NRF9151 Series 1 MB Flash 256 kB RAM DECT NR+/Cellular IoT SiP Transceiver #commonpartslibrary #integratedcircuit #wireless #transceiver #rf

XP Power 6W, 3000 VDC Isolated DC/DC Converter Module, Single Output Voltage 3.3V, ±1500mA, 24V Input Voltage, SIP XP_POWER DC/DC isolated Converter module *XP?POWER?ITQxxxxS?H*

XP Power 6W, 1000 VDC Isolated DC/DC Converter Module, Fully Regulated Single Output Voltage 3.3V, ±1300mA, 5V Input Voltage, SIP XP_POWER DC/DC isolated Converter module *XP?POWER?ITXxxxxSA*

Wi-Fi® 4 + Bluetooth® 5 LE System-in-Package (SiP) MCU – Highly integrated 2.4 GHz wireless System-in-Package (SiP) featuring an ESP32-S3 dual-core Xtensa® LX7 microcontroller for IoT devices, smart home products, AIoT, edge computing, industrial automation, HMI, wearable devices, and embedded wireless applications. Operates at up to 240 MHz with 8 MB embedded Flash and 2 MB embedded PSRAM, eliminating the need for external memory and reducing PCB size. Supports Wi-Fi 802.11 b/g/n and Bluetooth® 5 LE (including Long Range and 2 Mbps PHY), with up to +20 dBm transmit power and 150 Mbps Wi-Fi data rate. Features native USB 2.0 OTG, vector instructions for AI acceleration, 45 programmable GPIOs, SPI, I²C, I²S, UART, USB, RMT, LCD/Camera interface, PWM, TWAI® (CAN), ADC, touch sensing, AES-XTS, SHA, RSA, ECC, HMAC, secure boot, Flash encryption, and a true random number generator (TRNG) for secure embedded applications. Operates from a 3.0 V to 3.6 V supply, over a −40°C to +85°C temperature range, and is housed in a compact 56-pin QFN (7 × 7 mm) package. #EspressifSystems #ESP32S3PICO1N8R2 #ESP32S3 #WirelessMCU #SystemInPackage #WiFi #Bluetooth5LE #DualCore #XtensaLX7 #USBOTG #AIoT #EmbeddedSystems

Accelerometer, Gyroscope, Magnetometer, 9 Axis Sensor I2C, SPI, UART Output The BNO085 is a high-performance 9-axis absolute orientation sensor system-in-package (SiP) that integrates a 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and a low-power ARM Cortex-M0+ microcontroller running CEVA/Hillcrest SH-2 sensor fusion firmware. It provides accurate real-time orientation, motion tracking, and activity detection while offloading complex sensor fusion calculations from the host processor. The device is widely used in robotics, AR/VR systems, wearables, drones, IoT devices, and navigation applications. Key Features 9-axis motion sensing with integrated accelerometer, gyroscope, and magnetometer Built-in SH-2 sensor fusion engine for accurate orientation tracking ARM Cortex-M0+ processor for onboard motion processing Outputs quaternion, rotation vector, linear acceleration, gravity vector, angular velocity, and magnetic field data Advanced motion detection including tap, step, shake, and significant motion detection Activity classification and stability detection capabilities Low-latency rotation vectors optimized for AR/VR applications Supports I²C, SPI, and UART communication interfaces Configurable output data rates and timestamps Low-power operation suitable for battery-powered devices Compact 28-pin LGA package (5.2 mm × 3.8 mm) Operating temperature range: -40°C to +85°C Backward compatible with BNO080 designs while adding support for future application-specific libraries Applications Robotics and autonomous systems Virtual Reality (VR) and Augmented Reality (AR) Wearable devices and fitness trackers Drones and UAVs Head-mounted displays (HMDs) Industrial motion tracking IoT and smart devices Navigation and positioning systems #BNO085 #IMU #9AxisSensor #MotionTracking #SensorFusion #OrientationSensor #Robotics #AR #VR #IoT #Wearables #EmbeddedSystems #CEVA #HillcrestLabs #MotionDetection #Quaternion #InertialMeasurementUnit

DIP & SIP Switches, Switch, Gold Flash, Black Housing, PA9T, Auto-Insertable, 2 Switch, -40 85 C, DIP Switch, Alcoswitch DIP ADE Dip Switch SPST 2 Position Surface Mount Slide (Standard) Actuator 25mA 24VDC ADEN02STR04 #Switch

LED Circuit Board Indicator LED Circuit Board Indicator Bar - Single, SIP Yellow 2.1V 25mA Rectangle with Flat Top 8.89mm x 3.81mm Through Hole #commonpartslibrary #optoelectronic #circuitboard #tht

Bourns Isolated Resistor Array 10k +/-2% 4 Resistors, 1W Total, SIP package 4600X Through Hole #CommonPartsLibrary #Resistor #Resistor-array #4600X

+/-24V PGA I/P 24-BIT 256KSPS DA The ADAQ7767-1BBCZ is a high-performance, precision data acquisition (DAQ) µModule® system from Analog Devices. It integrates a 24-bit sigma-delta analog-to-digital converter (ADC), signal conditioning, and essential analog front-end components into a compact package. Designed for high accuracy and ease of use, it significantly reduces design complexity, layout effort, and noise sensitivity in precision measurement systems. This device is optimized for applications requiring high resolution, low noise, and excellent DC performance, such as industrial automation, instrumentation, and test equipment. Key Features 24-bit resolution sigma-delta ADC Integrated analog front end (AFE) Low noise, high dynamic range performance Programmable gain amplifier (PGA) Wide input bandwidth Low drift and high linearity SPI-compatible serial interface Internal reference and buffer options Compact system-in-package (SiP) design Electrical Characteristics Resolution: 24 bits Sampling Rate: Up to 256 kSPS (depending on configuration) Input Type: Differential Input Voltage Range: ±VREF (dependent on configuration) Signal-to-Noise Ratio (SNR): ~108 dB (typical) Total Harmonic Distortion (THD): Low distortion performance Reference Voltage: Internal or external supported Power Requirements Analog Supply Voltage (AVDD): 4.5 V to 5.5 V (typical) Digital Supply Voltage (DVDD): 1.8 V to 3.3 V Power Consumption: Optimized for precision applications Interface Communication: SPI-compatible serial interface Data Output: Serial digital output Control: Register-based configuration Package Information Package Type: µModule® (BGA) Package Code: BBCZ Mounting Type: Surface mount Compact footprint for space-constrained designs Operating Conditions Operating Temperature Range: -40°C to +85°C (industrial grade) Storage Temperature Range: -65°C to +150°C Applications Industrial process control Data acquisition systems Precision instrumentation Test and measurement equipment Medical instrumentation Energy monitoring systems Advantages Reduces PCB design complexity Minimizes noise and parasitic effects Factory-optimized signal chain performance Faster time-to-market

DIP Switches / SIP Switches 2 Position, SPST SMD DIP Switch #CommonPartsLibrary #Switch

The OSD6254-1G-IPM is a high-performance System-in-Package (SiP) from Octavo Systems that integrates the Texas Instruments AM6254 processor, 1 GB DDR4 memory, power management circuitry, and essential passive components into a compact 9 × 14 mm BGA package. Featuring a quad-core Arm Cortex-A53 processor with an integrated Cortex-M4F real-time core, it provides a highly integrated solution for industrial automation, IoT gateways, edge AI, HMI, and embedded Linux applications while significantly reducing PCB design complexity and time-to-market. Key Features: Quad-core Arm Cortex-A53 processor (up to 1.4 GHz) Integrated Arm Cortex-M4F real-time co-processor (up to 400 MHz) 1 GB DDR4 memory integrated within the SiP Integrated PMIC and required passive components Rich peripheral interfaces including Ethernet, USB, PCIe, CAN, UART, SPI, I²C, I²S, and SD/MMC Industrial operating temperature range: −40°C to +85°C Compact 9 × 14 mm, 500-ball BGA package Reduces PCB complexity, BOM count, and development time Optimized for embedded Linux, industrial control, HMI, IoT gateway, and edge AI applications #OctavoSystems #OSD6254 #AM6254 #ArmCortexA53 #CortexM4F #SystemInPackage #EmbeddedProcessor #IndustrialAutomation #EdgeAI #IoT #EmbeddedLinux #BGA

Isolated 1W 4:1 input DC/DC converter module, 4.5-18V input voltage, 3.3V output voltage, SIP Murata isolated isolation dc-dc converter step-down Converter*DCDC*Murata*NCS1SxxxxSC*

4 voltage divider network, dual terminator, SIP package R network divider topology R?Array?SIP*

Solid State Relay 20mA 6V DC-IN 2A 264V AC-OUT 4-Pin SIP Module #CommonPartsLibrary #Relay

Cellular IoT System-in-Package (SiP) integrating an Arm Cortex-M33 processor, LTE-M/NB-IoT modem, GNSS receiver, 1 MB Flash, 256 KB RAM, and an integrated power management system. It operates from a 3.0 V to 5.5 V supply, supports GPS, GLONASS, Galileo, and QZSS, and provides interfaces including UART, SPI, I²C, I²S, PWM, ADC, GPIO, and USB 2.0 in a compact SiP package. #CellularIoT #SiP #LTE_M #NB_IoT #GNSS #ArmCortexM33 #NordicSemiconductor #EmbeddedProcessor #LowPower #USB2_0 #UART #SPI #I2C

XP Power 6W, 1000 VDC Isolated DC/DC Converter Module, Fully Regulated Dual Output Voltage ±5V, ±600mA, 5V Input Voltage, SIP XP_POWER DC/DC isolated Converter module *XP?POWER?ITxxxxx*