Digital Signal Processors / Controllers (DSPs/DSCs) TMS320DM6431ZWT3 NFBGA-361_L16.0-W16.0-R19-C19-P0.80-BL LCSC Part Number: C2866110 undefined Manufactured by TI(德州仪器)

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320VC5510AZAV1 BGA-240_L15.0-W15.0-P0.80-TL_TI_ZAV0240A LCSC Part Number: C2871669 undefined Manufactured by TI(德州仪器)

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320VC5510AZAVA1 BGA-240_L15.0-W15.0-P0.80-TL_TI_ZAV0240A LCSC Part Number: C2860967 undefined Manufactured by TI(德州仪器)

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320VC5510AGBC1 BGA-240_L15.0-W15.0-P0.80-TL_TI_ZAV0240A LCSC Part Number: C2864575 undefined Manufactured by TI(德州仪器)

16 MHz ±15ppm Crystal 8pF 60 Ohms 4-SMD, No Lead The CX3225SB16000D0GZJC1, manufactured by Kyocera AVX, is a 16.000 MHz crystal oscillator element designed to provide precise frequency reference for microcontrollers, communication ICs, and digital systems. It belongs to the CX3225SB series, known for compact size and stable frequency performance. Key Characteristics Type: Quartz crystal (passive frequency component) Frequency: 16 MHz Load Capacitance: 8 pF Frequency Stability: ±15 ppm Frequency Tolerance: ±15 ppm Operating Mode: Fundamental ESR (Equivalent Series Resistance): ~60–80 Ω Mechanical Details Package: 4-SMD, no-lead (surface mount) Size: 3.2 mm × 2.5 mm (3225 package) Height: ~0.6 mm (low profile) Operating Conditions Temperature Range: −25°C to +85°C Mounting Type: Surface mount (SMT) Function (Simple Explanation) This component: Generates a stable clock signal (16 MHz) Acts as the timing reference for MCUs, processors, or RF modules Works together with internal oscillator circuits inside ICs Microcontroller clock sources (e.g., ESP32, STM32, AVR) Communication modules Embedded systems Consumer electronics IoT devices #CommonPartsLibrary #Crystal #Oscillator #resonator

Supervisor Open Drain or Open Collector 1 Channel SOT-23-5 The TPS382x family of supervisors provide circuit initialization and timing supervision, primarily for DSP and processor-based systems. During power on, RESET asserts when the supply voltage VDD becomes greater than 1.1V. Thereafter, the supply voltage supervisor monitors VDD and keeps RESET active low as long as VDD remains less than the threshold voltage, VIT−. An internal timer delays the return of the output to the inactive state (high) to make sure proper system reset. The delay time, td, starts after VDD has risen above the threshold voltage (VIT− + VHYS). When the supply voltage drops below the threshold voltage VIT−, the output becomes active (low) again. No external components are required. All the devices of this family have a fixed-sense threshold voltage, VIT–, set by an internal voltage divider. The TPS382x family also offers watchdog time out options of 200ms (TPS3820) and 1.6s (TPS3823, TPS3824, and TPS3828). • Power-on reset generator with a fixed delay time of 200ms (TPS3823, TPS3824, TPS3825, and TPS3828) or 25ms (TPS3820) • Manual reset input (TPS3820, TPS3823, TPS3825, and TPS3828) • Reset output available in active-low (TPS3820, TPS3823, TPS3824, and TPS3825), active-high (TPS3824 and TPS3825), and open drain (TPS3828) • Supply voltage supervision range: 2.5V, 3V, 3.3V, 5V • Watchdog timer (TPS3820, TPS3823, TPS3824, and TPS3828) • Supply current of 15μA (typical) • 5-pin SOT-23 package • Temperature range: −40°C to 85°C (−40°C to 125°C for TPS3823A-33) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #Supervisor

The TPS3839G33DBZT is an ultra-low-power voltage supervisor designed to monitor system supply rails and provide reliable reset signaling for microcontrollers, processors, FPGAs, and other digital systems. The device continuously supervises the supply voltage and asserts a reset output when the monitored voltage falls below the factory-programmed threshold, ensuring proper system startup, shutdown, and fault recovery. Its low quiescent current makes it particularly suitable for battery-powered, portable, and energy-efficient applications where power consumption is critical. The device features a precision voltage monitoring architecture with a fixed reset threshold optimized for nominal logic supply rails. It provides a stable reset output with an internally defined reset timeout period, eliminating the need for external timing components. The compact package and robust noise immunity make it ideal for embedded systems, industrial controls, consumer electronics, IoT devices, medical equipment, and wireless communication platforms. Key Features Ultra-low quiescent current operation Precision fixed-voltage supervision Factory-programmed reset threshold for logic supply monitoring Active-low reset output Internal reset timeout delay High threshold accuracy over temperature Fast response to undervoltage conditions Push-pull reset output configuration No external components required for operation Compact surface-mount package Wide operating temperature range High reliability and low power consumption Applications Microcontroller reset generation Embedded control systems Battery-powered electronics Industrial automation equipment IoT and wireless sensor nodes Portable medical devices Consumer electronics Data acquisition systems Power management subsystems Communication and networking equipment Electrical Characteristics Fixed supply voltage monitoring Precision undervoltage detection Low operating current Integrated reset timing circuitry Stable reset assertion during power-up and brownout conditions Noise-tolerant voltage supervision Reliable operation across specified temperature range Package Information Surface-mount package Compact footprint for space-constrained designs RoHS-compliant construction Suitable for automated assembly processes #commonpartslibrary #integratedcircuit #powersupervisor #voltagesupervisor #resetcontroller #powermanagement #embeddedsystems #microcontroller #lowpower #batterypowered #industrialelectronics #iot #electronicsdesign #semiconductor #texasinstruments

16 Bit Digital to Analog Converter 1 10-VSSOP The DAC80501MDGSR is a high-precision, single-channel digital-to-analog converter developed by Texas Instruments for industrial, instrumentation, and embedded control applications requiring accurate voltage output generation. The device integrates a low-drift voltage reference, precision output buffer, and serial peripheral interface communication into a compact low-power solution optimized for high-resolution signal generation. Designed for applications such as programmable power supplies, process control systems, automated test equipment, and sensor calibration, the device delivers excellent linearity, low noise performance, and stable output characteristics across varying environmental conditions. The integrated architecture minimizes external component requirements while maintaining high accuracy and long-term reliability. The converter supports rail-to-rail output operation and offers flexible reference configurations to accommodate different system architectures. Its SPI-compatible digital interface enables straightforward integration with microcontrollers, processors, and FPGA-based systems. Electrical Characteristics The device operates from a single analog supply and supports precision voltage output generation with monotonic performance across the full operating range. Integrated precision reference circuitry provides low temperature drift and stable output characteristics suitable for high-accuracy measurement and control systems. Low glitch energy, low offset error, and low gain error characteristics improve output stability during code transitions. The output amplifier is capable of driving moderate capacitive loads while maintaining signal integrity and settling performance. Interface and Control Communication is implemented through a high-speed SPI-compatible serial interface supporting standard synchronous digital communication protocols. The interface allows direct programming of DAC output codes and internal configuration registers. The device supports daisy-chain capable serial communication architecture for simplified expansion in multi-device systems. Internal registers provide control of reference operation, power management, and output configuration functions. Power Management The DAC80501MDGSR incorporates low-power operating modes intended for energy-sensitive applications. Integrated power-down functionality reduces current consumption during inactive system states while preserving configuration integrity. Internal circuitry is optimized for low quiescent current operation without compromising output precision or dynamic response performance. Package Information The device is supplied in a compact VSSOP surface-mount package suitable for space-constrained industrial and embedded designs. The package configuration supports automated assembly processes and standard PCB manufacturing techniques. Typical Applications Typical applications include industrial automation, programmable voltage sources, data acquisition systems, sensor simulation, instrumentation equipment, motor control systems, and precision calibration platforms. The device is particularly suitable for systems requiring stable and repeatable analog voltage generation with minimal external circuitry. #commonpartslibrary #integratedcircuit #analog #digital #converter

4/4 Transceiver Full MII, RMII 32-VQFN (5x5) ## Engineering Specification ## General Description The **LAN8770M-I/PRA** is a Microchip Technology single-port **100BASE-T1 Ethernet physical layer transceiver** designed for automotive, industrial, and embedded networking applications. It provides Ethernet communication over a single balanced twisted pair and is suitable for compact systems requiring reliable network connectivity, low-power operation, and standard MAC interface support. The device is commonly used in automotive electronic control units, infotainment systems, telematics modules, sensor nodes, industrial control systems, and embedded Ethernet hardware. ## Device Identification Manufacturer Part Number: **LAN8770M-I/PRA** Manufacturer: **Microchip Technology** Product Family: **LAN8770** Device Category: **Integrated Circuit** Device Type: **Ethernet PHY Transceiver** Ethernet Standard: **100BASE-T1** Interface Type: **MII and RMII** Mounting Type: **Surface Mount** Package Type: **VQFN** ## Functional Description The device functions as an Ethernet physical layer transceiver that connects a host controller or microcontroller MAC interface to a single-pair Ethernet physical medium. It handles the analog and digital PHY functions required for 100BASE-T1 communication, allowing embedded systems to transmit and receive Ethernet data over a single twisted pair cable. ## Network and Interface Description The **LAN8770M-I/PRA** supports 100 Mb/s single-pair Ethernet communication and provides MII and RMII host interface options. This allows integration with microcontrollers, processors, gateways, and network controllers that support standard Ethernet MAC interfaces. The device is intended for applications where compact Ethernet connectivity and reduced cabling complexity are required. ## Electrical Description The device is designed for low-voltage operation and supports multiple supply domains according to the manufacturer’s recommended operating conditions. Proper power sequencing, decoupling, reset handling, clocking, and reference layout should be implemented to maintain stable PHY operation and signal integrity. ## Package and Mechanical Description The component is supplied in a compact surface-mount **VQFN package**, suitable for dense printed circuit board assemblies. The package supports automated assembly and is appropriate for space-constrained automotive and industrial electronic designs. ## Control and Diagnostic Description The PHY supports management and configuration through standard control interfaces used in Ethernet designs. It provides status monitoring and configuration capability for link management, operating mode selection, and system-level diagnostics. These features allow the host controller to configure and monitor Ethernet link behavior during operation. ## Automotive and Industrial Suitability The **LAN8770M-I/PRA** is suitable for embedded systems requiring robust single-pair Ethernet communication. It is applicable to automotive networking, telematics, infotainment, advanced driver assistance systems, industrial Ethernet nodes, building automation, control modules, and other connected embedded platforms. ## Mounting and Assembly Description The component is intended for surface-mount PCB assembly using standard reflow soldering processes. PCB layout should follow Microchip’s hardware design guidance, including proper power supply decoupling, controlled impedance routing, short signal paths, grounding, and separation of sensitive analog and digital sections where applicable. ## Design Considerations The design should account for Ethernet signal integrity, single-pair cable interface requirements, common-mode noise control, EMC performance, supply filtering, oscillator or clock source requirements, reset timing, thermal performance, and package solderability. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Application Suitability The device is suitable for automotive Ethernet nodes, electronic control units, telematics modules, infotainment systems, sensor interfaces, industrial controllers, embedded gateways, connected equipment, and compact network-enabled hardware requiring 100BASE-T1 Ethernet PHY functionality. ## Hashtags #commonpartslibrary #integratedcircuit #ethernetphy #microchip #microchiptechnology #lan8770 #lan8770mipra #singlepairethernet #100baset1 #automotiveethernet #ethernettransceiver #phytransceiver #embeddednetworking #mii #rmii #vqfnpackage #smdcomponent #surfacemount #automotiveelectronics #industrialethernet #telematics #infotainment #embeddedhardware #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

N-Channel 30 V 161A (Tc) 140W (Tc) Surface Mount TO-252AA (DPAK) The IRLR7843TRPBF is an N-channel power MOSFET built on Infineon's HEXFET technology platform, originally developed by International Rectifier. It is designed as a low-voltage, high-current switching device intended for applications where minimizing conduction loss and maximizing efficiency are primary design goals. The part is particularly well suited to synchronous switching topologies, where pairs or arrays of MOSFETs alternately conduct to regulate power flow with minimal energy dissipation. This device targets high-density power conversion applications where board space is limited but current demands are substantial, such as notebook computer power delivery, point-of-load converters used in servers, and advanced telecom and datacom equipment. It is commonly found supporting synchronous buck converter stages that step down a higher input rail to a lower output voltage suitable for powering processors, memory, and other low-voltage digital logic. Its low on-resistance characteristic allows it to carry significant current while generating comparatively little resistive heating, which is essential in compact enclosures with constrained thermal budgets. The transistor is fabricated using a refined trench gate process that improves upon earlier HEXFET generations, offering reduced gate charge and lower switching losses alongside its low conduction resistance. This combination makes it effective in both the high-side and low-side positions of a synchronous switching cell, where fast, clean transitions reduce overlap losses and improve overall converter efficiency. The device also offers well-characterized avalanche energy ratings, giving designers confidence in its ruggedness when exposed to transient overvoltage events that can occur during switching, and it presents a very low gate impedance, allowing it to be driven efficiently by standard gate driver circuitry. Mechanically, the part is housed in a surface-mount power package with an exposed tab for enhanced thermal conduction to the host PCB, allowing heat generated during operation to be efficiently transferred away from the silicon die. This package style is widely used in power-dense designs where through-hole packages would be impractical. The device is supplied in a tape-and-reel format suitable for automated assembly and is compliant with RoHS material restrictions, reflecting current environmental and regulatory standards for electronic components. Spec Sheet Identification Part Number: IRLR7843TRPBF Device Family: HEXFET Power MOSFET Manufacturer: Infineon Technologies Functional Classification Device Type: Power MOSFET Channel Type: N-channel Technology: Trench-gate HEXFET (IR MOSFET legacy technology) Logic Level Compatibility: Logic-level gate drive compatible Electrical Characteristics Drain-to-Source Voltage Rating: Low-voltage class, optimized for sub-30V rail applications On-Resistance: Ultra-low on-resistance class Drain Current Capability: High continuous current class Gate Charge: Low gate charge, optimized for fast switching Gate Impedance: Ultra-low gate impedance Avalanche Characteristics: Fully characterized avalanche voltage and current rating Switching & Application Behavior Primary Application: Synchronous buck converter switching stages Suitable Position: High-side and low-side switch positions Target Use Cases: Point-of-load conversion, notebook power delivery, telecom/datacom power systems Thermal & Mechanical Package Type: Surface-mount power package with exposed thermal tab (DPAK-style) Mounting: Surface mount technology (SMT) Thermal Path: Tab-based conduction to PCB for heat dissipation Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active production Packaging Format Supply Format: Tape-and-reel, per part suffix designation #IRLR7843 #Infineon #HEXFET #PowerMOSFET #NChannelMOSFET #SynchronousBuck #PowerElectronics #DCDCConverter #PointOfLoad #PowerConversion #DPAK #SMTPackage #RoHSCompliant #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #PowerDensity #LowRDSon #DiscreteSemiconductor #commonpartslibrary #transistor

FLASH - NOR Memory IC 128Mb (16M x 8) SPI - Quad I/O, QPI, DTR 133 MHz 8-SOIC 128M-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI Winbond W25Q128JV is a 128-Mbit (16 MB) serial NOR Flash memory device designed for code and data storage in embedded systems. It supports standard SPI, Dual SPI, Quad SPI (QSPI), and Dual/Quad Peripheral Interface (DPI/QPI) modes, enabling high-speed data transfer rates up to 133 MHz clock operation and up to 532 MB/s equivalent throughput in Quad I/O DTR mode. The device supports Execute-In-Place (XIP), allowing processors and microcontrollers to run code directly from external flash memory without copying it to RAM. Features include 4 KB sector erase, 32 KB and 64 KB block erase, page programming, hardware/software write protection, security registers, JEDEC identification, SFDP support, suspend/resume operations, and low-power standby modes. Suitable for microcontrollers, FPGA configuration storage, IoT devices, industrial controllers, networking equipment, consumer electronics, and embedded systems requiring reliable non-volatile memory. Search Keywords: W25Q128JV, Winbond flash memory, SPI NOR Flash, QSPI Flash, Quad SPI memory, Serial Flash memory, 128Mbit Flash, 16MB Flash memory, Execute In Place XIP, external MCU flash, ESP32 flash memory, FPGA configuration memory, NOR flash storage, W25Q128, Dual SPI Flash, Quad I/O Flash, embedded nonvolatile memory, serial flash IC Hashtags: #W25Q128JV #Winbond #NORFlash #SPIMemory #QSPI #SerialFlash #FlashMemory #EmbeddedSystems #Microcontroller #ESP32 #FPGA #NonVolatileMemory #XIP #IoT #ElectronicsDesign #MemoryIC #FirmwareStorage #QuadSPI #EmbeddedHardware #ElectronicComponents

Other Processors and Microcontrollers (MCUs) PTBO134XXS-SOP16 SOP-16_L10.0-W3.9-P1.27-LS6.0-BL LCSC Part Number: C329423 JLCPCB Part Class: undefined Manufactured by PUOLOP(迪浦)

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320C5535AZAYA05 BGA-144_L12.1-W12.1-P0.80-BR_TMS320C5535AZHHA10 LCSC Part Number: C2873410 JLCPCB Part Class: undefined Manufactured by TI(德州仪器)

Humidity, Temperature 0 ~ 100% RH I2C ±1.8% RH 4 s Surface Mount The SHT41-AD1B-R3 is a high-precision digital humidity and temperature sensor developed by Sensirion. It integrates calibrated sensing elements, analog signal processing, and a digital communication interface within a compact surface-mount package optimized for space-constrained embedded applications. The device is designed for accurate environmental monitoring across industrial, consumer, HVAC, portable electronics, and IoT systems. The sensor utilizes Sensirion CMOSens® technology to provide stable long-term performance, fast response time, and excellent repeatability under varying environmental conditions. Factory calibration enables direct digital output without the need for external calibration circuitry. The integrated I²C interface simplifies system integration with microcontrollers and embedded processors. The SHT41-AD1B-R3 is engineered for low-power operation, making it suitable for battery-powered and energy-efficient designs. Its compact DFN package supports automated assembly processes and high-density PCB layouts. The device also incorporates advanced internal diagnostics and checksum protection to improve communication reliability and data integrity. Features High-accuracy relative humidity sensing High-accuracy temperature measurement Fully calibrated and linearized digital output I²C digital communication interface Low power consumption optimized for portable systems Fast response and measurement conversion time Excellent long-term stability and repeatability Integrated heater functionality for condensation mitigation Wide operating voltage range Compact surface-mount DFN package Factory-trimmed and tested performance High immunity to environmental stress and contamination Low drift over product lifetime Suitable for reflow soldering processes Electrical Characteristics Supply voltage supports low-voltage embedded systems Digital communication compatible with standard I²C hosts Low standby current consumption Optimized active measurement current Integrated CRC data protection for communication integrity Environmental Characteristics Wide operating temperature range Wide relative humidity operating range Designed for high reliability in industrial and consumer environments Resistant to moisture-induced performance degradation Supports long operational lifetime with stable calibration Package Information Compact DFN surface-mount package Moisture-sensitive device suitable for automated assembly RoHS compliant and halogen-free construction Tape-and-reel packaging configuration for production assembly Applications Environmental monitoring systems HVAC and climate control equipment Smart home and IoT devices Portable electronics Industrial automation systems Data loggers and instrumentation Weather monitoring equipment Indoor air quality monitoring Battery-powered sensor nodes Consumer electronic products #commonpartslibrary #sensor #temperature #humidity #environmentalsensor #i2c #embedded #industrial #iot #sensirion

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320DM642AZDK5 FCBGA-548_L23.0-W23.0-BL_ZDK LCSC Part Number: C2868865 undefined Manufactured by TI(德州仪器)

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320DM640AZNZ4 BBGA-548_L23.0-W23.0-P0.80-BL_TI_ZDK LCSC Part Number: C2879667 undefined Manufactured by TI(德州仪器)

6-Pin \"No Legs\" Cable with 10-pin micro-connector for Cortex processors Cable assembly, designed for ARM Cortex® SWD debugging and programming, featuring a 6-pin Tag-Connect™ Plug-of-Nails™ connector that mates with the TC2030 target footprint and a 10-pin FTSH-105 compatible ribbon connector. The cable supports SWD signals including VCC, SWDIO/TMS, SWCLK/TCK, SWO/TDO, nRESET, and GND for direct connection between compatible debuggers and target PCBs. #CableAssembly #DebugCable #ARMCortex #SWD #TagConnect #TC2030 #ProgrammingCable

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320C6748EZCE4 NFBGA-361_L13.0-W13.0-R19-C19-P0.65-TL LCSC Part Number: C2879137 undefined Manufactured by TI(德州仪器)