection o Cycle-by-Cycle Peak Current Limit o Thermal Shutdown • 12V and 24V distributed power bus supplies • Flat screen TV sets and monitors • Power tools and laser printers • White goods and small home appliances • FPGA, DSP, and ASIC supplies • Home audios • Network systems • Set top boxes • Gaming consoles • Consumer electronics #commonpartslibrary #integratedcircuit #AP63203WU7 #BuckConverter #DCDCConverter #PowerManagement #VoltageRegulator #SynchronousBuck #EmbeddedSystems #IndustrialElectronics #PowerSupply #DiodesInc #3V3Power #ElectronicsDesign

Slide Switch, SPDT, On-On, Through Hole, OS Series, 100mA # OS102011MS2QN1 ## General Description The OS102011MS2QN1 is a miniature slide switch manufactured by C&K, designed for low-power signal switching and control applications in electronic equipment. The switch features a compact mechanical design, reliable contact performance, and through-hole mounting configuration, making it suitable for embedded systems, industrial controls, instrumentation, telecommunications equipment, consumer electronics, and portable devices. Its robust construction ensures dependable operation throughout repeated switching cycles while maintaining stable electrical performance. The device is commonly utilized for mode selection, power control, configuration settings, and user-interface functions within electronic assemblies. ## Key Features ### Mechanical Characteristics * Miniature slide switch construction * Through-hole PCB mounting * Compact form factor * Durable actuator mechanism * Positive switching action * Designed for repeated mechanical operation ### Switching Characteristics * Maintained-contact operation * Reliable position retention * Low-force actuation * Stable contact engagement * Suitable for signal and control switching applications ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Stable switching performance * Suitable for low-current and low-voltage circuits * Consistent electrical operation throughout service life ### Contact System * High-reliability contact materials * Corrosion-resistant contact surfaces * Long operational durability * Dependable electrical continuity ### Material Construction * High-strength thermoplastic housing * Industrial-grade metallic contacts * Durable actuator assembly * RoHS-compliant materials ### Environmental Characteristics * Suitable for commercial and industrial electronic equipment * Resistant to mechanical wear * Reliable performance under normal operating environments * Designed for long-term service reliability ### Application Areas * Embedded Systems * Industrial Control Equipment * Consumer Electronics * Test and Measurement Instruments * Communication Devices * Medical Electronics * Power Control Circuits * User Interface Controls * Configuration and Mode Selection Functions * Electronic Development Platforms ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Switching Component ## Manufacturer C&K ## Product Family OS Series Miniature Slide Switches #OS102011MS2QN1 #CKSwitches #SlideSwitch #MiniatureSwitch #ElectronicSwitch #PCBSwitch #EmbeddedSystems #IndustrialElectronics #ControlSystems #ConsumerElectronics #HardwareDesign #ElectronicsEngineering #SignalSwitching #PCBAssembly #ElectronicComponents #commonpartslibrary #switch #slide #spdt

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

MAX-M10 RF Receiver BeiDou, Galileo, GLONASS, GPS, GNSS 1.561GHz, 1.575GHz, 1.602GHz -167dBm 921.6kbps Not Included Module The MAX-M10S-00B is a professional-grade, ultra-low-power GNSS positioning module from u-blox based on the u-blox M10 platform. It is designed for battery-powered applications such as asset trackers, wearables, IoT devices, and navigation systems. The module supports simultaneous reception of multiple GNSS constellations, providing high positioning availability, fast acquisition times, and excellent sensitivity even in challenging urban or weak-signal environments. It integrates a TCXO, LNA, and SAW filter to improve RF performance while maintaining very low power consumption. Key Features Multi-constellation GNSS receiver: GPS Galileo GLONASS BeiDou QZSS SBAS support (WAAS, EGNOS, MSAS, GAGAN) Concurrent tracking of up to four GNSS constellations for improved position availability and accuracy. Ultra-low power consumption: Approximately 25 mW in continuous tracking mode, making it ideal for battery-powered devices. High RF sensitivity: Tracking sensitivity up to −167 dBm for reliable operation in weak-signal conditions. High positioning accuracy: Typical position accuracy of approximately 1.5 m CEP under suitable conditions. Navigation update rate: Up to 10 Hz for responsive tracking applications. Integrated RF front-end: Built-in LNA (Low Noise Amplifier) Built-in SAW filter Integrated TCXO for stable operation. Supports Assisted GNSS services: AssistNow Online AssistNow Offline AssistNow Autonomous CloudLocate support for low-power IoT positioning. Communication interfaces: UART I²C NMEA and UBX protocols supported. Wide operating temperature range: −40°C to +85°C. Supply voltage: 1.76 V to 3.6 V. Typical Applications Asset tracking devices Wearable electronics Fleet management systems Industrial IoT Smart meters Drone and robotics navigation Personal navigation devices Timing and synchronization systems Package Information Package Type: Surface-mount LCC module Dimensions: 9.7 mm × 10.1 mm × 2.5 mm (typical module size) #Commonpartslibrary #RF #Wireless #RFreceivers #MAXM10S #uBlox #GNSS #GPS #Galileo #GLONASS #BeiDou #QZSS #NavigationModule #GNSSModule #GPSTracking #AssetTracking #IoT #IndustrialIoT #WearableTech #FleetManagement #DroneNavigation #EmbeddedSystems #ElectronicsDesign #PCBDesign #HardwareEngineering #LowPowerDesign #LocationTracking #Geolocation #RFDesign #LNA #SMTModule

Red, Green, Blue (RGB) 624nm Red, 525nm Green, 470nm Blue LED Indication - Discrete 2V Red, 3.3V Green, 3.3V Blue 4-SMD, No Lead # 150080M153000 ## General Description The 150080M153000 is a compact surface-mount full-color RGB LED manufactured by Würth Elektronik as part of the WL-SFCD series. The device integrates red, green, and blue light-emitting elements within a single package, enabling the generation of a wide spectrum of colors for status indication, user interfaces, backlighting, visual notifications, and decorative lighting applications. Its diffused lens design provides uniform light distribution and wide viewing visibility, making it suitable for industrial equipment, consumer electronics, communication devices, instrumentation systems, control panels, and embedded electronic products. The component is optimized for automated assembly processes and offers reliable optical performance, low power consumption, and long operational life. ## Key Features ### Optical Characteristics * Full-color RGB light output * Integrated red, green, and blue emitters * Diffused lens design for uniform illumination * Wide viewing angle * High-visibility indication capability * Consistent color performance ### Electrical Characteristics * Low-power operation * Stable optical output * Suitable for indicator and backlighting applications * Reliable performance across operating conditions * Optimized for embedded electronic systems ### Mechanical Characteristics * Surface-mount package construction * Compact footprint * Low-profile package design * Compatible with automated assembly processes * Reflow-soldering compatible ### Package Construction * Common-anode configuration * Integrated multi-die LED architecture * Rectangular lens geometry * Lead-free package design * Industrial-grade construction ### Material Characteristics * High-quality encapsulation materials * Diffused optical lens * RoHS-compliant construction * Environmentally compliant materials ### Environmental Characteristics * Suitable for commercial and industrial applications * Long operational service life * Reliable operation under standard environmental conditions * Resistant to normal assembly and handling processes ### Application Areas * Status Indicators * User Interface Displays * Industrial Control Panels * Consumer Electronics * Home Appliances * Telecommunications Equipment * Instrumentation Systems * Backlighting Applications * Smart Devices * Embedded Electronic Products * Safety and Security Equipment * Human-Machine Interface Systems ### Compliance * RoHS Compliant * REACH Compliant * Lead-Free Compatible * Industry-Standard Surface-Mount Technology ## Manufacturer Würth Elektronik ## Product Family WL-SFCD SMD Full-Color Chip LED Series #150080M153000 #WurthElektronik #RGBLED #SMDLED #WLSFCD #FullColorLED #LEDIndicator #Backlighting #Optoelectronics #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #PCBDesign #ElectronicsEngineering #SMTAssembly #commonpartslibrary #optoelectronic #ledindication

0.5 mOhms ±1% 5W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element # Engineering Specification ## Product Name CSS4J-4026R-L500F ## General Description CSS4J-4026R-L500F is a precision four-terminal Kelvin current sense shunt resistor designed for accurate current measurement in high-performance electronic and power management systems. The device is intended for use in applications requiring low resistance sensing, high measurement accuracy, and stable thermal performance under varying electrical loads. The component utilizes a metal element resistive structure optimized for minimal resistance drift, reduced temperature effects, and consistent long-term stability. Its four-terminal Kelvin configuration separates current flow and voltage sensing paths, enabling improved measurement accuracy by eliminating errors caused by PCB trace and connection resistance. The device is widely used in power conversion systems, battery monitoring systems, motor control circuits, and industrial power electronics where precise current feedback is essential for control, protection, and monitoring functions. Its surface-mount construction supports compact PCB layouts and automated assembly processes while maintaining robust mechanical and electrical reliability. The design emphasizes efficient heat dissipation, stable electrical characteristics, and compatibility with demanding industrial and automotive environments. It is suitable for integration into systems requiring continuous current monitoring and high measurement fidelity. ## Functional Requirements ### Current Measurement The device shall provide accurate current sensing through a low-resistance conductive path designed for minimal measurement error. ### Kelvin Sensing Operation The device shall support four-terminal Kelvin sensing to improve measurement accuracy by separating current and voltage sensing paths. ### Signal Stability The device shall maintain stable sensing characteristics under varying load and thermal conditions. ### System Integration The component shall support integration into power electronics and embedded control systems requiring precise current feedback. ## Electrical Requirements ### Low Resistance Operation The device shall exhibit very low resistance to minimize power loss and maintain measurement accuracy. ### Thermal Stability The resistor shall maintain consistent electrical behavior under elevated operating temperatures and thermal cycling conditions. ### Power Handling The device shall support operation in high-current environments typical of power conversion and motor control systems. ### Measurement Accuracy The design shall support precise voltage drop measurement proportional to current flow for control and monitoring applications. ## Mechanical Requirements ### Surface Mount Construction The device shall be provided in a surface mount package suitable for automated PCB assembly. ### Structural Integrity The component shall maintain mechanical stability during assembly, operation, and thermal cycling. ### PCB Integration The device shall support direct integration into multilayer printed circuit board designs with optimized current path layout. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under industrial and automotive environmental conditions. ### Thermal Performance The component shall maintain performance stability under continuous electrical loading and heat generation. ### Storage and Handling The device shall maintain physical and electrical integrity during storage, transport, and handling procedures. ## Quality Requirements ### Reliability The device shall provide long-term stability in resistance value and sensing accuracy under continuous operation. ### Verification Electrical, thermal, and mechanical characteristics shall be validated through appropriate testing and qualification procedures. ### Compliance The product shall conform to applicable standards for current sensing resistors used in industrial and automotive electronics. ## Documentation Requirements Technical documentation shall include application guidelines, layout recommendations for Kelvin sensing, thermal considerations, electrical characteristics, and integration practices for power electronics systems. ## Classification Tags #CSS4J4026RL500F #CurrentSenseResistor #ShuntResistor #KelvinSensing #FourTerminalResistor #PowerElectronics #BatteryManagement #MotorControl #PowerSupplyDesign #AnalogSensing #ElectricalEngineering #PCBDesign #EmbeddedSystems #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #HighCurrentSensing #PrecisionMeasurement #CircuitDesign

1/1 Transceiver Half RS422, RS485 8-SOIC These devices have robust 3.3-V drivers and receivers in a small package for demanding industrial applications. The bus pins are robust to ESD events with high levels of protection to Human-Body Model and IEC Contact Discharge specifications. Each of these devices combines a differential driver and a differential receiver which operate from a single 3.3-V power supply. The driver differential outputs and the receiver differential inputs are connected internally to form a bus port suitable for half-duplex (two-wire bus) communication. These devices feature a wide common-mode voltage range making the devices suitable for multi-point applications over long cable runs. These devices are characterized from –40°C to 125°C 1• Small-size VSSOP Packages Save Board Space, or SOIC for Drop-in Compatibility • Bus I/O Protection – >±15 kV HBM Protection – >±12 kV IEC 61000-4-2 Contact Discharge – >±4 kV IEC 61000-4-4 Fast Transient Burst • Extended Industrial Temperature Range –40°C to 125°C • Large Receiver Hysteresis (80 mV) for Noise Rejection • Low Unit-Loading Allows Over 200 Connected Nodes • Low Power Consumption – Low Standby Supply Current: < 2 µA – ICC < 1 mA Quiescent During Operation • 5-V Tolerant Logic Inputs Compatible With 3.3-V or 5-V Controllers • Signaling Rate Options Optimized for: 250 kbps, 20 Mbps, 50 Mbps • Glitch Free Power-Up and Power-Down Bus Inputs and Outputs 2 Applications • Factory Automation • Telecommunications Infrastructure • Motion Control #SN65HVD75D #RS485 #RS422 #Transceiver #TexasInstruments #IndustrialCommunication #FactoryAutomation #MotionControl #TelecomInfrastructure #ESDProtection #HalfDuplex #InterfaceIC #EmbeddedSystems #IndustrialElectronics #DataCommunication

24 MHz ±20ppm Crystal 18pF 60 Ohms 4-SMD, No Lead The ABM8G-24.000MHZ-18-D2Y-T is a compact 24.000 MHz surface-mount quartz crystal from Abracon's ABM8G series, designed to provide a stable and accurate clock reference for digital electronic systems. Housed in a miniature 3.2 × 2.5 mm, 4-pad SMD package, it is optimized for space-constrained applications while delivering reliable frequency performance over a wide operating temperature range. This crystal is commonly used in microcontrollers, wireless modules, communication equipment, networking devices, industrial electronics, and precision timing circuits. It operates in the fundamental mode with an 18 pF load capacitance, making it suitable for a broad range of oscillator circuits. Key Features 24.000 MHz fundamental-mode quartz crystal Compact 3.2 × 2.5 × 1.0 mm 4-pad SMD package 18 pF load capacitance ±20 ppm frequency tolerance ±30 ppm frequency stability Maximum 60 Ω ESR Wide operating temperature range: −40°C to +85°C Glass-sealed ceramic package for high reliability Compatible with standard IR reflow soldering processes Low-profile design suitable for compact PCB layouts Ideal for embedded systems, communications, wireless devices, and clock generation applications. #Abracon #QuartzCrystal #24MHz #ABM8G #SMDCrystal #TimingDevice #ClockSource #EmbeddedSystems #WirelessElectronics #IndustrialElectronics #PCBDesign #ElectronicsComponents

67 Position Female Connector M.2 (NGFF) Mini Card Gold 0.020" (0.50mm) Black # Engineering Specification ## Product Name 2199230-4 ## General Description 2199230-4 is a surface mount board-edge connector designed to support standardized M.2 module interfaces, specifically configured for Key E applications used in wireless communication, embedded computing, and high-speed peripheral expansion systems. The component provides a reliable mechanical and electrical interface between a host printed circuit board and a removable or fixed M.2 module. The connector is engineered to accept gold-finger edge contacts from an M.2 module, enabling secure signal transmission for high-speed data communication, power delivery, and control signaling. Its design supports stable mechanical retention, precise alignment, and consistent electrical contact performance under repeated mating cycles. This component is widely used in industrial computing platforms, telecommunications equipment, IoT devices, and embedded system architectures where modular expansion and standardized connectivity are required. It enables flexible system design by allowing interchangeable M.2 modules for wireless communication, storage, and specialized processing functions. The design emphasizes signal integrity, mechanical durability, and compatibility with high-density PCB layouts. It is suitable for applications requiring robust high-frequency performance and reliable long-term mechanical stability. ## Functional Requirements ### Module Interface The connector shall provide a standardized interface for M.2 Key E module insertion and electrical connection. ### Signal Transmission The connector shall support high-speed electrical signal routing between host systems and M.2 modules. ### Mechanical Retention The connector shall securely retain inserted modules under vibration and operational stress conditions. ### System Modularity The connector shall enable modular expansion and replacement of functional M.2 devices within host systems. ## Electrical Requirements ### Contact Performance The connector shall provide stable electrical contact between gold-finger module pads and host PCB terminals. ### Signal Integrity The design shall support high-frequency signal transmission with minimal loss and interference. ### Power Delivery The connector shall support regulated power distribution to installed M.2 modules. ### Low Resistance Path The electrical interface shall maintain low contact resistance for reliable long-term operation. ## Mechanical Requirements ### Board Edge Mounting The connector shall be mounted on a printed circuit board to accept edge-insertion M.2 modules. ### Alignment and Fit The design shall ensure precise alignment between module contacts and connector terminals. ### Durability The connector shall withstand repeated module insertion and removal cycles without performance degradation. ### Structural Stability The assembly shall maintain mechanical integrity under vibration and operational stress conditions. ## Environmental Requirements ### Operating Conditions The connector shall operate reliably in industrial, commercial, and embedded system environments. ### Thermal Performance The device shall maintain mechanical and electrical stability under elevated operating temperatures. ### Storage and Handling The component shall retain structural and functional integrity during storage, transportation, and assembly processes. ## Quality Requirements ### Reliability The connector shall provide consistent electrical and mechanical performance throughout its operational lifetime. ### Verification Mechanical retention, contact resistance, and signal integrity shall be validated through appropriate qualification testing. ### Compliance The product shall conform to applicable standards governing M.2 interface connectors and high-speed board-edge interconnect systems. ## Documentation Requirements Technical documentation shall include footprint layout guidance, mating interface specifications, signal routing recommendations, mechanical keep-out regions, and application guidelines for M.2 system integration. ## Classification Tags #21992304 #M2Connector #M2KeyE #EdgeCardConnector #GoldFingerInterface #HighSpeedConnector #BoardEdgeConnector #WirelessModuleConnector #PCIeInterface #NGFF #EmbeddedSystems #IoTHardware #TelecomHardware #PCBDesign #MechanicalConnector #SignalIntegrity #HighFrequencyDesign #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #SystemIntegration #HardwareDesign #TEConnectivity #ModuleInterface #BoardToModule

Bipolar Motor Driver NMOS On/Off, PWM 44-HTSSOP The DRV8262QDDWRQ1 is an automotive-qualified, high-power H-bridge motor driver from Texas Instruments designed for 24 V and 48 V automotive systems. It integrates two H-bridges capable of driving one or two brushed DC motors, a bipolar stepper motor, or thermoelectric coolers (TECs). The device features integrated high-side current sensing, programmable current regulation, and comprehensive protection functions, eliminating the need for external current-sense resistors while reducing PCB area and system cost. It supports wide supply voltages from 4.5 V to 60 V, making it suitable for demanding automotive body electronics and industrial motor control applications. Key Features Automotive AEC-Q100 Grade 1 qualified (-40°C to +125°C) Wide 4.5 V to 60 V operating supply voltage Dual H-bridge or single high-current H-bridge operation Drives: One or two brushed DC motors One bipolar stepper motor One or two thermoelectric coolers (TECs) Up to 8 A peak (dual H-bridge mode) Up to 16 A peak (single H-bridge mode) Low MOSFET on-resistance: 100 mΩ (dual H-bridge) 50 mΩ (single H-bridge) Integrated high-side current sensing with ±4% accuracy Programmable current regulation and current limiting Supports 1.8 V, 3.3 V, and 5 V logic interfaces Configurable PWM control modes (PH/EN or IN/IN) Ultra-low 3 µA sleep current Integrated protection features: Undervoltage Lockout (UVLO) Charge Pump Undervoltage (CPUV) Overcurrent Protection (OCP) Thermal Shutdown (OTSD) Fault output (nFAULT) Functional safety-capable with supporting documentation for automotive system design. #DRV8262QDDWRQ1 #MotorDriver #HBridge #AutomotiveElectronics #BrushedDCMotor #StepperMotor #CurrentSense #AECQ100 #TexasInstruments #EmbeddedSystems #PowerManagement #PCBDesign

Power Switch/Driver 1:1 N-Channel 1.35A 28-WQFN (4x5) The TPS274160 device is a smart high-side switch with four integrated 160-mΩ NMOS power FETs and a chargepump to drive the gates. The device offers robust protection and diagnostic features to drive various loads (inductive, capacitive, and resistive) such as low wattage bulbs, LEDs, relays, solenoids, heaters, and sub-modules. The part enables flexible, multi-channel output configurations through paralleling channels and is in a very small WQFN package to enable usage in space constrained applications. The device is protected against short circuit events and over-temperature events, safely shutting off the output during fault events. The device also implements an external adjustable current limiting feature. This feature improves the reliability of the system by reducing inrush current when driving large capacitive loads and minimizing overload current thereby eliminating system supply brown out condition. The device also integrates diagnostic features like output current monitoring (version B) and open load detection to enable improved intelligence in modules and to enable predictive maintenance functionality. • Quad-channel 160-mΩ smart high-side switch • Wide DC operating voltage range: 5 V to 36 V – 50-V absolute maximum voltage • Accurate adjustable current limiting (250 mA to 4 A) • Intelligent diagnostic features – TPS274160A: Open-drain fault output – TPS274160B: Analog current sense – Open-load or short to supply detection in the off-state • Robust protection features – Short-circuit protection – Inductive load flyback clamp – Undervoltage lockout (UVLO) protection – Loss of GND protection • Excellent ESD protection on VS and OUT pins – ±8/±15 kV IEC 61000-4-2 ESD contact/air discharge • Available in small and 28-pin leadless QFN packages • Functional Safety-Capable – Documentation available to aid functional safety system design 2 Applications • Digital output modules • Standalone remote I/O • Motor drives • Solenoid or valve drive #TexasInstruments #TPS274160BRLHR #HighSideSwitch #SmartSwitch #IndustrialAutomation #PowerManagement #LoadDriver #CurrentLimiting #ProtectionIC #IndustrialControl #RemoteIO #SolenoidDriver #MotorDrive #EmbeddedSystems #ElectronicsDesign

ARM® Cortex®-M4F STM32G4 Microcontroller IC 32-Bit 170MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) The STM32G491RET6 from STMicroelectronics is a high-performance 32-bit microcontroller based on the Arm® Cortex®-M4 core with Floating Point Unit (FPU), designed for advanced embedded applications requiring high computational performance, precise analog processing, and real-time control. It belongs to the STM32G4 series and integrates enhanced analog peripherals, motor-control timers, communication interfaces, security features, and hardware accelerators such as CORDIC and FMAC. The device operates at up to 170 MHz, provides 512 KB Flash memory, and includes 96 KB SRAM, making it suitable for applications such as motor control, digital power conversion, industrial automation, robotics, and embedded control systems. Key Features Core: Arm® Cortex®-M4 32-bit CPU with FPU, DSP instructions, and MPU Maximum CPU Frequency: Up to 170 MHz (up to 213 DMIPS) Memory: 512 KB Flash memory with ECC support 96 KB SRAM with parity checking features Quad-SPI memory interface Operating Voltage: 1.71 V to 3.6 V Package: LQFP-64 Advanced Analog Features: 3 × 12-bit ADCs with high-speed conversion 4 × 12-bit DAC channels 4 × Rail-to-Rail operational amplifiers 4 × Fast analog comparators Internal voltage reference buffer Hardware Accelerators: CORDIC accelerator for trigonometric calculations FMAC (Filter Math Accelerator) for digital filtering applications Timers & Motor Control: Advanced PWM timers for motor-control applications Multiple 16-bit and 32-bit timers Support for encoder and PWM control Communication Interfaces: 2 × FDCAN interfaces 5 × USART/UART 3 × SPI interfaces 3 × I²C interfaces USB 2.0 Full-Speed interface SAI audio interface Security Features: True Random Number Generator (TRNG) CRC calculation unit Unique device ID Debug & Programming: SWD and JTAG debugging support Typical Applications Motor control and BLDC controllers Digital power converters Industrial automation equipment Robotics and motion control Smart sensors and embedded control systems Power management applications #STM32G491RET6 #STM32G4 #STMicroelectronics #ARM_CortexM4 #Microcontroller #MCU #EmbeddedSystems #MotorControl #DigitalPower #IndustrialAutomation #Robotics #IoT #ElectronicsDesign #PCBDesign

N-Channel Power MOSFET – 40 V logic-level N-channel OptiMOS™ 6 power MOSFET optimized for high-efficiency synchronous buck converters, motor drives, battery-powered systems, and industrial power switching. Features a 40 V drain-to-source voltage (VDS), 100 A continuous drain current (TC = 25°C), 1.0 mΩ maximum RDS(on) at VGS = 10 V, and 1.4 mΩ maximum RDS(on) at VGS = 4.5 V. Includes logic-level gate drive, 67 nC typical gate charge, ±20 V gate-source voltage rating, 175°C maximum junction temperature, and 100% avalanche tested for enhanced ruggedness. Housed in an 8-pin PG-TDSON-8 (SuperSO8 5 × 6 mm) surface-mount package. #Infineon #BSC010N04LS6ATMA1 #BSC010N04LS6 #OptiMOS6 #PowerMOSFET #NChannelMOSFET #40V #LogicLevelMOSFET #LowRDSOn #SynchronousBuck #MotorDrive #PowerManagement #EmbeddedSystems

Accelerometer, Gyroscope, Magnetometer, 9 Axis Sensor I2C, SPI, UART Output The BNO085 is a high-performance 9-axis absolute orientation sensor system-in-package (SiP) that integrates a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a low-power ARM Cortex-M0+ microcontroller running CEVA/Hillcrest SH-2 sensor fusion firmware. It provides accurate real-time orientation, motion tracking, and activity detection while offloading complex sensor fusion calculations from the host processor. The device is widely used in robotics, AR/VR systems, wearables, drones, IoT devices, and navigation applications. Key Features 9-axis motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in SH-2 sensor fusion engine for accurate orientation tracking ARM Cortex-M0+ processor for onboard motion processing Outputs quaternion, rotation vector, linear acceleration, gravity vector, angular velocity, and magnetic field data Advanced motion detection including tap, step, shake, and significant motion detection Activity classification and stability detection capabilities Low-latency rotation vectors optimized for AR/VR applications Supports I²C, SPI, and UART communication interfaces Configurable output data rates and timestamps Low-power operation suitable for battery-powered devices Compact 28-pin LGA package (5.2 mm × 3.8 mm) Operating temperature range: -40°C to +85°C Backward compatible with BNO080 designs while adding support for future application-specific libraries Applications Robotics and autonomous systems Virtual Reality (VR) and Augmented Reality (AR) Wearable devices and fitness trackers Drones and UAVs Head-mounted displays (HMDs) Industrial motion tracking IoT and smart devices Navigation and positioning systems #BNO085 #IMU #9AxisSensor #MotionTracking #SensorFusion #OrientationSensor #Robotics #AR #VR #IoT #Wearables #EmbeddedSystems #CEVA #HillcrestLabs #MotionDetection #Quaternion #InertialMeasurementUnit

9 Position D-Sub Receptacle, Female Sockets Connector 2311765-1 is a 9-position right-angle D-Sub receptacle connector from the TE Connectivity AMPLIMITE HD-20 series. It is designed for wire-to-board signal applications and features through-hole PCB mounting with an integrated boardlock and 4-40 screwlock for secure mechanical retention. The connector is commonly used in industrial equipment, communication systems, embedded controllers, and other electronic devices requiring a reliable D-Sub interface. Key Features 9-position D-Sub receptacle (female) Right-angle through-hole PCB mounting AMPLIMITE HD-20 series 2-row configuration 2.77 mm (0.109") contact pitch Boardlock for improved PCB retention 4-40 screwlock for secure mating Maximum contact current: 3 A per contact Glass-filled PBT housing Operating temperature: -55°C to +85°C Ideal for signal transmission in industrial and embedded applications. #CommonPartsLibrary #Connector #TEConnectivity #AMPLIMITE #DSub #RightAngleConnector #PCBConnector #ThroughHole #WireToBoard #SignalConnector #ElectronicComponents #EmbeddedSystems

Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm

Buck Regulator Positive Output Step-Down DC-DC Controller IC 24-VQFN (3.5x5.5) The LM5148RGYR specification defines the engineering requirements for a synchronous buck controller integrated circuit designed for high-efficiency DC-DC power conversion applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure reliable voltage regulation, efficient power management, and long-term operational stability in industrial, automotive, telecommunications, and embedded electronic systems. The device is intended for use in high-performance power supply designs requiring wide input voltage capability, precise output voltage regulation, and high-current conversion efficiency. It controls external power MOSFETs to implement synchronous buck converter topologies suitable for distributed power architectures, industrial automation equipment, networking infrastructure, battery-powered systems, and embedded control applications. Engineering Requirements The controller shall be manufactured using qualified semiconductor fabrication processes and high-quality materials to ensure stable switching performance, low power consumption, and reliable long-term operation. The device shall maintain consistent functionality under specified operating voltage, temperature, and environmental conditions. Electrical characteristics shall provide accurate pulse-width modulation control, stable output voltage regulation, fast transient response, and reliable gate drive capability for external synchronous power MOSFETs. The controller shall maintain predictable switching performance during startup, shutdown, overload, and dynamic load conditions while supporting efficient power conversion. The integrated control architecture shall provide robust regulation, protection features, and compensation capability to ensure stable converter operation across varying input voltages and output load conditions. The device shall maintain operational integrity during power sequencing and fault recovery without compromising system reliability. Thermal performance shall support continuous operation within the specified junction temperature range while maintaining electrical performance and reliability. The package shall be suitable for automated surface-mount assembly and compatible with standard solder reflow manufacturing processes. Mechanical construction shall withstand thermal cycling, vibration, mechanical handling, and environmental exposure without degradation of functionality. Workmanship shall be free from defects including contamination, package cracking, bond failures, lead deformation, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, application guidelines, thermal characterization reports, qualification records, inspection reports, material declarations, reliability data, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #BuckController #DCDCConverter #PowerManagement #SynchronousBuck #PowerElectronics #EmbeddedSystems #IndustrialElectronics #QualityAssurance #EngineeringDocumentation

Mini 2.45 GHz Antenna The 2450AT18A100E is a high-frequency ceramic SMT antenna featuring a small 3.2 mm × 1.6 mm × 1.3 mm package, optimized for space-constrained RF designs. It operates from 2400 MHz to 2500 MHz with a 50 Ω impedance and provides a compact alternative to traditional PCB trace antennas while maintaining reliable RF performance. Key Features Operating Frequency: 2400 MHz – 2500 MHz (2.4 GHz ISM Band) Center Frequency: 2450 MHz Antenna Type: Mini Ceramic Chip Antenna / SMT RF Antenna Package Size: 3.2 mm × 1.6 mm × 1.3 mm Impedance: 50 Ω Peak Gain: Approximately +0.5 dBi (typical) Average Radiation Efficiency: Approximately 76% (based on Johanson evaluation board) Maximum Input Power: 2 W continuous wave (CW) Operating Temperature Range: -40 °C to +125 °C Mounting Type: Surface Mount Technology (SMT) Applications: Bluetooth / BLE devices Wi-Fi 2.4 GHz modules Zigbee / IEEE 802.15.4 systems IoT sensors and embedded wireless products #2450AT18A100E #JohansonTechnology #ChipAntenna #SMTAntenna #RFDesign #2GHzAntenna #Bluetooth #WiFi #Zigbee #IoT #WirelessCommunication #EmbeddedSystems #PCBDesign #RFAntenna #Antena #Chip #SurfaceMount