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10
Pin Number
10
4
Pin Number
4
13
Pin Number
13
16
Pin Number
16
7
Pin Number
7
2
Pin Number
2
3
Pin Number
3
11
Pin Number
11
MP3
Pin Number
MP3
15
Pin Number
15
17
Pin Number
17
MP2
Pin Number
MP2
12
Pin Number
12
9
Pin Number
9
19
Pin Number
19
MP4
Pin Number
MP4
18
Pin Number
18
1
Pin Number
1
5
Pin Number
5
20
Pin Number
20
MP1
Pin Number
MP1
6
Pin Number
6
8
Pin Number
8
14
Pin Number
14


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  • Generic Capacitor
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BM24-20DP/2-0.35V(51)

BM24-20DP/2-0.35V(51) thumbnail
22 (20 + 2 Power) Position Connector Header, Outer Shroud Contacts Surface Mount Gold
The BM24-20DP/2-0.35V(51) is a board-to-board and board-to-FPC header connector manufactured by Hirose Electric. It belongs to the BM24 series, a family of fine-pitch hybrid power and signal connectors designed for applications that require both data signaling and supplementary power delivery within the same compact interconnect, eliminating the need for a separate dedicated power connector alongside the signal interface. The connector functions as the plug (header) half of a mating pair, intended to mate with a corresponding BM24 receptacle to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile board-to-board arrangement. This part number designates a configuration with a defined signal contact count supplemented by additional dedicated power contacts, reflecting the series' hybrid design philosophy in which the majority of positions handle signal or data lines while a smaller subset of positions is reserved for carrying higher current to support onboard power rails. This arrangement is particularly useful in compact consumer devices such as smartphones, wearables, and camera modules, where both data interfaces and local power distribution must be routed across a board-to-board junction without dedicating separate connectors to each function. The series is positioned by Hirose as supporting high-speed signaling standards including USB interfaces, making it suitable for applications that combine high-speed data transmission with power delivery in a single compact connector footprint. The connector's fine contact pitch and low mated height make it well suited to thin, space-constrained form factors where minimizing both footprint area and stack height is a priority. As with other Hirose board-to-board offerings, the connector is non-polarized in its base mechanical design, and it is supplied on embossed carrier tape for automated pick-and-place assembly, with construction compliant to RoHS material restrictions. Mechanically, the header is built to withstand the repeated mating cycles typical of consumer electronics manufacturing, rework, and field service, while maintaining stable, low-resistance contact across both its signal and power contact paths under realistic vibration and thermal conditions. As a header-style connector, it is intended to be soldered directly to a host PCB, with its mating receptacle counterpart soldered to the opposing board or FPC, allowing the assemblies to be joined and separated as needed throughout the product lifecycle.
Spec Sheet Identification
Part Number: BM24-20DP/2-0.35V(51) Series: BM24 Connector Style: Hybrid power/signal board-to-board and board-to-FPC connector
Connector Type / Configuration
Type: Header (plug) Gender: Male Orientation: Straight, surface mount Contact Arrangement: Hybrid configuration combining signal contacts and dedicated power contacts Polarization: Non-polarized
Electrical Ratings
Applicable High-Speed Protocols: USB2.0, USB3.0, USB3.1 (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Power Contacts: Dedicated higher-current contacts integrated alongside signal contacts
Mechanical Specifications
Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics assembly and rework
Contact & Material Properties
Contact Plating (Mating Area): Gold Insulator Material: High-temperature engineering resin suitable for SMT reflow
Environmental Ratings
RoHS Compliance: Yes
Packaging
Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity
Mating Compatibility
Mates With: Corresponding BM24 series receptacle connector Application Note: Intended for hybrid power and signal board-to-board or board-to-FPC interconnection in compact consumer electronics

Properties

BM24-20DP/2-0.35V(51)

Hirose

Connector

J

TO

parametric-v1

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