Digital Potentiometer 10k Ohm 4 Circuit 257 Taps I2C Interface 20-TSSOP # Engineering Specification ## Product Name MCP4461-103E/ST ## General Description MCP4461-103E/ST is a non-volatile digital potentiometer integrated circuit designed to provide electronically programmable resistance adjustment for analog and mixed-signal applications. The device enables precise digital control of resistance values through a serial communication interface, eliminating the need for manual potentiometer adjustments and enhancing system automation capabilities. The component integrates multiple resistor networks, non-volatile memory, and digital control logic within a compact package, making it suitable for signal conditioning, gain adjustment, calibration, offset trimming, volume control, and configuration management applications. The design supports reliable operation in embedded systems, industrial electronics, instrumentation equipment, communication devices, and consumer products requiring programmable analog control. The device is optimized for ease of integration, low power consumption, repeatable performance, and long-term reliability. Non-volatile memory functionality allows resistance settings to be retained during power interruptions, supporting consistent system behavior and simplified startup configuration. ## Functional Requirements ### Digital Resistance Control The device shall provide programmable resistance adjustment through a digital communication interface. ### Non-Volatile Memory Operation The device shall retain programmed resistance settings when power is removed and restore stored values upon power-up. ### Multi-Channel Adjustment The device shall support independent control of multiple resistance channels for flexible system configuration. ### Analog Signal Conditioning The device shall support use in gain control, calibration, bias adjustment, offset correction, and signal tuning applications. ## Electrical Requirements ### Power Supply Compatibility The device shall operate from standard low-voltage electronic power supply rails suitable for embedded and industrial systems. ### Digital Communication The device shall support serial communication for configuration, programming, and control of internal resistance networks. ### Resistance Network Performance The device shall provide repeatable and stable resistance adjustment characteristics throughout normal operating conditions. ### Low Power Operation The device shall minimize power consumption while maintaining functional performance and memory retention capability. ### Noise and Signal Integrity The design shall support accurate analog signal processing with minimal impact on system performance. ## Mechanical Requirements ### Package Construction The component shall be supplied in a surface-mount package suitable for automated PCB assembly processes. ### Board Integration The device shall support standard printed circuit board mounting practices and electronic manufacturing workflows. ### Structural Reliability The package shall maintain electrical and mechanical integrity during handling, assembly, and operational service. ## Environmental Requirements ### Operating Environment The device shall operate reliably within environmental conditions commonly encountered in commercial and industrial electronic equipment. ### Storage Conditions The component shall maintain functional and physical integrity during storage, transportation, and inventory management activities. ### Environmental Robustness The design shall support stable operation under expected temperature and humidity variations within specified application environments. ## Quality Requirements ### Reliability The device shall provide consistent long-term performance with stable resistance characteristics and memory retention capability. ### Verification Electrical functionality, communication performance, memory operation, and resistance adjustment behavior shall be validated through applicable testing procedures. ### Compliance The product shall conform to relevant semiconductor manufacturing, quality assurance, and electronic component standards. ## Documentation Requirements Technical documentation shall include device functionality, communication interface requirements, programming guidelines, application recommendations, electrical characteristics, package information, and reliability considerations. ## Classification Tags #MCP4461 #MCP4461103EST #DigitalPotentiometer #NonVolatileMemory #IntegratedCircuit #ICComponent #AnalogElectronics #MixedSignalDesign #SignalConditioning #GainControl #CalibrationCircuit #EmbeddedSystems #ElectronicComponents #ElectricalEngineering #PCBDesign #CircuitDesign #IndustrialElectronics #Instrumentation #CommonPartsLibrary #EngineeringSpecification #ComponentLibrary #TechnicalDocumentation #SystemIntegration #HardwareDevelopment #ReliabilityEngineering

Connector Header Surface Mount 20 position 0.100" (2.54mm) The 3020-20-0300-00 is a shrouded rectangular male header connector manufactured by CNC Tech for board-to-cable interconnection applications. It features a dual-row, surface-mount design with a standard 2.54 mm pitch, making it suitable for signal and low-power connections in industrial, consumer, and embedded electronic systems. The connector incorporates gold-plated brass contacts for reliable electrical performance and a high-temperature nylon housing that provides excellent mechanical durability and insulation characteristics. The integrated keying slot and fully shrouded construction help ensure proper mating orientation and secure connections during assembly and operation. Key Features Dual-row male header connector Surface-mount (SMT) termination Standard 2.54 mm contact pitch 20-position configuration Shrouded four-wall housing for mating protection Integrated keying slot for polarization Gold-plated contact surfaces for improved conductivity and corrosion resistance Brass contact material for mechanical strength High-temperature PA9T nylon insulator UL94 V-0 flame-retardant housing material Operating temperature range suitable for industrial environments Board-to-cable/wire interconnection design Square contact geometry for reliable mating RoHS-compliant construction Rated for up to 3 A current per contact under specified conditions #CommonPartsLibrary #Connector #Header #MaleHeader #SMT #BoardToCable #CNCTech #Interconnect #ShroudedHeader #2p54mmPitch #Electronics #EmbeddedSystems #3020_20_0300_00

Ultra-Low-Power Voltage Supervisor (Reset IC) – Single-channel voltage supervisor designed for microcontrollers, processors, IoT devices, industrial control systems, automotive electronics, battery-powered equipment, and embedded systems requiring reliable power-on reset and brownout detection. The Texas Instruments TLV803EA30DBZR monitors a 3.0 V supply rail with a 3.08 V reset threshold, providing an active-low open-drain RESET output to ensure proper system initialization and recovery during undervoltage conditions. Features 250 nA typical quiescent current, 130 ms minimum reset timeout, supply voltage operation from 0.7 V to 6 V, and open-drain output for easy interfacing with multiple voltage domains. Includes power-on reset, brownout protection, and low-power operation, making it ideal for energy-efficient embedded applications. Operates over a −40°C to +125°C temperature range and is housed in a compact 3-pin SOT-23 (DBZ) package for surface-mount designs. #TexasInstruments #TLV803EA30DBZR #TLV803E #VoltageSupervisor #ResetIC #PowerOnReset #BrownoutDetection #LowPower #OpenDrain #PowerManagement #EmbeddedSystems #IndustrialElectronics

Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 2A 8-SOIC (0.154", 3.90mm Width) # L6982N33DR ## General Description The L6982N33DR is a high-efficiency synchronous step-down switching regulator manufactured by STMicroelectronics. It is designed to provide a fixed regulated output voltage from a wide input voltage range while maintaining excellent conversion efficiency and low power dissipation. The device integrates high-side and low-side power MOSFETs, control circuitry, protection features, and compensation functions within a compact package, reducing external component count and simplifying power supply design. Its robust architecture makes it suitable for industrial automation systems, distributed power architectures, telecommunications equipment, embedded systems, consumer electronics, smart devices, and battery-powered applications requiring efficient DC-to-DC voltage conversion. ## Key Features ### Power Conversion Architecture * Synchronous buck regulator topology * Fixed output voltage regulation * Integrated power MOSFETs * High-efficiency power conversion * Optimized switching performance * Reduced external component requirements ### Electrical Characteristics * Wide input voltage operating range * Stable output voltage regulation * High conversion efficiency * Low standby power consumption * Fast transient response * Low output ripple performance ### Control Features * Current-mode control architecture * Internal compensation circuitry * Soft-start functionality * Frequency synchronization capability * Stable operation under varying load conditions ### Protection Features * Overcurrent protection * Short-circuit protection * Thermal shutdown protection * Undervoltage lockout protection * Safe startup operation * Enhanced system reliability ### Power Management * Low-power operating modes * Energy-efficient design * Suitable for battery-powered systems * Optimized thermal performance * Reduced power dissipation ### Package Characteristics * Surface-mount package * Compact footprint * Automated assembly compatible * High-density PCB design support * Industrial-grade packaging ### Material Construction * Monolithic integrated power management solution * Lead-free package materials * RoHS-compliant construction * High-reliability semiconductor technology ### Environmental Characteristics * Suitable for industrial operating environments * Long operational service life * Reliable continuous operation * Robust thermal performance ### Application Areas * Industrial Automation Equipment * Embedded Systems * Microcontroller Power Supplies * FPGA and Processor Power Rails * Telecommunications Equipment * Smart Metering Systems * Consumer Electronics * Building Automation Systems * Distributed Power Architectures * Battery-Powered Devices * IoT Products * Power Management Modules ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Power Management Solution ## Manufacturer STMicroelectronics ## Product Family L6982 Synchronous Step-Down Switching Regulator Series #L6982N33DR #STMicroelectronics #BuckConverter #DCtoDCConverter #SwitchingRegulator #PowerManagement #PowerSupplyDesign #EmbeddedSystems #IndustrialElectronics #VoltageRegulator #PowerElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SMPS

Supervisor Open Drain or Open Collector 1 Channel SOT-23-3 The MCP120T-450I/TT is a microcontroller supervisory (voltage reset) IC from Microchip Technology designed to monitor the system supply voltage and ensure reliable startup and operation of microcontroller-based systems. It keeps the microcontroller in the reset state until the supply voltage reaches a safe operating level and automatically asserts a reset signal if the supply voltage falls below the preset threshold, protecting the system from brown-out and power-failure conditions. The device features an open-drain active-low RESET output, a 4.375 V threshold, and is housed in a compact SOT-23-3 package, making it suitable for space-constrained embedded applications. Key Features Monitors a single supply voltage with a 4.375 V reset threshold Open-drain, active-low RESET output Holds the microcontroller in reset during power-up until VDD is stable Automatically resets the system during brown-out or power-loss events 150 ms minimum reset timeout after VDD exceeds the threshold Supports 3 V, 3.3 V, and 5 V system supervision Low operating current (typically 45 µA) Wide operating temperature range: −40°C to +85°C Compact SOT-23-3 surface-mount package Hashtags #Microchip #MCP120 #VoltageSupervisor #ResetIC #BrownOutProtection #PowerOnReset #PMIC #EmbeddedSystems #Microcontroller #SOT23 #PowerManagement #CircuitProtection

PSRAM (Pseudo SRAM) Memory IC 512Mbit HyperBus 166 MHz 36 ns 24-TFBGA (6x8) The IS66/67WVH64M8DALL/BLL are 512Mb Dual Die device containing two units of 256Mbit Pseudo Static Random Access Memory, organized as 64M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation, designed especially for Mobile and Automotive applications Key Features 512-Mbit (64M × 8) HyperRAM™ PSRAM High-speed HyperBus interface Clock frequency up to 166 MHz Fast 36 ns access time Single-ended clock architecture with reduced pin count Operating voltage range: 2.7 V to 3.6 V Industrial temperature range: −40°C to +85°C Low-power volatile memory solution Surface-mount 24-TFBGA (6 mm × 8 mm) package Suitable for graphics, AI edge devices, networking, and embedded systems requiring large external memory capacity. #CommonPartsLibrary #IntegratedCircuit #HyperRAM #PSRAM #ISSI #MemoryIC #HyperBus #EmbeddedSystems #IndustrialElectronics #IoT #HighSpeedMemory #BGA #VolatileMemory #EdgeComputing #HMI #ElectronicsDesign

USB-C (USB TYPE-C) Receptacle Connector 24 (6+18 Dummy) - Power Only 6 Pin Position Surface Mount, Right Angle; Through Hole The 2479774-2 specification defines the engineering requirements for a high-density electronic connector assembly intended for board-to-cable or board-to-board interconnection in advanced electronic systems. This specification establishes the functional, mechanical, electrical, environmental, and quality requirements necessary to ensure reliable signal transmission, stable mechanical engagement, and long-term durability in demanding electronic applications. The component is intended for use in systems requiring compact interconnect solutions with high signal integrity and robust mechanical retention. It is suitable for applications such as industrial electronics, communication systems, embedded control units, and high-performance electronic assemblies where reliable connectivity and repeatable mating performance are required. Engineering Requirements The connector assembly shall be manufactured using precision-formed conductive materials and high-strength insulating housing materials to ensure stable electrical performance and mechanical reliability. The design shall support secure mating engagement and consistent signal continuity across repeated connection cycles. Electrical characteristics shall ensure low contact resistance, stable signal integrity, and reliable conductivity under defined operating conditions. The connector shall maintain performance under mechanical vibration, thermal variation, and environmental stress conditions typical of industrial and embedded system applications. Mechanical construction shall ensure accurate alignment between mating interfaces, secure locking engagement, and resistance to accidental disconnection. The design shall support repeated mating cycles without degradation of electrical or mechanical performance. Workmanship shall be free from defects such as contamination, deformation, plating irregularities, or structural inconsistencies that could impact reliability or functionality. Manufacturing and inspection shall be conducted under controlled quality systems using calibrated equipment to ensure compliance with engineering requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established engineering change control procedures prior to implementation. Documentation Supporting documentation shall include engineering drawings, connector datasheets, material declarations, inspection records, qualification test reports, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems. Revision Control All changes to this specification shall be managed through formal engineering change control procedures. Each revision shall undergo technical evaluation, validation, and approval prior to release to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #Connector #HighDensityInterconnect #ElectronicComponents #SignalIntegrity #EmbeddedSystems #IndustrialElectronics #Manufacturing #QualityAssurance #EngineeringDocumentation

ARM® Cortex®-M0+ MSPM0 C Microcontroller IC 32-Bit 24MHz 16KB (16K x 8) FLASH 8-DSBGA (0.86x1.6) MSPM0C110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MCU family based on the enhanced Arm® Cortex®-M0+ core platform operating at up to 24MHz frequency. These costoptimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages from 1.62V to 3.6V. The MSPM0C110x devices provide up to 16KB embedded flash program memory with 1KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy from -2% to +1.2%, eliminating the need for an external crystal. Additional features include a 1-channel DMA, CRC-16 accelerator, and a variety of highperformance analog peripherals such as one 12-bit 1.5Msps ADC with VDD as the voltage reference, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as one 16-bit advanced timer, two 16-bit general purpose timer, one windowed watchdog timer, and a variety of communication peripherals including one UART, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, smart card, SMBus, and PMBus. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. MSPM0C110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums. Features • Core – Arm® 32-bit Cortex®-M0+ CPU, frequency up to 24MHz • Operating characteristics – Extended temperature: –40°C to 125°C – Wide supply voltage range: 1.62V to 3.6V • Memories – Up to 16KB of flash – 1KB of SRAM • High-performance analog peripherals – One analog-to-digital converter (ADC) with up to 10 total external channels, 1.7Msps at 10 bit or 1.5Msps at 12 bit with VDD as the voltage reference – Configurable 1.4V or 2.5V internal ADC voltage reference (VREF) – Integrated temperature sensor – Integrated supply monitor • Optimized low-power modes – RUN: 87µA/MHz – STOP: 609µA at 4MHz, 311µA at 32kHz – STANDBY: 5µA with SRAM retention – SHUTDOWN: 200nA • Intelligent digital peripherals – 1-channel DMA controller dedicated for ADC – Three timers supporting up to 14 PWM channels • One 16-bit advanced timers with deadband support up to 8 PWM channels • One 16-bit general purpose timer with 4 capture/compares • One 16-bit general purpose timer with 2 capture/compares – Windowed watchdog timer – BEEPER generating 1kHz, 2kHz, 4kHz, or 8kHz square wave to drive the external beeper • Enhanced communication interfaces – One UART interface supporting LIN, IrDA, DALI, smart card, Manchester and low-power operation in STANDBY mode – One I2C interface supporting FM+ (1Mbps), SMBus, PMBus, and wakeup from STOP mode – One SPI supporting up to 12Mbps • Clock system – Internal 24MHz oscillator with an accuracy from -2% to +1.2% (SYSOSC) – Internal 32kHz low-frequency oscillator (LFOSC) • Data integrity – Cyclic redundancy checker (CRC-16) • Flexible I/O features – Up to 18 GPIOs – Two 5V-tolerant open-drain IOs • Development support – 2-pin serial wire debug (SWD) • Package options – 20-pin TSSOP (PW) – 20-pin VSSOP (DGS) – 20-pin WQFN (RUK) – 16-pin SOT (DYY) – 8-pin SOT (DDF) – 8-pin WSON (DSG) – 8-pin DSBGA (YCJ) • Family members (also see Device Comparison) – MSPS003F4: 16KB of flash, 1KB of RAM – MSPS003F3: 8KB of flash, 1KB of RAM – MSPM0C1104: 16KB of flash, 1KB of RAM – MSPM0C1103: 8KB of flash, 1KB of RAM • Development kits and software (also see Tools and Software) – LP-MSPM0C1104 LaunchPad™ development kit – MSP Software Development Kit (SDK) 2 Applications • Battery charging and management • Power supplies and power delivery • Personal electronics • Building security and fire safety • Connected peripherals and printers • Grid infrastructure • Smart metering • Communication modules • Medical and healthcare • Lighting #MSPM0C1104S8YCJR #MSPM0C1104 #TexasInstruments #CortexM0Plus #Microcontroller #EmbeddedSystems #LowPowerMCU #IoT #WearableDevices #IndustrialControl #ConsumerElectronics #ADC #UART #SPI #I2C #PWM #TI #ElectronicsDesign #PCBDesign #EmbeddedDevelopment

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

2.2µH Unshielded Molded Inductor 17 A 3.7mOhm 2-SMD, J-Lead The MPL-AY1265-2R2 is a 2.2 µH surface-mount molded power inductor from Monolithic Power Systems (MPS). It is designed for high-current DC-DC switching power supplies and power management applications requiring low DC resistance (DCR), high efficiency, and stable inductance over a wide operating temperature range. Its molded construction minimizes audible noise and provides excellent mechanical reliability for compact, high-performance electronic designs. Key Features 2.2 µH inductance with ±20% tolerance High rated current: up to 17 A Low DC resistance: 3.7 mΩ typ. (4.3 mΩ max.) Soft saturation characteristics for improved reliability Molded construction for enhanced durability and reduced EMI Low audible noise during switching operation Stable performance across a wide temperature range Operating temperature: −40°C to +155°C Compact SMD package: 13.5 × 12.6 × 6.2 mm RoHS/REACH compliant and halogen-free Typical Applications Battery-powered devices Portable electronics Embedded computing systems High-current switching mode power supplies (SMPS) High-frequency DC-DC converters Point-of-load (POL) converters FPGA power rails #MoldedInductor #PowerInductor #2_2uH #HighCurrent #LowDCR #SMPS #DCDCConverter #PowerManagement #SMD #MonolithicPowerSystems #RoHS #EmbeddedSystems

The CH9102X is a high-speed USB-to-UART bridge IC developed by WCH (Jiangsu Qinheng Microelectronics). It enables seamless communication between a USB host and UART-based embedded systems, making it ideal for programming, debugging, firmware updates, and serial data communication. The device integrates a USB 2.0 Full-Speed interface, an internal clock, power-on reset, and firmware, eliminating the need for an external crystal oscillator. The CH9102X variant supports 3.3 V UART I/O and is widely used on development boards such as ESP32 and other MCU-based designs. Key Features USB 2.0 Full-Speed (12 Mbps) compliant device interface USB-to-UART bridge supporting baud rates from 50 bps to 4 Mbps 3.3 V UART I/O (CH9102X variant) Integrated clock oscillator (no external crystal required) Built-in power-on reset circuit Hardware full-duplex UART with independent TX/RX buffers Supports 5, 6, 7, or 8 data bits Supports None, Odd, Even, Mark, and Space parity Supports RTS/CTS hardware flow control Supports MODEM signals: RTS, CTS, DTR, DSR, DCD, and RI TNOW output for automatic RS-485 transmit/receive control Compatible with built-in CDC drivers and vendor VCP drivers on major operating systems Available in compact RoHS-compliant QFN packages #CH9102X #USBtoUART #USBBridge #UART #SerialConverter #WCH #USB20 #EmbeddedSystems #ESP32 #MCU #RS485 #FirmwareUpdate #Debugging #IoT #PCBDesign

Connector Header Through Hole 10 position 0.100" (2.54mm) 104128-1 is a 10-position, dual-row, vertical through-hole PCB header from the AMP-LATCH series by TE Connectivity. It is designed for reliable board-to-board and ribbon cable interconnections in signal applications. The connector features a low-profile, shrouded housing with an integrated ejection latch and polarization to ensure secure mating and prevent incorrect insertion. It is commonly used in industrial equipment, embedded systems, instrumentation, telecommunications, and computer peripherals where dependable IDC ribbon cable connections are required. 10-position, 2-row connector 2.54 mm (0.100 in) pitch Vertical through-hole PCB mounting Low-profile shrouded header Integrated ejection latch for secure cable retention Polarized design to prevent mismating Gold-plated mating contacts for reliable signal transmission Tin-lead solder tails for through-hole soldering Maximum current rating: 1 A per contact Operating temperature: -65°C to +105°C UL 94V-0 flame-retardant nylon housing Suitable for board-to-board and ribbon cable signal applications #TEConnectivity #AMPLATCH #RibbonCableConnector #PCBHeader #ThroughHole #BoardToBoard #IDCConnector #VerticalHeader #SignalConnector #EmbeddedSystems #IndustrialElectronics #ElectronicComponents

Isolated Module DC DC Converter 2 Output 12 ~ 15V -12 ~ -15V 125mA, 125mA 18V - 36V Input The CC3-2412DF-E is an isolated DC-DC converter module designed to provide efficient and reliable power conversion in industrial, telecommunications, instrumentation, and embedded electronic systems. The module converts a regulated DC input voltage into isolated dual-output DC supplies while maintaining electrical isolation between the input and output stages. Its compact encapsulated design simplifies PCB integration and enhances system reliability by reducing the need for external conversion circuitry. The device is optimized for applications requiring isolated power rails, noise reduction, and protection against ground loop interference. Engineering Specifications Manufacturer: TDK-Lambda Part Number: CC3-2412DF-E Device Type: Isolated DC-DC Converter Module Conversion Topology: Isolated Power Conversion Input Voltage: Nominal DC Input Operation Output Configuration: Dual Output Output Regulation: Regulated DC Output Isolation Type: Galvanic Isolation Efficiency: High-Efficiency Power Conversion Protection Features: Short Circuit Protection and Overload Tolerance Package Type: Encapsulated Through-Hole Module Mounting Style: Through-Hole Operating Temperature Range: Industrial Grade Reliability: Designed for Continuous Operation RoHS Compliant: Yes Applications: Industrial Automation, Telecommunications Equipment, Embedded Systems, Instrumentation, Data Acquisition Systems, Process Control Equipment, Power Distribution Circuits, Isolated Interface Designs Key Features Isolated input-to-output power conversion Dual regulated output architecture Compact PCB-mount package High efficiency operation Reduced electrical noise and ground loop interference Reliable performance in industrial environments Simplified power supply design integration Robust protection against abnormal operating conditions Suitable for mixed-signal and sensitive analog systems Long operational lifespan and stable output characteristics #CC32412DFE #TDKLambda #DCDCConverter #IsolatedPowerSupply #PowerModule #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerConversion #GalvanicIsolation #Telecommunications #Instrumentation #AutomationSystems #PCBDesign #ElectronicComponents #DualOutput #PowerManagement #IndustrialAutomation #ElectricalEngineering #PowerSupplyDesign

5.7 kV RMS/1.5 kV RMS, Quad-Channel LVDS 2.5 Gigabit Isolator (0 Reverse Channels) LVDS Digital Isolator 5700Vrms 4 Channel 2.5Gbps 40kV/µs CMTI 28-BSSOP (0.295", 7.50mm Width) The ADN4624 is a quad-channel, signal isolated, low voltage differential signaling (LVDS) buffer that operates at up to 2.5 Gbps with very low jitter. The device integrates Analog Devices, Inc., iCoupler® technology, enhanced for high speed operation to provide drop-in galvanic isolation of LVDS signal chains. AC coupling and/or level shifting to the LVDS receivers and from the LVDS drivers allows isolation of other high speed signals such as current mode logic (CML). The ADN4624 includes a refresh mechanism to monitor the input and output states and ensure they remain the same in the absence of data transitions (for example, at power-on). For lower power consumption and high speed operation with low jitter, the LVDS and isolator circuits rely on 1.8 V supplies. The ADN4624 is fully specified over a wide industrial temperature range and is available in a 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance (for 5.7 kV rms or 8 kVPEAK surge and impulse voltages and reinforced insulation at ac mains voltages) or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance (for basic/functional isolation). FEATURES ► 5.7 kV rms and 1.5 kV rms LVDS isolators ► Complies with TIA/EIA-644-A LVDS signal levels ► Quad-channel configuration ► Any data rate up to 2.5 Gbps switching with low jitter ► 10 Gbps total bandwidth across four channels ► 2.15 ns typical propagation delay ► Typical jitter: 0.82 ps rms random, 40 ps total peak ► Lower power 1.8 V supplies ► ±8 kV IEC 61000-4-2 ESD protection across isolation barrier ► High common-mode transient immunity: 100 kV/μs typical ► Safety and regulatory approvals (28-lead SOIC_W_FP package) ► UL (pending): 5700 V rms for 1 minute per UL 1577 ► CSA Component Acceptance Notice 5A (pending) ► VDE certificate of conformity (pending) ► DIN V VDE V 0884-11 (VDE V 0884-11):2017-01 ► VIORM = 849 VPEAK (working voltage) ► Enable or disable refresh (low speed output correctness check) ► Operating temperature range: −40°C to +125°C ► 28-lead, wide-body, finer pitch SOIC_W_FP package with 8.3 mm creepage and clearance or 6 mm × 6 mm LFCSP package with 1.27 mm creepage and clearance APPLICATIONS ► Isolated video and imaging data ► Analog front-end isolation ► Data plane isolation ► Isolated high speed clock and data links ► Multi-gigabit serialization/deserialization (SERDES) ► Board-to-board optical replacement (for example, short reach fiber) #CommonPartsLibrary #ADN4624BRNZ #DigitalIsolator #LVDS #AnalogDevices #HighSpeedInterface #GalvanicIsolation #LVDSIsolator #DigitalIsolation #IndustrialElectronics #HighSpeedData #SERDES #SignalIntegrity #EmbeddedSystems #ElectronicsDesign #InterfaceICs

Isolated Module DC DC Converter 2 Output 5V -5V 300mA 4.5V - 5.5V Input # Engineering Specification ## Product Name IR0505S ## General Description IR0505S is an isolated power conversion module designed to provide reliable DC-to-DC power conversion for electronic and embedded systems requiring galvanic isolation between input and output circuits. The device is intended for use in industrial control equipment, communication systems, instrumentation, automation platforms, and other electronic applications where stable power delivery and electrical isolation are essential. The module incorporates integrated switching and isolation technologies to support efficient power transfer while reducing system complexity and board-level design effort. Its compact form factor allows straightforward integration into printed circuit board assemblies and power distribution architectures. The design emphasizes operational reliability, electrical safety, electromagnetic compatibility, and long-term performance in demanding environments. ## Functional Requirements ### Power Conversion The module shall convert input DC power to an isolated DC output suitable for downstream electronic circuits and subsystems. ### Electrical Isolation The module shall provide galvanic isolation between input and output domains to reduce the propagation of electrical noise, ground loops, and fault conditions. ### Operational Stability The module shall maintain stable output characteristics during normal operating conditions and expected load variations. ### System Integration The module shall support integration into embedded, industrial, and communication systems through standard electrical interfaces and assembly practices. ## Electrical Requirements ### Input Characteristics The device shall accept DC input power within the specified operating range and maintain reliable operation throughout normal conditions. ### Output Characteristics The device shall provide regulated isolated output power suitable for electronic loads requiring stable voltage and current delivery. ### Protection Features The design shall incorporate protective characteristics to support safe operation during abnormal electrical conditions and transient events. ### Noise Performance The module shall minimize conducted and radiated electrical noise to support compatibility with sensitive electronic circuits. ## Mechanical Requirements ### Package Construction The module shall utilize a compact package suitable for direct PCB mounting and automated assembly processes. ### Structural Integrity The assembly shall withstand normal handling, installation, transportation, and operational stresses without degradation of performance. ### Maintainability The device shall support replacement and servicing through standard electronic maintenance procedures. ## Environmental Requirements ### Operating Environment The module shall perform reliably within the environmental conditions specified for industrial and commercial electronic applications. ### Storage Conditions The product shall maintain functional integrity during storage and transportation when handled according to recommended practices. ## Quality Requirements ### Reliability The module shall be designed for dependable long-term operation with consistent electrical performance throughout its intended service life. ### Verification Electrical, mechanical, and environmental characteristics shall be validated through applicable inspection, testing, and qualification procedures. ### Compliance The product shall conform to applicable safety, quality, and manufacturing standards relevant to isolated power conversion devices. ## Documentation Requirements Supporting documentation shall include product identification, electrical characteristics, application guidance, installation recommendations, safety information, and maintenance considerations. ## Classification Tags #IR0505S #DCDCConverter #IsolatedPowerSupply #PowerModule #CommonPartsLibrary #IntegratedCircuit #PowerElectronics #ElectronicComponents #ElectricalEngineering #EmbeddedSystems #IndustrialAutomation #PowerManagement #CircuitDesign #PCBDesign #SystemIntegration #EngineeringSpecification #TechnicalDocumentation #ReliabilityEngineering #ElectronicHardware #ComponentLibrary

Supervisor Open Drain or Open Collector 1 Channel 8-SOIC The MC34164D-5R2G is a high-speed, dual operational amplifier designed for precise analog signal processing in industrial, instrumentation, and consumer electronic applications. It features low offset voltage, low input bias current, and wide bandwidth for accurate and reliable performance across various analog signal conditions. Its robust design provides stable operation under high-speed switching and varying temperature conditions, making it suitable for data acquisition systems, sensor interfaces, audio signal conditioning, control circuits, and measurement instrumentation. The device comes in a compact dual-in-line package for easy PCB integration and versatility in mixed-signal designs. Engineering Specifications Manufacturer: ON Semiconductor Part Number: MC34164D-5R2G Device Type: Dual Operational Amplifier Amplifier Configuration: Dual Op-Amp Input Offset Voltage: Low for Precision Applications Input Bias Current: Low Supply Voltage Range: Wide Operating Range Gain Bandwidth Product: High for Fast Signal Processing Slew Rate: Optimized for High-Speed Applications Output Type: Rail-to-Rail Compatible Noise Performance: Low Noise Analog Operation Package Type: Small Outline Integrated Circuit (SOIC) Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Sensor Signal Conditioning, Data Acquisition, Control Systems, Audio Processing, Industrial Instrumentation, Embedded Analog Circuits, Measurement and Monitoring Equipment, General-Purpose Analog Designs Key Features Dual high-speed operational amplifier in a single package Low input offset voltage for precision analog applications Low input bias current for high-impedance signal sources Wide supply voltage range for flexible design Fast slew rate and high gain bandwidth for accurate signal processing Compact surface-mount package for space-efficient PCB layouts Stable operation under industrial temperature ranges Suitable for instrumentation and embedded analog signal circuits Low-noise design for high-fidelity analog applications #MC34164D5R2G #ONSemiconductor #OperationalAmplifier #OpAmp #DualOpAmp #HighSpeedOpAmp #AnalogSignalProcessing #SensorInterface #DataAcquisition #ControlSystems #AudioProcessing #IndustrialElectronics #EmbeddedSystems #SOICPackage #SurfaceMount #ElectronicComponents #PCBDesign #PrecisionAmplifier #SignalConditioning

Isolated Module DC DC Converter 1 Output 5.1V 6A 9V - 36V Input The TEN 30WIN series is a family of high performance 30W DC/DC converter modules featuring ultra wide 4:1 input voltage ranges in a compact low profile case with industry-standard footprint. Standard features include remote On/Off, output voltage trimming, over voltage protection, under voltage lockout, over temperature and short circuit protection. Typical applications for these products are battery operated equipment and distributed power architectures in communication and industrial electronics, everywhere where isolated, tightly regulated voltages are required and space is limited on the PCB. • 2“ x 1“ x 0.4“ shielded metal package • Ultra wide 4:1 input voltage range • Single- dual- and triple output models • Very high efficiency up to 91 % • Operating temperature range –40 °C to +75 °C • Over temperature protection • I/O isolation 1600 VDC • Remote On/Off • Adjustable output voltage #TRACOPower #TEN302411WIN #DCDCConverter #IsolatedPowerSupply #PowerModule #IndustrialElectronics #EmbeddedSystems #TelecomPower #BatteryPoweredDevices #PowerManagement #ElectronicsDesign #PCBDesign #DCDCModule #WideInputRange #IndustrialAutomation

Battery Power Management IC Lithium Ion/Polymer 24-QFN (4x4) nPM1100 is an integrated Power Management IC (PMIC) with a linear-mode lithium-ion/lithium-polymer battery charger in a compact 2.1x2.1 mm WLCSP package. It has a highly efficient, dual-mode configurable output DC/DC buck regulator. nPM1100 is an extremely compact PMIC device, created for space constrained applications with a small lithium-ion or lithium-polymer battery. It is compatible with all nRF52 and nRF53 Series SoCs and supports charging batteries at up to 500 mA through USB, and also delivers up to 150 mA of current to power external components with regulated voltage. A minimum of five passive components are required for operation and the device functions without a control interface. It is the perfect companion for nRF52 and nRF53 multiprotocol SoCs in battery powered designs. Low quiescent current (IQ) extends battery life during shipping and storage with Ship mode, or in operation using auto-controlled hysteretic buck mode for high efficiency down to 1 µA loads. Charge and error indication LED drivers are built in. Charge profile limits are configurable and VBUS current limits can be fixed or auto-controlled with on-chip USB port detection. • 400 mA linear battery charger • Linear charger for lithium-ion/lithium-polymer batteries • Adjustable charge current from 20 mA to 400 mA • Selectable termination voltage of 4.1 V or 4.2 V • Automatic trickle, constant current, and constant voltage charging • Battery thermal protection • Discharge current limitation • JEITA compliant • Li-ion/Li-polymer USB battery charger with a high efficiency buck regulator • 800 nA - Typical quiescent current • 460 nA - Shipping mode quiescent current • Thermal protection • Input regulator • USB compatible current limit of 100 mA and 500 mA • 4.1 V to 6.7 V input voltage range for normal operation • 20 V overvoltage protection • Reverse current protection • 3.0 V to 5.5 V system voltage output • USB port detection supporting the following types: • SDP • CDP/DCP • 1.8 V to 3.0 V, 150 mA step-down buck regulator • Step-down buck regulator with up to 92% efficiency • Automatic transition between hysteretic and pulse width modulation (PWM) modes • Forced PWM mode for clean power operation • Pin-selectable output voltage (1.8 V, 2.1 V, 2.7 V, 3.0 V) • Soft start-up • LED drivers for charger state indication • 5 mA low side LED driver for charging indication • 5 mA low side LED driver for error indication • 2.3 V to 4.35 V battery operating input range • 2.1x2.1 mm WLCSP package • Suitable for two layer PCB design #CommonPartsLibrary #IntegratedCircuit #NordicSemiconductor #nPM1100 #PMIC #BatteryCharger #PowerManagement #LiIon #LiPolymer #BuckConverter #Wearables #IoT #WirelessSensor #LowPowerDesign #USBCharging #EmbeddedSystems #nRF52 #nRF53 #PortableElectronics

Headers & Wire Housings PICOFLEX 10P HDR LOPRO SN Connector Header Through Hole 10 position 0.050" (1.27mm) The 0903250010 is a 10-position vertical through-hole header connector from the Picoflex PF-50 series by Molex. It features a 1.27 mm pitch, straight orientation, and is designed for reliable board-to-cable interconnections in compact electronic equipment. The connector is commonly used with Picoflex ribbon cable assemblies in industrial, consumer, telecommunications, and embedded electronic applications. It provides a space-saving solution while maintaining dependable electrical and mechanical performance. Key Features 10 contacts (single-row configuration) 1.27 mm (0.050") contact pitch Vertical (straight) through-hole mounting Male header design Compatible with Molex Picoflex cable connectors Current rating up to 1.2 A per contact Voltage rating up to 250 V Operating temperature range: -40°C to +105°C Low contact resistance (15 mΩ max) High insulation resistance (1000 MΩ min) RoHS compliant Compact footprint for high-density PCB designs Suitable for signal and low-power applications #CommonPartsLibrary #0903250010 #Molex #Picoflex #Connector #HeaderConnector #ThroughHole #PCBConnector #BoardToCable #Interconnect #Electronics #EmbeddedSystems #IndustrialElectronics #RibbonCable #1_27mmPitch #ElectronicComponents

Low-Side Gate Driver IC Inverting TO-220-5 The TC4421AVAT is a high-speed MOSFET driver designed to efficiently drive power MOSFETs and IGBTs in switching applications. It features a low-impedance push-pull output stage capable of sourcing and sinking significant current, enabling rapid charging and discharging of gate capacitances for fast switching. The device supports both high- and low-side configurations, providing flexibility for power supply, motor control, DC-DC conversion, and class-D amplifier designs. Its robust design ensures reliable operation under high switching frequencies, minimizing losses and improving overall system efficiency. Engineering Specifications Manufacturer: Microchip Technology Part Number: TC4421AVAT Device Type: High-Speed MOSFET Driver Output Stage: Push-Pull Drive Capability: High Source and Sink Current Input Logic Compatibility: CMOS/TTL Compatible Supply Voltage Range: Wide Operating Range Propagation Delay: Low Rise/Fall Time: Fast Switching Output Voltage Swing: Rail-to-Rail Operating Frequency: High-Frequency Switching Applications Package Type: SOIC (Small Outline Integrated Circuit) Mounting Style: Surface Mount Thermal Performance: Designed for Efficient Heat Dissipation Protection Features: Undervoltage Lockout, Robust Against Overload Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Power MOSFET/IGBT Switching, DC-DC Converters, Motor Control, Power Supplies, Class-D Audio Amplifiers, Pulse-Width Modulation Circuits, High-Speed Switching Circuits Key Features High current output for rapid gate charging and discharging CMOS/TTL input logic compatible Fast propagation delay and rise/fall times Rail-to-rail output voltage swing Suitable for high-speed, high-efficiency switching designs Reliable operation in industrial and commercial environments Compact surface-mount package for easy PCB integration Supports both high-side and low-side MOSFET driving Robust against short-term overloads and undervoltage conditions #TC4421AVAT #MicrochipTechnology #MOSFETDriver #IGBTDriver #HighSpeedDriver #PWMDriver #SwitchingPower #DC_DCConverter #MotorControl #PowerElectronics #IndustrialElectronics #SurfaceMount #ElectronicComponents #HighCurrentDriver #FastSwitching #EmbeddedSystems #PCBDesign

8 Position FFC, FPC Connector Contacts, Bottom 0.039" (1.00mm) Surface Mount, Right Angle The Molex Easy-On connector is a compact surface-mount FPC/FFC interconnect solution designed for reliable board-to-cable connections in space-constrained electronic systems. Featuring a bottom-contact configuration with a flip-lock actuator, it provides secure retention of flexible printed circuits while supporting repeated insertion and removal cycles. Its low-profile construction and robust locking mechanism make it suitable for consumer electronics, industrial controls, embedded systems, displays, and portable devices where dependable signal transmission and compact form factors are required. Engineering Specifications Manufacturer: Molex Series: Easy-On FD19 Part Number: 2005280080 Connector Type: FFC/FPC Connector Contact Configuration: Bottom Contact Actuator Type: Flip-Lock ZIF Mounting Style: Surface Mount Orientation: Right Angle Circuit Count: Eight Positions Pitch: One Millimeter Cable Type: Flexible Flat Cable / Flexible Printed Circuit Contact Material: Copper Alloy Contact Finish: Gold over Nickel Housing Material: High-Temperature Thermoplastic Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Halogen Free: Yes Application Areas: LCD Interfaces, Touch Panels, Embedded Electronics, Industrial Equipment, Portable Devices, Consumer Electronics #Molex #EasyOn #FD19 #FFCConnector #FPCConnector #FlipLock #BottomContact #ZIFConnector #SMTConnector #ElectronicComponents #Interconnect #PCBDesign #EmbeddedSystems #DisplayInterface #IndustrialElectronics

24 Position Receptacle Connector 0.039" (1.00mm) Surface Mount Gold CLM-112-02-L-D-A is a 24-position, dual-row, 1.00 mm pitch surface-mount female socket connector from the Samtec CLM series. It is designed for high-density board-to-board interconnections and features Samtec's Tiger Claw™ dual-wipe contact system, providing reliable electrical performance and secure mating in compact electronic designs. The low-profile construction makes it ideal for space-constrained applications such as embedded systems, industrial controls, communication equipment, and portable electronics. Key Features 1.00 mm pitch, dual-row socket connector 24 positions (2 × 12 contacts) Surface-mount (SMT) termination Low-profile design for compact PCB layouts Tiger Claw™ dual-wipe contacts for enhanced connection reliability Gold-plated contacts for improved conductivity and corrosion resistance Suitable for board-to-board applications Available with multiple plating and packaging options Operating temperature range suitable for industrial environments RoHS compliant and UL recognized Applications Embedded computing systems Industrial automation equipment IoT devices Communication and networking hardware Test and measurement instruments Consumer electronics #Samtec #CLMSeries #BoardToBoardConnector #SMTConnector #FemaleSocket #HighDensityConnector #TigerClawContact #ElectronicsDesign #PCBConnector #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions