ARM® Cortex®-M4 series Microcontroller IC 32-Bit Single-Core 168MHz 1MB (1M x 8) FLASH 64-LQFP (10x10) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces, and camera Includes ST state-of-the-art patented technology • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting CompactFlash™, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset, and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop, and Standby modes –VBAT supply for RTC, 20×32-bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #commonpartslibrary #integratedcircuit #microcontroller

24 Bit Analog to Digital Converter 8 Input 8 Sigma-Delta 32-TQFP (5x5) The ADS131M08IPBSR is a high-precision, simultaneous-sampling analog-to-digital converter designed for multi-channel data acquisition systems requiring accurate and synchronized measurements. Manufactured by Texas Instruments, this device integrates eight differential input channels with low-noise performance, programmable gain amplification, and precision voltage reference support. The converter architecture is optimized for industrial automation, energy monitoring, medical instrumentation, and precision sensing applications where phase alignment and signal fidelity are critical. The device incorporates delta-sigma conversion technology with integrated digital filtering to provide high dynamic range and excellent noise performance across a wide operating bandwidth. It supports flexible data interface configurations through a high-speed SPI-compatible serial interface, enabling efficient communication with microcontrollers, DSPs, and FPGA-based systems. The integrated diagnostic and monitoring features improve system reliability and simplify fault detection in safety-critical applications. The ADS131M08IPBSR operates from low-voltage analog and digital supplies while maintaining low power consumption suitable for embedded and portable systems. The compact thermally enhanced package supports dense PCB layouts and reliable operation across industrial temperature environments. Engineering Specification Device Type: Simultaneous-Sampling Delta-Sigma Analog-to-Digital Converter Manufacturer: Texas Instruments Channel Configuration: Eight Differential Input Channels Resolution: Twenty-Four Bit ADC Architecture: Delta-Sigma Sampling Type: Simultaneous Sampling Input Type: Differential Analog Inputs Programmable Gain Amplifier: Integrated Data Output Interface: SPI-Compatible Serial Interface Reference Support: External Precision Voltage Reference Digital Filtering: Integrated Sinc Filter Architecture Operating Supply Voltage: Low-Voltage Analog and Digital Supplies Noise Performance: Low Noise Precision Measurement Capability Power Consumption: Optimized for Low Power Operation Diagnostics Features: Integrated Self-Monitoring and Fault Detection Temperature Range: Industrial Operating Temperature Range Package Type: TQFP Surface-Mount Package Mounting Type: Surface Mount Technology Application Areas: Energy Metering, Industrial Automation, Medical Instrumentation, Data Acquisition Systems, Multi-Channel Sensor Interfaces #commonpartslibrary #integratedcircuit #analog #digital #converter

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2C digital interface. The ADXL345 is well suited for mobile device applications. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Free-fall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345 is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, plastic package. ► Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) ► Power consumption scales automatically with bandwidth ► User-selectable resolution ► Fixed 10-bit resolution ► Full resolution, where resolution increases with g range, up to 13-bit resolution at ±16 g (maintaining 4 mg/LSB scale factor in all g ranges) ► Embedded memory management system with FIFO technology minimizes host processor load ► Single tap/double tap detection ► Activity/inactivity monitoring ► Free-fall detection ► Supply voltage range: 2.0 V to 3.6 V ► I/O voltage range: 1.7 V to VS ► SPI (3- and 4-wire) and I2C digital interfaces ► Flexible interrupt modes mappable to either interrupt pin ► Measurement ranges selectable via serial command ► Bandwidth selectable via serial command ► Wide temperature range (−40°C to +85°C) ► 10,000 g shock survival ► Pb free/RoHS compliant #CommonPartsLibrary #IntegratedCircuit #Sensor #Transducer #Motion-Sensor #Accelerometer #ADXL345

The BP2866C, manufactured by 晶丰明源半导体, is a high precision buck constant current LED driver designed for universal input offline LED lighting applications. Operating in critical conduction mode, this component is suitable for 85Vac~265Vac input and integrates a 500V power MOSFET. It features patented demagnetization detection technology and high-voltage JFET power supply technology, eliminating the need for a VCC capacitor and starting resistors, thereby minimizing system cost and size. The BP2866C offers precise output current and excellent line regulation through a patent-pending current control method. It includes robust protection functions such as LED short circuit protection, VCC under voltage protection, and thermal regulation. Available in a SOP7 package, it ensures a +5% LED output current accuracy and is ideal for applications like LED candle lights and bulbs.

LED Lighting WL-SWTP White, Warm 2700K 3V 20mA 120° 1206 (3216 Metric) The 158301227 is a surface-mount white LED manufactured by Würth Elektronik, belonging to the WL-SWTP series of top-view PLCC-packaged light-emitting diodes designed for general illumination, backlighting, and signal indication applications in compact electronics. It is built on a gallium nitride semiconductor chip, the standard chip technology used in high-efficiency white LED production, which achieves white light emission by combining a blue GaN die with a phosphor conversion layer that down-converts a portion of the blue photons into broader-spectrum yellow light, with the combined blue and yellow output perceived by the human eye as white light. This particular variant is characterized by a warm white Sunrise color temperature, placing it in the lowest color temperature tier of the WL-SWTP family. Warm white light at this color temperature produces a yellowish, incandescent-like appearance that is widely preferred in residential, hospitality, and ambient lighting applications where a soft, comfortable visual environment is desired. This makes the device a natural fit for LED-based replacements for incandescent and halogen light sources in T5 and T8 fluorescent tube form factor products, as well as indoor display backlights, decorative architectural lighting, and other applications where a warm light quality is specified or preferred by end users. The WL-SWTP series features fast switching, no infrared radiation, high color rendering index, slim and miniature size, low power consumption, suitability for all SMT assembly methods, a top-view emission direction, and a wide viewing angle. The high color rendering index characteristic of this device means that objects illuminated by it appear with colors close to how they would look under natural daylight illumination, which is an important quality metric in retail, museum, medical examination, and other environments where accurate color representation enhances user experience or functional accuracy. Texas Instruments The PLCC package style used in this device is a molded plastic leaded chip carrier format that provides a well-defined, mechanically stable footprint for surface-mount assembly, with the optical emitting surface oriented perpendicular to the PCB plane in the top-view configuration. This top-view orientation makes the device suitable for direct illumination of surfaces positioned above the PCB, such as diffusers, light guides, or display panels mounted parallel to the LED board. The compact 3014 package footprint allows high-density LED arrays to be assembled on narrow PCB strips or modules, which is typical in LED tube light and edge-lit backlight designs. The device is supplied on tape-and-reel packaging suitable for automated high-speed pick-and-place assembly at production volumes. Spec Sheet Identification Part Number: 158301227 Series: WL-SWTP — SMD White Top View PLCC LED Manufacturer: Würth Elektronik GmbH & Co. KG Functional Classification Device Type: Surface-mount white LED Chip Technology: Gallium Nitride (GaN) with phosphor conversion Emission Type: White light via blue die plus phosphor down-conversion View Direction: Top view — perpendicular to PCB surface Optical Characteristics Emitting Color: Sunrise warm white Color Temperature: Warm white class, lowest CCT tier in WL-SWTP family Color Rendering Index: High CRI class, suitable for color-critical applications Viewing Angle: Wide angle, broad spatial distribution Infrared Radiation: None — no IR emission Electrical Characteristics Operating Current: Standard signal LED drive current class Forward Voltage: Standard GaN white LED forward voltage class Switching Speed: Fast switching capable Thermal Characteristics Thermal Resistance, Junction to Solder Point: Defined per series specification Maximum LED Junction Temperature: Rated to elevated junction temperature class Package & Mechanical Package Type: PLCC (Plastic Leaded Chip Carrier), PLCC-2 style Package Size: 3014 SMD footprint Mounting Method: Surface mount technology (SMT) Assembly Compatibility: Suitable for all standard SMT assembly methods including reflow soldering Target Applications Signal indication and pilot lights Indoor display backlighting General illumination and commercial lighting Replacement for PLCC 3528 devices in T8 and T5 LED tube designs Architectural and ambient lighting systems Environmental & Qualification RoHS Compliance: Yes REACH Compliance: Yes Packaging Supply Format: Tape-and-reel Standard Reel Quantity: Standard volume reel per Würth packaging convention #WuerthElektronik #WuerthElectronic #WLSWTP #WhiteLED #WarmWhiteLED #SunriseLED #PLCCLED #SMDLed #3014LED #TopViewLED #GaNLED #HighCRI #LEDBacklight #GeneralIllumination #IndoorLighting #SignalLED #LightingDesign #OptoelectronicComponent #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #REACHCompliant

Diode 40 V 5A Surface Mount DO-214AB (SMC) The SSC54-E3/57T is a surface-mount Schottky barrier rectifier diode manufactured by Vishay Intertechnology . It is designed for high-efficiency power rectification applications requiring low forward voltage drop and fast switching performance. This diode is commonly used in DC-DC converters, switching power supplies, polarity protection circuits, and freewheeling applications. The device comes in a compact DO-214AB (SMC) package suitable for automated PCB assembly. Key Features Schottky barrier rectifier technology Maximum repetitive reverse voltage: 40 V Average forward current: 5 A Very low forward voltage drop (~0.49 V max) High surge current capability up to 175 A Fast switching speed with low power loss Surface-mount DO-214AB (SMC) package Operating junction temperature up to 150°C Matte tin-plated terminals, RoHS compliant Suitable for high-frequency power conversion applications #CommonPartsLibrary #Diode

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Through Hole, Right Angle The USB4085-GF-A is a USB Type-C receptacle connector designed for compact embedded and consumer electronic applications requiring USB connectivity and power delivery support. It provides a reversible plug interface compliant with USB Type-C mechanical specifications and is commonly used in portable devices, development platforms, industrial electronics, and power-enabled USB systems. This connector supports USB data communication and power connections through a surface-mount design optimized for automated PCB assembly. The device includes integrated through-hole shell stakes for enhanced mechanical retention and durability under repeated insertion cycles. Its compact footprint and standardized pin arrangement enable compatibility with modern USB Type-C implementations while maintaining reliable electrical and mechanical performance. The USB4085-GF-A is suitable for USB charging, data transfer, embedded systems, battery-powered devices, and general-purpose USB Type-C interface applications. Engineering Specification Connector Type USB Type-C Receptacle Connector USB Interface Standard USB Type-C compliant receptacle Mounting Style Surface-mount technology with through-hole shell retention tabs Contact Configuration Dual-row reversible USB Type-C contact arrangement Number of Contacts Twenty-four signal and power contacts Orientation Right-angle PCB mount Data Support USB data communication support compatible with USB Type-C applications Power Capability Supports USB power and charging applications Shielding Integrated metal shell shielding for EMI reduction and mechanical protection Mechanical Retention Reinforced through-hole shell stakes for connector stability and insertion durability Contact Material Copper alloy contacts with plated finish for conductivity and corrosion resistance Housing Material High-temperature thermoplastic suitable for reflow soldering Operating Temperature Range Industrial-grade operating temperature capability suitable for embedded electronic systems Assembly Compatibility Compatible with automated SMT reflow assembly processes Application Areas Portable electronics, embedded systems, industrial controllers, development boards, battery-powered devices, USB charging interfaces, and communication equipment #commonpartslibrary #connector #usbtypec #interface #powermanagement #embeddedhardware #electronics #usbconnector

Air Quality Sensors VOC and NOx (MOX) Gas Pollutant Sensor The SGP41-D-R4 is a compact digital gas sensor developed by Sensirion for indoor air quality monitoring applications. It is designed to detect volatile organic compounds (VOC) and nitrogen oxides (NOx) using Sensirion’s CMOSens® sensor technology. The device integrates sensing elements, analog front-end circuitry, calibration memory, and digital signal processing within a miniature surface-mount package, enabling accurate and reliable environmental sensing with minimal external components. The sensor communicates through a standard I²C digital interface and is optimized for low-power operation, making it suitable for battery-powered and portable electronic systems. The SGP41 is intended for use in air purifiers, HVAC systems, smart home devices, wearable electronics, environmental monitoring equipment, and other applications requiring real-time indoor air quality assessment. The device supports humidity-compensated measurements when paired with an external humidity and temperature sensor, improving long-term stability and measurement accuracy. Factory calibration eliminates the need for manual calibration during manufacturing. Key Features Digital VOC and NOx gas sensing CMOSens® technology integration I²C communication interface Fully calibrated and linearized output Humidity compensation capability Low power consumption operation Compact DFN surface-mount package Fast response and recovery characteristics Optimized for indoor air quality applications RoHS and halogen-free compliant Electrical Characteristics Supply voltage operation compatible with low-voltage embedded systems Low average current consumption suitable for portable devices Integrated digital signal processing and calibration memory I²C serial communication support with standard addressing Stable operation across industrial temperature ranges Mechanical Characteristics Small DFN package optimized for compact PCB layouts Surface-mount assembly compatible Low-profile package suitable for space-constrained designs Moisture-sensitive device requiring proper handling during assembly Functional Characteristics Simultaneous VOC and NOx sensing capability Real-time indoor air quality monitoring Compensation support for environmental humidity effects Long-term measurement stability Fast startup and measurement readiness Designed for continuous sensing applications Typical Applications Indoor air quality monitoring systems Smart thermostats and HVAC controllers Air purifiers and ventilation systems Smart home and IoT devices Portable environmental monitoring equipment Wearable health and wellness devices Building automation systems Consumer electronics requiring air quality detection #Sensor #Transducer #Gas#Sensor #SGP41

2/2 Transceiver Full RS232 16-SOIC The MAX3232ECWE+T is a dual-channel RS-232 transceiver manufactured by Analog Devices under the Maxim Integrated product family. This integrated circuit is designed to provide reliable bidirectional communication between TTL or CMOS logic-level devices and RS-232 serial communication interfaces. The device integrates charge-pump voltage converters and line drivers/receivers, enabling full RS-232 signal compliance using a single low-voltage power supply. The transceiver supports high-speed serial data communication while maintaining low power consumption and robust signal integrity. It is widely used in embedded systems, industrial automation equipment, communication interfaces, instrumentation systems, microcontroller platforms, portable electronics, and legacy serial communication applications. The MAX3232ECWE+T enables seamless voltage-level translation between modern low-voltage digital electronics and traditional RS-232 communication standards. Its compact surface-mount package and integrated functionality reduce external component requirements and simplify serial interface implementation in space-constrained electronic systems. Engineering Specification Device Type RS-232 transceiver interface IC Communication Standard RS-232 serial communication interface Channel Configuration Dual driver and dual receiver architecture Logic Compatibility TTL and CMOS logic-level interface support Voltage Conversion Integrated charge-pump voltage generation Data Communication Bidirectional asynchronous serial communication support Signal Characteristics Compliant RS-232 voltage-level transmission and reception Power Characteristics Low-voltage single-supply operation Data Rate Performance High-speed serial communication capability Protection Features Robust communication interface tolerance and stable signal operation Package Type SOIC surface-mount package Mounting Style Surface mount technology Applications Embedded systems Industrial automation Serial communication interfaces Microcontroller systems Instrumentation equipment Portable electronics Communication gateways Legacy serial devices Data acquisition systems RS-232 interface conversion Manufacturer Analog Devices / Maxim Integrated #commonpartslibrary #rs232 #serialcommunication #transceiver #interfaceic #maximintegrated #analogdevices #embeddedhardware #communicationinterfaces #surfaceountcomponents #electronicsdesign #industrialelectronics #microcontroller #datacommunication #signalconversion

Humidity, Temperature 0 ~ 100% RH I2C ±1.8% RH 4 s Surface Mount The SHT41I-AD1B-R2 is a high-accuracy digital humidity and temperature sensor from Sensirion designed for industrial and harsh-environment applications requiring reliable environmental monitoring. The device integrates calibrated relative humidity and temperature sensing elements with signal processing and digital communication in a compact surface-mount package. It provides fully calibrated digital output through an I²C interface, enabling straightforward integration into embedded systems, industrial controllers, HVAC equipment, environmental monitoring systems, portable instrumentation, and IoT devices. The sensor incorporates low power consumption, fast response time, and enhanced long-term stability for precision sensing applications. Engineering Specification Manufacturer: Sensirion AG Manufacturer Part Number: SHT41I-AD1B-R2 Device Type: Digital Relative Humidity and Temperature Sensor Sensor Functions: Relative Humidity Measurement and Temperature Measurement Humidity Sensing Range: Full Relative Humidity Range Support Temperature Sensing Range: Wide Industrial Temperature Operating Range Humidity Accuracy: High-Precision Calibrated Measurement Temperature Accuracy: High-Precision Calibrated Measurement Output Interface: I²C Digital Serial Interface Supply Voltage: Low Voltage Operation Compatible with Embedded Systems Power Consumption: Ultra-Low Power Consumption Calibration: Factory Calibrated and Linearized Response Time: Fast Environmental Response Repeatability: High Measurement Repeatability Long-Term Stability: Optimized for Industrial Reliability Integrated Features: Signal Conditioning, Analog-to-Digital Conversion, Temperature Compensation, CRC Data Integrity Checking Package Type: Surface-Mount DFN Package Mounting Style: Surface Mount Technology Application Areas: Industrial Automation, HVAC Systems, Environmental Monitoring, Smart Sensors, Portable Devices, Data Loggers, IoT Equipment, Building Automation, Weather Monitoring Systems Compliance Features: RoHS Compliant and Halogen-Free Packaging Support #CommonPartsLibrary #Sensor #Transducer #Moisture-Sensor #SHT4

The Wio-WM1110 Dev Kit is an all-in-one solution for developing low-power, long-range IoT positioning applications. Based on Wio-WM1110 Wireless Module, features Semtech's LoRa® technology for long-range wireless communication, GNSS, and Wi-Fi for location tracking, and also supports Bluetooth Low Energy, Bluetooth mesh, NFC, Thread, and Zigbee.

4 Position Wire to Board Terminal Block Vertical with Board 0.197" (5.00mm) Through Hole The WAGO 2604-3104 is a through-hole PCB terminal block designed for secure wire-to-board power and signal connections in industrial and commercial electronic equipment. It features WAGO Push-in CAGE CLAMP® spring connection technology with integrated lever actuation, allowing fast, tool-free wire insertion and removal. The connector is intended for reliable field wiring applications where vibration resistance, ease of maintenance, and compact PCB integration are required. Engineering Specification Manufacturer: WAGO Manufacturer Part Number: 2604-3104 Product Family: PCB Terminal Block Series: 2604 Connector Type: Wire-to-Board Terminal Block Mounting Style: Through-Hole PCB Mount Orientation: Vertical / Top Entry Number of Positions: 4 Pitch Spacing: 5.00 mm Connection Technology: Push-in CAGE CLAMP® Actuation Method: Lever Operated Wire Size Range: 24 AWG to 12 AWG Supported Conductors: Solid, stranded, and ferruled wires Rated Voltage: Up to 400 V IEC, 300 V UL Rated Current: Up to 32 A IEC, 20 A UL Operating Temperature Range: -60°C to +105°C Insulation Material: Polyamide PA66 Contact Material: Electrolytic Copper Contact Plating: Tin-Plated Spring Material: Chrome Nickel Spring Steel Flammability Rating: UL94 V-0 Color: Gray housing with orange lever PCB Contact Type: THT solder pins Application Areas: Industrial controls, power distribution, automation systems, instrumentation, and general PCB power interconnects. #commonpartslibrary #connector #terminalblock

IXYS Integrated Circuits brings OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays. As part of this family, the CPC1709J single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output, constructed with an efficient MOSFET switch and photovoltaic die, uses IXYS Integrated Circuits’ patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.3 °C/W). Features • 22.8ADC Load Current with 5°C/W Heat Sink • Low 0.05 On-Resistance • 60VP Blocking Voltage • 2500Vrms Input/Output Isolation • Low Thermal Impedance: JC = 0.3 °C/W • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications • Low Drive Power Requirements • No EMI/RFI Generation Applications • Industrial Controls / Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment #CPC1709J #IXYS #Littelfuse #SolidStateRelay #SSR #OptoMOS #PowerRelay #DCRelay #MOSFETRelay #HighCurrentSwitching #ElectricalIsolation #IndustrialElectronics #PowerManagement #BatterySystems #AutomationControl

Mini 2.45 GHz Antenna The 2450AT18A100E is a high-frequency ceramic SMT antenna featuring a small 3.2 mm × 1.6 mm × 1.3 mm package, optimized for space-constrained RF designs. It operates from 2400 MHz to 2500 MHz with a 50 Ω impedance and provides a compact alternative to traditional PCB trace antennas while maintaining reliable RF performance. Key Features Operating Frequency: 2400 MHz – 2500 MHz (2.4 GHz ISM Band) Center Frequency: 2450 MHz Antenna Type: Mini Ceramic Chip Antenna / SMT RF Antenna Package Size: 3.2 mm × 1.6 mm × 1.3 mm Impedance: 50 Ω Peak Gain: Approximately +0.5 dBi (typical) Average Radiation Efficiency: Approximately 76% (based on Johanson evaluation board) Maximum Input Power: 2 W continuous wave (CW) Operating Temperature Range: -40 °C to +125 °C Mounting Type: Surface Mount Technology (SMT) Applications: Bluetooth / BLE devices Wi-Fi 2.4 GHz modules Zigbee / IEEE 802.15.4 systems IoT sensors and embedded wireless products #2450AT18A100E #JohansonTechnology #ChipAntenna #SMTAntenna #RFDesign #2GHzAntenna #Bluetooth #WiFi #Zigbee #IoT #WirelessCommunication #EmbeddedSystems #PCBDesign #RFAntenna #Antena #Chip #SurfaceMount

Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.5Hz ~ 625Hz 16-LGA (3x3) # LIS3DHTR ## General Description The LIS3DHTR is an ultra-low-power three-axis digital accelerometer manufactured by STMicroelectronics. It is designed to provide accurate motion, orientation, tilt, vibration, and acceleration sensing for a wide range of embedded and portable electronic applications. The device integrates advanced MEMS sensor technology, configurable measurement ranges, embedded motion-detection functions, and digital communication interfaces within a compact surface-mount package. Its low power consumption and high measurement accuracy make it suitable for wearable devices, industrial monitoring systems, asset tracking equipment, smart sensors, consumer electronics, medical devices, Internet of Things products, and battery-powered embedded systems. ## Key Features ### Sensor Architecture * Three-axis digital accelerometer * MEMS sensing technology * High-resolution motion measurement * Multi-axis acceleration detection * Real-time movement monitoring * Precision orientation sensing ### Measurement Capabilities * Motion detection functionality * Tilt sensing capability * Free-fall detection support * Vibration monitoring * Orientation recognition * Impact and shock detection * Activity and inactivity monitoring ### Electrical Characteristics * Ultra-low-power operation * Low current consumption * High measurement stability * Fast response capability * Reliable sensor performance * Optimized for battery-powered systems ### Embedded Processing Features * Integrated interrupt generation * Event detection capability * Motion recognition support * Threshold-based monitoring * Embedded motion-processing functions * Autonomous event reporting ### Communication Interfaces * SPI digital communication interface * I²C digital communication interface * Easy microcontroller integration * Reliable data transfer capability * Flexible system connectivity ### Package Characteristics * Compact surface-mount package * Low-profile design * Automated assembly compatible * High-density PCB layout support * Suitable for space-constrained applications ### Material Construction * Advanced MEMS sensor technology * High-reliability semiconductor integration * RoHS-compliant materials * Lead-free package construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Reliable operation under industrial conditions * Stable sensor performance over time * Resistant to mechanical stress and vibration * Suitable for continuous monitoring applications ### Application Areas * Wearable Electronics * Internet of Things Devices * Smart Sensors * Asset Tracking Systems * Industrial Monitoring Equipment * Consumer Electronics * Medical Devices * Portable Electronics * Motion Detection Systems * Vibration Monitoring Equipment * Fitness and Activity Tracking Devices * Embedded Control Systems ### Compliance * RoHS Compliant * Lead-Free Compatible * Industrial-Grade MEMS Motion Sensor Solution ## Manufacturer STMicroelectronics ## Product Family LIS3DH Three-Axis Digital Accelerometer Series #LIS3DHTR #STMicroelectronics #Accelerometer #MEMSSensor #MotionSensor #ThreeAxisAccelerometer #IoT #WearableDevices #EmbeddedSystems #IndustrialMonitoring #AssetTracking #VibrationMonitoring #ConsumerElectronics #ElectronicsEngineering #SensorTechnology

Linear Voltage Regulator IC Positive Fixed 1 Output 1A SOT-223-3 General Description The AP2114H-3.3TRG1 is a low dropout linear voltage regulator designed to provide a stable fixed output voltage for low-noise and power-sensitive electronic applications. The device is optimized for high current capability, low quiescent current operation, and reliable thermal performance. It is suitable for portable electronics, embedded systems, communication equipment, consumer devices, and industrial control applications where stable power regulation is required. The regulator incorporates internal protection functions including over-current protection and thermal shutdown to improve operational reliability and system safety. The component is supplied in a surface-mount SOT-223 package suitable for automated PCB assembly processes. Device Type Low Dropout Linear Voltage Regulator with Enable Function Output Configuration Positive Fixed Output Nominal Output Voltage 3.3 V Maximum Output Current 1 A minimum continuous load current capability Input Voltage Range Operates from low-voltage DC input supplies up to 6 V maximum Dropout Voltage Low dropout operation suitable for battery-powered and low-headroom applications Output Accuracy High precision regulated output voltage with tight tolerance characteristics Quiescent Current Low standby current for power-efficient system operation Power Supply Rejection High ripple rejection performance for low-noise output regulation Protection Features Integrated over-current protection Thermal shutdown protection Short-circuit protection Operating Temperature Range Suitable for industrial temperature operating conditions from negative forty degrees Celsius to positive eighty-five degrees Celsius Package Information Surface-mount SOT-223 package Mounting Method Surface Mount Technology Applications LCD monitors LCD televisions Set-top boxes Portable electronics Embedded controllers Industrial electronic systems Low-noise power supply applications #CommonPartsLibrary #IntegratedCircuit #PowerManagement

The IA611 SmartMic is an "always-on" Audio Processor featuring Voice Wake and Voice ID keyword detector, a two-second buffer', and Knowles' proven high performance acoustic SiSonic™ MEMS microphone technology in a single, miniature, top-port package. The IA611 offers flexibility by supporting the most relevant audio and data interfaces. Its integrated programmable DSP with 248 kBytes of RAM is available for customer and 3rd party algorithms, enabling unlimited creativity. The solution pushes the system performance to ultra-low power with its custom core design, and accelerates time to market with its highly integrated combination of hardware, software, and firmware.

SDRAM Memory IC 512Mbit Parallel 143 MHz 5.4 ns 54-TSOP II The AS4C32M16SB-7TCN is a single-data-rate synchronous dynamic random-access memory (SDR SDRAM) device manufactured by Alliance Memory. It is organized internally as a multi-bank array, allowing concurrent access operations across banks to improve effective memory bandwidth compared to simpler asynchronous DRAM architectures. The device is intended for general-purpose embedded memory applications where a synchronous, clock-driven memory interface is required, including embedded systems, industrial controllers, consumer electronics, networking equipment, and other designs that rely on a parallel SDRAM interface for working memory or buffering. As a drop-in style component within Alliance Memory's broader memory portfolio, this part is designed to be pin- and function-compatible with legacy SDR SDRAM devices originally offered by other manufacturers, allowing designers to source a continued-availability alternative for designs that depend on this memory architecture even as some original suppliers have discontinued production. This makes the device particularly useful in long-lifecycle industrial, embedded, and legacy system designs where a guaranteed supply of a specific memory interface and timing profile is critical to sustaining production over many years. The "B" designation in the part family indicates a specific die revision within the AS4C32M16S product line, reflecting a particular generation of internal silicon design while maintaining functional and pinout compatibility with related die revisions in the same footprint. The device communicates over a standard synchronous SDRAM command interface, using a clock-synchronized protocol for row and column addressing, data burst transfers, and bank management, and it supports the auto-refresh and self-refresh mechanisms typical of SDRAM devices to maintain stored data integrity without requiring constant external refresh management by the host controller. Mechanically, the device is housed in a thin small-outline package suited to space-constrained PCB layouts, and it is built for standard surface-mount assembly processes. The "-7TCN" suffix on this part number reflects a specific speed grade, package style, and temperature grade combination within the product family, with this particular variant intended for commercial temperature range operation. The device is supplied in tray packaging for surface-mount assembly and is compliant with RoHS material restrictions, supporting standard environmental and regulatory requirements for electronic components. Spec Sheet Identification Part Number: AS4C32M16SB-7TCN Device Family: AS4C32M16SB Manufacturer: Alliance Memory, Inc. Die Revision: B-die Functional Classification Device Type: Synchronous DRAM (SDR SDRAM) Memory Organization: Multi-bank array architecture Interface Type: Parallel, clock-synchronous command interface Refresh Capability: Supports auto-refresh and self-refresh modes Electrical Characteristics Supply Voltage: Standard 3.3V-class SDRAM supply rating Clock Frequency: Mid-range SDR SDRAM clock speed class Access Timing: Standard SDR SDRAM access time class for its speed grade Environmental & Qualification Temperature Grade: Commercial ("C" suffix designation) RoHS Compliance: Yes Product Positioning: Long-lifecycle, drop-in replacement memory device Package Package Type: Thin Small Outline Package, TSOP-II style Mounting: Surface mount technology (SMT) Packaging Format Supply Format: Tray packaging #AS4C32M16SB #AllianceMemory #SDRAM #SDRSDRAM #MemoryIC #EmbeddedMemory #TSOP #SurfaceMount #LegacyMemory #DropInReplacement #DRAM #EmbeddedSystems #IndustrialElectronics #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #MemoryComponent #PCBDesign #CommonPartsLibrary #IntegratedCircuit #Memory #AS4C32

USB-C (USB TYPE-C) USB 2.0 Receptacle Connector 24 (16+8 Dummy) Position Surface Mount, Through Hole The USB4960-00-C is a vertical USB Type-C® USB 2.0 receptacle connector manufactured by GCT (Global Connector Technology). It is designed for compact embedded systems, consumer electronics, industrial equipment, and IoT devices requiring a reliable USB Type-C interface for USB 2.0 data transfer and power delivery. The connector features a hybrid Surface Mount Technology (SMT) and Through-Hole (TH) shell stake design, providing excellent PCB retention and mechanical durability. It supports up to 240 W (48 V DC) power capability and is rated for 10,000 mating cycles, making it suitable for demanding applications. Key Features USB Type-C® USB 2.0 vertical receptacle 16 active contacts with 8 dummy contacts (24-position mechanical interface) Hybrid SMT signal pins with through-hole shell stakes for enhanced mechanical strength Supports up to 48 V DC and 240 W power capability Rated for 10,000 mating cycles Gold-plated copper alloy contacts for reliable electrical performance Shielded metal shell for improved EMI protection Operating temperature: -25°C to +85°C Features locating pegs, board guide, pick-and-place cap, and solder retention for automated assembly Ideal for embedded systems, industrial electronics, consumer devices, and USB charging applications. #USBTypeC #USB20 #ReceptacleConnector #VerticalConnector #SMT #ThroughHole #GCT #PowerConnector #DataConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40C-100DS-0.4V(51) is a board-to-board and board-to-FPC receptacle connector manufactured by Hirose Electric. It belongs to the DF40 series, a family of fine-pitch stacking connectors intended for compact, high-density interconnect applications such as mobile devices, cameras, wearables, and other space-constrained electronics. The connector functions as the receptacle (socket) half of a mating pair, designed to stack with a corresponding DF40 plug header to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile vertical arrangement. This particular part number represents the full-position, low-profile variant within the series, configured without a reinforcing metal fitting and without a locating boss or mechanical holddown feature, meaning it relies on the contact array itself rather than additional structural hardware for mechanical retention during reflow and handling. The connector is supplied in straight, surface-mount form and is non-polarized, so it can be inserted in either orientation relative to its mating counterpart. Contacts are arranged in parallel rows along the connector body, with gold plating in the contact mating area to ensure reliable signal continuity and resistance to oxidation over repeated use. The series is positioned by Hirose as a general-purpose, high-speed-capable interconnect, suitable for a range of differential and single-ended signaling standards used in consumer and industrial electronics, with the broader DF40 family supporting interfaces such as USB, MIPI, SATA, and PCIe. Its low stacking height and fine contact pitch make it well suited to applications where board-to-board spacing must be minimized, such as camera modules, display modules, or stacked daughterboard architectures in handheld and wearable products. The connector is packaged on embossed carrier tape for automated pick-and-place assembly, and its construction is compliant with RoHS material restrictions. Mechanically, the connector body is built to support repeated mating cycles typical of consumer electronics assembly and rework, while maintaining stable electrical contact under vibration and thermal cycling across its rated environmental range. As a stacking-style connector rather than a card-edge or cable-mount type, it is intended to be soldered directly to a host PCB pad pattern, with the mating plug soldered to the corresponding board or FPC, allowing the two assemblies to be joined and separated as needed during manufacturing, test, or service operations. Spec Sheet Identification Part Number: DF40C-100DS-0.4V(51) Series: DF40 Variant: "C" type — without reinforcing metal fitting Connector Type / Configuration Type: Receptacle (socket), board-to-board / board-to-FPC Gender: Female Orientation: Straight Row Arrangement: Dual row Polarization: Non-polarized Locking/Retention Feature: None (no metal holddown or locating boss) Electrical Ratings Current Rating: Low-current signal class Voltage Rating: Standard signal-level rating typical of fine-pitch board-to-board connectors Applicable High-Speed Protocols: USB, MIPI, SATA, PCIe (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Stacking/Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics rework Contact & Material Properties Contact Material: Phosphor bronze Contact Plating (Mating Area): Gold Insulator Color: Black Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings Operating Temperature Range: Extended consumer/industrial range RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding DF40 series plug/header connector Application Note: Intended for mezzanine-style stacking between two PCBs or between a PCB and FPC #DF40 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #StackingConnector #CommonPartsLibrary #Connector #SMTConnector #FinePitchConnector #MezzanineConnector #ElectronicComponents #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #ConsumerElectronics #HighSpeedConnector #RoHSCompliant #ComponentLibrary

ARM® Cortex®-M33 RT-600 Microcontroller IC 32-Bit Dual-Core 300MHz External Program Memory 176-VFBGA (9x9) The RT600 is a family of dual-core microcontrollers for embedded applications featuring an Arm Cortex-M33 CPU combined with a Cadence Xtensa HiFi4 advanced Audio Digital Signal Processor CPU. The Cortex-M33 includes two hardware coprocessors providing enhanced performance for an array of complex algorithms. The family offers a rich set of peripherals and very low power consumption. The Arm Cortex-M33 is a next generation core based on the ARMv8-M architecture that offers system enhancements, such as ARM TrustZone® security, single-cycle digital signal processing, and a tightly-coupled coprocessor interface, combined with low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M33 CPU employs a 3-stage instruction pipe and includes an internal prefetch unit that supports speculative branching. A hardware floating-point processor is integrated into the core. On the RT600, the Cortex-M33 is augmented with two hardware coprocessors providing accelerated support for additional DSP algorithms and cryptography. The Cadence Xtensa HiFi 4 Audio DSP engine is a highly optimized audio processor designed especially for efficient execution of audio and voice codecs and pre- and post-processing modules. It supports four 32x32-bit MACs, some support for 72-bit accumulators, limited ability to support eight 32x16-bit MACs, and the ability to issue two 64-bit loads per cycle. There is a floating point unit providing up to four single-precision IEEE floating point MACs per cycle. The RT600 provides up to 4.5 MB of on-chip SRAM (plus an additional 128 KB of tightly-coupled HiFi4 ram) and several high-bandwidth interfaces to access off-chip flash. The FlexSPI flash interface supports two channels and includes an 32 KB cache and an on-the-fly decryption engine. The RT600 is designed to allow the CortexM33 to operate at frequencies of up to 300 MHz and the HiFi4 DSP to operate at frequencies of up to 600 MHz. Key Features Dual-core architecture with Arm Cortex-M33 CPU and Cadence Xtensa HiFi4 DSP Cortex-M33 operating at up to 300 MHz HiFi4 DSP operating at up to 600 MHz Up to 4.5 MB on-chip SRAM 128 KB DSP tightly coupled memory (TCM) FlexSPI interface supporting Quad/Octal SPI Flash with execute-in-place (XIP) High-speed USB 2.0 Host/Device with integrated PHY Digital microphone (DMIC) interface supporting up to 8 channels Multiple I2S, SPI, I²C, UART, SDIO, and I3C interfaces 12-bit ADC with up to 1 MSPS sampling rate Hardware cryptography acceleration (AES, SHA, RSA, ECC) Arm TrustZone® security technology Secure boot and physically unclonable function (PUF) key storage Multiple low-power operating modes for battery-powered applications Up to 147 GPIOs depending on package option 176-pin VFBGA package (9 mm × 9 mm) Typical Applications Voice-controlled smart devices Audio processing and DSP systems Smart speakers and soundbars Industrial HMI and control panels Edge AI and machine learning applications IoT gateways and connected devices Wearable and portable electronics #NXP #iMXRT685 #RT600 #CortexM33 #HiFi4DSP #Microcontroller #EmbeddedSystems #EdgeAI #VoiceRecognition #AudioProcessing #IoT #IndustrialAutomation #SecureMCU #MachineLearning #MCUDesign

2 A 125 V 125 V Fuse Board Mount (Cartridge Style Excluded) Surface Mount 2-SMD, Square End Block The Nano2® SMF Fuse is a very small, Wire-in-Air (WIA) square shape surface mount fuse that was designed for secondary side circuit over-current protection applications. These fuses are designed for PCB using surface mount technology Features & Benefits ■ Very fast-acting ■ Small size ■ Wide range of current rating available (0.062A to 20A) ■ Wide operating temperature range ■ RoHS compliant and Halogen Free ■ UL Listed and Recognized to UL/CSA/NMX UL 248-1 and UL/CSA/NMX UL 248-14 (see Agency Approvals) ■ Conforms to DENAN’s Appendix 3 ■ Conforms to IEC/EN 60127-1 and IEC/EN 60127-7 #commonpartslibrary #fuse

680 kOhms ±5% 0.25W, 1/4W Through Hole Resistor Axial Automotive AEC-Q200 Carbon Film The CFR-25JB-52-680K is a carbon film through-hole resistor designed for general-purpose electronic applications requiring stable resistance characteristics, reliable long-term performance, and cost-effective implementation. This resistor is commonly used in signal conditioning, voltage division, pull-up and pull-down networks, biasing circuits, and low-power analog or digital systems. Its axial leaded construction supports automated insertion and conventional through-hole assembly methods, making it suitable for consumer electronics, industrial controls, instrumentation, and embedded systems. The device utilizes carbon film resistive technology to provide dependable electrical performance with moderate noise characteristics and good environmental stability. The flame-retardant coating enhances mechanical durability and improves resistance against moisture and environmental exposure. The component is optimized for standard operating environments where compact size, stable operation, and economical design are required. Electrical Characteristics Resistance Value: 680 kΩ Resistance Tolerance: ±5% Resistor Technology: Carbon Film Rated Power Dissipation: 1/4 W Maximum Working Voltage: 250 V Maximum Overload Voltage: 500 V Temperature Coefficient: ±350 ppm/°C Insulation Resistance: High reliability insulation structure suitable for general electronic equipment Mechanical Characteristics Package Type: Axial Through-Hole Mounting Style: Through Hole Body Style: Cylindrical Flame-Retardant Coated Body Lead Material: Tin-Plated Copper Lead Configuration: Axial Leads for PCB insertion Environmental Characteristics Operating Temperature Range: −55°C to +155°C Moisture Resistance: Suitable for standard humidity environments Flame Resistance: Flame-retardant protective coating compliant with general safety requirements Applications Signal Conditioning Circuits Voltage Divider Networks Pull-Up and Pull-Down Resistors Industrial Control Electronics Consumer Electronic Products General Analog and Digital Circuitry Embedded Systems and Microcontroller Interfaces #commonpartslibrary #passivecomponents #resistor #carbonfilm #throughhole #axialresistor #powermanagement #analog #digital #industrialelectronics

Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications

Current Sense Amplifier 1 Circuit Single-Ended SOT-23-6 The INA187A3IDBVR is a precision high-side and low-side current sense amplifier designed for accurate bidirectional current measurement in power management, motor control, battery monitoring, and industrial sensing applications. The device integrates a matched precision gain stage optimized for shunt resistor voltage amplification while maintaining excellent common-mode rejection and low offset drift. It supports wide common-mode input voltages, enabling current monitoring across supply rails in automotive, industrial, and embedded systems. The amplifier features fast response characteristics, low quiescent current consumption, and a compact surface-mount package suitable for space-constrained designs. Engineering Specification Device Type Precision Current Sense Amplifier Manufacturer Texas Instruments Manufacturer Part Number INA187A3IDBVR Amplifier Configuration Current shunt monitor with fixed gain Gain Variant High fixed gain configuration optimized for low-value shunt resistor sensing Input Measurement Capability Bidirectional current sensing Common-Mode Voltage Range Supports high-side and low-side sensing across wide supply rails Input Offset Characteristics Low offset voltage with low temperature drift for accurate current measurement Bandwidth Performance Wide bandwidth suitable for dynamic load and transient current monitoring Response Time Fast settling and propagation performance for real-time current feedback systems Power Supply Requirements Single-supply operation compatible with low-voltage logic systems Output Type Analog voltage output proportional to sensed shunt voltage Common-Mode Rejection High common-mode rejection ratio for stable operation in noisy environments Temperature Performance Industrial operating temperature range with stable gain accuracy over temperature Protection Features Robust input structure designed for high common-mode environments Package Type SOT-23 surface-mount package Mounting Method Surface mount technology Typical Applications Battery management systems, power distribution monitoring, motor current feedback, DC/DC converter monitoring, industrial automation, telecom power systems, and embedded power diagnostics. #commonpartslibrary #integratedcircuit #currentsenseamplifier