The TPS3839G33DBZT is an ultra-low-power voltage supervisor designed to monitor system supply rails and provide reliable reset signaling for microcontrollers, processors, FPGAs, and other digital systems. The device continuously supervises the supply voltage and asserts a reset output when the monitored voltage falls below the factory-programmed threshold, ensuring proper system startup, shutdown, and fault recovery. Its low quiescent current makes it particularly suitable for battery-powered, portable, and energy-efficient applications where power consumption is critical. The device features a precision voltage monitoring architecture with a fixed reset threshold optimized for nominal logic supply rails. It provides a stable reset output with an internally defined reset timeout period, eliminating the need for external timing components. The compact package and robust noise immunity make it ideal for embedded systems, industrial controls, consumer electronics, IoT devices, medical equipment, and wireless communication platforms. Key Features Ultra-low quiescent current operation Precision fixed-voltage supervision Factory-programmed reset threshold for logic supply monitoring Active-low reset output Internal reset timeout delay High threshold accuracy over temperature Fast response to undervoltage conditions Push-pull reset output configuration No external components required for operation Compact surface-mount package Wide operating temperature range High reliability and low power consumption Applications Microcontroller reset generation Embedded control systems Battery-powered electronics Industrial automation equipment IoT and wireless sensor nodes Portable medical devices Consumer electronics Data acquisition systems Power management subsystems Communication and networking equipment Electrical Characteristics Fixed supply voltage monitoring Precision undervoltage detection Low operating current Integrated reset timing circuitry Stable reset assertion during power-up and brownout conditions Noise-tolerant voltage supervision Reliable operation across specified temperature range Package Information Surface-mount package Compact footprint for space-constrained designs RoHS-compliant construction Suitable for automated assembly processes #commonpartslibrary #integratedcircuit #powersupervisor #voltagesupervisor #resetcontroller #powermanagement #embeddedsystems #microcontroller #lowpower #batterypowered #industrialelectronics #iot #electronicsdesign #semiconductor #texasinstruments

QFN-68-EP(7x7) Power Management - Specialized RoHS The RK809-5 is a highly integrated Power Management Integrated Circuit (PMIC) from Rockchip designed for multi-core processor systems and embedded applications. It provides a complete power management solution by integrating multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, battery fuel gauging, RTC functionality, and audio codec capabilities into a single device. The RK809-5 is commonly used alongside Rockchip SoCs in single-board computers, tablets, AIoT devices, and industrial embedded systems. Key Features Five high-efficiency synchronous buck converters with fast transient response. Nine low-dropout (LDO) voltage regulators for powering sensitive analog and digital circuits. Integrated battery fuel gauge for battery capacity monitoring. Configurable power-up and power-down sequencing (OTP programmable). Dynamic Voltage Scaling (DVS/DVFS) support via I²C interface. Integrated Real-Time Clock (RTC) with 32.768 kHz crystal oscillator support. Two integrated load switches for peripheral power control. Over-current, over-voltage, and thermal protection features. Built-in audio CODEC with headphone driver and Class-D amplifier support. Designed to minimize external component count and simplify power system design. QFN-68-EP (7 mm × 7 mm) package. #RK8095 #RK809 #Rockchip #PMIC #PowerManagementIC #BatteryManagement #AudioCodec #RTC #DVFS #EmbeddedSystems #SingleBoardComputer #IoT #IndustrialElectronics #PowerSupplyDesign #ElectronicsEngineering

5.7 kV RMS/1.5 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator (0 Reverse Channels) LVDS Digital Isolator 5700Vrms 4 Channel 2.5Gbps 40kV/µs CMTI 28-BSSOP (0.295", 7.50mm Width) The ADN4624 is a quad-channel, signal isolated, low voltage differential signaling (LVDS) buffer that operates at up to 2.5 Gbps with very low jitter. The device integrates Analog Devices, Inc., iCoupler® technology, enhanced for high speed operation to provide drop-in galvanic isolation of LVDS signal chains. AC coupling and/or level shifting to the LVDS receivers and from the LVDS drivers allows isolation of other high speed signals such as current mode logic (CML). The ADN4624 includes a refresh mechanism to monitor the input and output states and ensure they remain the same in the absence of data transitions (for example, at power-on). For lower power consumption and high speed operation with low jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The ADN4624 is fully specified over a wide industrial temperature range and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8 kVPEAK surge and impulse voltages and reinforced insulation at ac mains voltages) or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance (for basic/functional isolation). FEATURES ► 5.7 kV rms and 1.5 kV rms LVDS isolators ► Complies with TIA/EIA-644-A LVDS signal levels ► Quad-channel configuration ► Any data rate up to 2.5 Gbps switching with low jitter ► 10 Gbps total bandwidth across four channels ► 2.15 ns typical propagation delay ► Typical jitter: 0.82 ps rms random, 40 ps total peak ► Lower power 1.8 V supplies ► ±8 kV IEC 61000-4-2 ESD protection across isolation barrier ► High common-mode transient immunity: 100 kV/μs typical ► Safety and regulatory approvals (28-lead SOIC_W_FP package) ► UL (pending): 5700 V rms for 1 minute per UL 1577 ► CSA Component Acceptance Notice 5A (pending) ► VDE certificate of conformity (pending) ► DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 ► VIORM = 849 VPEAK (working voltage) ► Enable or disable refresh (low speed output correctness check) ► Operating temperature range: −40°C to +125°C ► 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance APPLICATIONS ► Isolated video and imaging data ► Analog front-end isolation ► Data plane isolation ► Isolated high speed clock and data links ► Multi-gigabit serialization/deserialization (SERDES) ► Board-to-board optical replacement (for example, short reach fiber) #CommonPartsLibrary #ADN4624BRNZ #DigitalIsolator #LVDS #AnalogDevices #HighSpeedInterface #GalvanicIsolation #LVDSIsolator #DigitalIsolation #IndustrialElectronics #HighSpeedData #SERDES #SignalIntegrity #EmbeddedSystems #ElectronicsDesign #InterfaceICs

General Purpose Relay DPDT (2 Form C) Through Hole The G5V-2-DC5 is a compact signal relay manufactured by Omron Electronic Components and designed for reliable low-power switching in telecommunications, industrial control systems, instrumentation, automation equipment, security systems, and embedded electronic applications. The relay utilizes a dual-pole double-throw contact arrangement, enabling flexible signal routing and isolation between control and load circuits. The device features a highly reliable electromagnetic switching mechanism optimized for stable operation, low contact resistance, and consistent electrical performance throughout its service life. Its compact package allows efficient PCB integration while supporting high-density circuit layouts. The relay is engineered to provide dependable switching of low-level signals and control circuits where accuracy, durability, and long-term reliability are critical design requirements. The construction incorporates high-quality contact materials and precision mechanical components to ensure excellent switching characteristics, enhanced contact stability, and resistance to environmental influences. The relay is suitable for applications requiring galvanic isolation, signal multiplexing, interface switching, and control circuit management. General Description The G5V-2-DC5 is a miniature signal relay intended for precision switching applications in electronic systems. It offers dependable electrical isolation between circuits while maintaining excellent signal integrity and operational reliability. Its compact footprint, proven switching performance, and robust construction make it a popular choice for communication equipment, industrial electronics, measurement systems, network infrastructure, security devices, and embedded control platforms. The relay is widely recognized for its reliability, ease of integration, and suitability for demanding electronic switching environments. #G5V2DC5 #Omron #SignalRelay #ElectromechanicalRelay #PCBRelay #IndustrialElectronics #EmbeddedSystems #Automation #ControlSystems #Telecommunications #ElectronicComponents #HardwareDesign #CircuitProtection #ElectricalEngineering #PCBDesign #RelayModule #ElectronicSwitching #Instrumentation #EngineeringSpecification #ElectronicsDesign

The NX3225SA-26MHz-STD-CSR-6 is a surface-mount quartz crystal resonator designed to provide a stable frequency reference for microcontrollers, wireless communication modules, embedded systems, consumer electronics, industrial controls, and timing applications. Manufactured in a compact ceramic package, this crystal offers excellent frequency stability, low power consumption, and reliable long-term performance. Its standard frequency tolerance and stability characteristics make it suitable for clock generation, frequency synthesis, and synchronization functions in a wide range of electronic designs requiring precise timing accuracy. Features Surface-mount quartz crystal resonator Fundamental mode operation Compact ceramic package suitable for high-density PCB layouts Stable frequency reference for digital and RF applications Low equivalent series resistance for reliable oscillator startup Compatible with automated assembly processes Excellent aging characteristics and long-term reliability Suitable for low-power and battery-operated devices RoHS-compliant and lead-free construction Applications Microcontroller clock generation Wireless communication modules Bluetooth and Wi-Fi devices Industrial automation equipment IoT and smart devices Consumer electronics Measurement and instrumentation systems Embedded control platforms Timing and synchronization circuits Electrical Characteristics Nominal frequency centered at twenty-six megahertz Standard frequency tolerance classification Standard operating temperature stability Fundamental crystal oscillation mode Specified load capacitance configuration Low equivalent series resistance High insulation resistance Low drive level operation Reliable startup characteristics Long operational lifetime with minimal frequency drift Mechanical Characteristics Ceramic surface-mount package Compact footprint suitable for space-constrained designs Metal lid sealed construction Designed for reflow soldering processes Tape-and-reel packaging compatibility Environmental Characteristics Industrial-grade reliability Resistance to mechanical shock and vibration within specification limits Moisture-resistant sealed package construction Suitable for standard electronic manufacturing environments Compliant with environmental and hazardous substance regulations #commonpartslibrary #crystal #quartzcrystal #frequencyreference #timingdevice #oscillator #clocksource #smtcomponent #passivecomponent #embeddedsystems #wirelesscommunication #industrialelectronics #consumerelectronics #iotdevices #electronicsdesign

BGA-565(15.5x14.4) Microcontrollers, Quad-core ARM Cortex-A55 processor The RK3566 is a high-performance, low-power 64-bit application processor developed by Rockchip for AIoT, industrial control, smart displays, tablets, embedded systems, and single-board computers. It integrates a quad-core ARM Cortex-A55 CPU, Mali-G52 GPU, AI acceleration engine (NPU), advanced multimedia processing, and a rich set of connectivity interfaces, making it suitable for Linux- and Android-based applications requiring efficient performance and multimedia capabilities. Key Features Quad-core 64-bit ARM Cortex-A55 processor operating up to 2.0 GHz. ARM Mali-G52 2EE GPU with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1. Integrated NPU delivering up to 1 TOPS AI computing performance. Supports DDR3, DDR3L, DDR4, LPDDR3, LPDDR4, and LPDDR4X memory. Hardware video decoding up to 4K@60fps for H.264, H.265, and VP9 formats. Hardware video encoding up to 1080p@60fps for H.264 and H.265. Built-in 8MP ISP with HDR image processing support. Multiple display interfaces including HDMI 2.0, eDP, MIPI-DSI, LVDS, RGB, and E-Ink. High-speed connectivity with USB 3.0, USB 2.0, PCIe, SATA, Gigabit Ethernet, SDIO, and eMMC 5.1. Rich peripheral support including UART, SPI, I²C, PWM, ADC, I²S, PDM, and GPIO. Optimized for Android, Linux, industrial HMI, smart home, edge computing, and AIoT applications. Manufactured using a 22 nm process for improved power efficiency. #RK3566 #Rockchip #ARMCortexA55 #MaliG52 #AIoT #EmbeddedSystems #SingleBoardComputer #Linux #Android #IndustrialControl #SmartDisplay #EdgeComputing #SoC #Processor #NPU #4KVideo #IoT #Electronics #HardwareDesign #PCBDesign

SLC NAND Flash Parallel/Serial 3.3V 256G-bit 32G x 8 100-Pin LBGA FLASH - NAND (SLC) Memory IC 256Gbit Parallel 100 MHz 100-LBGA (12x18) The MT29F256G08AUCABH3-10ITZ:A is a high-density 256Gb Single-Level Cell (SLC) NAND Flash memory device from Micron Technology. It provides non-volatile data storage with high reliability, fast read/write performance, and long endurance, making it suitable for industrial, networking, embedded computing, automotive, and data-logging applications. The device supports both asynchronous and synchronous interfaces and complies with the Open NAND Flash Interface (ONFI) standard for enhanced interoperability and performance. It is housed in a compact 100-ball LBGA package (12 mm × 18 mm). • Open NAND Flash Interface (ONFI) 2.2-compliant1 • Single-level cell (SLC) technology • Organization – Page size x8: 8640 bytes (8192 + 448 bytes) – Block size: 128 pages (1024K + 56K bytes) – Plane size: 2 planes x 2048 blocks per plane – Device size: 32Gb: 4096 blocks; 64Gb: 8192 blocks; 128Gb: 16,384 blocks; 256Gb: 32,768 blocks • Synchronous I/O performance – Up to synchronous timing mode 5 – Clock rate: 10ns (DDR) – Read/write throughput per pin: 200 MT/s • Asynchronous I/O performance – Up to asynchronous timing mode 5 – tRC/tWC: 20ns (MIN) – Read/write throughput per pin: 50 MT/s • Array performance – Read page: 35µs (MAX) – Program page: 350µs (TYP) – Erase block: 1.5ms (TYP) • Operating Voltage Range – VCC: 2.7–3.6V – VCCQ: 1.7–1.95V, 2.7–3.6V • Command set: ONFI NAND Flash Protocol • Advanced Command Set – Program cache – Read cache sequential – Read cache random – One-time programmable (OTP) mode – Multi-plane commands – Multi-LUN operations – Read unique ID – Copyback • First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see Error Management (page 114). • RESET (FFh) required as first command after power-on • Operation status byte provides software method for detecting – Operation completion – Pass/fail condition – Write-protect status • Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous interface • Copyback operations supported within the plane from which data is read • Quality and reliability – Data retention: JESD47G compliant; see qualification report – Endurance: 60,000 PROGRAM/ERASE cycles • Operating temperature: – Commercial: 0°C to +70°C – Industrial (IT): –40ºC to +85ºC • Package – 52-pad LGA – 48-pin TSOP – 100-ball BGA – 132-ball BGA #Micron #NANDFlash #SLCNAND #FlashMemory #NonVolatileMemory #ONFI #EmbeddedSystems #IndustrialElectronics #DataStorage #MemoryIC #LBGA100 #HighReliability #MT29F256G08AUCABH310ITZA #MicronMemory #ParallelNANDFlash

SDRAM - Mobile LPDDR4 Memory IC 48Gbit 2.133 GHz MT53E1536M32D4DT-046 WT:A is a high-density 48Gb (6GB) LPDDR4/LPDDR4X SDRAM memory device from Micron Technology. It is designed for high-performance, low-power applications requiring fast memory bandwidth and efficient power management. The device features a 32-bit data bus, supports data rates up to 4266 MT/s, and is packaged in a compact 200-ball FBGA, making it suitable for embedded computing, industrial systems, networking equipment, AI edge devices, automotive electronics, and mobile platforms. Key Features 48Gb (6GB) LPDDR4/LPDDR4X SDRAM Organized as 1.5G × 32 bits Data transfer rates up to 4266 MT/s Maximum clock frequency of 2133 MHz Low-power operation with 1.1V core supply 32-bit memory interface 200-ball FBGA package JEDEC LPDDR4-compliant architecture Per-bank refresh support Temperature-compensated refresh Self-refresh and deep power-down modes Partial-array self-refresh capability High bandwidth with reduced power consumption Optimized for compact embedded designs Operating temperature range: –30°C to +85°C Typical Applications Embedded Linux computers Single-board computers (SBCs) AI and edge computing platforms Industrial automation systems Networking and telecommunications equipment Automotive infotainment and control systems Tablets and mobile devices FPGA and SoC-based designs #commonpartslibrary #integratedcircuit #memory #dram #sdram #lpddr4 #lpddr4x #mobiledram #micron #embeddedsystems #embeddedcomputing #industrialelectronics #automotiveelectronics #edgecomputing #artificialintelligence #networking #telecommunications #highspeedmemory #lowpowerdesign #computerhardware #electroniccomponents #semiconductor #datasheet #fbga #memorychip #electronicsdesign #pcbdesign #hardwareengineering #electronicengineering #systemonchip #fpga #iot #internetofthings #computermemory #digitalelectronics #surfaceMount #smt #bga #storage #highperformancecomputing #hpc #mobiledevices #industrialautomation #electronicdesign #componentlibrary #fluxlibrary #parametricpart #eda #schematic #pcb #electronicdesignautomation #chipdesign #embeddedhardware #memorymodule #lowpowerelectronics #highbandwidthmemory #electronics #hardwaredevelopment #engineering #electricalengineering

64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black The PCIE-064-02-X-D-TH is a high-density PCI Express edge connector designed for reliable board-to-board and card-to-host connections in high-speed data communication applications. Manufactured by Samtec, this connector supports PCI Express signaling standards while providing robust mechanical and electrical performance for high-frequency, high-bandwidth systems. Its through-hole mounting and dual-row design ensure secure attachment to the PCB, high mating retention, and long operational life. The connector is ideal for computer peripherals, server systems, embedded computing platforms, networking devices, and industrial electronic equipment where signal integrity, mechanical reliability, and high-density interconnects are critical. Engineering Specifications Manufacturer: Samtec Part Number: PCIE-064-02-X-D-TH Series: PCI Express Edge Connector Connector Type: Board-to-Board / Card Edge Connector Contact Configuration: Dual-Row High-Density Contacts Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Surface Housing Material: High-Temperature Thermoplastic Signal Performance: PCI Express Standard Compliant Electrical Performance: High-Speed Data Transmission Mechanical Durability: High Mating Cycle Life Orientation: Right Angle / Standard Edge Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: PCI Express Expansion Cards, High-Speed Computing Systems, Server and Data Center Hardware, Embedded Platforms, Networking Equipment, Industrial Computing, High-Bandwidth Digital Interfaces, Board-Level Interconnects Key Features High-density dual-row PCIe edge contacts Through-hole mounting for robust PCB attachment Gold-plated contact interface for reliable signal transmission Supports high-speed PCI Express signaling Compact, high-density design for space-constrained PCBs Long mechanical life with repeated mating cycles Compatible with standard PCI Express cards and connectors Reliable operation in industrial and commercial environments Ideal for embedded computing, server, and networking applications Ensures signal integrity for high-bandwidth data communication #PCIE06402XDTH #Samtec #PCIeConnector #EdgeConnector #BoardToBoard #HighSpeedInterconnect #HighDensityConnector #ThroughHole #IndustrialElectronics #EmbeddedSystems #ServerHardware #NetworkingEquipment #ElectronicComponents #PCBDesign #HighBandwidth #DataCommunication #PCIExpress #ExpansionCardConnector #MechanicalReliability #ElectronicInterconnect

STN1110-IMM General Description The STN1110-IMM is a multiprotocol OBD-II to UART interpreter integrated circuit designed for automotive diagnostic, telematics, and vehicle communication applications. The device translates OBD-II network traffic into a UART serial data stream for communication with external microcontrollers, embedded processors, and host systems. It supports all legislated OBD-II protocols and provides compatibility with ELM327-based software while offering enhanced processing performance, expanded memory resources, advanced message filtering, firmware upgrade capability, and low-power operation. The device is intended for use in automotive diagnostic tools, fleet management systems, vehicle monitoring equipment, data acquisition systems, and embedded automotive communication products. Engineering Specification Part Number: STN1110-IMM Component Type: OBD-II to UART Interpreter Integrated Circuit Device Category: Automotive Communication Interface IC Package Type: QFN Mounting Type: Surface Mount Device (SMD) Interface Type: * UART * OBD-II Supported Protocols: * ISO 15765-4 CAN * ISO 14230-4 KWP2000 * ISO 9141-2 * SAE J1850 PWM * SAE J1850 VPW Key Features: * Multiprotocol OBD-II support * ELM327 command compatibility * Enhanced ST command extensions * High-speed UART communication * Advanced message filtering * Firmware upgrade capability * Large message buffering * Low-power operation * Automotive diagnostic interface functionality Applications: * OBD-II Scan Tools * Vehicle Diagnostics * Automotive Telematics * Fleet Management Systems * Data Logging Equipment * Embedded Automotive Controllers * Emissions Monitoring Systems * Vehicle Communication Gateways Tags #commonpartslibrary #integratedcircuit #ic #automotive #automotiveelectronics #automotivediagnostics #obdii #obd #uart #vehiclecommunication #telematics #embeddedsystems #communicationinterface #diagnosticinterface #scantool #canbus #kwp2000 #saej1850 #iso9141 #surfaceMount #smd #qfn #electroniccomponent #semiconductor #vehicleelectronics #microcontrollerinterface #datalogging #fleetmanagement #embeddedhardware #hardwaredesign

77 (55 + 22 Ground) Position Header, Male Pins Connector 0.079" (2.00mm) Through Hole The 5106081‑1 is a high-reliability male PCB connector manufactured by TE Connectivity. It belongs to the Z‑PACK 2 mm HM Series, designed for mezzanine and backplane board-to-board interconnects. The connector features precision-machined phosphor bronze contacts with tin plating, ensuring consistent electrical conductivity, low contact resistance, and long-term reliability. The device has a through-hole press-fit termination style for robust mechanical attachment to printed circuit boards and optimal compatibility with automated assembly processes. Its vertical orientation and standardized 2 mm pitch allow compact, high-density PCB layouts while maintaining reliable alignment and mating with compatible female headers. The connector is engineered to support repeated insertion cycles, high signal integrity, and consistent electrical performance in industrial, telecommunications, and embedded electronic applications. General Description The 5106081‑1 is a durable, 77-position male PCB connector intended for high-density board-to-board interconnect solutions. It provides secure electrical connections, mechanical stability, and long-term reliability in demanding electronic systems. Widely used in industrial automation, telecommunications, and embedded computing, this connector ensures precise mating, easy PCB integration, and robust operation in backplane and mezzanine applications. Its press-fit through-hole design, reliable contact material, and standardized footprint make it a versatile solution for complex multi-board electronic assemblies. #TEConnectivity #PCBConnector #MaleHeader #BoardToBoard #ZPACK #2mmPitch #HighDensityInterconnect #ThroughHole #PressFit #IndustrialElectronics #Telecommunications #EmbeddedSystems #ElectricalEngineering #ReliableConnection #EngineeringSpec #ElectronicConnector #HighPerformanceConnector

IC RF TxRx + MCU General ISM < 1GHz LoRaWAN 1.0, Sigfox 915MHz 73-UFBGA The STM32WL55JCI6TR is an ultra-low-power wireless microcontroller developed by STMicroelectronics. It integrates a high-performance Arm Cortex-M4 core with a secondary Arm Cortex-M0+ core and a sub-GHz radio transceiver within a single package. The device is designed for long-range wireless communication, industrial automation, smart metering, environmental monitoring, asset tracking, and Internet of Things applications. Its highly integrated architecture reduces external component count while providing secure, energy-efficient operation suitable for battery-powered and embedded systems. #STM32WL55JCI6TR #STM32WL #STM32 #STMicroelectronics #Microcontroller #WirelessMCU #LoRa #SubGHz #IoT #EmbeddedSystems #IndustrialAutomation #SmartMetering #LowPowerDesign #WirelessCommunication #RemoteMonitoring

USB-C (USB TYPE-C) Receptacle Connector 24 Position Panel Mount, Through Hole, Right Angle The MUSBRM1C1M0 is a ruggedized USB Type-C receptacle connector designed for high-reliability data and power connectivity in industrial, embedded, transportation, and harsh-environment applications. The connector features a reversible USB Type-C interface that supports modern high-speed communication protocols while providing robust mechanical durability and secure board-level attachment. Its reinforced construction helps withstand vibration, shock, and repeated mating cycles, making it suitable for demanding applications where reliability and long service life are critical. The device is commonly used in industrial controllers, communication equipment, medical devices, consumer electronics, and next-generation embedded systems requiring compact and versatile connectivity. Engineering Specifications Manufacturer: Amphenol Communications Solutions Part Number: MUSBRM1C1M0 Connector Type: USB Type-C Receptacle Interface Standard: Universal Serial Bus Type-C Connector Gender: Receptacle Mounting Style: Surface Mount Orientation: Right Angle Contact Configuration: USB Type-C Multi-Function Interface Data Support: High-Speed Data Transmission Power Delivery Support: Compatible with USB Power Delivery Architectures Shielding: Integrated EMI Shielding Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Strength Metal Shield Construction Durability: High Mating Cycle Life Environmental Performance: Designed for Industrial Applications Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Automation, Consumer Electronics, Communication Equipment, Medical Devices, IoT Products, Portable Electronics, Data Acquisition Systems Key Features Reversible USB Type-C connection interface Ruggedized mechanical construction High-speed data communication capability Secure PCB mounting design Enhanced resistance to vibration and mechanical stress Integrated shielding for improved electromagnetic compatibility Compact footprint for space-constrained designs Supports modern USB power and data architectures Long operational lifespan with high insertion cycle durability Suitable for industrial and commercial electronic systems #MUSBRM1C1M0 #Amphenol #USBTypeC #USBConnector #TypeCReceptacle #HighSpeedConnectivity #PowerDelivery #IndustrialElectronics #EmbeddedSystems #CommunicationEquipment #IoTDevices #ConsumerElectronics #PCBDesign #ElectronicComponents #SurfaceMount #DataTransmission #USBPD #IndustrialAutomation #MedicalElectronics #ConnectorTechnology

The RFFC5072 is a highly integrated wideband RF frequency conversion IC that combines a fractional-N PLL synthesizer, low phase-noise VCO, and a high-linearity RF mixer in a single device. It is designed for wireless infrastructure, software-defined radio (SDR), test equipment, military communications, and broadband frequency conversion applications. The device can generate local oscillator (LO) frequencies from 85 MHz to 4.2 GHz and perform frequency conversion for RF signals up to 6 GHz while maintaining excellent phase noise and spurious performance. Features  85MHz to 4200MHz LO Frequency Range  Fractional-N Synthesizer with Very Low Spurious Levels  Typical Step Size 1.5Hz  Fully Integrated Low Phase Noise VCO and LO Buffers  Integrated Phase Noise • 0.18° rms at 1GHz • 0.50° rms at 3GHz  High Linearity RF Mixer(s)  30MHz to 6000MHz Mixer Frequency Range  Input IP3 +23dBm  Mixer Bias Adjustable for Low Power Operation  Full Duplex Mode (RFFC5071)  2.7V to 3.3V Power Supply  Low Current Consumption  3- or 4-Wire Serial Interface Applications  Wideband Radios  Distributed Antenna Systems  Diversity Receivers  Software Defined Radios  Frequency Band Shifters  Point-to-Point Radios  WiMax/LTE Infrastructure  Satellite Communications  Wideband Jammers #RFFC5072 #Qorvo #RFMixer #FrequencySynthesizer #PLL #VCO #WidebandRF #FrequencyConverter #SDR #WirelessInfrastructure #RFDesign #MicrowaveEngineering #Telecommunications #EmbeddedSystems #ElectronicsDesign #RFIC #SignalProcessing #HardwareEngineering

Ultra Efficient Dual Sources Energy Manager with Ratio/Constant Voltage Regulation, Regulated Buck Output and 5 V Charger, 120 mV, 135 mA The AEM13921 is a fully integrated and compact power management circuit that extracts DC power from two harvesting sources to store energy in a rechargeable storage element and supply an application circuit. A 5 V input can also be used to charge the storage element (e.g., if it gets depleted). This compact and ultra-efficient PMIC allows for extending battery lifetime and eliminating the primary energy storage in a large range of applications. Both sources implement Maximum Power Point Tracking (MPPT) based on open-circuit voltage ratio as well as constant source voltage regulation features, allowing for harvesting the maximum power available from each source to charge the storage element. With its unique cold-start circuit, it can start operating with an input voltage as low as 275 mV (min. 1.5 µW power). The configurable protection thresholds prevent overcharging and overdischarging the storage element. No external components are required to set those thresholds. The thermal monitoring prevents charging and discharging the storage element outside a configurable temperature range. The Average Power Monitoring (APM) allows the application circuit to get an estimate of the energy harvested from each source to the battery and from the battery to the application circuit. A shipping mode is available to avoid charging and discharging the storage element during shipping or storage. A buck regulator with selectable output voltage allows an application circuit to be supplied with high efficiency. I²C communication allows users to control every setting of the AEM13921 from the application circuit MCU. Features and Benefits Dual sources inputs - Boost operation optimized for each source. - Conversion efficiency above 90 % on each source. - Harvests from 120 mV after cold start. - Simultaneous harvesting from both sources. - Up to 135 mA current extracted from the harvester. Maximum Power Point Tracking - Both sources configurable to constant voltage mode or to open-circuit voltage ratio mode. - Optimal harvesting from a multiple combinations of harvesters (PV cells, RF, vibration, pulsed sources...). Cold start from 275 mV / 1.5 µW input - Startup at ultra-low power from each harvesting source input. Configurable overdischarge & overcharge protection - Supports various types of rechargeable storage elements (LiC, Li-ion, LiPo, Li-ceramic pouch...). Regulated output for application circuit - Buck regulator conversion efficiency up to 96 %. - Selectable output voltage between 0.6 V and 3.3 V. - Output current up to 100 mA. Thermal monitoring - Storage element protection against overtemperature and under-temperature during charging and discharging, independently. Average Power Monitoring - Provides data to determine how much energy has been transferred to the storage from each source and from the 5 V charger, as well as the energy drained from the storage to supply the application circuit. System configuration by GPIO or I²C communication - All settings dynamically configurable through GPIO or I²C (Fast Mode Plus). - System data available through I²C. Shipping mode - Storage element charge and discharge disabling during shipment. External 5 V charging capability - Extra charging input for 5 V power supplies. - Configurable CC and CV modes (max. 135 mA). - Provides a fast charging alternative when no source is available for a long time. #AEM13921 #EnergyHarvesting #PowerManagementIC #PMIC #MPPT #BatteryCharging #EnergyAutonomous #IoT #WirelessSensor #IndustrialMonitoring #EmbeddedSystems #QFN #epeas #LowPowerDesign

10 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold The SFM-105-02-X-D-A is a high-reliability dual-row socket connector designed for board-to-board and mezzanine interconnection applications. Manufactured by Samtec, this connector provides a compact and durable solution for connecting printed circuit boards in embedded systems, industrial electronics, communications equipment, test instruments, and high-performance computing platforms. The connector features precision-machined contacts that ensure consistent electrical performance, excellent mating reliability, and long operational life. Its low-profile design and high-density contact arrangement make it suitable for applications requiring space-efficient interconnect solutions while maintaining signal integrity and mechanical robustness. Engineering Specifications Manufacturer: Samtec Part Number: SFM-105-02-X-D-A Series: SFM Series Connector Type: Board-to-Board Socket Connector Contact System: Precision Socket Contacts Row Configuration: Dual Row Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Temperature Thermoplastic Mating Compatibility: Standard Samtec Header Systems Electrical Performance: High-Reliability Signal Interconnection Mechanical Durability: High Mating Cycle Life Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Control Equipment, Communication Systems, Data Acquisition Platforms, Instrumentation, Test Equipment, Computing Hardware, PCB Interconnect Solutions Key Features High-density dual-row socket configuration Precision-machined contacts for reliable electrical performance Gold-plated contact interface for enhanced conductivity and durability Compact footprint for space-constrained designs Excellent mating alignment and retention characteristics High mechanical durability for repeated insertion cycles Suitable for board stacking and mezzanine interconnections Compatible with a wide range of Samtec header connectors Designed for industrial and commercial electronic systems Supports reliable signal transmission in high-performance applications #SFM10502XDA #Samtec #BoardToBoardConnector #SocketConnector #DualRowConnector #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #CommunicationSystems #Instrumentation #DataAcquisition #MezzanineConnector #ThroughHoleConnector #ElectronicComponents #PCBDesign #SignalIntegrity #HighReliability #ConnectorTechnology #EmbeddedHardware

Isolated Module DC DC Converter 2 Output 12 ~ 15V -12 ~ -15V 125mA, 125mA 18V - 36V Input The CC3-2412DF-E is an isolated DC-DC converter module designed to provide efficient and reliable power conversion in industrial, telecommunications, instrumentation, and embedded electronic systems. The module converts a regulated DC input voltage into isolated dual-output DC supplies while maintaining electrical isolation between the input and output stages. Its compact encapsulated design simplifies PCB integration and enhances system reliability by reducing the need for external conversion circuitry. The device is optimized for applications requiring isolated power rails, noise reduction, and protection against ground loop interference. Engineering Specifications Manufacturer: TDK-Lambda Part Number: CC3-2412DF-E Device Type: Isolated DC-DC Converter Module Conversion Topology: Isolated Power Conversion Input Voltage: Nominal DC Input Operation Output Configuration: Dual Output Output Regulation: Regulated DC Output Isolation Type: Galvanic Isolation Efficiency: High-Efficiency Power Conversion Protection Features: Short Circuit Protection and Overload Tolerance Package Type: Encapsulated Through-Hole Module Mounting Style: Through-Hole Operating Temperature Range: Industrial Grade Reliability: Designed for Continuous Operation RoHS Compliant: Yes Applications: Industrial Automation, Telecommunications Equipment, Embedded Systems, Instrumentation, Data Acquisition Systems, Process Control Equipment, Power Distribution Circuits, Isolated Interface Designs Key Features Isolated input-to-output power conversion Dual regulated output architecture Compact PCB-mount package High efficiency operation Reduced electrical noise and ground loop interference Reliable performance in industrial environments Simplified power supply design integration Robust protection against abnormal operating conditions Suitable for mixed-signal and sensitive analog systems Long operational lifespan and stable output characteristics #CC32412DFE #TDKLambda #DCDCConverter #IsolatedPowerSupply #PowerModule #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerConversion #GalvanicIsolation #Telecommunications #Instrumentation #AutomationSystems #PCBDesign #ElectronicComponents #DualOutput #PowerManagement #IndustrialAutomation #ElectricalEngineering #PowerSupplyDesign

Supervisor Open Drain or Open Collector 1 Channel 8-SOIC The MC34164D-5R2G is a high-speed, dual operational amplifier designed for precise analog signal processing in industrial, instrumentation, and consumer electronic applications. It features low offset voltage, low input bias current, and wide bandwidth for accurate and reliable performance across various analog signal conditions. Its robust design provides stable operation under high-speed switching and varying temperature conditions, making it suitable for data acquisition systems, sensor interfaces, audio signal conditioning, control circuits, and measurement instrumentation. The device comes in a compact dual-in-line package for easy PCB integration and versatility in mixed-signal designs. Engineering Specifications Manufacturer: ON Semiconductor Part Number: MC34164D-5R2G Device Type: Dual Operational Amplifier Amplifier Configuration: Dual Op-Amp Input Offset Voltage: Low for Precision Applications Input Bias Current: Low Supply Voltage Range: Wide Operating Range Gain Bandwidth Product: High for Fast Signal Processing Slew Rate: Optimized for High-Speed Applications Output Type: Rail-to-Rail Compatible Noise Performance: Low Noise Analog Operation Package Type: Small Outline Integrated Circuit (SOIC) Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Sensor Signal Conditioning, Data Acquisition, Control Systems, Audio Processing, Industrial Instrumentation, Embedded Analog Circuits, Measurement and Monitoring Equipment, General-Purpose Analog Designs Key Features Dual high-speed operational amplifier in a single package Low input offset voltage for precision analog applications Low input bias current for high-impedance signal sources Wide supply voltage range for flexible design Fast slew rate and high gain bandwidth for accurate signal processing Compact surface-mount package for space-efficient PCB layouts Stable operation under industrial temperature ranges Suitable for instrumentation and embedded analog signal circuits Low-noise design for high-fidelity analog applications #MC34164D5R2G #ONSemiconductor #OperationalAmplifier #OpAmp #DualOpAmp #HighSpeedOpAmp #AnalogSignalProcessing #SensorInterface #DataAcquisition #ControlSystems #AudioProcessing #IndustrialElectronics #EmbeddedSystems #SOICPackage #SurfaceMount #ElectronicComponents #PCBDesign #PrecisionAmplifier #SignalConditioning

Connector Header Surface Mount, Right Angle 8 position 0.039" (1.00mm) The SM08B-SRSS-TB is a compact, right-angle, surface-mount terminal block connector designed for secure wire-to-board connections in a wide range of electronic applications. It features a spring-clamp mechanism that ensures reliable electrical contact while allowing easy insertion and removal of solid or stranded wires without the need for screws. The terminal block is constructed from high-temperature, flame-retardant thermoplastic, providing robust mechanical stability and durability in harsh environments. Its low-profile design, consistent contact pressure, and compact footprint make it ideal for industrial control panels, automation systems, consumer electronics, power supplies, and signal distribution boards where secure and maintenance-free wire connections are required. Engineering Specifications Manufacturer: Sullins Connector Solutions / TE Connectivity Part Number: SM08B-SRSS-TB Connector Type: Terminal Block, Right Angle Mounting Style: Surface Mount Actuation Method: Spring-Clamp Wire Size Accommodation: Small Gauge Solid and Stranded Wires Contact Material: Tin-Plated Copper Alloy Housing Material: High-Temperature Thermoplastic, Flame Retardant Operating Voltage: Standard Low-Voltage Electronics Current Rating: Suitable for Signal and Low-Power Connections Pitch: Standard 5 mm / 0.2 inch (SM Series Typical) Poles: 8 Positions Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Industrial Controls, Automation Equipment, Signal Distribution, PCB Wiring, Consumer Electronics, Power Supplies, Embedded Systems Key Features Reliable spring-clamp wire retention Maintenance-free, no screws required Compact, low-profile design Durable thermoplastic housing Easy PCB mounting and soldering Suitable for solid and stranded wires #SM08B #SM08B_SRSS_TB #SpringClampConnector #TerminalBlock #SurfaceMount #RightAngleConnector #WireToBoard #PCBConnector #IndustrialElectronics #Automation #EmbeddedSystems #ElectronicComponents #SignalDistribution #LowPowerConnector #CompactConnector

Headers & Wire Housings PICOFLEX 10P HDR LOPRO SN Connector Header Through Hole 10 position 0.050" (1.27mm) The 0903250010 is a 10-position vertical through-hole header connector from the Picoflex PF-50 series by Molex. It features a 1.27 mm pitch, straight orientation, and is designed for reliable board-to-cable interconnections in compact electronic equipment. The connector is commonly used with Picoflex ribbon cable assemblies in industrial, consumer, telecommunications, and embedded electronic applications. It provides a space-saving solution while maintaining dependable electrical and mechanical performance. Key Features 10 contacts (single-row configuration) 1.27 mm (0.050") contact pitch Vertical (straight) through-hole mounting Male header design Compatible with Molex Picoflex cable connectors Current rating up to 1.2 A per contact Voltage rating up to 250 V Operating temperature range: -40°C to +105°C Low contact resistance (15 mΩ max) High insulation resistance (1000 MΩ min) RoHS compliant Compact footprint for high-density PCB designs Suitable for signal and low-power applications #CommonPartsLibrary #0903250010 #Molex #Picoflex #Connector #HeaderConnector #ThroughHole #PCBConnector #BoardToCable #Interconnect #Electronics #EmbeddedSystems #IndustrialElectronics #RibbonCable #1_27mmPitch #ElectronicComponents