FLASH - NAND Memory IC 4Gbit Parallel 48-TSOP I #commonpartslibrary #memoryic #flash

SLC NAND Flash Parallel/Serial 3.3V 256G-bit 32G x 8 100-Pin LBGA FLASH - NAND (SLC) Memory IC 256Gbit Parallel 100 MHz 100-LBGA (12x18) The MT29F256G08AUCABH3-10ITZ:A is a high-density 256Gb Single-Level Cell (SLC) NAND Flash memory device from Micron Technology. It provides non-volatile data storage with high reliability, fast read/write performance, and long endurance, making it suitable for industrial, networking, embedded computing, automotive, and data-logging applications. The device supports both asynchronous and synchronous interfaces and complies with the Open NAND Flash Interface (ONFI) standard for enhanced interoperability and performance. It is housed in a compact 100-ball LBGA package (12 mm × 18 mm). • Open NAND Flash Interface (ONFI) 2.2-compliant1 • Single-level cell (SLC) technology • Organization – Page size x8: 8640 bytes (8192 + 448 bytes) – Block size: 128 pages (1024K + 56K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 32Gb: 4096 blocks; 64Gb: 8192 blocks; 128Gb: 16,384 blocks; 256Gb: 32,768 blocks • Synchronous I/O performance – Up to synchronous timing mode 5 – Clock rate: 10ns (DDR) – Read/write throughput per pin: 200 MT/s • Asynchronous I/O performance – Up to asynchronous timing mode 5 – tRC/tWC: 20ns (MIN) – Read/write throughput per pin: 50 MT/s • Array performance – Read page: 35µs (MAX) – Program page: 350µs (TYP) – Erase block: 1.5ms (TYP) • Operating Voltage Range – VCC: 2.7–3.6V – VCCQ: 1.7–1.95V, 2.7–3.6V • Command set: ONFI NAND Flash Protocol • Advanced Command Set – Program cache – Read cache sequential – Read cache random – One-time programmable (OTP) mode – Multi-plane commands – Multi-LUN operations – Read unique ID – Copyback • First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see Error Management (page 114). • RESET (FFh) required as first command after power-on • Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status • Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous interface • Copyback operations supported within the plane from which data is read • Quality and reliability – Data retention: JESD47G compliant; see qualification report – Endurance: 60,000 PROGRAM/ERASE cycles • Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40ºC to +85ºC • Package – 52-pad LGA – 48-pin TSOP – 100-ball BGA – 132-ball BGA #Micron #NANDFlash #SLCNAND #FlashMemory #NonVolatileMemory #ONFI #EmbeddedSystems #IndustrialElectronics #DataStorage #MemoryIC #LBGA100 #HighReliability #MT29F256G08AUCABH310ITZA #MicronMemory #ParallelNANDFlash

SDRAM - Mobile LPDDR4X Memory IC 8Gbit Parallel 2.133 GHz 200-FBGA (10x15) The IM8G32L4JCBG-046I is an 8Gb (1GB) LPDDR4X SDRAM memory device designed for high-performance, low-power embedded applications. Organized as 256M × 32 bits, it delivers data rates up to 4266 MT/s, making it suitable for industrial computing, AI edge devices, networking equipment, automotive systems, and other memory-intensive applications. The LPDDR4X architecture reduces power consumption while maintaining high bandwidth and reliable operation across industrial temperature ranges. Key Features 8Gb (Gigabit) LPDDR4X SDRAM Memory organization: 256M × 32 bits High-speed operation up to 4266 MT/s Low-power LPDDR4X interface for reduced energy consumption 32-bit data bus width Industrial operating temperature range: –40°C to +95°C 200-ball FBGA package (10 mm × 15 mm) High bandwidth for demanding embedded applications Optimized for low-power and thermally constrained designs Suitable for industrial, automotive, networking, and edge AI systems #LPDDR4X #SDRAM #MemoryIC #EmbeddedSystems #IndustrialElectronics #EdgeComputing #AIoT #HighSpeedMemory #LowPowerDesign #AutomotiveElectronics #NetworkingHardware #FBGA #HardwareDesign #ElectronicsEngineering #PCBDesign #IntelligentMemory

The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, built around the ESP32-S3 SoC. It integrates a dual-core Xtensa® LX7 processor running at up to 240 MHz, along with 16 MB Quad SPI Flash and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive embedded, IoT, AIoT, multimedia, and edge AI applications. The module includes an onboard PCB antenna, RF matching circuitry, crystal oscillator, and flash/PSRAM, simplifying hardware design and reducing development time. Key Features Dual-core Xtensa LX7 CPU operating up to 240 MHz 16 MB onboard Flash memory 8 MB onboard Octal PSRAM for large buffers, graphics, and AI workloads 2.4 GHz Wi-Fi (IEEE 802.11 b/g/n) Bluetooth 5.0 Low Energy (BLE) Built-in support for AI acceleration and vector instructions for machine learning and signal processing applications Rich peripheral set including: GPIO UART SPI I²C I²S USB 2.0 OTG PWM ADC Touch sensing SD/MMC interface CAN (TWAI) Integrated USB Serial/JTAG debugging capability Supply voltage range: 3.0 V to 3.6 V Operating temperature: −40°C to +65°C Surface-mount module with integrated PCB antenna Supports secure boot, flash encryption, and hardware cryptographic acceleration for secure IoT devices. Typical Applications Smart home and IoT devices Edge AI and machine learning Voice assistants and speech recognition Industrial automation Human-machine interfaces (HMI) Wireless sensors and gateways Smart displays and touch panels Audio streaming and multimedia devices Robotics and connected products #RF-Transceiver #Module #ESP32

The ESP32-S3-PICO-1-N8R8 is a highly integrated System-in-Package (SiP) module from Espressif based on the ESP32-S3 SoC. It is designed for compact, low-power IoT applications requiring strong wireless performance, rich peripherals, and minimal external components. This variant (N8R8) integrates 8 MB of SPI flash and 8 MB of PSRAM, making it suitable for memory-intensive applications such as AIoT, voice processing, and graphical user interfaces. The module integrates RF circuitry, crystal oscillator, power management, and memory into a single package, significantly reducing PCB size and BOM cost while improving reliability. ⚡ Key Features Processor & Performance Dual-core Xtensa LX7 microprocessor Up to 240 MHz clock speed Hardware acceleration for AI/ML and vector operations Memory 8 MB SPI Flash 8 MB PSRAM Internal SRAM for fast access tasks Wireless Connectivity 2.4 GHz Wi-Fi 802.11 b/g/n Bluetooth 5 (LE) support Integrated RF front-end Peripherals GPIO, SPI, I2C, UART, ADC, PWM USB 1.1 OTG support RMT, I2S, SD/MMC interface Touch sensor support Power & Efficiency Low-power sleep modes for battery-powered devices Integrated power management circuitry (SiP-level integration) Wide operating voltage: 3.0V – 3.6V Integration Advantages Built-in crystal oscillator Integrated RF matching components Reduced external component count (SiP design) Compact footprint for space-constrained designs 📌 Typical Applications Smart home devices IoT sensors and controllers Voice-enabled AI devices Wearables HMI (Human Machine Interface) Industrial monitoring systems

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

WiFi 802.11a/b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace The ESP32-S3-WROOM-1-N8R2 is a compact, low-power Wi-Fi and Bluetooth® Low Energy (BLE) module developed by Espressif Systems. It is based on the ESP32-S3 system-on-chip (SoC), which integrates a dual-core Xtensa® LX7 processor optimized for high performance and edge AI processing. This module includes 8 MB of external SPI flash memory and 2 MB of PSRAM, enabling efficient handling of memory-intensive applications such as graphical interfaces, buffering, and embedded machine learning workloads. Designed for flexibility and scalability, the module integrates RF components, power management, and a wide range of peripherals into a surface-mount package suitable for IoT, industrial, and consumer electronics applications. Key Features Dual-core Xtensa® LX7 processor operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 Low Energy support Embedded 8 MB SPI flash memory Integrated 2 MB PSRAM AI acceleration through vector instruction support USB OTG (full-speed) capability Multiple low-power operating modes Built-in hardware security features Extensive peripheral interface support Functional Overview The module consists of several integrated subsystems, including a dual-core processing unit, memory subsystem (flash and PSRAM), RF subsystem for wireless communication, peripheral interface controllers, power management circuitry, and a hardware-based security engine. Electrical Characteristics Operating voltage range: 3.0 V to 3.6 V (typical 3.3 V) Operating temperature range: -40°C to +85°C RF operating frequency: 2.4 GHz Current consumption varies depending on operating mode, ranging from microamp levels in deep sleep to hundreds of milliamps during active transmission Processor and Memory The module features a dual-core Xtensa® LX7 CPU capable of running at frequencies up to 240 MHz. It includes approximately 512 KB of internal SRAM, supplemented by 8 MB of external flash memory and 2 MB of PSRAM for extended data storage and processing. Wireless Connectivity The ESP32-S3-WROOM-1-N8R2 supports Wi-Fi communication compliant with 802.11 b/g/n standards in the 2.4 GHz band. It also supports Bluetooth 5 Low Energy for short-range wireless communication. The module includes an integrated PCB antenna and supports RF output power up to approximately +20 dBm. Peripheral Interfaces The module provides a wide range of interfaces, including general-purpose input/output (GPIO) pins, SPI, I2C, UART, and I2S for audio applications. It also supports PWM for LED control, a 12-bit analog-to-digital converter (ADC), and USB OTG functionality. Pin functions are multiplexed to maximize flexibility. Power Management Power efficiency is achieved through multiple operating modes, including active mode, modem sleep, light sleep, and deep sleep. The module includes an RTC subsystem for low-power timekeeping and supports dynamic frequency scaling to optimize performance and energy consumption. Security Features The module incorporates several hardware-based security mechanisms, including secure boot, flash encryption, and digital signature verification. It also includes a hardware random number generator and cryptographic accelerators supporting AES, SHA, RSA, and ECC algorithms. Mechanical Characteristics The module is designed for surface-mount integration and measures approximately 18 mm by 25.5 mm. It includes an onboard PCB antenna and is suitable for compact embedded designs. Pin Configuration Overview GPIO pins are multiplexed to support various peripheral functions such as analog inputs, communication interfaces, and control signals. Dedicated pins are provided for power supply, module enable, and boot configuration. Typical Applications Internet of Things (IoT) devices Smart home systems Industrial automation and monitoring Edge AI and machine learning applications Wearable electronics Audio and multimedia systems USB-enabled embedded devices Compliance The module is designed to meet Wi-Fi and Bluetooth standards and is compliant with RoHS requirements. Certification such as FCC or CE may apply depending on the specific module variant and deployment. Ordering Information The ESP32-S3-WROOM-1-N8R2 variant includes 8 MB of flash memory and 2 MB of PSRAM. #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N8R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, designed for advanced IoT, edge AI, smart devices, industrial automation, and embedded applications. It is based on the ESP32-S3 SoC featuring a dual-core Xtensa® LX7 processor running up to 240 MHz, integrated wireless connectivity, and enhanced AI acceleration capabilities. The N8R8 variant includes 8 MB Flash memory and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive applications such as machine learning, image processing, graphical user interfaces, and data logging. Key Features Dual-core 32-bit Xtensa LX7 CPU operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 LE (Low Energy) support 8 MB Flash memory 8 MB Octal SPI PSRAM Vector instructions and hardware acceleration for AI/ML workloads Integrated PCB trace antenna USB OTG and USB Serial/JTAG support Rich peripheral set including: GPIO ADC UART SPI I²C I²S PWM USB Operating voltage: 3.0 V to 3.6 V Wireless data rates up to 150 Mbps RF output power up to 20.5 dBm High receiver sensitivity down to –104.5 dBm Surface-mount 41-pin module package Industrial operating temperature range up to -40°C to +85°C (module-dependent specification) #Module #RF-Transceiver #Esp32

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-2-N32R16V is a powerful dual-core microcontroller module that integrates wireless connectivity, large memory, and hardware acceleration for AI and signal processing tasks. It is particularly suited for applications requiring edge AI, voice recognition, and high-speed data processing, while still maintaining low power consumption. Dual-core Xtensa LX7 CPU Up to 240 MHz Includes vector instructions for AI and DSP workloads Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE) N32 → 32 MB external Flash R16 → 16 MB PSRAM Built for memory-intensive applications #commonpartslibrary #transceiver #wireless #rf

The ESP32-WROOM-32E (16MB) is a highly integrated Wi-Fi + Bluetooth + Bluetooth Low Energy (BLE) module developed by Espressif. It is based on the ESP32-D0WD-V3 chip and features a dual-core processor, rich peripherals, and large flash memory—making it ideal for IoT, embedded systems, and wireless applications. This module is part of the upgraded WROOM-32E series, offering improved RF performance, better stability, and enhanced reliability compared to earlier versions like the 32D. Key Features (16MB Variant) Processor & Memory Dual-core Xtensa® 32-bit LX6 CPU, up to 240 MHz 520 KB SRAM + 448 KB ROM 16 MB SPI Flash (large storage for firmware/data) Optional variants with PSRAM for memory-intensive tasks Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth v4.2 (BR/EDR + BLE) Integrated PCB antenna (no external antenna needed) Peripherals & Interfaces Up to 26–38 GPIOs (depending on usage) Supports: UART, SPI, I2C, I2S PWM (LED & motor control) ADC, DAC Capacitive touch sensors SD/SDIO/MMC, CAN (TWAI) Electrical & Physical Operating voltage: 3.0V – 3.6V Operating temperature: –40°C to +85°C (industrial range) Compact size: 18 × 25.5 × 3.1 mm Typical Applications Smart home devices (lighting, appliances) IoT sensors and gateways Industrial automation systems Wearables and smart gadgets Audio/voice processing (thanks to dual-core + large flash) #module #ESP32 #16MB

The ESP32-DevKitC is an official ESP32-based development board from Espressif Systems designed for rapid prototyping and IoT application development. It integrates an ESP32 module (such as ESP32-WROOM-32E or ESP32-WROVER variants), USB-to-UART programming interface, power regulation circuitry, reset and boot buttons, and access to most ESP32 GPIOs through dual-row headers. The board is breadboard-friendly and supports wireless connectivity, making it suitable for smart devices, industrial monitoring, home automation, wearable electronics, and embedded control systems. Key Features ESP32 Dual-Core Processor Xtensa® 32-bit LX6 dual-core MCU Up to 240 MHz clock frequency High-performance embedded processing capability. Wireless Connectivity Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth Classic (BR/EDR) and Bluetooth Low Energy (BLE) support. Memory Typically includes 4 MB SPI Flash Some variants provide additional PSRAM for memory-intensive applications. Rich Peripheral Interfaces UART, SPI, I²C, I²S, SDIO ADC and DAC PWM outputs Capacitive touch sensing Pulse counter and timer peripherals. Extensive GPIO Access Most ESP32 pins are broken out to headers Supports digital I/O, interrupts, analog inputs, and communication interfaces. Development-Friendly Hardware USB-to-UART bridge for programming and debugging Dedicated EN (Reset) and BOOT buttons On-board 3.3 V regulator Breadboard-compatible layout. Flexible Power Options Powered through Micro-USB and onboard power circuitry Supports external power connections through header pins. #DevelopmentBoard