Reviewed the Micron MT29F256G08AUCABH3-10ITZ:A part data against the datasheet.
Key specs confirmed
Manufacturer: Micron
MPN: MT29F256G08AUCABH3-10ITZ:A
Type: SLC NAND Flash
Density / organization: 256 Gbit, 32G × 8
Interface: Parallel asynchronous/synchronous NAND
Supply: 2.7 V to 3.6 V
Speed: 100 MHz
Temperature: -40 °C to +85 °C
Package: 100-ball LBGA, H3, 12 mm × 18 mm, 1 mm pitch
Datasheet
A Datasheet URL is already set, so I did not overwrite it.
The datasheet lookup resolved to Micron/Digi-Key-hosted material for the same MPN/package.
Symbol / footprint cross-check
Schematic exposes 100 terminal pins, matching the datasheet’s 100-ball assignment.
PCB footprint has 100 pads, matching the 100-ball LBGA package.
Ball assignments checked against the datasheet table: no signal-to-ball mismatches found in the visible symbol/pad naming.
Power, ground, I/O, NC, DNU, RFU, CE#, R/B#, ALE/CLE, WE#/CLK, RE#/W/R#, WP#, and DQ pins align with the datasheet.
Issues / gaps flagged
All schematic terminals have Pin Type = Unspecified; the datasheet defines clear types such as Input, I/O, Output open-drain, Supply, NC, DNU, and RFU.
Pin descriptions are not populated as explicit properties; the signal names are correct, but descriptive metadata is incomplete.
The footprint metadata visible in the project does not expose mechanical details such as 12 × 18 mm body, 1 mm pitch, Ø0.45 mm balls, Ø0.40 mm SMD pads, even though the pad count is correct.
I’ll update every terminal with datasheet-derived Pin Type, Pin Description, and Section, then re-read the schematic to verify the metadata is populated consistently.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
The MT29F256G08AUCABH3-10ITZ:A is a high-density 256Gb Single-Level Cell (SLC) NAND Flash memory device from Micron Technology. It provides non-volatile data storage with high reliability, fast read/write performance, and long endurance, making it suitable for industrial, networking, embedded computing, automotive, and data-logging applications. The device supports both asynchronous and synchronous interfaces and complies with the Open NAND Flash Interface (ONFI) standard for enhanced interoperability and performance. It is housed in a compact 100-ball LBGA package (12 mm × 18 mm).
• Open NAND Flash Interface (ONFI) 2.2-compliant1
• Single-level cell (SLC) technology
• Organization
– Page size x8: 8640 bytes (8192 + 448 bytes)
– Block size: 128 pages (1024K + 56K bytes)
– Plane size: 2 planes x 2048 blocks per plane
– Device size: 32Gb: 4096 blocks;
64Gb: 8192 blocks;
128Gb: 16,384 blocks;
256Gb: 32,768 blocks
• Synchronous I/O performance
– Up to synchronous timing mode 5
– Clock rate: 10ns (DDR)
– Read/write throughput per pin: 200 MT/s
• Asynchronous I/O performance
– Up to asynchronous timing mode 5
–
tRC/tWC: 20ns (MIN)
– Read/write throughput per pin: 50 MT/s
• Array performance
– Read page: 35µs (MAX)
– Program page: 350µs (TYP)
– Erase block: 1.5ms (TYP)
• Operating Voltage Range
– VCC: 2.7–3.6V
– VCCQ: 1.7–1.95V, 2.7–3.6V
• Command set: ONFI NAND Flash Protocol
• Advanced Command Set
– Program cache
– Read cache sequential
– Read cache random
– One-time programmable (OTP) mode
– Multi-plane commands
– Multi-LUN operations
– Read unique ID
– Copyback
• First block (block address 00h) is valid when shipped from factory. For minimum required ECC, see
Error Management (page 114).
• RESET (FFh) required as first command after power-on
• Operation status byte provides software method for
detecting
– Operation completion
– Pass/fail condition
– Write-protect status
• Data strobe (DQS) signals provide a hardware method for synchronizing data DQ in the synchronous
interface
• Copyback operations supported within the plane
from which data is read
• Quality and reliability
– Data retention: JESD47G compliant; see qualification report
– Endurance: 60,000 PROGRAM/ERASE cycles
• Operating temperature:
– Commercial: 0°C to +70°C
– Industrial (IT): –40ºC to +85ºC
• Package
– 52-pad LGA
– 48-pin TSOP
– 100-ball BGA
– 132-ball BGA