22 (20 + 2 Power) Position Connector Header, Outer Shroud Contacts Surface Mount Gold
The BM24-20DP/2-0.35V(51) is a board-to-board and board-to-FPC header connector manufactured by Hirose Electric. It belongs to the BM24 series, a family of fine-pitch hybrid power and signal connectors designed for applications that require both data signaling and supplementary power delivery within the same compact interconnect, eliminating the need for a separate dedicated power connector alongside the signal interface. The connector functions as the plug (header) half of a mating pair, intended to mate with a corresponding BM24 receptacle to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile board-to-board arrangement.
This part number designates a configuration with a defined signal contact count supplemented by additional dedicated power contacts, reflecting the series' hybrid design philosophy in which the majority of positions handle signal or data lines while a smaller subset of positions is reserved for carrying higher current to support onboard power rails. This arrangement is particularly useful in compact consumer devices such as smartphones, wearables, and camera modules, where both data interfaces and local power distribution must be routed across a board-to-board junction without dedicating separate connectors to each function.
The series is positioned by Hirose as supporting high-speed signaling standards including USB interfaces, making it suitable for applications that combine high-speed data transmission with power delivery in a single compact connector footprint. The connector's fine contact pitch and low mated height make it well suited to thin, space-constrained form factors where minimizing both footprint area and stack height is a priority. As with other Hirose board-to-board offerings, the connector is non-polarized in its base mechanical design, and it is supplied on embossed carrier tape for automated pick-and-place assembly, with construction compliant to RoHS material restrictions.
Mechanically, the header is built to withstand the repeated mating cycles typical of consumer electronics manufacturing, rework, and field service, while maintaining stable, low-resistance contact across both its signal and power contact paths under realistic vibration and thermal conditions. As a header-style connector, it is intended to be soldered directly to a host PCB, with its mating receptacle counterpart soldered to the opposing board or FPC, allowing the assemblies to be joined and separated as needed throughout the product lifecycle.
Spec Sheet
Identification
Part Number: BM24-20DP/2-0.35V(51)
Series: BM24
Connector Style: Hybrid power/signal board-to-board and board-to-FPC connector
Connector Type / Configuration
Type: Header (plug)
Gender: Male
Orientation: Straight, surface mount
Contact Arrangement: Hybrid configuration combining signal contacts and dedicated power contacts
Polarization: Non-polarized
Electrical Ratings
Applicable High-Speed Protocols: USB2.0, USB3.0, USB3.1 (series capability)
Transmission Rate: High-speed, multi-gigabit class (series capability)
Power Contacts: Dedicated higher-current contacts integrated alongside signal contacts
Mechanical Specifications
Contact Pitch: Fine pitch
Mounting Pitch: Matches contact pitch
Mated Height: Low-profile
Mounting Method: Surface mount technology (SMT)
Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics assembly and rework
Contact & Material Properties
Contact Plating (Mating Area): Gold
Insulator Material: High-temperature engineering resin suitable for SMT reflow
Environmental Ratings
RoHS Compliance: Yes
Packaging
Packaging Format: Embossed carrier tape, reel format
Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity
Mating Compatibility
Mates With: Corresponding BM24 series receptacle connector
Application Note: Intended for hybrid power and signal board-to-board or board-to-FPC interconnection in compact consumer electronics