Battery Contact Clip Multiple (AA, CR2) 1 Cell PC Pin Keystone Electronics 2915 Battery Contact Clip is a through-hole PCB battery contact clip designed for securely mounting cylindrical batteries such as AA and CR2 cells in electronic circuits. Manufactured by Keystone Electronics, this component provides a compact and reliable battery connection solution for embedded systems, portable devices, battery-powered equipment, and prototyping applications. It uses PC pin terminations for easy solder mounting onto printed circuit boards. Key Features Supports cylindrical battery sizes including AA and CR2 Single-cell battery contact clip design Through-hole PCB mounting PC pin termination style Compact low-profile construction Reliable spring-contact battery retention Suitable for portable and battery-powered electronics Durable metal contact construction Easy battery insertion and removal Active production status from Keystone Electronics

22 (20 + 2 Power) Position Connector Header, Outer Shroud Contacts Surface Mount Gold The BM24-20DP/2-0.35V(51) is a board-to-board and board-to-FPC header connector manufactured by Hirose Electric. It belongs to the BM24 series, a family of fine-pitch hybrid power and signal connectors designed for applications that require both data signaling and supplementary power delivery within the same compact interconnect, eliminating the need for a separate dedicated power connector alongside the signal interface. The connector functions as the plug (header) half of a mating pair, intended to mate with a corresponding BM24 receptacle to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile board-to-board arrangement. This part number designates a configuration with a defined signal contact count supplemented by additional dedicated power contacts, reflecting the series' hybrid design philosophy in which the majority of positions handle signal or data lines while a smaller subset of positions is reserved for carrying higher current to support onboard power rails. This arrangement is particularly useful in compact consumer devices such as smartphones, wearables, and camera modules, where both data interfaces and local power distribution must be routed across a board-to-board junction without dedicating separate connectors to each function. The series is positioned by Hirose as supporting high-speed signaling standards including USB interfaces, making it suitable for applications that combine high-speed data transmission with power delivery in a single compact connector footprint. The connector's fine contact pitch and low mated height make it well suited to thin, space-constrained form factors where minimizing both footprint area and stack height is a priority. As with other Hirose board-to-board offerings, the connector is non-polarized in its base mechanical design, and it is supplied on embossed carrier tape for automated pick-and-place assembly, with construction compliant to RoHS material restrictions. Mechanically, the header is built to withstand the repeated mating cycles typical of consumer electronics manufacturing, rework, and field service, while maintaining stable, low-resistance contact across both its signal and power contact paths under realistic vibration and thermal conditions. As a header-style connector, it is intended to be soldered directly to a host PCB, with its mating receptacle counterpart soldered to the opposing board or FPC, allowing the assemblies to be joined and separated as needed throughout the product lifecycle. Spec Sheet Identification Part Number: BM24-20DP/2-0.35V(51) Series: BM24 Connector Style: Hybrid power/signal board-to-board and board-to-FPC connector Connector Type / Configuration Type: Header (plug) Gender: Male Orientation: Straight, surface mount Contact Arrangement: Hybrid configuration combining signal contacts and dedicated power contacts Polarization: Non-polarized Electrical Ratings Applicable High-Speed Protocols: USB2.0, USB3.0, USB3.1 (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Power Contacts: Dedicated higher-current contacts integrated alongside signal contacts Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics assembly and rework Contact & Material Properties Contact Plating (Mating Area): Gold Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding BM24 series receptacle connector Application Note: Intended for hybrid power and signal board-to-board or board-to-FPC interconnection in compact consumer electronics #BM24 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #HybridConnector #PowerAndSignal #Connector #SMTConnector #FinePitchConnector #USB #HighSpeedConnector #ConsumerElectronics #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #RoHSCompliant #ComponentLibrary #CommonPartsLibrary

10 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold The SFM-105-02-X-D-A is a high-reliability dual-row socket connector designed for board-to-board and mezzanine interconnection applications. Manufactured by Samtec, this connector provides a compact and durable solution for connecting printed circuit boards in embedded systems, industrial electronics, communications equipment, test instruments, and high-performance computing platforms. The connector features precision-machined contacts that ensure consistent electrical performance, excellent mating reliability, and long operational life. Its low-profile design and high-density contact arrangement make it suitable for applications requiring space-efficient interconnect solutions while maintaining signal integrity and mechanical robustness. Engineering Specifications Manufacturer: Samtec Part Number: SFM-105-02-X-D-A Series: SFM Series Connector Type: Board-to-Board Socket Connector Contact System: Precision Socket Contacts Row Configuration: Dual Row Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Temperature Thermoplastic Mating Compatibility: Standard Samtec Header Systems Electrical Performance: High-Reliability Signal Interconnection Mechanical Durability: High Mating Cycle Life Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Control Equipment, Communication Systems, Data Acquisition Platforms, Instrumentation, Test Equipment, Computing Hardware, PCB Interconnect Solutions Key Features High-density dual-row socket configuration Precision-machined contacts for reliable electrical performance Gold-plated contact interface for enhanced conductivity and durability Compact footprint for space-constrained designs Excellent mating alignment and retention characteristics High mechanical durability for repeated insertion cycles Suitable for board stacking and mezzanine interconnections Compatible with a wide range of Samtec header connectors Designed for industrial and commercial electronic systems Supports reliable signal transmission in high-performance applications #SFM10502XDA #Samtec #BoardToBoardConnector #SocketConnector #DualRowConnector #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #CommunicationSystems #Instrumentation #DataAcquisition #MezzanineConnector #ThroughHoleConnector #ElectronicComponents #PCBDesign #SignalIntegrity #HighReliability #ConnectorTechnology #EmbeddedHardware

Connector Header Through Hole 16 position 0.100" (2.54mm) SEK/IDC Low Profile straight male, 2.9mm tails, 16pin, PL3 16-position, 2.54 mm pitch, through-hole straight low-profile header.

WR-FPC SMT ZIF Horizontal Hinge FFC/FPC Connector, 22 positions, 0.50 mm pitch, bottom-contact type with flip-lock (ZIF) actuator. Surface-mount connector designed for flexible flat cable (FFC) and flexible printed circuit (FPC) connections in compact electronic devices. Horizontal cable entry, low-profile design, halogen-free and RoHS compliant. Suitable for displays, touch panels, cameras, embedded systems, consumer electronics, industrial devices, and PCB interconnect applications. Search Keywords: WR-FPC, WR-FPC SMT ZIF, 687122149022, FFC Connector, FPC Connector, 22 Pin FFC Connector, 22 Pin FPC Connector, 0.5mm Pitch Connector, Bottom Contact Connector, ZIF Connector, Flip Lock Connector, Horizontal FFC Connector, SMT FFC Connector, Würth Elektronik Connector, Flexible Flat Cable Connector, LCD Connector, Display Connector, Camera Connector Hashtags: #WRFPC #687122149022 #WurthElektronik #FFCConnector #FPCConnector #ZIFConnector #FlipLockConnector #SMTConnector #BottomContact #22PinConnector #05mmPitch #FlexibleFlatCable #FlexiblePrintedCircuit #DisplayConnector #EmbeddedHardware #PCBDesign #ElectronicsDesign #HardwareEngineering #IndustrialElectronics #ConsumerElectronicsWR-FPC 0.50mm SMT Horiz. Bot. Contact Hinge type WR-FPC 0.50mm 22pins Hinge type SMT Horizontal Bottom Contact

Low-profile 12.3 mm height power relay with maximum switching of 10A General Purpose Relays 2.3 mm in height

LQFP-48 is a Low-Profile Quad Flat Package (LQFP) with 48 leads arranged in a 7x7mm body size and a lead pitch of 0.5mm. This package is commonly used for integrated circuits and microcontrollers that require a higher pin count. 48-LQFP #part #template

LQFP-32 is a surface-mount package for integrated circuits (ICs) with 32 leads arranged in a 7x7 mm square grid. The lead pitch is 0.8 mm, and the body size is approximately 7.0 mm x 7.0 mm x 1.4 mm (L x W x H). LQFP-32 is commonly used for microcontrollers, digital signal processors, and other complex ICs that require a high pin count. It provides a low-profile solution that is well-suited for space-constrained applications. 32-LQFP #part #template

LQFP-64 is a low-profile quad flat package commonly used for integrated circuits. It has a body size of approximately 7 mm x 7 mm (L x W) with 64 pins. The lead pitch between the pins is typically 0.4 mm. The package is also known as Low-Profile Quad Flat Package 64 or LQFP-64. #part #template

TDK T5838 digital PDM MEMS microphone, low-profile surface-mount microphone with pulse density modulation (PDM) output, operating from 1.65V to 1.98V supply, configurable performance modes including High Quality, Low Power and Ultrasonic operation, signal-to-noise ratio (SNR) up to 68dB, acoustic overload point (AOP) up to 133dBSPL, clock frequency range from 400kHz to 4.8MHz, wake-on-sound support, left/right channel selection, compact package optimized for portable audio, voice recognition, smart devices, IoT products and battery-powered applications. Search Keywords: TDK T5838, T5838 MEMS microphone, T5838 PDM microphone, digital MEMS microphone, PDM output microphone, low power MEMS microphone, ultrasonic MEMS microphone, TDK InvenSense microphone, wake on sound microphone, digital microphone 1.8V, MEMS audio sensor, voice recognition microphone, IoT microphone, T5838 datasheet Hashtags: #T5838 #TDKT5838 #TDK #MEMSMicrophone #DigitalMicrophone #PDMMicrophone #AudioSensor #VoiceRecognition #WakeOnSound #LowPowerMicrophone #UltrasonicMicrophone #IoTAudio #SmartDeviceAudio #MEMSAudio #EmbeddedAudio

Telecom Relay DPDT (2 Form C) Surface Mount The G6K-2F-Y DC5 specification defines the engineering requirements for a low-profile dual-pole signal relay designed for precision switching in electronic control and communication systems. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure reliable signal switching, low contact resistance, and long-term operational stability in compact electronic assemblies. The relay is intended for use in telecommunications equipment, instrumentation, industrial control systems, automated test equipment, and embedded electronic applications requiring high-reliability signal routing. It provides electrically isolated switching with low power consumption and stable contact performance, making it suitable for low-level signal and logic circuit applications. Engineering Requirements The relay shall be manufactured using qualified electromechanical components and controlled production processes to ensure consistent switching characteristics, mechanical durability, and long service life. The internal contact system shall provide reliable electrical continuity and repeatable switching performance throughout the specified operational life. Electrical characteristics shall ensure stable contact resistance, low coil power consumption, high insulation resistance, and reliable dielectric isolation between coil and contact circuits. The relay shall maintain dependable switching performance under specified voltage, current, temperature, and environmental operating conditions. Mechanical construction shall provide accurate contact alignment, secure enclosure integrity, and resistance to vibration, shock, and thermal cycling. The package shall be suitable for printed circuit board mounting and compatible with standard electronic assembly and soldering processes without degradation of performance. Workmanship shall be free from defects including contamination, corrosion, mechanical deformation, contact misalignment, or structural irregularities that could adversely affect electrical or mechanical reliability. Inspection, validation, and testing shall be conducted using calibrated equipment and controlled quality procedures to verify compliance with all applicable engineering and manufacturing requirements. Any deviation from this specification shall require formal engineering evaluation, documented technical justification, and approval through the established engineering change control process before implementation. Documentation Supporting documentation shall include engineering drawings, electrical performance specifications, qualification reports, inspection records, material declarations, and revision-controlled manufacturing documentation. All documentation shall be maintained under formal configuration management and quality assurance systems to ensure complete product traceability. Revision Control Any modification to this specification shall be managed through the formal engineering change management process. All revisions shall undergo technical review, validation, and approval before release to ensure continued compliance with design intent and applicable engineering standards. #EngineeringSpecification #SignalRelay #ElectromechanicalRelay #ElectronicSwitching #IndustrialElectronics #EmbeddedSystems #Telecommunications #QualityAssurance #EngineeringDocumentation #ElectronicComponents

3.8V to 32V Input, 2A Low Quiescent Current Synchronous Buck Converter with Enhanced EMI Suppression The AP63200/AP63201/AP63203/AP63205 is a 2A, synchronous buck converter with a wide input voltage range of 3.8V to 32V and fully integrates a 125mΩ high-side power MOSFET and a 68mΩ low-side power MOSFET to provide high-efficiency step-down DC/DC conversion. The AP63200/AP63201/AP63203/AP63205 device is easily used by minimizing the external component count due to its adoption of peak current mode control along with its integrated compensation network. The AP63200/AP63201/AP63203/AP63205 has optimized designs for Electromagnetic Interference (EMI) reduction. The converter features Frequency Spread Spectrum (FSS) with a switching frequency jitter of ±6%, which reduces EMI by not allowing emitted energy to stay in any one frequency for a significant period of time. It also has a proprietary gate driver scheme to resist switching node ringing without sacrificing MOSFET turn-on and turn-off times, which further erases highfrequency radiated EMI noise caused by MOSFET switching. The device is available in a low-profile, TSOT26 package • VIN 3.8V to 32V • 2A Continuous Output Current • 0.8V ±1% Reference Voltage • 22µA Ultralow Quiescent Current • Switching Frequency o 500kHz: AP63200 and AP63201 o 1.1MHz: AP63203 and AP63205 • Pulse Width Modulation (PWM) Regardless of Output Load o AP63201 • Supports Pulse Frequency Modulation (PFM) o AP63200, AP63203, and AP63205 o Up to 80% Efficiency at 1mA Light Load o Up to 88% Efficiency at 5mA Light Load • Fixed Output Voltage o 3.3V: AP63203 o 5.0V: AP63205 • Proprietary Gate Driver Design for Best EMI Reduction • Frequency Spread Spectrum (FSS) to Reduce EMI • Precision Enable Threshold to Adjust UVLO • Protection Circuitry o Overvoltage Protection o Cycle-by-Cycle Peak Current Limit o Thermal Shutdown #CommonPartsLibrary #IntegratedCircuit #PowerManagement #Switching-regulator

LQFP-44 is a low-profile quad flat package commonly used for integrated circuits. It has a body size of approximately 10 mm x 10 mm (L x W) with 44 pins. The lead pitch between the pins is typically 0.8 mm. The package is also known as Low-Profile Quad Flat Package 44 or LQFP-44. #part #template

LQFP-52 is a low-profile quad flat package commonly used for integrated circuits. It has a body size of approximately 10 mm x 10 mm (L x W) with 52 pins. The lead pitch between the pins is typically 0.65 mm. The package is also known as Low-Profile Quad Flat Package 52 or LQFP-52. #part #template

JST SM04B-SRSS-TB(LF)(SN) is a 4-position, 1.0 mm pitch, right-angle surface-mount JST SH PCB connector commonly used for STEMMA QT and Qwiic I²C connections. Keywords: SM04B-SRSS-TB, JST SH, 4-pin connector, 1.0mm pitch, STEMMA QT Qwiic The SM04B-SRSS-TB (LF)(SN) is a JST SH/SR series 4-position wire-to-board connector header designed for compact, high-density PCB applications. It features a 1.0 mm pitch, right-angle surface-mount (SMT) design, and a shrouded housing for secure mating and alignment. This connector is commonly used in space-constrained electronic devices where reliable signal transmission and low-profile mounting are required, such as in consumer electronics, industrial control boards, and embedded systems. It mates with compatible JST SH series housings, providing a secure push-fit connection for crimped wire assemblies. Key Features 4-position (1x4) wire-to-board connector header 1.0 mm fine pitch for compact PCB layouts Surface-mount (SMT), right-angle configuration Shrouded design for improved alignment and protection Rated current: 1 A per contact Rated voltage: 50 V AC/DC Low-profile height (~2.9 mm) Tin-plated contacts for reliable conductivity Operating temperature: -25°C to +85°C Compatible with JST SH/SR series mating housings Tape-and-reel packaging for automated PCB assembly #CommonPartsLibrary #Connector #JST #SM04BSRSSTB #SHSeries #SRSeries #WireToBoard #1mmPitch #SMTConnector #PCBConnector #ElectronicsComponents #ConnectorHeader

# DF40C-100DS-0.4V(51) ## General Description The DF40C-100DS-0.4V(51) is a high-density board-to-board mezzanine connector manufactured by Hirose Electric. It belongs to the DF40 series of ultra-fine pitch connectors designed for compact electronic systems requiring reliable signal transmission and high interconnection density. The connector features a precision contact system, low-profile construction, and surface-mount configuration, making it suitable for embedded systems, industrial electronics, communication equipment, medical devices, portable electronics, computing platforms, and advanced IoT products. Its robust mechanical design ensures secure mating, excellent signal integrity, and dependable long-term performance in applications where board space is limited and connection reliability is critical. ## Key Features ### Connector Architecture * Board-to-board mezzanine connector design * High-density interconnection capability * Fine-pitch contact arrangement * Precision mating structure * Low-profile configuration * Optimized for compact electronic assemblies ### Electrical Characteristics * Reliable signal transmission * Low contact resistance * Stable electrical performance * High signal integrity capability * Suitable for high-speed digital interfaces * Consistent connection reliability ### Mechanical Characteristics * Surface-mount mounting configuration * Precision alignment structure * Secure mating retention mechanism * Compact footprint design * High-density PCB integration support * Automated assembly compatible ### Contact System * High-reliability contact construction * Gold-plated contact surfaces * Corrosion-resistant interface * Enhanced mating durability * Reliable electrical continuity * Stable long-term performance ### Material Construction * High-strength thermoplastic housing * Precision metal contact system * RoHS-compliant materials * Lead-free compatible construction * Industrial-grade manufacturing quality ### Environmental Characteristics * Long operational service life * Suitable for industrial and commercial applications * Reliable performance under continuous operation * Resistant to mechanical stress and vibration * Stable operation across standard environmental conditions ### Application Areas * Embedded Computing Systems * Industrial Automation Equipment * Medical Electronics * Communication Devices * Portable Electronic Products * Human-Machine Interfaces * Consumer Electronics * Data Acquisition Systems * IoT Devices * Wireless Communication Modules * Control Systems * High-Density PCB Assemblies ### Compliance * RoHS Compliant * Lead-Free Compatible * High-Density Interconnect Solution ## Manufacturer Hirose Electric Co., Ltd. ## Product Family DF40 Series Board-to-Board Connectors #DF40C100DS04V51 #Hirose #DF40Series #BoardToBoardConnector #MezzanineConnector #HighDensityConnector #PCBConnector #EmbeddedSystems #IndustrialElectronics #CommunicationEquipment #MedicalElectronics #IoTDevices #ElectronicsEngineering #PCBDesign #SurfaceMountConnector

CONN HEADER SMD R/A 3POS 1.25mm The SM03B-GHS-TB(LF)(SN) is a 3-pin, surface-mount, right-angle header connector that mates with JST GH-series wire housings. It provides a reliable, low-profile connection between a PCB and external wires using a crimp-style mating system. It belongs to the JST GH series, known for fine-pitch, compact connectors optimized for miniaturized electronics. 3-position connector (signal/power lines) 1.25 mm pitch for high-density PCB layout Surface-mount, right-angle (horizontal) mounting Shrouded header design for secure mating and alignment Locking ramp mechanism to prevent accidental disconnection Tin-plated contacts for reliable conductivity Lead-free / RoHS compliant (LF/SN finish) Current rating: ~1 A typical Voltage rating: ~50 V Operating temperature: approx. -25 °C to +85 °C 📦 Typical Applications Consumer electronics (wearables, IoT devices) Industrial control modules Robotics and sensor interfaces Battery-powered embedded systems Compact PCB interconnect systems #CommonPartsLibrary #Connector

3.8V to 32V Input, 2A Low Quiescent Current Synchronous Buck Converter with Enhanced EMI Suppression The AP63200/AP63201/AP63203/AP63205 is a 2A, synchronous buck converter with a wide input voltage range of 3.8V to 32V and fully integrates a 125mΩ high-side power MOSFET and a 68mΩ low-side power MOSFET to provide high-efficiency step-down DC/DC conversion. The AP63200/AP63201/AP63203/AP63205 device is easily used by minimizing the external component count due to its adoption of peak current mode control along with its integrated compensation network. The AP63200/AP63201/AP63203/AP63205 has optimized designs for Electromagnetic Interference (EMI) reduction. The converter features Frequency Spread Spectrum (FSS) with a switching frequency jitter of ±6%, which reduces EMI by not allowing emitted energy to stay in any one frequency for a significant period of time. It also has a proprietary gate driver scheme to resist switching node ringing without sacrificing MOSFET turn-on and turn-off times, which further erases highfrequency radiated EMI noise caused by MOSFET switching. The device is available in a low-profile, TSOT26 package • VIN 3.8V to 32V • 2A Continuous Output Current • 0.8V ±1% Reference Voltage • 22µA Ultralow Quiescent Current • Switching Frequency o 500kHz: AP63200 and AP63201 o 1.1MHz: AP63203 and AP63205 • Pulse Width Modulation (PWM) Regardless of Output Load o AP63201 • Supports Pulse Frequency Modulation (PFM) o AP63200, AP63203, and AP63205 o Up to 80% Efficiency at 1mA Light Load o Up to 88% Efficiency at 5mA Light Load • Fixed Output Voltage o 3.3V: AP63203 o 5.0V: AP63205 • Proprietary Gate Driver Design for Best EMI Reduction • Frequency Spread Spectrum (FSS) to Reduce EMI • Precision Enable Threshold to Adjust UVLO • Protection Circuitry o Overvoltage Protection o Cycle-by-Cycle Peak Current Limit o Thermal Shutdown #CommonPartsLibrary #IntegratedCircuit #PowerManagement

M.2 CONN.P=0.5 6.7mm H conn The 91302-67-067R2M is a 67-position M.2 (NGFF) card-edge connector manufactured by UMAX. It is designed for connecting M.2 SSDs and PCIe-based expansion modules to a host PCB. The connector features an M-Key interface, making it suitable for high-speed PCIe storage applications such as NVMe solid-state drives. It is a surface-mount, right-angle receptacle with a 0.5 mm contact pitch and a 6.7 mm height above the PCB. Key Features M.2 M-Key connector Supports M-Key M.2 modules, commonly used for PCIe/NVMe SSDs. 67 contacts (67P) Standard pin count for M-Key M.2 card-edge connections. 0.5 mm pitch Fine-pitch design suitable for compact, high-density PCB layouts. Surface-mount, right-angle mounting Optimized for automated PCB assembly and low-profile system designs. 6.7 mm connector height Provides compatibility with standard M.2 card installation requirements. Female card-edge receptacle Accepts M.2 modules directly without additional adapters. RoHS compliant Meets environmental requirements for lead-free electronic assemblies. Typical Applications NVMe SSD sockets PCIe M.2 storage devices Embedded computing systems Industrial PCs Networking equipment Edge AI and IoT gateways Single-board computers requiring M.2 expansion #CommonPartsLibrary #Connector