Ambient Light Sensors VEML7700-TT SENSOR-SMD_EML7700-TT LCSC Part Number: C1850416 JLCPCB Part Class: Extended Part Manufactured by VISHAY(威世)

High Accuracy Ambient Light Sensor with I2C Interface Optical Sensor Ambient 545nm I2C 4-SMD, J-Lead #CommonPartsLibrary #sensor #Transducer #Optical-Sensor #Ambient-Light #IR #UV-Sensor #VEML7700

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Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-2-N32R16V is a powerful dual-core microcontroller module that integrates wireless connectivity, large memory, and hardware acceleration for AI and signal processing tasks. It is particularly suited for applications requiring edge AI, voice recognition, and high-speed data processing, while still maintaining low power consumption. Dual-core Xtensa LX7 CPU Up to 240 MHz Includes vector instructions for AI and DSP workloads Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE) N32 → 32 MB external Flash R16 → 16 MB PSRAM Built for memory-intensive applications #commonpartslibrary #transceiver #wireless #rf

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi + Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 32-bit processor running up to 240 MHz. This module integrates 16 MB Flash memory and 8 MB PSRAM, making it suitable for memory-intensive applications such as AI, image processing, and advanced IoT systems. It also includes an onboard PCB trace antenna, RF circuitry, crystal oscillator, and power management components—allowing designers to quickly integrate wireless connectivity into compact embedded designs. Key Features Processing & Memory Dual-core Xtensa LX7 CPU, up to 240 MHz 384 KB ROM, 512 KB SRAM + 16 KB RTC SRAM 16 MB Flash (Quad SPI) 8 MB PSRAM (Octal/Quad SPI) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 (LE) + Mesh support Integrated PCB antenna Peripherals & Interfaces Up to 36 GPIOs Interfaces: UART, SPI, I2C, I2S, PWM, ADC, USB OTG Built-in USB Serial/JTAG support Supports touch sensors, timers, watchdogs, CAN (TWAI) Electrical Characteristics Supply voltage: 3.0 V – 3.6 V TX power: up to ~20.5 dBm RX sensitivity: ~-103.5 dBm Operating temp: −40 °C to +65 °C (typical) Advanced Capabilities Optimized for AI acceleration (vector instructions) Suitable for voice recognition, image processing, and edge AI Low-power modes for battery-operated devices| Typical Applications IoT devices and sensor hubs Smart home & home automation AIoT (voice/image recognition) Industrial automation & monitoring Wearables and health devices USB-connected embedded systems #Module #RF-Transceiver #ESP32-S3

Accelerometer, Gyroscope, Magnetometer, 9 Axis Sensor I2C, SPI, UART Output The BNO085 is a high-performance 9-axis absolute orientation sensor system-in-package (SiP) that integrates a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a low-power ARM Cortex-M0+ microcontroller running CEVA/Hillcrest SH-2 sensor fusion firmware. It provides accurate real-time orientation, motion tracking, and activity detection while offloading complex sensor fusion calculations from the host processor. The device is widely used in robotics, AR/VR systems, wearables, drones, IoT devices, and navigation applications. Key Features 9-axis motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in SH-2 sensor fusion engine for accurate orientation tracking ARM Cortex-M0+ processor for onboard motion processing Outputs quaternion, rotation vector, linear acceleration, gravity vector, angular velocity, and magnetic field data Advanced motion detection including tap, step, shake, and significant motion detection Activity classification and stability detection capabilities Low-latency rotation vectors optimized for AR/VR applications Supports I²C, SPI, and UART communication interfaces Configurable output data rates and timestamps Low-power operation suitable for battery-powered devices Compact 28-pin LGA package (5.2 mm × 3.8 mm) Operating temperature range: -40°C to +85°C Backward compatible with BNO080 designs while adding support for future application-specific libraries Applications Robotics and autonomous systems Virtual Reality (VR) and Augmented Reality (AR) Wearable devices and fitness trackers Drones and UAVs Head-mounted displays (HMDs) Industrial motion tracking IoT and smart devices Navigation and positioning systems #BNO085 #IMU #9AxisSensor #MotionTracking #SensorFusion #OrientationSensor #Robotics #AR #VR #IoT #Wearables #EmbeddedSystems #CEVA #HillcrestLabs #MotionDetection #Quaternion #InertialMeasurementUnit

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

Wi-Fi® 4 + Bluetooth® 5 LE System-in-Package (SiP) MCU – Highly integrated 2.4 GHz wireless System-in-Package (SiP) featuring an ESP32-S3 dual-core Xtensa® LX7 microcontroller for IoT devices, smart home products, AIoT, edge computing, industrial automation, HMI, wearable devices, and embedded wireless applications. Operates at up to 240 MHz with 8 MB embedded Flash and 2 MB embedded PSRAM, eliminating the need for external memory and reducing PCB size. Supports Wi-Fi 802.11 b/g/n and Bluetooth® 5 LE (including Long Range and 2 Mbps PHY), with up to +20 dBm transmit power and 150 Mbps Wi-Fi data rate. Features native USB 2.0 OTG, vector instructions for AI acceleration, 45 programmable GPIOs, SPI, I²C, I²S, UART, USB, RMT, LCD/Camera interface, PWM, TWAI® (CAN), ADC, touch sensing, AES-XTS, SHA, RSA, ECC, HMAC, secure boot, Flash encryption, and a true random number generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +85°C temperature range, and is housed in a compact 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3PICO1N8R2 #ESP32S3 #WirelessMCU #SystemInPackage #WiFi #Bluetooth5LE #DualCore #XtensaLX7 #USBOTG #AIoT #EmbeddedSystems

IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad The ESP32-S3R8 is a high-performance wireless microcontroller system-on-chip manufactured by Espressif Systems. This device integrates dual-core processing, Wi-Fi connectivity, Bluetooth Low Energy communication, embedded memory resources, and advanced peripheral interfaces within a compact package optimized for embedded and IoT applications. The microcontroller is based on the Xtensa LX7 architecture and is designed to support edge computing, wireless communication, human-machine interfaces, audio processing, AI acceleration, and low-power connected systems. The ESP32-S3R8 includes integrated flash and RAM resources, advanced security functions, vector instruction acceleration, and extensive GPIO/peripheral capability for modern embedded development. The device is widely used in IoT devices, industrial automation systems, smart home equipment, wearable electronics, wireless sensor nodes, edge AI applications, USB-enabled embedded systems, and portable consumer electronics. Its integrated wireless functionality and high processing performance reduce external component count while simplifying system-level design for connected embedded platforms. Engineering Specification Device Type Wireless microcontroller system-on-chip Processor Architecture Dual-core Xtensa LX7 microcontroller architecture Wireless Connectivity Integrated Wi-Fi and Bluetooth Low Energy communication Processing Features High-performance embedded processing with vector instruction acceleration Memory Resources Integrated RAM and embedded memory architecture Communication Interfaces SPI I2C UART I2S USB PWM ADC GPIO interfaces Wireless Features Secure wireless networking and low-power communication support USB Capability Integrated USB communication and device functionality AI and DSP Features Vector instruction support for AI and digital signal processing workloads Security Features Hardware encryption and secure boot support Power Characteristics Low-power operating modes for battery-powered systems Package Type QFN surface-mount package Mounting Style Surface mount technology Applications IoT devices Wireless embedded systems Industrial automation Smart home electronics Edge AI applications Wearable devices Consumer electronics USB-enabled systems Sensor networks Embedded communication platforms Manufacturer Espressif Systems #commonpartslibrary #esp32 #esp32s3 #wirelessmcu #microcontroller #iot #embeddedhardware #wifi #bluetoothlowenergy #espressif #surfaceountcomponents #electronicsdesign #edgeai #wirelesscommunication #consumerelectronics

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-S3-WROOM-1-N8R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, designed for advanced IoT, edge AI, smart devices, industrial automation, and embedded applications. It is based on the ESP32-S3 SoC featuring a dual-core Xtensa® LX7 processor running up to 240 MHz, integrated wireless connectivity, and enhanced AI acceleration capabilities. The N8R8 variant includes 8 MB Flash memory and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive applications such as machine learning, image processing, graphical user interfaces, and data logging. Key Features Dual-core 32-bit Xtensa LX7 CPU operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 LE (Low Energy) support 8 MB Flash memory 8 MB Octal SPI PSRAM Vector instructions and hardware acceleration for AI/ML workloads Integrated PCB trace antenna USB OTG and USB Serial/JTAG support Rich peripheral set including: GPIO ADC UART SPI I²C I²S PWM USB Operating voltage: 3.0 V to 3.6 V Wireless data rates up to 150 Mbps RF output power up to 20.5 dBm High receiver sensitivity down to –104.5 dBm Surface-mount 41-pin module package Industrial operating temperature range up to -40°C to +85°C (module-dependent specification) #Module #RF-Transceiver #Esp32

WiFi 802.11a/b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace The ESP32-S3-WROOM-1-N8R2 is a compact, low-power Wi-Fi and Bluetooth® Low Energy (BLE) module developed by Espressif Systems. It is based on the ESP32-S3 system-on-chip (SoC), which integrates a dual-core Xtensa® LX7 processor optimized for high performance and edge AI processing. This module includes 8 MB of external SPI flash memory and 2 MB of PSRAM, enabling efficient handling of memory-intensive applications such as graphical interfaces, buffering, and embedded machine learning workloads. Designed for flexibility and scalability, the module integrates RF components, power management, and a wide range of peripherals into a surface-mount package suitable for IoT, industrial, and consumer electronics applications. Key Features Dual-core Xtensa® LX7 processor operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 Low Energy support Embedded 8 MB SPI flash memory Integrated 2 MB PSRAM AI acceleration through vector instruction support USB OTG (full-speed) capability Multiple low-power operating modes Built-in hardware security features Extensive peripheral interface support Functional Overview The module consists of several integrated subsystems, including a dual-core processing unit, memory subsystem (flash and PSRAM), RF subsystem for wireless communication, peripheral interface controllers, power management circuitry, and a hardware-based security engine. Electrical Characteristics Operating voltage range: 3.0 V to 3.6 V (typical 3.3 V) Operating temperature range: -40°C to +85°C RF operating frequency: 2.4 GHz Current consumption varies depending on operating mode, ranging from microamp levels in deep sleep to hundreds of milliamps during active transmission Processor and Memory The module features a dual-core Xtensa® LX7 CPU capable of running at frequencies up to 240 MHz. It includes approximately 512 KB of internal SRAM, supplemented by 8 MB of external flash memory and 2 MB of PSRAM for extended data storage and processing. Wireless Connectivity The ESP32-S3-WROOM-1-N8R2 supports Wi-Fi communication compliant with 802.11 b/g/n standards in the 2.4 GHz band. It also supports Bluetooth 5 Low Energy for short-range wireless communication. The module includes an integrated PCB antenna and supports RF output power up to approximately +20 dBm. Peripheral Interfaces The module provides a wide range of interfaces, including general-purpose input/output (GPIO) pins, SPI, I2C, UART, and I2S for audio applications. It also supports PWM for LED control, a 12-bit analog-to-digital converter (ADC), and USB OTG functionality. Pin functions are multiplexed to maximize flexibility. Power Management Power efficiency is achieved through multiple operating modes, including active mode, modem sleep, light sleep, and deep sleep. The module includes an RTC subsystem for low-power timekeeping and supports dynamic frequency scaling to optimize performance and energy consumption. Security Features The module incorporates several hardware-based security mechanisms, including secure boot, flash encryption, and digital signature verification. It also includes a hardware random number generator and cryptographic accelerators supporting AES, SHA, RSA, and ECC algorithms. Mechanical Characteristics The module is designed for surface-mount integration and measures approximately 18 mm by 25.5 mm. It includes an onboard PCB antenna and is suitable for compact embedded designs. Pin Configuration Overview GPIO pins are multiplexed to support various peripheral functions such as analog inputs, communication interfaces, and control signals. Dedicated pins are provided for power supply, module enable, and boot configuration. Typical Applications Internet of Things (IoT) devices Smart home systems Industrial automation and monitoring Edge AI and machine learning applications Wearable electronics Audio and multimedia systems USB-enabled embedded devices Compliance The module is designed to meet Wi-Fi and Bluetooth standards and is compliant with RoHS requirements. Certification such as FCC or CE may apply depending on the specific module variant and deployment. Ordering Information The ESP32-S3-WROOM-1-N8R2 variant includes 8 MB of flash memory and 2 MB of PSRAM. #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

The ESP32-S3-WROOM-1-N16R8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems, built around the ESP32-S3 SoC. It integrates a dual-core Xtensa® LX7 processor running at up to 240 MHz, along with 16 MB Quad SPI Flash and 8 MB Octal SPI PSRAM, making it suitable for memory-intensive embedded, IoT, AIoT, multimedia, and edge AI applications. The module includes an onboard PCB antenna, RF matching circuitry, crystal oscillator, and flash/PSRAM, simplifying hardware design and reducing development time. Key Features Dual-core Xtensa LX7 CPU operating up to 240 MHz 16 MB onboard Flash memory 8 MB onboard Octal PSRAM for large buffers, graphics, and AI workloads 2.4 GHz Wi-Fi (IEEE 802.11 b/g/n) Bluetooth 5.0 Low Energy (BLE) Built-in support for AI acceleration and vector instructions for machine learning and signal processing applications Rich peripheral set including: GPIO UART SPI I²C I²S USB 2.0 OTG PWM ADC Touch sensing SD/MMC interface CAN (TWAI) Integrated USB Serial/JTAG debugging capability Supply voltage range: 3.0 V to 3.6 V Operating temperature: −40°C to +65°C Surface-mount module with integrated PCB antenna Supports secure boot, flash encryption, and hardware cryptographic acceleration for secure IoT devices. Typical Applications Smart home and IoT devices Edge AI and machine learning Voice assistants and speech recognition Industrial automation Human-machine interfaces (HMI) Wireless sensors and gateways Smart displays and touch panels Audio streaming and multimedia devices Robotics and connected products #RF-Transceiver #Module #ESP32

ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32

QFN40P500X500X55-41N-D http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en598760 8-bit Microcontrollers - MCU 64KB Flash, 4KB RAM, 1KB EEPROM, 12-bit ADC2, Vector Interrupts, DMA, MAP, DIA, DAC, Comp, PWM, CWG, HLT, WWDT, SCAN/CRC, ZCD, PPS, UART, SPI/I2C, IDLE/DOZE/PMD 0.55 Microchip PIC18F46K42-E/MV 579-PIC18F46K42-E/MV https://www.mouser.co.uk/ProductDetail/Microchip-Technology-Atmel/PIC18F46K42-E-MV?qs=HXFqYaX1Q2zCGlbiPY6VYQ%3D%3D PIC18F46K42-E/MV https://www.arrow.com/en/products/pic18f46k42-emv/microchip-technology?region=nac