32b Arm® Cortex®-M4 MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 com. interfaces, camera & LCD-TFT 201-UFBGA #microcontrollers #stm32 #commonpartslibrary

32b Arm® Cortex®-M4 MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 com. interfaces, camera & LCD-TFT 169-UFBGA (7x7) #microcontrollers #stm32 #commonpartslibrary

Seeed Studio XIAO ESP32S3 Module Integration (Camera-Free)

Seeed Studio XIAO ESP32S3 leverages dual-core ESP32S3 chip, supporting both Wi-Fi and BLE wireless connectivities, which allows battery charge. It integrates built-in camera sensor, digital microphone. It offers 8MB PSRAM, 8MB FLASH, and external SD card slot. All of these make it suitable for embedded ML, like intelligent voice and vision AI.

Seeed Studio XIAO ESP32S3 leverages dual-core ESP32S3 chip, supporting both Wi-Fi and BLE wireless connectivities, which allows battery charge. It integrates built-in camera sensor, digital microphone. It offers 8MB PSRAM, 8MB FLASH, and external SD card slot. All of these make it suitable for embedded ML, like intelligent voice and vision AI.

OV5640 Omnivision Technologies Camera Sensor. OV5640 provides full-frame, sub-sampled, scaled or windowed 8-bit/10-bit images in a wide range of formats, controlled through the Serial Camera Control Bus (SCCB) interface.

OV5640 Omnivision Technologies Camera Sensor. OV5640 provides full-frame, sub-sampled, scaled or windowed 8-bit/10-bit images in a wide range of formats, controlled through the Serial Camera Control Bus (SCCB) interface.

ARM Microcontrollers - MCU ARM M4 1024 FLASH 168 Mhz 192kB SRAM 100-LQFP (14x14) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of Flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop and Standby modes –VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #CommonPartsLibrary #IntegratedCircuit #Microcontroller #STM32F407

ARM® Cortex®-M4 series Microcontroller IC 32-Bit Single-Core 168MHz 1MB (1M x 8) FLASH 64-LQFP (10x10) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces, and camera Includes ST state-of-the-art patented technology • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting CompactFlash™, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset, and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop, and Standby modes –VBAT supply for RTC, 20×32-bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #commonpartslibrary #integratedcircuit #microcontroller

2286550-1 is a TE Connectivity Automotive HSD (High-Speed Data) hybrid connector header designed for high-speed data transmission in automotive applications. It is a shielded, right-angle PCB-mounted connector that combines HSD and MQS contacts, making it suitable for Ethernet, LVDS, USB, camera, infotainment, and other vehicle data communication systems. The connector features a 100 Ω controlled impedance design for reliable signal integrity in demanding automotive environments. Key Features Automotive HSD+2MQS hybrid header connector 6-position interface with A-coding Right-angle (horizontal) PCB mounting Board-to-board and wire-to-board connectivity Shielded construction for EMI protection 100 Ω impedance for high-speed data transmission Through-hole solder termination Operating voltage up to 60 VDC Maximum current rating: 2.5 A Operating frequency range: 0 to 3 GHz Gold-plated signal contacts for reliable performance Operating temperature range: -40°C to +105°C Reflow soldering capable Designed for automotive signal applications #CommonPartsLibrary #Connector #TEConnectivity #AutomotiveConnector #HSDConnector #DataConnectivity #HighSpeedData #AutomotiveEthernet #WireToBoard #BoardToBoard #ShieldedConnector #PCBConnector #AutomotiveElectronics #22865501

The onsemi AR2020 is a stacked 1/1.8-inch back side illuminated (BSI) CMOS active-pixel digital image sensor with a pixel array of 5120H x 3840V (5136H x 3856V including border pixels). The AR2020 has enhanced NIR response. It incorporates sophisticated on-chip camera functions such as Wake on Motion (WOM), context switching and multiple subsampling modes. It is programmable through a simple I2C interface and has very low power consumption. The AR2020 digital image sensor features onsemi's breakthrough low-noise CMOS imaging technology. The AR2020 sensor can generate full resolution image at up to 60 frames per second (fps) in 10-bit linear mode. AR2020 can achieve 30 fps in line interleaved high dynamic range (LI-HDR) and enhanced Dynamic Range (eDR) modes. #sensor #Transducer #Optical-Sensor #Image-Sensor #Hyperlux™ LP

This project is a motherboard for the ESP32-CAM module, which enables easy and flexible WiFi camera applications. The motherboard provides power supply, programming interface, and GPIO expansion for the ESP32-CAM. It also supports external sensors for more functionality. #motherboard #WiFi #MCU #ReferenceDesign #project #ESP32 #camera #reusable #module #edgeComputing #espressif #template

The ams OSRAM TCS3448 is a highly versatile, multi-purpose spectral light sensor designed to sense the spectral components of ambient light in the visible range. This 14-channel sensor is optimized for applications requiring precise color sensing and ambient light classification, making it ideal for enhancing camera performance through improved color temperature (CCT), automatic white balance (AWB), and exposure time adjustments. The TCS3448 features individual channels covering approximately 380 nm to 1000 nm, including 11 channels centered in the visible spectrum, one near-infrared (NIR) channel, and a clear channel. Additionally, it integrates a flicker detection channel that can automatically flag ambient light flicker at 50/60 Hz and buffer data for calculating other flicker frequencies. The sensor's high-precision optical interference filters are directly deposited on photodiodes embedded in CMOS silicon, ensuring accurate spectral data. With a built-in aperture, programmable digital GPIO, and LED driver, the TCS3448 offers robust control and synchronization capabilities. The device is available in an ultra-low profile package, making it suitable for a wide range of applications, from industrial automation to mobile and wearable devices. Features: 14-channel spectral sensing Visible range coverage (380 nm to 1000 nm) 11 visible spectrum channels Near-infrared (NIR) channel Clear channel Flicker detection up to 1 kHz Integrated aperture for increased accuracy High-precision optical interference filters Programmable digital GPIO LED driver for light source control Serial I²C interface (1.2 V/1.8 V) Ultra-low profile package (3.1 mm x 2 mm x 1 mm) Field of view (FOV) ±40° 0.18 µ process technology Compatible with AS7343 software #CommonPartsLibrary #IntegratedCircuit #Sensor #Transducers #Optical-Sensor #Ambient-Light #IR #UV-Sensor

Infrared (IR) Emitter 840nm~870nm 1.4V~1.8V 700mA 60° Surface Mount,3.9x3.9mm The SE03-EMC3838A-B60 is a high-power surface-mount infrared (IR) LED emitter designed for applications requiring efficient 850 nm infrared illumination. It uses a compact black EMC package for improved thermal performance and reliability, making it suitable for SMT assembly and high-current operation. This component is commonly used in surveillance camera IR illumination, infrared sensing, and IR data transmission systems. Key Features 850 nm peak infrared wavelength (840–870 nm range) High-efficiency IR emission Surface-mount 2-SMD no-lead package Wide 60° viewing angle Typical forward voltage: 1.6 V Supports up to 700 mA forward current Black EMC package for enhanced heat dissipation Operating temperature range: -30°C to +85°C Suitable for automated SMT reflow assembly Compact approximately 3.9 mm × 3.9 mm footprint #commonpartslibrary #led #Infrared

RF Connectors / Coaxial Connectors Right Angle Plug PCB w/Housing T&R WBlue HSD®, Fakra, Quadraxial Connector Plug, Male Pin 100 Ohms Through Hole, Right Angle Solder D4S20D-40MA5-Z is a right-angle HSD (High-Speed Data) FAKRA quadraxial connector from Rosenberger designed for automotive and industrial high-speed data communication systems. It features a 100 Ω impedance, right-angle PCB mounting, and a secure latch-lock mechanism, making it suitable for infotainment, telematics, camera, and ADAS applications where reliable signal integrity is critical. The connector supports frequencies up to 2 GHz and operates across a wide temperature range of -40°C to +105°C. Key Features: HSD® / FAKRA quadraxial right-angle PCB connector 100 Ω controlled impedance for high-speed data transmission Male plug configuration with latch-lock fastening Through-hole PCB mounting with solder termination Frequency support up to 2 GHz Operating temperature range: -40°C to +105°C Gold-plated center contact for excellent conductivity and corrosion resistance Water-blue Code Z housing for automotive coding identification Robust construction with brass body and nickel finish Ideal for automotive infotainment, ADAS, telematics, and industrial communication systems #D4S20D40MA5Z #Rosenberger #HSDConnector #FAKRA #RFConnector #HighSpeedData #AutomotiveElectronics #ADAS #Telematics #PCBConnector #CoaxialConnector #SignalIntegrity

The ESP32-CAM Ai-Thinker is a compact, low-cost Wi-Fi and Bluetooth-enabled camera development module based on the ESP32-S dual-core microcontroller. It integrates an OV2640 2MP camera sensor, onboard Flash memory, PSRAM, and a MicroSD card slot, making it suitable for IoT vision applications, wireless surveillance, image capture, video streaming, face recognition, and smart home projects. The module combines wireless connectivity and image processing capabilities in a small form factor while maintaining low power consumption. Key Features ESP32-S Dual-Core Processor Tensilica Xtensa LX6 dual-core 32-bit CPU Operating frequency up to 240 MHz Computing performance up to 600 DMIPS Integrated Camera Equipped with OV2640 CMOS image sensor Maximum image resolution: 1600 × 1200 (UXGA, 2MP) Supports JPEG image compression and video streaming Memory 4 MB Flash memory External PSRAM for frame buffering and image processing 520 KB internal SRAM Wireless Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 4.2 BR/EDR and BLE support Storage Built-in MicroSD/TF card slot Supports local storage of images, videos, and data logs Peripheral Interfaces UART SPI I²C PWM ADC DAC GPIO expansion pins Power Supply Operating voltage: 5 V Low-power operation with deep-sleep capability for battery-powered applications Compact Design Module size approximately 27 mm × 40.5 mm PCB antenna onboard Optional external antenna connection on some variants

2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar The DS90UB953-Q1 is an automotive-grade high-speed serializer designed to convert parallel image sensor data into a high-speed serial stream for transmission over a single differential pair using FPD-Link III technology. It is intended for use in camera-based systems where compact cabling, high data integrity, and low latency are required. The device interfaces directly with image sensors through a MIPI CSI-2 input and transmits video, control, and GPIO data over a single coaxial or shielded twisted pair cable. Integrated clocking and control features allow synchronization with remote deserializers, enabling robust communication in electrically noisy environments typical of automotive and industrial applications. Functional Description The device receives image data from a connected sensor through a MIPI CSI-2 interface and serializes this data for transmission over a high-speed differential link. In addition to video data, bidirectional control communication is supported through an embedded control channel, allowing configuration and monitoring of remote devices using an I²C interface. The serializer incorporates programmable GPIO functionality that can be used for control signaling or sensor monitoring, with the ability to transport these signals across the link. Internal clock generation and phase-locked loop circuitry support multiple clocking modes, enabling flexible system design with either local or remote reference clocks. The device also includes pattern generation capabilities for system testing and validation. Electrical Characteristics The component operates from multiple power domains supporting core logic, I/O, and phase-locked loop functions. It is designed to provide stable high-speed signal transmission with controlled impedance outputs and low jitter characteristics. The differential serial output supports reliable long-distance communication over coaxial or twisted-pair media. Input interfaces are optimized for compatibility with standard MIPI CSI-2 signaling, ensuring seamless integration with modern image sensors. The control interface uses an open-drain I²C protocol for configuration and communication. Mechanical Characteristics The device is provided in a compact quad flat no-lead package suitable for high-density PCB designs. The package includes an exposed thermal pad that serves both as a heat dissipation path and a low-impedance electrical ground connection. The small footprint and low profile make it well suited for space-constrained applications such as camera modules and embedded vision systems. Environmental Characteristics The DS90UB953-Q1 is qualified for automotive applications and is designed to operate reliably over extended temperature ranges and under conditions of electrical noise, vibration, and mechanical stress. The device is compatible with standard surface-mount assembly processes, including lead-free reflow soldering. Materials and construction comply with relevant environmental and reliability standards for automotive-grade electronic components. Materials and Construction The package body is constructed from high-temperature thermally stable materials suitable for reflow soldering. Electrical contacts are formed from copper-based alloys with plated finishes to ensure long-term conductivity, corrosion resistance, and mechanical durability. The exposed pad is designed to interface directly with the PCB ground plane for improved thermal and electrical performance.

2.4GHz Wi-Fi+Bluetooth LE SoC ESP32-S3FH4R2 is a highly integrated low-power Wi-Fi and Bluetooth LE System-on-Chip (SoC) from Espressif Systems. It is based on a dual-core Xtensa® LX7 processor running at up to 240 MHz and is designed for IoT, smart home, industrial control, AIoT, audio processing, and embedded applications. The ESP32-S3FH4R2 variant includes 4 MB of in-package Quad SPI Flash and 2 MB of in-package Quad SPI PSRAM, reducing external component count and simplifying PCB design. Key Features Dual-core Xtensa® LX7 CPU Up to 240 MHz operating frequency 32-bit architecture with floating-point unit (FPU) SIMD instructions for AI and signal-processing workloads Integrated Memory 4 MB in-package Flash 2 MB in-package PSRAM 512 KB on-chip SRAM 384 KB ROM Additional RTC memory for low-power operation Wireless Connectivity IEEE 802.11 b/g/n 2.4 GHz Wi-Fi Bluetooth® 5 Low Energy (LE) Long-range and low-power wireless communication support Rich Peripheral Set Up to 45 programmable GPIOs USB OTG and USB Serial/JTAG SPI, I²C, I²S, UART, SDIO TWAI® (CAN 2.0 compatible) Camera interface LCD interface PWM, pulse counter, RMT, DMA controller Analog Features Two 12-bit SAR ADCs Temperature sensor 14 capacitive touch sensing inputs Security Features Secure Boot Flash Encryption AES, SHA, RSA, HMAC hardware accelerators True Random Number Generator (RNG) Digital Signature peripheral Low-Power Operation Multiple power-saving modes ULP-RISC-V coprocessor ULP-FSM coprocessor Deep-sleep support with RTC memory retention

ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

32 TOPS vision SoC for 1-12 cameras, autonomous mobile robots, machine vision, mobile DVR, AI-BOX #Integrated-circuit #processor #Microcontroller #AM69A