Pressure Sensor 203.05PSI (1400kPa) Absolute 24 b 8-SMD Module The MS580314BA01-00 is a high-resolution digital absolute pressure sensor module from TE Connectivity Measurement Specialties. It integrates a precision MEMS pressure sensing element, a 24-bit ΔΣ ADC, and factory-calibrated coefficients to provide highly accurate digital pressure and temperature measurements. The sensor supports both I²C and SPI communication interfaces, making it easy to interface with a wide range of microcontrollers while requiring minimal external components. It is designed for low-power, high-accuracy applications such as altimeters, depth measurement systems, weather monitoring, industrial pressure sensing, and portable instrumentation. Key Features Digital absolute pressure sensor with integrated MEMS sensing element High-resolution 24-bit ΔΣ ADC with factory calibration Supports I²C and SPI digital interfaces Pressure range up to 14 bar (1400 kPa / 203 psi) Supply voltage: 1.8 V to 3.6 V Integrated temperature measurement for compensation and monitoring Low power consumption, suitable for battery-powered devices Operating temperature range: −40°C to +85°C Excellent long-term stability with low hysteresis Compact 8-SMD module for surface-mount PCB assembly Requires few or no external components for operation #PressureSensor #MEMS #AbsolutePressure #DigitalSensor #24BitADC #I2C #SPI #LowPower #IndustrialElectronics #Altimeter #DepthMeasurement #WeatherMonitoring #TEConnectivity #SurfaceMount #EmbeddedSystems

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Current Sense Amplifier 1 Circuit Single-Ended SOT-23-6 The INA187A3IDBVR is a precision high-side and low-side current sense amplifier designed for accurate bidirectional current measurement in power management, motor control, battery monitoring, and industrial sensing applications. The device integrates a matched precision gain stage optimized for shunt resistor voltage amplification while maintaining excellent common-mode rejection and low offset drift. It supports wide common-mode input voltages, enabling current monitoring across supply rails in automotive, industrial, and embedded systems. The amplifier features fast response characteristics, low quiescent current consumption, and a compact surface-mount package suitable for space-constrained designs. Engineering Specification Device Type Precision Current Sense Amplifier Manufacturer Texas Instruments Manufacturer Part Number INA187A3IDBVR Amplifier Configuration Current shunt monitor with fixed gain Gain Variant High fixed gain configuration optimized for low-value shunt resistor sensing Input Measurement Capability Bidirectional current sensing Common-Mode Voltage Range Supports high-side and low-side sensing across wide supply rails Input Offset Characteristics Low offset voltage with low temperature drift for accurate current measurement Bandwidth Performance Wide bandwidth suitable for dynamic load and transient current monitoring Response Time Fast settling and propagation performance for real-time current feedback systems Power Supply Requirements Single-supply operation compatible with low-voltage logic systems Output Type Analog voltage output proportional to sensed shunt voltage Common-Mode Rejection High common-mode rejection ratio for stable operation in noisy environments Temperature Performance Industrial operating temperature range with stable gain accuracy over temperature Protection Features Robust input structure designed for high common-mode environments Package Type SOT-23 surface-mount package Mounting Method Surface mount technology Typical Applications Battery management systems, power distribution monitoring, motor current feedback, DC/DC converter monitoring, industrial automation, telecom power systems, and embedded power diagnostics. #commonpartslibrary #integratedcircuit #currentsenseamplifier

Gas, Humidity, Pressure, Temperature Sensor Digital Output The BME690 is a compact 4-in-1 environmental sensor from Bosch Sensortec designed for advanced indoor air-quality monitoring. It integrates gas, humidity, temperature, and barometric pressure sensing into a single low-power MEMS device. The sensor is optimized for battery-powered and high-condensation environments, making it suitable for smart home, industrial, wearable, and IoT applications. Key Features 4-in-1 environmental sensing: Gas sensing Relative humidity Temperature Barometric pressure Detects: Volatile Organic Compounds (VOCs) Volatile Sulfur Compounds (VSCs) Other air-quality-related gases Supports indoor air quality (IAQ) monitoring Provides: IAQ index bVOC equivalent CO₂ equivalent outputs Improved robustness for high-condensation environments Ultra-small package: 3.0 × 3.0 × 0.93 mm 8-pin metal LGA package Low power consumption suitable for battery-powered devices Interfaces: I²C up to 3.4 MHz SPI up to 10 MHz Wide operating range: Temperature: −40°C to +85°C Humidity: 0–100% RH Pressure: 300–1100 hPa Supply voltage: VDDIO: 1.2 V to 3.6 V VDD: 1.71 V to 3.6 V Humidity accuracy: ±3% RH Temperature accuracy: ±0.5°C Pressure accuracy: ±0.5 hPa absolute Supports AI-based gas classification using Bosch BME AI-Studio Pin-compatible evolution of the BME688 platform Designed for: Smart home devices HVAC systems Air-quality mapping Food freshness monitoring Wearables Industrial sensing applications #CommonPartsLibrary #Sensor

Battery Multi-Function Controller IC Lithium Ion/Polymer 32-VFQFPN (5x5) L9961 is part of a complete battery pack monitoring, balancing, and protecting system for Li-Ion and Li-Polymer cells in 3, 4 or 5 series configurations. The L9961 uses a high precision ADC to provide cell voltage, stack voltage and temperature conversion via external NTC. Voltage monitoring functions are cyclically performed with a programmable loop time. Stack current is also monitored via a high accuracy CSA, continuously running and performing also Coulomb counting. Cell balancing is available and can be simultaneously activated on all cells. IC configuration and information exchange for SOC/SOH estimation are performed via I2C peripheral. The IC also integrates a dual pre-driver programmable in both HS/LS configurations for driving pack relays. L9961 also implements battery pack fuse protection to prevent fire and explosion hazards. A 3.3 V regulator with a high current capability is available for supplying pack controller and other external circuitry in both standby and normal operation modes. The IC protects the battery pack against over/under voltage conditions and monitors for over/ under temperature. It also features protection against overcurrent (both directions) and short-circuit in discharge events. Safety-relevant configurations can be stored in the internal NVM to avoid re-programming the device at each wake-up. Features • 2 μA shipment - DEEP SLEEP mode current and 5 μA standby consumption (with VREG LDO active) standby consumption (with VREG LDO active) • Integrated 3.3 V VREG LDO for supplying MCU and LEDs • Measures cell voltage (3 to 5 cells), with over/undervoltage detection and balance undervoltage protection • 12-bit voltage measurement with maximum error of ±15 mV in the [1.5 – 4.5] V range, for -40 °C < TJ < 105 °C • Measures stack voltage, with over/under voltage detection and plausibility check vs. sum of cells • Measures pack temperature via NTC, with over/undertemperature detection • Ratiometric temperature measurement with ±0.8% max. gain error in the [0.2 – VREG] V range, for -40 °C < TJ < 105 °C • Measures battery current, with Coulomb counting, overcurrent (both directions) and short-circuit in discharge protection. • 16-bit signed current measurement with 0.1% full scale error at room temperature • I 2C peripheral for device programming and data transfers over I2C bus • Cell balancing supporting up to 70 mA per cell • Dual configurable HS/LS predriver for pack relay management • Pack fuse management • Embedded NVM for configuration parameters storage • High hotplug robustness Applications • Cordless power tools • Backup energy storage systems and UPS • Light electric vehicles (e-bikes, scooters, etc.) • Portable and semi-portable equipment • Medical equipment #L9961TR #BatteryManagement #BMS #LiIonBattery #LiPoBattery #STMicroelectronics #BatteryProtection #CellBalancing #CoulombCounting #PowerManagement #EmbeddedSystems #EnergyStorage #EBike #PowerTools #ElectronicsDesign

Monitors & Reset Circuits TPS3808G33DRVT WSON-6_L2.0-W2.0-P0.65-TL-EP LCSC Part Number: C702176 JLCPCB Part Class: undefined Manufactured by TI(德州仪器) Texas Instruments TPS3808 low-quiescent-current voltage supervisor and reset generator, supply voltage monitoring from 0.4V to 5V, 0.5% threshold accuracy, adjustable reset delay from 1.25ms to 10s using external capacitor, open-drain RESET output, manual reset (MR) input, ultra-low 2.4µA typical quiescent current, suitable for microcontrollers, DSPs, FPGAs, ASICs, battery-powered and portable devices, operating temperature range -40°C to +125°C, available in SOT-23-6 and WSON-6 packages. Search Keywords: TPS3808, TPS3808G, Texas Instruments TPS3808, TI TPS3808, voltage supervisor, reset supervisor, reset generator, watchdog reset, power-on reset, POR supervisor, brownout detector, voltage monitor IC, microcontroller supervisor, open drain reset, adjustable reset delay, manual reset supervisor, low power supervisor, battery powered reset IC, TPS3808 datasheet, TPS3808 SOT-23-6, TPS3808 WSON-6 Hashtags: #TPS3808 #TexasInstrumentsTPS3808 #TIVoltageSupervisor #VoltageSupervisor #ResetSupervisor #ResetGenerator #PowerOnReset #BrownoutDetector #VoltageMonitorIC #MicrocontrollerSupervisor #OpenDrainReset #ManualReset #LowPowerSupervisor #BatteryPoweredDesign #SOT236 #WSON6

16 Bit Digital to Analog Converter 1 40-VQFN (6x6) The DAC81416RHAT is a precision, low-power, multi-channel digital-to-analog converter designed for high-accuracy industrial and instrumentation applications. It integrates sixteen independently programmable voltage-output DAC channels with internal precision reference support, output buffering, and flexible serial communication capability. The device is optimized for systems requiring deterministic analog signal generation, high linearity, low drift, and stable long-term performance. Typical applications include automated test equipment, process control, programmable logic controllers, data acquisition systems, and closed-loop control platforms. The device supports high-resolution output generation with monotonic behavior and excellent channel-to-channel matching. Integrated diagnostic and protection features improve system reliability in harsh operating environments. The architecture is intended for dense analog output designs where low power consumption, compact footprint, and precision accuracy are critical. Engineering Specification Manufacturer: Texas Instruments Device Type: Multi-Channel Precision Voltage Output Digital-to-Analog Converter Package Type: VQFN Mounting Type: Surface Mount Channel Configuration: Sixteen independent DAC output channels DAC Resolution: High-resolution precision architecture suitable for industrial control and instrumentation systems Output Type: Buffered voltage output Interface Type: SPI-compatible serial interface Reference Support: Internal reference with external reference capability Power Supply Operation: Single-supply analog and digital operation Output Characteristics: Rail-to-rail capable buffered analog outputs with low glitch energy and fast settling behavior Linearity Performance: High integral and differential linearity with monotonic output behavior across full operating range Noise Performance: Low output noise and low temperature drift for precision signal generation Update Capability: Simultaneous and asynchronous channel update support Calibration Features: Integrated gain and offset correction support Diagnostic Features: Communication integrity monitoring and fault detection capability Industrial Features: Designed for precision automation, process control, programmable instrumentation, and multi-channel analog control systems Temperature Range: Industrial operating temperature range Protection Features: Robust serial interface handling and stable output drive architecture for industrial environments Applications: Industrial automation, programmable power control, automated test equipment, data acquisition systems, instrumentation, and closed-loop analog control platforms #commonpartslibrary #integratedcircuit #analog #digital #converter

4/4 Transceiver Full MII, RMII 32-VQFN (5x5) ## Engineering Specification ## General Description The **LAN8770M-I/PRA** is a Microchip Technology single-port **100BASE-T1 Ethernet physical layer transceiver** designed for automotive, industrial, and embedded networking applications. It provides Ethernet communication over a single balanced twisted pair and is suitable for compact systems requiring reliable network connectivity, low-power operation, and standard MAC interface support. The device is commonly used in automotive electronic control units, infotainment systems, telematics modules, sensor nodes, industrial control systems, and embedded Ethernet hardware. ## Device Identification Manufacturer Part Number: **LAN8770M-I/PRA** Manufacturer: **Microchip Technology** Product Family: **LAN8770** Device Category: **Integrated Circuit** Device Type: **Ethernet PHY Transceiver** Ethernet Standard: **100BASE-T1** Interface Type: **MII and RMII** Mounting Type: **Surface Mount** Package Type: **VQFN** ## Functional Description The device functions as an Ethernet physical layer transceiver that connects a host controller or microcontroller MAC interface to a single-pair Ethernet physical medium. It handles the analog and digital PHY functions required for 100BASE-T1 communication, allowing embedded systems to transmit and receive Ethernet data over a single twisted pair cable. ## Network and Interface Description The **LAN8770M-I/PRA** supports 100 Mb/s single-pair Ethernet communication and provides MII and RMII host interface options. This allows integration with microcontrollers, processors, gateways, and network controllers that support standard Ethernet MAC interfaces. The device is intended for applications where compact Ethernet connectivity and reduced cabling complexity are required. ## Electrical Description The device is designed for low-voltage operation and supports multiple supply domains according to the manufacturer’s recommended operating conditions. Proper power sequencing, decoupling, reset handling, clocking, and reference layout should be implemented to maintain stable PHY operation and signal integrity. ## Package and Mechanical Description The component is supplied in a compact surface-mount **VQFN package**, suitable for dense printed circuit board assemblies. The package supports automated assembly and is appropriate for space-constrained automotive and industrial electronic designs. ## Control and Diagnostic Description The PHY supports management and configuration through standard control interfaces used in Ethernet designs. It provides status monitoring and configuration capability for link management, operating mode selection, and system-level diagnostics. These features allow the host controller to configure and monitor Ethernet link behavior during operation. ## Automotive and Industrial Suitability The **LAN8770M-I/PRA** is suitable for embedded systems requiring robust single-pair Ethernet communication. It is applicable to automotive networking, telematics, infotainment, advanced driver assistance systems, industrial Ethernet nodes, building automation, control modules, and other connected embedded platforms. ## Mounting and Assembly Description The component is intended for surface-mount PCB assembly using standard reflow soldering processes. PCB layout should follow Microchip’s hardware design guidance, including proper power supply decoupling, controlled impedance routing, short signal paths, grounding, and separation of sensitive analog and digital sections where applicable. ## Design Considerations The design should account for Ethernet signal integrity, single-pair cable interface requirements, common-mode noise control, EMC performance, supply filtering, oscillator or clock source requirements, reset timing, thermal performance, and package solderability. The device should not be operated beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Application Suitability The device is suitable for automotive Ethernet nodes, electronic control units, telematics modules, infotainment systems, sensor interfaces, industrial controllers, embedded gateways, connected equipment, and compact network-enabled hardware requiring 100BASE-T1 Ethernet PHY functionality. ## Hashtags #commonpartslibrary #integratedcircuit #ethernetphy #microchip #microchiptechnology #lan8770 #lan8770mipra #singlepairethernet #100baset1 #automotiveethernet #ethernettransceiver #phytransceiver #embeddednetworking #mii #rmii #vqfnpackage #smdcomponent #surfacemount #automotiveelectronics #industrialethernet #telematics #infotainment #embeddedhardware #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

Accelerometer X, Y, Z Axis ±2g, 4g, 8g 6.25Hz ~ 200Hz 12-LGA (2.2x2.3) The ADXL367BCCZ-RL7 is an ultra-low power, three-axis MEMS accelerometer developed by Analog Devices for motion sensing applications requiring extremely low energy consumption and high measurement stability. The device integrates precision acceleration sensing, embedded motion detection capabilities, and intelligent power management features within a compact surface-mount package suitable for portable and battery-operated systems. The accelerometer supports both I²C and SPI digital communication interfaces, enabling flexible integration with embedded processors, microcontrollers, and sensor hubs. Its architecture is optimized for continuous motion monitoring while maintaining exceptionally low current consumption, making it ideal for wearable electronics, asset tracking devices, medical monitoring equipment, industrial sensing systems, and Internet of Things platforms. The device incorporates embedded activity, inactivity, and wake-up detection functions that allow host processors to remain in low-power states until significant motion events occur. Integrated FIFO buffering and programmable interrupt functionality reduce processor overhead and improve overall system efficiency. The ADXL367BCCZ-RL7 is designed for robust operation across a wide operating temperature range and maintains high measurement accuracy with low noise and excellent long-term stability. The compact LGA package enables dense PCB layouts for space-constrained designs. Key Features Motion Sensing Three-axis digital accelerometer Selectable acceleration measurement ranges High-resolution motion detection Low noise sensing architecture Integrated temperature sensor Power Management Ultra-low power operation optimized for battery-powered systems Multiple operating and standby modes Autonomous motion-triggered wake-up capability Efficient duty-cycling support Digital Interfaces Supports SPI communication Supports I²C communication Programmable interrupt outputs Embedded FIFO data buffering Embedded Detection Functions Activity detection Inactivity detection Motion-triggered interrupt generation Autonomous wake-up monitoring Mechanical and Environmental Compact LGA surface-mount package High shock tolerance Wide operating temperature capability Suitable for portable and industrial environments Electrical Characteristics Supply Requirements Low-voltage digital supply operation Optimized for low-current embedded systems Stable operation across supported voltage range Sensor Performance High sensitivity stability Low offset drift Low output noise density Configurable output data rates Communication and Control Supported Interfaces SPI serial interface I²C serial interface Programmability Configurable measurement ranges Adjustable output data rates Programmable interrupt mapping FIFO configuration support Package Information Package Type LGA surface-mount package Mounting PCB surface mount compatible Suitable for automated assembly processes Typical Applications Wearable electronics Health and fitness monitoring Portable instrumentation Asset and condition monitoring Industrial sensing systems IoT sensor nodes Motion-activated devices Battery-powered embedded systems #commonpartslibrary #integratedcircuit #accelerometer #sensor

3 Channel AFE 24 Bit 28-WQFN (5x5) ADS1293CISQ/NOPB is a highly integrated, low-power 3-channel ECG Analog Front-End (AFE) from Texas Instruments. It is designed for portable and battery-powered medical devices, fitness monitors, heart-rate monitoring systems, Holter monitors, and other electrocardiogram (ECG) applications. The device integrates signal acquisition, filtering, lead-off detection, right-leg drive generation, and high-resolution analog-to-digital conversion into a single IC, reducing external component count and system cost. Key Features Three high-resolution ECG acquisition channels 24-bit analog-to-digital conversion Simultaneous pace detection support Ultra-low power consumption of approximately 0.3 mW per channel Low input-referred noise of 7 µVpp (40 Hz bandwidth) Programmable sample rates up to 25.6 ksps Differential input voltage range of ±400 mV Integrated EMI-hardened input filters Flexible input routing matrix Built-in Right-Leg Drive (RLD) amplifier AC and DC lead-off detection Integrated Wilson and Goldberger terminal generation Battery voltage monitoring capability Internal oscillator and voltage reference ALARMB pin for interrupt-driven diagnostics and fault reporting Multiple power-down and standby modes for battery-powered systems SPI-compatible digital interface Operating temperature range: –20°C to +85°C 28-pin WQFN package (5 mm × 5 mm) Typical Applications Portable 1-, 3-, 5-, 6-, 7-, 8-, and 12-lead ECG systems Holter monitors Event recorders Telemedicine devices Patient vital-sign monitoring equipment Automated External Defibrillators (AEDs) Sports and fitness heart-rate monitors Wearable medical devices Hashtags #commonpartslibrary #integratedcircuit #TexasInstruments #ADS1293 #AFE #AnalogFrontEnd #ECG #Electrocardiogram #MedicalElectronics #HealthTech #WearableDevices #HeartRateMonitor #PatientMonitoring #BiomedicalEngineering #24BitADC #LowPowerDesign #SPI #SignalConditioning #PortableMedicalDevices #HolterMonitor #Telemedicine #VitalSignsMonitoring #EmbeddedSystems #MixedSignalIC #WQFN28 #BatteryPoweredDevices #MedicalInstrumentation

ARM® Cortex®-M33 RA6E1 Microcontroller IC 32-Bit 200MHz 1MB (1M x 8) FLASH 64-LFQFP (10x10) ## Engineering Specification ## General Description The **R7FA6E10F2CFM#AA0** is a Renesas Electronics **RA6E1 series microcontroller** designed for embedded control, industrial electronics, IoT edge devices, automation systems, and general-purpose connected applications. It is built around an **Arm Cortex-M33 processor with TrustZone support**, providing high performance, secure execution capability, and flexible integration for modern embedded designs. ## Device Identification Manufacturer Part Number: **R7FA6E10F2CFM#AA0** Manufacturer: **Renesas Electronics** Product Family: **RA Family** Series: **RA6 Series** Group: **RA6E1 Group** Device Category: **Integrated Circuit** Device Type: **Microcontroller Unit** ## Core and Processing The device uses an **Arm Cortex-M33 core** and is intended for high-performance embedded processing. It supports secure application development through TrustZone technology and is suitable for systems requiring reliable control, fast response, and efficient software execution. ## Memory Configuration The microcontroller includes program flash memory, data flash memory, and SRAM resources suitable for embedded firmware, application code, configuration storage, and runtime processing requirements. ## Package and Mechanical Description The component is supplied in an **LQFP surface-mount package**, making it suitable for compact printed circuit board layouts and standard automated assembly processes. ## Electrical and Operating Description The device is designed for low-voltage embedded systems and supports operation across an industrial temperature range. It is suitable for products requiring stable performance in controlled, commercial, or industrial operating environments. ## Communication and Interface Support The device supports common embedded communication interfaces such as USB, UART, SPI, I²C, QSPI, and CAN, allowing integration with sensors, displays, external memory, communication modules, and other peripheral devices. ## Analog and Control Features The microcontroller includes analog conversion capability, timer functions, PWM support, watchdog protection, reset monitoring, and low-voltage detection features. These functions make it suitable for control systems, monitoring equipment, and mixed-signal embedded applications. ## Security and Debug Features The device supports embedded security functions including TrustZone, unique device identification, and true random number generation. Debug and development access is supported through standard JTAG and SWD interfaces. ## Application Suitability This device is suitable for embedded controllers, IoT devices, industrial automation, metering equipment, appliance control, USB-connected products, sensor-based systems, and general electronic control applications requiring a compact and secure microcontroller solution. ## Hashtags #commonpartslibrary #integratedcircuit #microcontroller #renesas #renesaselectronics #ra6e1 #ra6series #armcortexm33 #embeddedsystems #electronicscomponents #semiconductor #mcu #iotdevices #industrialautomation #pcbdesign #electronicparts #componentlibrary #engineeringparts #hardwaredesign #electronicsengineering

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345-EP is an extended performance version of the ADXL345, which is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2 C digital interface. The ADXL345-EP is well suited for extended temperature range industrial and aerospace equipment. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Freefall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345-EP is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, enhanced plastic package. Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) Power consumption scales automatically with bandwidth User-selectable resolution from 10 to 13 bits 4 mg/LSB scale factor in all g ranges 32-sample FIFO minimizes host processor load Single tap, double tap, and free-fall detection Activity/inactivity monitoring Supply voltage range: 2.0 V to 3.6 V I/O voltage range: 1.7 V to VS SPI (3- and 4-wire) and I2C digital interfaces Flexible interrupt modes mappable to either interrupt pin Measurement ranges selectable via serial command Bandwidth selectable via serial command 10,000 g shock survival Pb free/RoHS compliant #commonpartslibrary #integratedcircuit #accelerometer

Ultra Efficient Dual Sources Energy Manager with Ratio/Constant Voltage Regulation, Regulated Buck Output and 5 V Charger, 120 mV, 135 mA The AEM13921 is a fully integrated and compact power management circuit that extracts DC power from two harvesting sources to store energy in a rechargeable storage element and supply an application circuit. A 5 V input can also be used to charge the storage element (e.g., if it gets depleted). This compact and ultra-efficient PMIC allows for extending battery lifetime and eliminating the primary energy storage in a large range of applications. Both sources implement Maximum Power Point Tracking (MPPT) based on open-circuit voltage ratio as well as constant source voltage regulation features, allowing for harvesting the maximum power available from each source to charge the storage element. With its unique cold-start circuit, it can start operating with an input voltage as low as 275 mV (min. 1.5 µW power). The configurable protection thresholds prevent overcharging and overdischarging the storage element. No external components are required to set those thresholds. The thermal monitoring prevents charging and discharging the storage element outside a configurable temperature range. The Average Power Monitoring (APM) allows the application circuit to get an estimate of the energy harvested from each source to the battery and from the battery to the application circuit. A shipping mode is available to avoid charging and discharging the storage element during shipping or storage. A buck regulator with selectable output voltage allows an application circuit to be supplied with high efficiency. I²C communication allows users to control every setting of the AEM13921 from the application circuit MCU. Features and Benefits Dual sources inputs - Boost operation optimized for each source. - Conversion efficiency above 90 % on each source. - Harvests from 120 mV after cold start. - Simultaneous harvesting from both sources. - Up to 135 mA current extracted from the harvester. Maximum Power Point Tracking - Both sources configurable to constant voltage mode or to open-circuit voltage ratio mode. - Optimal harvesting from a multiple combinations of harvesters (PV cells, RF, vibration, pulsed sources...). Cold start from 275 mV / 1.5 µW input - Startup at ultra-low power from each harvesting source input. Configurable overdischarge & overcharge protection - Supports various types of rechargeable storage elements (LiC, Li-ion, LiPo, Li-ceramic pouch...). Regulated output for application circuit - Buck regulator conversion efficiency up to 96 %. - Selectable output voltage between 0.6 V and 3.3 V. - Output current up to 100 mA. Thermal monitoring - Storage element protection against overtemperature and under-temperature during charging and discharging, independently. Average Power Monitoring - Provides data to determine how much energy has been transferred to the storage from each source and from the 5 V charger, as well as the energy drained from the storage to supply the application circuit. System configuration by GPIO or I²C communication - All settings dynamically configurable through GPIO or I²C (Fast Mode Plus). - System data available through I²C. Shipping mode - Storage element charge and discharge disabling during shipment. External 5 V charging capability - Extra charging input for 5 V power supplies. - Configurable CC and CV modes (max. 135 mA). - Provides a fast charging alternative when no source is available for a long time. #AEM13921 #EnergyHarvesting #PowerManagementIC #PMIC #MPPT #BatteryCharging #EnergyAutonomous #IoT #WirelessSensor #IndustrialMonitoring #EmbeddedSystems #QFN #epeas #LowPowerDesign

Temperature Sensor Digital, Local -40°C ~ 125°C 16 b 4-PICOSTAR (0.76x0.76) The TMP114NCIYMTR is a high-accuracy digital temperature sensor designed for precision thermal monitoring applications in industrial, automotive, medical, and embedded electronic systems. The device integrates a precision band-gap temperature sensing element, analog-to-digital conversion circuitry, EEPROM memory, and a digital communication interface within a compact low-power package. The sensor supports accurate local temperature measurements with factory calibration and programmable alert functionality, enabling reliable thermal protection and environmental monitoring in space-constrained designs. Engineering Specification Manufacturer: Texas Instruments Manufacturer Part Number: TMP114NCIYMTR Device Type: Digital Temperature Sensor Temperature Measurement Method: Local Semiconductor Temperature Sensing Interface Type: I²C-Compatible Serial Interface Supply Voltage Range: Ultra-Low Voltage Operation Compatible with Battery-Powered Systems Temperature Measurement Range: Industrial Temperature Range Support Accuracy: High-Precision Factory-Calibrated Temperature Measurement Resolution: High-Resolution Digital Temperature Output Conversion Architecture: Integrated Sigma-Delta Analog-to-Digital Conversion Programmable Features: High and low temperature alert thresholds EEPROM-stored configuration settings Programmable conversion rate Offset correction calibration Alert and interrupt functionality Power Consumption: Optimized for Low-Power Embedded Applications Communication Speed: Standard and Fast-Mode I²C Support Package Type: Small Outline Leadless Package Mounting Type: Surface Mount Technology Operating Environment: Suitable for Industrial and Embedded Control Systems Protection Features: Integrated thermal monitoring alerts Nonvolatile configuration retention Robust digital communication interface Applications: Industrial temperature monitoring Medical instrumentation Battery-powered electronics Thermal management systems Precision embedded sensing Data acquisition equipment Environmental monitoring devices #commonpartslibrary #integratedcircuit #temperaturesensor #digital

ARM® Cortex®-M0+ STM32U0 Microcontroller IC 32-Bit 56MHz 256KB (256K x 8) FLASH 48-LQFP (7x7) # STM32U083CCT6 ## General Description The STM32U083CCT6 is an ultra-low-power microcontroller from STMicroelectronics based on the Arm Cortex-M0+ core. It is specifically designed for energy-efficient embedded applications requiring long battery life, advanced peripheral integration, secure operation, and reliable real-time performance. The device combines low-power processing, embedded Flash memory, SRAM, analog peripherals, communication interfaces, and hardware security features within a compact package. Its architecture makes it ideal for smart sensors, industrial monitoring systems, medical devices, wearable electronics, smart metering, home automation products, and Internet of Things applications where power efficiency is a primary design requirement. ## Key Features ### Processing Architecture * Arm Cortex-M0+ processor core * Optimized low-power computing architecture * Efficient real-time processing capability * Interrupt-driven operation support * Embedded system control functionality ### Memory Resources * Embedded Flash memory * Integrated SRAM * Non-volatile data storage support * High-reliability memory architecture * Efficient code execution capability ### Low-Power Features * Ultra-low-power operating modes * Multiple sleep and standby modes * Fast wake-up capability * Battery-powered application optimization * Energy-efficient peripheral operation * Extended product operating life in portable systems ### Security Features * Hardware security mechanisms * Memory protection functionality * Secure firmware execution support * Data integrity protection * Secure embedded application development support ### Communication Interfaces * USART communication interfaces * UART communication support * SPI serial communication interfaces * I²C communication interfaces * Low-power communication capability * Flexible external device connectivity ### Analog Features * Analog-to-digital conversion capability * Precision signal acquisition support * Integrated analog peripherals * Sensor interface compatibility * Low-power analog operation ### Timer and Control Functions * General-purpose timers * PWM signal generation * Real-time clock functionality * Event-driven control capability * Timing and scheduling support ### Package Characteristics * Surface-mount package * Compact footprint design * Automated assembly compatibility * Suitable for space-constrained applications * Industrial-grade packaging ### Material Construction * Advanced low-power semiconductor technology * RoHS-compliant materials * Lead-free package construction * High-reliability integrated circuit design ### Environmental Characteristics * Suitable for industrial and commercial environments * Long operational service life * Stable performance under continuous operation * Robust low-power architecture ### Application Areas * Internet of Things Devices * Smart Sensors * Wearable Electronics * Medical Monitoring Equipment * Home Automation Systems * Smart Metering Applications * Battery-Powered Products * Environmental Monitoring Systems * Industrial Data Acquisition Equipment * Consumer Electronics * Portable Embedded Systems * Wireless Sensor Nodes ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade Embedded Microcontroller Solution ## Manufacturer STMicroelectronics ## Product Family STM32U0 Ultra-Low-Power Microcontroller Series #STM32U083CCT6 #STM32U0 #STMicroelectronics #Microcontroller #UltraLowPowerMCU #CortexM0Plus #EmbeddedSystems #IoT #SmartSensors #WearableElectronics #BatteryPoweredDevices #IndustrialElectronics #EmbeddedDesign #FirmwareDevelopment #ElectronicsEngineering

+/-24V PGA I/P 24-BIT 256KSPS DA The ADAQ7767-1BBCZ is a high-performance, precision data acquisition (DAQ) µModule® system from Analog Devices. It integrates a 24-bit sigma-delta analog-to-digital converter (ADC), signal conditioning, and essential analog front-end components into a compact package. Designed for high accuracy and ease of use, it significantly reduces design complexity, layout effort, and noise sensitivity in precision measurement systems. This device is optimized for applications requiring high resolution, low noise, and excellent DC performance, such as industrial automation, instrumentation, and test equipment. Key Features 24-bit resolution sigma-delta ADC Integrated analog front end (AFE) Low noise, high dynamic range performance Programmable gain amplifier (PGA) Wide input bandwidth Low drift and high linearity SPI-compatible serial interface Internal reference and buffer options Compact system-in-package (SiP) design Electrical Characteristics Resolution: 24 bits Sampling Rate: Up to 256 kSPS (depending on configuration) Input Type: Differential Input Voltage Range: ±VREF (dependent on configuration) Signal-to-Noise Ratio (SNR): ~108 dB (typical) Total Harmonic Distortion (THD): Low distortion performance Reference Voltage: Internal or external supported Power Requirements Analog Supply Voltage (AVDD): 4.5 V to 5.5 V (typical) Digital Supply Voltage (DVDD): 1.8 V to 3.3 V Power Consumption: Optimized for precision applications Interface Communication: SPI-compatible serial interface Data Output: Serial digital output Control: Register-based configuration Package Information Package Type: µModule® (BGA) Package Code: BBCZ Mounting Type: Surface mount Compact footprint for space-constrained designs Operating Conditions Operating Temperature Range: -40°C to +85°C (industrial grade) Storage Temperature Range: -65°C to +150°C Applications Industrial process control Data acquisition systems Precision instrumentation Test and measurement equipment Medical instrumentation Energy monitoring systems Advantages Reduces PCB design complexity Minimizes noise and parasitic effects Factory-optimized signal chain performance Faster time-to-market

Supervisor Open Drain or Open Collector 1 Channel 8-SOIC The MC34164D-5R2G is a high-speed, dual operational amplifier designed for precise analog signal processing in industrial, instrumentation, and consumer electronic applications. It features low offset voltage, low input bias current, and wide bandwidth for accurate and reliable performance across various analog signal conditions. Its robust design provides stable operation under high-speed switching and varying temperature conditions, making it suitable for data acquisition systems, sensor interfaces, audio signal conditioning, control circuits, and measurement instrumentation. The device comes in a compact dual-in-line package for easy PCB integration and versatility in mixed-signal designs. Engineering Specifications Manufacturer: ON Semiconductor Part Number: MC34164D-5R2G Device Type: Dual Operational Amplifier Amplifier Configuration: Dual Op-Amp Input Offset Voltage: Low for Precision Applications Input Bias Current: Low Supply Voltage Range: Wide Operating Range Gain Bandwidth Product: High for Fast Signal Processing Slew Rate: Optimized for High-Speed Applications Output Type: Rail-to-Rail Compatible Noise Performance: Low Noise Analog Operation Package Type: Small Outline Integrated Circuit (SOIC) Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Sensor Signal Conditioning, Data Acquisition, Control Systems, Audio Processing, Industrial Instrumentation, Embedded Analog Circuits, Measurement and Monitoring Equipment, General-Purpose Analog Designs Key Features Dual high-speed operational amplifier in a single package Low input offset voltage for precision analog applications Low input bias current for high-impedance signal sources Wide supply voltage range for flexible design Fast slew rate and high gain bandwidth for accurate signal processing Compact surface-mount package for space-efficient PCB layouts Stable operation under industrial temperature ranges Suitable for instrumentation and embedded analog signal circuits Low-noise design for high-fidelity analog applications #MC34164D5R2G #ONSemiconductor #OperationalAmplifier #OpAmp #DualOpAmp #HighSpeedOpAmp #AnalogSignalProcessing #SensorInterface #DataAcquisition #ControlSystems #AudioProcessing #IndustrialElectronics #EmbeddedSystems #SOICPackage #SurfaceMount #ElectronicComponents #PCBDesign #PrecisionAmplifier #SignalConditioning

Charger IC Multi-Chemistry 32-QFN (4x4) The BQ25730RSNR is a highly integrated synchronous buck battery charger and system power management IC developed by Texas Instruments for applications requiring efficient charging of multi-cell lithium-ion and lithium-polymer batteries. The device is optimized for USB Type-C, USB Power Delivery, industrial, and portable embedded systems where high charging efficiency, flexible power management, and compact implementation are required. The charger integrates high-side and low-side MOSFET gate drivers along with advanced power path management features, enabling efficient battery charging while simultaneously powering the system load. The architecture supports NVDC power path operation, allowing stable system voltage regulation even when the battery is deeply discharged or absent. The device supports a wide operating input voltage range and programmable charging parameters suitable for various battery chemistries and capacities. Integrated input current optimization and dynamic power management help maximize available adapter power while preventing overload conditions. The BQ25730RSNR communicates with the host processor through an I²C interface, enabling software configuration, telemetry monitoring, and fault management. Internal ADC functionality provides real-time monitoring of charging voltage, current, temperature, and system operating conditions. Its high integration level reduces external component count and PCB area, making it suitable for compact industrial and portable power applications. Electrical Characteristics Wide input voltage operating range compatible with USB PD adapters and industrial power sources. Supports multi-cell lithium-ion and lithium-polymer battery charging configurations. High-efficiency synchronous buck charging architecture. Programmable charge current and charge voltage through digital control interface. Integrated ADC for system telemetry and power monitoring. Dynamic power management optimizes adapter utilization and system stability. Low standby current operation for battery-powered systems. Charging Features Constant current and constant voltage charging modes. Programmable input current limiting for USB and adapter compliance. Battery preconditioning and charge termination functionality. Support for fast charging operation with thermal regulation. Power path management enables simultaneous battery charging and system operation. Automatic recharge and battery maintenance functionality. Protection Features Input overvoltage protection. Battery overvoltage and overcurrent protection. Thermal regulation and thermal shutdown protection. Short-circuit and fault condition protection. Battery temperature monitoring support using external NTC thermistors. Reverse current protection and adapter isolation. Interface and Control I²C serial communication interface for configuration and monitoring. Programmable charging profiles and operating parameters. Interrupt and status reporting capabilities. Integrated telemetry reporting for voltage, current, and temperature measurements. Autonomous operation capability with minimal host intervention. Package Information Package type is WQFN. Compact thermally enhanced surface-mount package. Optimized for automated PCB assembly and high-density layouts. Applications USB Type-C and USB Power Delivery systems. Industrial portable electronics. Embedded computing platforms. Portable medical and instrumentation equipment. Battery-powered industrial controllers. Handheld terminals and data acquisition systems. Portable consumer and commercial electronics. #commonpartslibrary #integratedcircuit #powermanagement #batterycharger

Accelerometer X, Y, Z Axis ±2g, 4g 1.5kHz 14-CLCC (6x6) General Description The ADXL354BEZ is a low noise, low drift, low power, 3-axis MEMS accelerometer designed for high precision sensing applications. It provides analog voltage outputs proportional to acceleration along the X, Y, and Z axes. The device is optimized for applications requiring high resolution and long-term stability, including structural health monitoring, condition monitoring, tilt sensing, and seismic measurements. The sensor features excellent temperature stability, minimal offset drift, and selectable measurement ranges. Its very low noise density makes it suitable for vibration analysis and other sensitive measurement environments. Key Features 3-axis MEMS accelerometer with analog outputs Selectable measurement ranges of ±2 g, ±4 g, and ±8 g Ultra-low noise density of approximately 20 µg/√Hz Low offset drift across temperature Low power consumption of approximately 150 µA (typical) High resolution and measurement stability Integrated temperature sensor output Hermetically sealed package for improved environmental robustness Functional Description The ADXL354BEZ measures acceleration using capacitive MEMS sensing elements arranged along three orthogonal axes. When acceleration is applied, the internal sensing structure experiences displacement, causing a change in capacitance. This change is converted into an analog voltage output for each axis. Each axis produces a continuous-time analog signal, allowing direct interfacing with external analog-to-digital converters or signal conditioning circuits. Internal signal conditioning ensures low noise performance and stable output behavior. Electrical Characteristics (Typical) The device operates with a supply voltage ranging from 2.25 V to 3.6 V. Typical supply current during normal operation is approximately 150 µA. The noise density for all three axes is around 20 µg/√Hz. The bandwidth is user selectable and can reach up to approximately 1.5 kHz. The output signals are analog and ratiometric with respect to the supply voltage. Mechanical Characteristics The ADXL354BEZ is housed in a compact leadless chip carrier (LCC) package with approximate dimensions of 5 mm by 5 mm. It is designed for surface-mount installation. The sensing axes are aligned orthogonally to provide accurate three-dimensional acceleration measurement. Performance Characteristics High resolution suitable for precision sensing applications Low temperature coefficient and minimal drift over time High linearity across the full-scale measurement range Excellent long-term stability Low cross-axis sensitivity for improved accuracy Pin Configuration Overview The device includes power supply and ground connections, along with individual analog outputs for each axis labeled XOUT, YOUT, and ZOUT. A self-test pin is provided for functionality verification, and a temperature output pin allows monitoring of internal device temperature. Operating Conditions The device is designed to operate over a temperature range from −40°C to +125°C. Storage temperature ranges from −65°C to +150°C. The recommended supply voltage range is 2.25 V to 3.6 V. Applications Structural health monitoring Industrial condition monitoring Seismic and geophysical sensing Tilt and inclination measurement Platform stabilization systems Vibration analysis Advantages Extremely low noise performance for high sensitivity applications Stable operation across wide temperature ranges Simple analog interface without the need for digital communication protocols Robust packaging suitable for harsh environments Compliance and Reliability The ADXL354BEZ is RoHS compliant and designed for industrial-grade applications. It offers high reliability and long-term performance stability in demanding operating conditions. #commonpartslibrary #sensor #accelerometer

Accelerometer X, Y, Z Axis ±3g 1.6kHz (X,Y), 550Hz (Z) 16-LFCSP-LQ (4x4) The ADXL335BCPZ-RL7 is a low-power, complete 3-axis accelerometer with analog voltage outputs proportional to acceleration. It measures acceleration along the X, Y, and Z axes with a full-scale range of ±3 g. This device integrates a micro-electromechanical system (MEMS) sensor with signal conditioning circuitry, enabling direct analog output without the need for external amplification. The RL7 suffix indicates tape-and-reel packaging for automated assembly. The ADXL335BCPZ-RL7 is designed for compact, battery-powered, and motion-sensitive applications where low power consumption and ease of integration are critical. Functional Overview The accelerometer operates using a capacitive sensing structure. Acceleration causes displacement of an internal mass, changing capacitance, which is converted into a proportional analog voltage output. Each axis operates independently and provides a continuous analog signal that can be read by a microcontroller’s ADC. External capacitors allow the user to configure bandwidth per axis, enabling optimization for noise or response speed. Electrical Characteristics Supply Voltage Range: 1.8 V to 3.6 V Supply Current: Typical: 350 µA Measurement Range: ±3 g Sensitivity (Typical): 300 mV/g Zero-g Bias Level: Approximately VCC / 2 Bandwidth: Adjustable via external capacitors Typical limits: X, Y axes: up to 1600 Hz Z axis: up to 550 Hz Output Characteristics Output Type: Analog (ratiometric to supply voltage) Axes: Three independent outputs (XOUT, YOUT, ZOUT) Output Impedance: Approximately 32 kΩ Noise Density: X/Y axes: ~150 µg/√Hz Z axis: ~300 µg/√Hz Mechanical Characteristics Package Type: 16-lead LFCSP Package Dimensions: Approximately 4 mm × 4 mm × 1.45 mm Mounting: Surface mount Packaging Option: Tape and reel (RL7) Environmental Specifications Operating Temperature Range: −40°C to +85°C Storage Temperature Range: −65°C to +150°C Shock Survival: Up to 10,000 g Interface Requirements External Components: Capacitors required for bandwidth selection (one per axis) Interface Type: Analog voltage outputs compatible with ADC inputs Pin Description (Summary) ST: Self-test input XOUT: X-axis analog output YOUT: Y-axis analog output ZOUT: Z-axis analog output VCC: Power supply GND: Ground NC: No connection / reserved Applications Tilt and orientation sensing Motion and vibration detection Portable electronics Gaming controllers Wearable devices Industrial monitoring systems Key Features Three-axis acceleration measurement Low power consumption Analog output for simple interfacing Compact MEMS package Adjustable bandwidth Wide temperature operating range Tape-and-reel packaging for automated manufacturing #commonpartslibrary #integratedcircuit #sensor #accelerometer

Pressure Sensor +/-0.22PSI (+/-1.5kPa) Differential Male - 0.08\" (2.00mm) Tube, Dual 16 b 16-SMD Module, Dual Top Ports The SDP33-1500Pa-TR-250PCS is a digital differential pressure sensor module from Sensirion AG, designed for high-precision measurement of low-pressure differences up to ±1500 Pa (±1.5 kPa). It belongs to the SDP3x series, which uses Sensirion’s CMOSens® technology for compact, accurate, and stable sensing performance. It is widely used in HVAC systems, airflow measurement, medical devices, and industrial control applications where precise air or gas flow monitoring is required. Key Features Differential Pressure Measurement Range: ±1500 Pa (±1.5 kPa) Digital Output Interface I²C communication for easy MCU integration High Resolution 16-bit digital output Accurate & Stable Performance Factory-calibrated and temperature compensated No zero-point drift Low Power Consumption Designed for battery-powered and embedded systems Compact SMD Module Small footprint, surface-mount package (easy PCB integration) Fast Response Time Suitable for real-time airflow and pressure monitoring Wide Operating Conditions Supply voltage: ~3.3V Operating temperature: -40°C to +85°C Reflow Solderable Compatible with standard SMT manufacturing processes Reliable Long-Term Stability Built for high-volume industrial and commercial applications Typical Applications HVAC airflow and filter monitoring Ventilation and air quality systems Medical respiratory devices Industrial automation and process control Drones and airspeed (pitot tube systems) IoT environmental sensing #CommonPartsLibrary #Sensor

Air Quality Sensor CO2 Sensor 2.5V/3.3V/5V 20-Pin SMD EP T/R The SCD41-D-R1 is a miniature photoacoustic carbon dioxide sensor module developed by Sensirion for high-accuracy environmental sensing applications. The device integrates a CO₂ sensing element, temperature sensor, humidity sensor, optical components, calibration memory, and digital signal processing into a compact surface-mount package suitable for embedded systems and portable electronics. The sensor utilizes photoacoustic sensing technology to provide precise carbon dioxide concentration measurements while maintaining low power consumption and long-term stability. Integrated humidity and temperature sensing capabilities enable environmental compensation and simplify system integration by reducing the need for external sensors. The SCD41 communicates through a standard I²C digital interface and supports automatic self-calibration functions for reliable long-term operation. Its compact footprint and low energy requirements make it suitable for battery-powered devices, smart building systems, HVAC equipment, indoor air quality monitoring systems, and IoT applications. The module is factory calibrated and designed for continuous monitoring of indoor air quality conditions. The integrated architecture minimizes external component requirements while enabling accurate sensing performance across a wide operating range. Key Features Photoacoustic CO₂ sensing technology Integrated temperature and humidity sensing High accuracy carbon dioxide measurement I²C digital communication interface Low power consumption operation Automatic self-calibration support Compact surface-mount package Factory calibrated output Long-term measurement stability Optimized for indoor air quality applications Low-profile PCB mounting design RoHS and halogen-free compliant Electrical Characteristics Low-voltage supply operation Low average current consumption suitable for portable devices Integrated digital signal processing Non-volatile calibration memory Standard I²C communication compatibility Stable operation across industrial environmental conditions Mechanical Characteristics Compact SMD package for space-constrained applications Surface-mount assembly compatible Low-profile package structure Integrated optical cavity and sensing chamber Moisture-sensitive device requiring controlled handling during assembly Functional Characteristics Real-time carbon dioxide concentration monitoring Simultaneous temperature and humidity measurement Automatic environmental compensation Continuous and periodic measurement modes Fast startup and measurement response Long operational lifetime with stable calibration Optimized airflow design for accurate sensing Suitable for continuous indoor environmental monitoring Typical Applications Indoor air quality monitoring systems Smart thermostats and HVAC controllers Building automation equipment Demand-controlled ventilation systems Portable environmental monitoring devices Smart home and IoT products Air purification systems Occupancy and ventilation monitoring Battery-powered sensing devices Consumer and industrial environmental monitoring equipment #commonpartslibrary #sensor #airquality

1 Ohms ±1% 2W Chip Resistor 2512 (6332 Metric) Current Sense Thick Film The CRM2512-FX-1R00ELF specification defines the engineering requirements for a surface-mount current sense resistor designed for precision current measurement and power management applications. This specification establishes the functional, electrical, mechanical, thermal, environmental, and quality requirements necessary to ensure accurate resistance performance, efficient power dissipation, and long-term operational reliability in electronic systems. The component is intended for use in power supplies, battery management systems, motor control circuits, industrial automation equipment, and embedded electronic applications requiring precise current monitoring. The resistor provides a low-resistance element for current sensing while maintaining high measurement accuracy, thermal stability, and compatibility with automated surface-mount manufacturing processes. Engineering Requirements The resistor shall be manufactured using high-quality resistive materials and controlled fabrication processes to ensure stable resistance characteristics, low temperature coefficient, and reliable long-term performance. The construction shall provide consistent electrical behavior throughout the specified operating conditions without significant drift or degradation. Electrical characteristics shall ensure accurate resistance value, stable current sensing performance, and low inductance suitable for high-frequency switching environments. The component shall maintain its specified tolerance and thermal performance under continuous rated power and transient load conditions. Thermal performance shall support efficient heat dissipation through the package structure and printed circuit board interface. The resistor shall withstand normal solder reflow processes and maintain structural integrity during thermal cycling, vibration, and mechanical handling. Mechanical construction shall be compatible with standard surface-mount assembly processes and shall provide reliable solder joint formation. Workmanship shall be free from defects including cracks, delamination, contamination, plating irregularities, or structural inconsistencies that could adversely affect electrical or mechanical performance. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, thermal characterization data, qualification reports, inspection records, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before implementation to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #CurrentSenseResistor #PowerElectronics #SurfaceMount #PrecisionResistor #IndustrialElectronics #PowerManagement #QualityAssurance #EngineeringDocumentation #ElectronicComponents

Infrared (IR), Visible Emitter 536nm, 660nm, 950nm 1.3V, 1.9V, 2.3V 40mA, 80mA, 200mA 3.7mW/sr @ 80mA 120° 8-SMD, No Lead The SFH 7018A is a high-performance 3-in-1 multi-emitter LED module from ams OSRAM designed for optical vital-sign monitoring applications. It integrates green, red, and infrared LEDs into a compact reflective QFN package optimized for wearable health devices such as smartwatches, fitness bands, pulse oximeters, and medical monitoring equipment. The device features a dual-cavity optical structure that minimizes optical interference between emitters, improving heart-rate and SpO₂ measurement accuracy. Key Features Integrated green, red, and infrared LEDs in one package Wavelengths: Green: 536 nm Red: 660 nm Infrared: 950 nm Optimized for: Heart-rate monitoring SpO₂ sensing PPG (photoplethysmography) Highly reflective QFN SMT package Advanced 2-cavity design for reduced optical crosstalk Low forward voltage operation optimized for battery-powered devices Can operate without a boost converter in many designs Wide viewing angle: 120° Surface-mount package: 8-SMD, no lead Operating temperature range: −40°C to +85°C Emitters can be driven independently Suitable for compact wearable and medical electronics #CommonPartsLibrary #LED #Infrared

Hot Swap Controller 1 Channel General Purpose 23-LQFN-CLIP (6x5) The TPS16851VMAR is an automotive-grade integrated electronic fuse device designed to provide advanced power path protection and monitoring for low-voltage DC power distribution systems. The device integrates multiple protection mechanisms including overvoltage protection, undervoltage protection, overcurrent protection, reverse current blocking, and inrush current control within a compact package optimized for space-constrained applications. It is intended for use in automotive, industrial, and embedded electronic systems requiring robust hot-swap capability, fault isolation, and controlled power sequencing. The device incorporates precision current sensing and programmable fault management functions that enable reliable protection of downstream circuitry against abnormal operating conditions. Adjustable protection thresholds and timing parameters allow flexible system-level configuration while maintaining fast fault response and high reliability. Integrated MOSFET control minimizes external component count and simplifies PCB implementation. The TPS16851VMAR supports wide input operating ranges suitable for automotive battery-powered environments and transient-prone supply rails. The device is qualified for harsh operating conditions and includes thermal shutdown and fault reporting features to improve system safety and diagnostics. Engineering Specification Device Type Automotive electronic fuse with integrated protection and power management functionality Manufacturer Texas Instruments Package Type VQFN-HR surface-mount package Mounting Type Surface mount Application Category Automotive power distribution and protection Protection Features Overvoltage protection Undervoltage protection Overcurrent protection Short-circuit protection Reverse current blocking Thermal shutdown Inrush current limiting Control Features Programmable fault thresholds Adjustable current limit Programmable timing and retry behavior Enable and shutdown control Fault indication and monitoring Power Management Features Integrated MOSFET control Hot-swap capability Controlled startup sequencing Load disconnect functionality Interface Characteristics Analog control interface Diagnostic fault reporting Current sense monitoring Operating Environment Automotive-qualified operating conditions High transient immunity Designed for harsh electrical environments PCB Integration Compact footprint Thermally enhanced package Low external component requirement Typical Applications Automotive electronic control units Infotainment systems ADAS power distribution Industrial control systems Embedded power management Protected DC supply rails #commonpartslibrary #integratedcircuit #powermanagement #hotswapcontrollers