ARM® Cortex®-M7 STM32H7 Microcontroller IC 32-Bit 480MHz 2MB (2M x 8) FLASH 144-LQFP (20x20) #microcontrollers #stm32 #commonpartslibrary

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

ARM® Cortex®-M7 STM32H7 Microcontroller IC 32-Bit 480MHz 2MB (2M x 8) FLASH 100-LQFP (14x14) #microcontrollers #stm32 #commonpartslibrary

Connector Header Through Hole 6 position 0.100" (2.54mm) The TSW-106-06-T-S is a through-hole, single-row, 6-position header from Samtec’s TSW series, designed for board-to-board or wire-to-board interconnections. It features a standard 2.54 mm (0.100") pitch and utilizes square posts for reliable mating with female sockets or IDC connectors. This header is commonly used in prototyping, development boards, and general-purpose PCB designs requiring robust and cost-effective interconnect solutions. Key Features Single-row vertical header 6 positions (1x6 configuration) Standard 2.54 mm pitch spacing Through-hole mounting for strong mechanical retention Tin-plated contacts for cost efficiency Square post design for reliable electrical contact Compatible with a wide range of mating connectors Electrical Characteristics Current Rating: ~3 A per contact (typical, depending on application) Contact Resistance: ≤ 10 mΩ (initial) Insulation Resistance: ≥ 1000 MΩ Withstanding Voltage: ~500 VAC Mechanical Characteristics Number of Positions: 6 Rows: 1 Pitch: 2.54 mm (0.100") Mounting Type: Through-hole Contact Type: Male pin (square post) Post Length Style: Standard (06) Tail Length: ~3.18 mm (0.125") typical Mating Pin Size: ~0.64 mm square Material and Plating Contact Material: Phosphor Bronze Plating: Tin over Nickel Insulator Material: Glass-filled thermoplastic (UL94 V-0 rated) Environmental Specifications Operating Temperature Range: -55°C to +105°C RoHS Compliant: Yes Lead-Free: Yes Applications PCB prototyping and development boards Embedded systems and microcontroller headers Board-to-board connections General-purpose signal connections Packaging Typically supplied in bulk or tube packaging depending on order quantity #commonpartslibrary #connector #header