Part Review and Datasheet Update

Completed the CPC1709J part review and updated the project’s Datasheet URL to the official Littelfuse/IXYS datasheet.
What I found/updated:
  • MPN: CPC1709J
  • Manufacturer: IXYS Integrated Circuits / Littelfuse
  • Package: ISOPLUS-264, 4-lead
  • Description: 1-Form-A normally-open DC OptoMOS solid-state relay
  • Key specs: 60 V blocking, 9 A free-air, 22.8 A with 5°C/W heatsink, 0.05 Ω on-resistance, 2500 Vrms isolation, 10 mA input control current
  • Symbol pin descriptions were missing, so I added:
    • Pin 1: Load/output +
    • Pin 2: Load/output −
    • Pin 3: Input LED/control −
    • Pin 4: Input LED/control +
Open items / flags:
  • The footprint appears consistent with a 4-lead ISOPLUS-264 layout, but the exact mechanical drawing should still be visually checked against the datasheet page drawing before release.
  • No functional mismatch remains in the schematic symbol after adding pin descriptions.
Suggested next steps:
  1. Visually compare the footprint against the datasheet mechanical drawing.
  2. Add/verify 3D model alignment if this part will be used mechanically.
  3. Run a final part-quality review before publishing or reusing in designs.
Verify footprint and DRC
Verify footprint drawing
Add 3D model
Run final review
Fix footprint issues


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CPC1709J

CPC1709J thumbnail
IXYS Integrated Circuits brings OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays. As part of this family, the CPC1709J single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output, constructed with an efficient MOSFET switch and photovoltaic die, uses IXYS Integrated Circuits’ patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.3 °C/W).
Features • 22.8ADC Load Current with 5°C/W Heat Sink • Low 0.05 On-Resistance • 60VP Blocking Voltage • 2500Vrms Input/Output Isolation • Low Thermal Impedance: JC = 0.3 °C/W • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications • Low Drive Power Requirements • No EMI/RFI Generation Applications • Industrial Controls / Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment

Properties

CPC1709J

IXYS Integrated Circuits Division

Relay

U

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