USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Through Hole, Right Angle The USB4085-GF-A is a USB Type-C receptacle connector designed for compact embedded and consumer electronic applications requiring USB connectivity and power delivery support. It provides a reversible plug interface compliant with USB Type-C mechanical specifications and is commonly used in portable devices, development platforms, industrial electronics, and power-enabled USB systems. This connector supports USB data communication and power connections through a surface-mount design optimized for automated PCB assembly. The device includes integrated through-hole shell stakes for enhanced mechanical retention and durability under repeated insertion cycles. Its compact footprint and standardized pin arrangement enable compatibility with modern USB Type-C implementations while maintaining reliable electrical and mechanical performance. The USB4085-GF-A is suitable for USB charging, data transfer, embedded systems, battery-powered devices, and general-purpose USB Type-C interface applications. Engineering Specification Connector Type USB Type-C Receptacle Connector USB Interface Standard USB Type-C compliant receptacle Mounting Style Surface-mount technology with through-hole shell retention tabs Contact Configuration Dual-row reversible USB Type-C contact arrangement Number of Contacts Twenty-four signal and power contacts Orientation Right-angle PCB mount Data Support USB data communication support compatible with USB Type-C applications Power Capability Supports USB power and charging applications Shielding Integrated metal shell shielding for EMI reduction and mechanical protection Mechanical Retention Reinforced through-hole shell stakes for connector stability and insertion durability Contact Material Copper alloy contacts with plated finish for conductivity and corrosion resistance Housing Material High-temperature thermoplastic suitable for reflow soldering Operating Temperature Range Industrial-grade operating temperature capability suitable for embedded electronic systems Assembly Compatibility Compatible with automated SMT reflow assembly processes Application Areas Portable electronics, embedded systems, industrial controllers, development boards, battery-powered devices, USB charging interfaces, and communication equipment #commonpartslibrary #connector #usbtypec #interface #powermanagement #embeddedhardware #electronics #usbconnector

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Through Hole The USB4960-00-C is a vertical USB Type-C® USB 2.0 receptacle connector manufactured by GCT (Global Connector Technology). It is designed for compact embedded systems, consumer electronics, industrial equipment, and IoT devices requiring a reliable USB Type-C interface for USB 2.0 data transfer and power delivery. The connector features a hybrid Surface Mount Technology (SMT) and Through-Hole (TH) shell stake design, providing excellent PCB retention and mechanical durability. It supports up to 240 W (48 V DC) power capability and is rated for 10,000 mating cycles, making it suitable for demanding applications. Key Features USB Type-C® USB 2.0 vertical receptacle 16 active contacts with 8 dummy contacts (24-position mechanical interface) Hybrid SMT signal pins with through-hole shell stakes for enhanced mechanical strength Supports up to 48 V DC and 240 W power capability Rated for 10,000 mating cycles Gold-plated copper alloy contacts for reliable electrical performance Shielded metal shell for improved EMI protection Operating temperature: -25°C to +85°C Features locating pegs, board guide, pick-and-place cap, and solder retention for automated assembly Ideal for embedded systems, industrial electronics, consumer devices, and USB charging applications. #USBTypeC #USB20 #ReceptacleConnector #VerticalConnector #SMT #ThroughHole #GCT #PowerConnector #DataConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics

Connector Header Through Hole 13 position 0.100" (2.54mm) pin header 1x13 2.54mm The TSW-113-07-F-S is a surface-mount, dual-row header designed for reliable board-to-board or board-to-wire connections in compact electronic assemblies. It is commonly used in applications where space efficiency, mechanical stability, and consistent electrical performance are required. The component features a low-profile design suited for automated assembly processes and is compatible with standard reflow soldering techniques. Configuration and Design This connector is configured as a dual-row header with a fine pitch layout, enabling high-density interconnections while maintaining signal integrity. The surface-mount termination style allows for direct placement onto printed circuit boards without the need for through-hole mounting, supporting modern manufacturing practices and reducing assembly time. Material and Construction The housing is typically constructed from a high-temperature thermoplastic material suitable for reflow soldering environments. Contacts are manufactured from a conductive alloy and are plated to enhance durability, corrosion resistance, and electrical conductivity. The plating material is selected to ensure long-term reliability under normal operating conditions. Electrical Characteristics The connector supports low-voltage signal transmission and is designed to maintain consistent contact resistance throughout its service life. It is suitable for general-purpose electronic applications where stable electrical connections are essential. Mechanical Properties The component is engineered to provide secure mating retention and resistance to mechanical stress during handling and operation. Its surface-mount design contributes to improved alignment and stability on the PCB, especially in high-vibration environments when properly soldered. Environmental Considerations The device is capable of operating within standard commercial temperature ranges and is designed to withstand typical environmental conditions encountered in electronic assemblies. Materials used are compliant with common industry standards for environmental safety and manufacturing. #commonpartslibrary #connector #header

Connector Header Surface Mount, Right Angle 15 position 0.049" (1.25mm) The 0532611571 is a wire-to-board crimp housing connector manufactured by Molex, belonging to the Mini-Lock series. It is designed for compact, high-reliability connections in power and signal applications. This connector supports secure mating with corresponding headers and is commonly used in consumer electronics, industrial equipment, and automotive systems where space-saving and reliable contact are required. Key Features Compact wire-to-board connector system Positive locking mechanism for secure mating Designed for crimp terminal insertion Suitable for both power and signal transmission Polarized housing to prevent misalignment Friction lock for retention stability Mechanical Characteristics Number of positions: 15 Pitch: 2.50 mm Mounting type: Free-hanging (in-line) Contact termination: Crimp Housing material: Thermoplastic (UL-rated) Color: Natural (typical) Electrical Characteristics Rated voltage: Up to 250 V Current rating: Up to 3 A per contact (dependent on wire gauge and terminals used) Contact resistance: Low resistance design for reliable conduction Insulation resistance: High insulation performance Environmental Characteristics Operating temperature range: -40°C to +105°C RoHS compliant Suitable for standard environmental conditions in electronic assemblies Compatible Components Mating headers: Molex Mini-Lock series headers (2.50 mm pitch) Crimp terminals: Molex Mini-Lock crimp terminals (e.g., 50212 series) Applications Consumer electronics Industrial control systems Automotive electronics Power distribution within compact devices #commonpartslibrary #connector

Voltage Level Translator Bidirectional 1 Circuit 2 Channel 26Mbps 8-XSON (1.35x1) The TCA39416DTWR is a high-performance LED driver and multiplexer IC designed for precise control of multi-channel lighting applications. It integrates constant-current drivers, digital dimming capability, and multiplexing functionality to efficiently manage a large array of LEDs in industrial, automotive, display, and general-purpose lighting systems. The device supports high-speed operation and flexible channel configuration, ensuring uniform brightness control, low electromagnetic interference, and robust performance in space-constrained designs. Its compact surface-mount package and integrated control features make it ideal for embedded lighting solutions requiring reliable, accurate, and scalable LED management. Engineering Specifications Manufacturer: Texas Instruments Part Number: TCA39416DTWR Device Type: LED Driver and Multiplexer IC Channel Count: Multi-Channel LED Control Driver Type: Constant-Current LED Driver Dimming Control: Digital PWM Dimming Supported Multiplexing: Integrated Multiplexer Functionality Input Interface: Digital Control Inputs Output Configuration: Sinking LED Channels Supply Voltage Range: Wide Operating Range Switching Frequency: High-Speed LED Operation Thermal Management: Efficient Power Dissipation Design Package Type: TSSOP Surface-Mount Package Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Industrial LED Lighting, Automotive Light Arrays, Display Backlighting, Status Indicators, Embedded LED Systems, Digital Signage, Instrumentation Panels, Multi-Channel LED Control Key Features Multi-channel constant-current LED drivers Integrated digital dimming via PWM control Built-in multiplexing for efficient channel management Compact surface-mount package for PCB integration High-speed operation for flicker-free lighting Low power consumption and thermal optimization Reliable performance in industrial and automotive environments Uniform brightness control across channels Flexible configuration for scalable LED arrays Designed for embedded lighting and display applications #TCA39416DTWR #TexasInstruments #LEDDriver #MultiplexerIC #MultiChannelLED #PWMDimming #EmbeddedLighting #IndustrialElectronics #AutomotiveLighting #DisplayBacklight #LEDControl #SurfaceMountIC #ElectronicComponents #PCBDesign #LEDArray #HighSpeedLED #IndustrialGrade #SignalControl #PowerEfficient #LightingElectronics

Air Quality Sensor CO2 Sensor 2.5V/3.3V/5V 20-Pin SMD EP T/R The SCD41-D-R1 is a miniature photoacoustic carbon dioxide sensor module developed by Sensirion for high-accuracy environmental sensing applications. The device integrates a CO₂ sensing element, temperature sensor, humidity sensor, optical components, calibration memory, and digital signal processing into a compact surface-mount package suitable for embedded systems and portable electronics. The sensor utilizes photoacoustic sensing technology to provide precise carbon dioxide concentration measurements while maintaining low power consumption and long-term stability. Integrated humidity and temperature sensing capabilities enable environmental compensation and simplify system integration by reducing the need for external sensors. The SCD41 communicates through a standard I²C digital interface and supports automatic self-calibration functions for reliable long-term operation. Its compact footprint and low energy requirements make it suitable for battery-powered devices, smart building systems, HVAC equipment, indoor air quality monitoring systems, and IoT applications. The module is factory calibrated and designed for continuous monitoring of indoor air quality conditions. The integrated architecture minimizes external component requirements while enabling accurate sensing performance across a wide operating range. Key Features Photoacoustic CO₂ sensing technology Integrated temperature and humidity sensing High accuracy carbon dioxide measurement I²C digital communication interface Low power consumption operation Automatic self-calibration support Compact surface-mount package Factory calibrated output Long-term measurement stability Optimized for indoor air quality applications Low-profile PCB mounting design RoHS and halogen-free compliant Electrical Characteristics Low-voltage supply operation Low average current consumption suitable for portable devices Integrated digital signal processing Non-volatile calibration memory Standard I²C communication compatibility Stable operation across industrial environmental conditions Mechanical Characteristics Compact SMD package for space-constrained applications Surface-mount assembly compatible Low-profile package structure Integrated optical cavity and sensing chamber Moisture-sensitive device requiring controlled handling during assembly Functional Characteristics Real-time carbon dioxide concentration monitoring Simultaneous temperature and humidity measurement Automatic environmental compensation Continuous and periodic measurement modes Fast startup and measurement response Long operational lifetime with stable calibration Optimized airflow design for accurate sensing Suitable for continuous indoor environmental monitoring Typical Applications Indoor air quality monitoring systems Smart thermostats and HVAC controllers Building automation equipment Demand-controlled ventilation systems Portable environmental monitoring devices Smart home and IoT products Air purification systems Occupancy and ventilation monitoring Battery-powered sensing devices Consumer and industrial environmental monitoring equipment #commonpartslibrary #sensor #airquality

Optical Sensor Through-Beam 0.197" (5mm) PCB Mount The EE-SX4081 specification defines the engineering requirements for a slot-type photomicrosensor designed for non-contact object detection and position sensing in electronic and electromechanical systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure accurate optical sensing, reliable switching performance, and long-term operational stability. The component is intended for use in industrial automation, office equipment, consumer electronics, and embedded control systems requiring precise detection of object presence, motion, or position. The integrated infrared emitter and phototransistor receiver provide dependable sensing through interruption of the optical path, enabling high-speed, contactless detection in compact system designs. Engineering Requirements The photomicrosensor shall be manufactured using qualified optoelectronic components and controlled production processes to ensure consistent sensing performance, mechanical integrity, and long service life. The optical assembly shall maintain accurate alignment between the emitter and receiver to provide stable detection characteristics throughout the specified operating conditions. Electrical characteristics shall provide reliable switching response, stable output behavior, and low power consumption while maintaining consistent sensitivity across the intended operating voltage and temperature ranges. The sensor shall exhibit reliable performance under normal ambient light conditions and shall maintain signal integrity during continuous operation. Mechanical construction shall ensure precise slot dimensions, secure mounting capability, and resistance to vibration, mechanical shock, and thermal cycling encountered during normal operation. The package shall be suitable for printed circuit board assembly and shall withstand standard soldering and handling processes without degradation. Workmanship shall be free from defects including contamination, optical misalignment, package damage, corrosion, or structural irregularities that could affect sensing accuracy or reliability. Inspection, validation, and testing shall be performed using calibrated equipment and controlled quality procedures to verify compliance with engineering requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical specifications, optical performance data, qualification reports, inspection records, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete traceability throughout the product lifecycle. Revision Control Any modification to this specification shall be processed through the formal engineering change management system. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #Photomicrosensor #OpticalSensor #SlotSensor #IndustrialAutomation #EmbeddedSystems #Optoelectronics #QualityAssurance #EngineeringDocumentation #ElectronicComponents

Connector Header Surface Mount 10 position 0.050" (1.27mm) It is a 2-row, 10-position (2×5) male pin header with a 1.27 mm (0.050″) pitch, commonly used in high-density PCB designs. The connector features a surface-mount (SMT) configuration and an unshrouded design, making it suitable for applications where space is limited and flexible mating is required. Pitch: 1.27 mm (fine pitch for compact layouts) Positions: 10 contacts (dual row) Mounting Type: Surface-mount (SMT) Contact Type: Male pins (square post) Contact Material: Phosphor bronze with gold plating (good conductivity & corrosion resistance) Current Rating: ~3.4 A per contact Operating Temperature: −55 °C to +125 °C Insulator Material: LCP (high-temperature, SMT-compatible plastic) Mating Pin Length: ~3.05 mm Unshrouded header → easier alignment flexibility but no polarization protection Dual-row layout → increases connection density Cuttable strip → can be customized to shorter lengths Gold-plated contacts → improves durability for repeated mating cycles Board-to-board interconnections Embedded systems and compact electronics Industrial control and automation Telecommunications and consumer devices #CommonPartsLibrary #Connector #FTSH

Charger IC Lithium Ion/Polymer 16-WQFN (3x3) The BQ25302RTER is a highly integrated single-cell lithium-ion and lithium-polymer battery charger and power-path management IC developed by Texas Instruments. The device is optimized for compact portable and wearable applications requiring efficient battery charging from USB or low-voltage DC power sources. It integrates a switching charger, power-path management, system voltage regulation, battery FET, and protection features into a compact package suitable for space-constrained designs. The device supports programmable charging current and voltage regulation while maintaining high power conversion efficiency through its switching charger architecture. Integrated power-path management allows the system load to operate simultaneously while charging the battery, improving system reliability and startup behavior when the battery is deeply discharged or absent. The BQ25302RTER includes input current limiting, thermal regulation, battery temperature monitoring support, and multiple safety timers to ensure safe charging operation. The charger automatically manages preconditioning, fast charging, charge termination, and recharge cycles for lithium-based battery chemistries. The device also supports USB-compliant input operation and includes configurable features through an I2C-compatible interface. Its compact WQFN package and high integration level reduce external component count and PCB area, making it suitable for wearable electronics, portable medical devices, IoT products, handheld instruments, wireless accessories, and battery-powered embedded systems. Electrical Characteristics Input operating voltage supports standard USB and low-voltage DC input sources suitable for portable electronics applications. Supports single-cell lithium-ion and lithium-polymer battery charging with programmable charge voltage regulation. Integrated high-efficiency switching charger architecture minimizes power dissipation and improves thermal performance compared to linear chargers. Programmable fast-charge current supports flexible battery capacity scaling and application-specific charging requirements. Integrated power-path management allows simultaneous battery charging and system power delivery. Includes programmable input current limiting to support USB current compliance and adapter protection. Automatic charge cycle management includes precharge, fast charge, termination, and recharge operation. Supports battery temperature qualification using external thermistor monitoring. Integrated thermal regulation dynamically reduces charge current during high-temperature operating conditions. Low quiescent current operation improves standby battery life in portable products. Protection Features Integrated overvoltage protection for input power safety. Battery overcurrent and short-circuit protection enhance system reliability. Thermal shutdown circuitry protects the device during excessive junction temperature conditions. Safety timers monitor charging duration and prevent abnormal charging operation. Input current limiting protects USB ports and weak power adapters from overload conditions. Undervoltage lockout prevents improper operation during insufficient input supply conditions. Interface and Control I2C-compatible serial interface enables configuration and monitoring of charger parameters. Status reporting supports system-level battery and charging management. Programmable charging parameters allow firmware-controlled optimization for different battery chemistries and capacities. Interrupt and status functions support embedded power management architectures. Package Information Supplied in a compact WQFN package optimized for portable and space-constrained PCB layouts. Package design supports efficient thermal dissipation and automated surface-mount assembly processes. RoHS-compliant and suitable for modern lead-free manufacturing requirements. Typical Applications Wearable electronics Wireless earbuds and audio accessories Portable medical devices IoT and embedded battery-powered systems Handheld consumer electronics Portable instrumentation Rechargeable sensor modules Compact USB-powered battery charging systems #CommonPartsLibrary #IntegratedCircuit #PowerManagement #battery charger

Isolated Module DC DC Converter 2 Output 15V -15V 170mA, 170mA 4.5V - 9V Input The REC5-0515DRW/H6/C/SMD-R specification defines the engineering requirements for an isolated DC-DC converter module designed for regulated power conversion in compact electronic systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure stable voltage conversion, reliable isolation, and long-term operational performance. The device is intended for use in embedded systems, industrial control equipment, communication modules, and distributed power architectures where isolated power rails are required. It provides regulated output power from a DC input source while maintaining galvanic isolation between input and output stages to enhance system safety and signal integrity. Engineering Requirements The power module shall be manufactured using controlled electronic assembly processes and high-reliability components to ensure stable conversion efficiency and consistent output regulation. The internal architecture shall support isolated power transfer with stable performance under defined load and environmental conditions. Electrical characteristics shall ensure stable output regulation, low output ripple, and reliable transient response during load variation. The device shall maintain consistent performance across its intended operating temperature range and input voltage variation conditions. Isolation performance shall ensure electrical separation between input and output circuits to protect downstream electronics and maintain system safety requirements. The module shall withstand electrical stress conditions defined by applicable safety and reliability standards. Thermal performance shall support continuous operation without degradation of output regulation or reliability under rated operating conditions. The device shall be suitable for PCB mounting and shall maintain structural integrity during soldering and long-term operation. Workmanship shall be free from defects such as contamination, cracks, soldering defects, or structural irregularities that could affect electrical performance or mechanical reliability. Manufacturing and inspection shall be performed using controlled processes and calibrated equipment. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established engineering change control procedures. Documentation Supporting documentation shall include datasheets, electrical performance reports, isolation certification data, qualification test records, inspection reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems. Revision Control All changes to this specification shall be managed through the formal engineering change control system. Each revision shall undergo technical validation and approval prior to release to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #DCDCConverter #PowerModule #IsolatedPower #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerSupply #QualityAssurance #EngineeringDocumentation

Air Quality Sensor CO2 Sensor 2.5V/3.3V/5V 20-Pin SMD EP T/R The SCD41-D-R1 is a miniature photoacoustic carbon dioxide sensor module developed by Sensirion for high-accuracy environmental sensing applications. The device integrates a CO₂ sensing element, temperature sensor, humidity sensor, optical components, calibration memory, and digital signal processing into a compact surface-mount package suitable for embedded systems and portable electronics. The sensor utilizes photoacoustic sensing technology to provide precise carbon dioxide concentration measurements while maintaining low power consumption and long-term stability. Integrated humidity and temperature sensing capabilities enable environmental compensation and simplify system integration by reducing the need for external sensors. The SCD41 communicates through a standard I²C digital interface and supports automatic self-calibration functions for reliable long-term operation. Its compact footprint and low energy requirements make it suitable for battery-powered devices, smart building systems, HVAC equipment, indoor air quality monitoring systems, and IoT applications. The module is factory calibrated and designed for continuous monitoring of indoor air quality conditions. The integrated architecture minimizes external component requirements while enabling accurate sensing performance across a wide operating range. Key Features Photoacoustic CO₂ sensing technology Integrated temperature and humidity sensing High accuracy carbon dioxide measurement I²C digital communication interface Low power consumption operation Automatic self-calibration support Compact surface-mount package Factory calibrated output Long-term measurement stability Optimized for indoor air quality applications Low-profile PCB mounting design RoHS and halogen-free compliant Electrical Characteristics Low-voltage supply operation Low average current consumption suitable for portable devices Integrated digital signal processing Non-volatile calibration memory Standard I²C communication compatibility Stable operation across industrial environmental conditions Mechanical Characteristics Compact SMD package for space-constrained applications Surface-mount assembly compatible Low-profile package structure Integrated optical cavity and sensing chamber Moisture-sensitive device requiring controlled handling during assembly Functional Characteristics Real-time carbon dioxide concentration monitoring Simultaneous temperature and humidity measurement Automatic environmental compensation Continuous and periodic measurement modes Fast startup and measurement response Long operational lifetime with stable calibration Optimized airflow design for accurate sensing Suitable for continuous indoor environmental monitoring Typical Applications Indoor air quality monitoring systems Smart thermostats and HVAC controllers Building automation equipment Demand-controlled ventilation systems Portable environmental monitoring devices Smart home and IoT products Air purification systems Occupancy and ventilation monitoring Battery-powered sensing devices Consumer and industrial environmental monitoring equipment #commonpartslibrary #sensor #airquality

Ultra-Low Noise Digital MEMS Microphone with PDM Output – High-performance omnidirectional MEMS microphone designed for voice assistants, smart speakers, conferencing systems, industrial voice interfaces, IoT devices, wearables, automotive applications, and embedded audio systems. Part of the Infineon XENSIV™ microphone family, it features a digital PDM output, 73 dB(A) signal-to-noise ratio (SNR), −26 dBFS sensitivity (±1 dB @ 94 dB SPL), and an acoustic overload point (AOP) of 122 dB SPL, delivering excellent speech intelligibility and high dynamic range. Operates from a 1.62 V to 3.6 V supply with 980 µA typical current consumption, supports a 20 Hz to 19 kHz frequency response, and includes multiple operating modes for power optimization. Features a bottom-port acoustic design, IP57 dust and water resistance, and AEC-Q103 qualification (on demand) for demanding environments. Housed in a compact 5-pad LLGA package (4.0 × 3.0 × 1.2 mm) and specified for operation over a −40°C to +85°C temperature range. #Infineon #IM73D122V01XTMA1 #XENSIV #MEMSMicrophone #DigitalMicrophone #PDM #VoiceInterface #SmartSpeaker #IoT #AudioProcessing #AECQ103 #EmbeddedSystems

Bourns SRN3015 Series semi-shielded power inductor, compact 3.0mm × 3.0mm × 1.5mm SMD package, ferrite core construction, inductance range 1.0µH to 100µH, rated current up to 2.35A, saturation current up to 2.35A, low DCR design, operating temperature -40°C to +125°C, RoHS compliant and halogen-free, optimized for DC/DC converters, portable electronics, digital cameras, HDDs, smartphones, LCD displays and compact power management applications. Search Keywords: SRN3015, Bourns SRN3015, SRN3015 power inductor, semi shielded inductor, SMD power inductor, 3x3mm inductor, ferrite inductor, DC DC converter inductor, low profile inductor, SRN3015-1R0Y, SRN3015-2R2M, SRN3015-4R7M, SRN3015-100M, power choke, switching regulator inductor Hashtags: #SRN3015 #BournsSRN3015 #Bourns #PowerInductor #SemiShieldedInductor #SMDInductor #FerriteInductor #DCDCInductor #SwitchingRegulatorInductor #PowerChoke #LowProfileInductor #3x3mmInductor #PortablePower #SMPSInductor #MagneticComponent

Switch DIP ON OFF SPST 6 Recessed Slide 0.025A 24VDC J-Bend 1.27mm SMD Tube Series 218 is a compact DIP switch for miniature application where size is a constraint. It is ideal for server, security, HVAC system. 218 switch design aids improved reliability with positive detent and non-deflecting contactor during actuation.

Connector Header Through Hole 4 position 0.118" (3.00mm) 2242460430 is a Molex Micro-Fit+ Versa Color Vertical Header, a 4-circuit, dual-row, through-hole wire-to-board power connector designed for reliable power and signal connections in industrial, consumer, and power distribution applications. It features a 3.00 mm pitch, shrouded housing, polarized mating interface, and high-current copper alloy contacts for secure and robust connectivity. The connector supports up to 12.5 A per contact and 600 V AC/DC operation, making it suitable for compact high-power designs. Key Features 4-position dual-row vertical PCB header 3.00 mm pitch (Micro-Fit+ Versa series) Through-hole mounting with solder termination Male pin contacts with tin plating Up to 12.5 A current rating per contact Up to 600 V AC/DC voltage rating Shrouded and polarized design for mating protection Locking and keying features for secure connection High-strength copper alloy contacts Glass-filled LCP housing, UL94 V-0 rated Operating temperature range: -40°C to +125°C Glow-wire capable construction Suitable for power and wire-to-board applications #Molex #MicroFitPlus #WireToBoard #PowerConnector #PCBHeader #ThroughHole #IndustrialElectronics #HighCurrentConnector #Connector #ElectronicsDesign

IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.0, Thread, Zigbee® 2.4GHz 48-VFQFN Exposed Pad The NRF52840-QFAA-F-R belongs to Nordic’s nRF52 series and supports multiple wireless standards including Bluetooth 5, Bluetooth Low Energy (BLE), Thread, Zigbee, ANT, and proprietary 2.4 GHz protocols. It features a 64 MHz ARM Cortex-M4F CPU with floating-point unit (FPU), making it suitable for both wireless communication and real-time embedded processing. The device integrates large memory resources, rich peripherals, USB support, NFC capability, and advanced security features, reducing the need for external components in wireless embedded designs. Key Features 32-bit ARM Cortex-M4F processor running at 64 MHz 1 MB Flash memory and 256 KB RAM Supports Bluetooth 5 / BLE, Thread, Zigbee, ANT, and proprietary 2.4 GHz protocols IEEE 802.15.4 compliant radio Up to +8 dBm TX output power High receiver sensitivity down to −103 dBm Data rates up to 2 Mbps Ultra-low power consumption for battery-powered applications USB 2.0 Full-Speed controller NFC-A tag support Multiple communication interfaces: SPI UART I2C (TWI) I2S PWM PDM ADC Up to 48 GPIOs Integrated ARM CryptoCell-310 security engine Operating voltage range: 1.7 V to 5.5 V Operating temperature: −40°C to +85°C Compact 48-QFN (6×6 mm) package Typical Applications BLE devices Smart home products Wearables Wireless sensors Industrial IoT HID devices (keyboard/mouse) Asset tracking Mesh networking devices USB dongles and gateways PCB Design Notes Community PCB reviews commonly recommend: Proper RF grounding and 50-ohm antenna routing Using ESD/TVS protection on USB lines Keeping RF matching components close to the antenna Using solid ground planes for 2.4 GHz performance #CommonPartsLibrary #IntegratedCircuit #RF