Connector Header Through Hole 5 position 0.100" (2.54mm) SWD header 1x5 2.54mm PinHeader 1x05 2.54mm horizontal The TSW-105-07-G-S is a high-reliability, through-hole, single-row pin header from Samtec’s TSW series. It is designed for board-to-board or wire-to-board interconnections in a wide range of electronic applications. Featuring a standard 2.54 mm pitch and gold-plated contacts, this connector ensures reliable electrical performance, durability, and compatibility with industry-standard mating components. Mechanical Characteristics Connector Type: Pin Header Mounting Type: Through-Hole Number of Positions: 5 Number of Rows: Single Row Pitch: 2.54 mm Orientation: Vertical Termination Style: Solder Contact Shape: Square Post Material and Plating Contact Material: Phosphor Bronze Contact Plating: Gold over Nickel Housing Material: Black Thermoplastic (UL94 V-0 rated) Electrical Characteristics Current Rating: Typically up to 3 A per contact Voltage Rating: Typically up to 500 VAC Contact Resistance: Low contact resistance for reliable signal transmission Insulation Resistance: High insulation resistance Environmental Characteristics Operating Temperature Range: -55°C to +125°C Flammability Rating: UL94 V-0 Applications Board-to-board connections Wire-to-board interfaces Prototyping and development systems Industrial and consumer electronics Compliance and Standards RoHS Compliant Lead-Free #CommonPartsLibrary #Connector #Header #TSW

Connector Header Through Hole 6 position 0.100" (2.54mm) The TSW-103-07-G-D is a through-hole, dual-row (2×3) male pin header from the TSW series of Samtec. It is designed for board-to-board or cable-to-board interconnections, using a standard 2.54 mm (0.1″) pitch, making it widely compatible with common PCB layouts and prototyping systems. This connector features gold-plated square posts for reliable electrical contact and durability, and is commonly used in embedded systems, development boards, and general electronics applications. Key Features Connector Type: Male pin header (unshrouded) Number of Positions: 6 pins (2 rows × 3 pins) Pitch: 2.54 mm (0.100″) standard spacing Mounting Type: Through-hole soldering Contact System: 0.025″ (0.635 mm) square post Contact Material: Phosphor bronze with gold plating Orientation: Vertical (straight) Row Spacing: 2.54 mm Operating Temperature: −55 °C to +125 °C Insulator Material: PBT (UL94 V-0 rated) Typical Use: Board-to-board or cable interface AVR ISP 2x3 2.54mm header #commonpartslibrary #connector #header

Connector Header Through Hole 6 position 0.100" (2.54mm) The TSW-106-06-T-S is a through-hole, single-row, 6-position header from Samtec’s TSW series, designed for board-to-board or wire-to-board interconnections. It features a standard 2.54 mm (0.100") pitch and utilizes square posts for reliable mating with female sockets or IDC connectors. This header is commonly used in prototyping, development boards, and general-purpose PCB designs requiring robust and cost-effective interconnect solutions. Key Features Single-row vertical header 6 positions (1x6 configuration) Standard 2.54 mm pitch spacing Through-hole mounting for strong mechanical retention Tin-plated contacts for cost efficiency Square post design for reliable electrical contact Compatible with a wide range of mating connectors Electrical Characteristics Current Rating: ~3 A per contact (typical, depending on application) Contact Resistance: ≤ 10 mΩ (initial) Insulation Resistance: ≥ 1000 MΩ Withstanding Voltage: ~500 VAC Mechanical Characteristics Number of Positions: 6 Rows: 1 Pitch: 2.54 mm (0.100") Mounting Type: Through-hole Contact Type: Male pin (square post) Post Length Style: Standard (06) Tail Length: ~3.18 mm (0.125") typical Mating Pin Size: ~0.64 mm square Material and Plating Contact Material: Phosphor Bronze Plating: Tin over Nickel Insulator Material: Glass-filled thermoplastic (UL94 V-0 rated) Environmental Specifications Operating Temperature Range: -55°C to +105°C RoHS Compliant: Yes Lead-Free: Yes Applications PCB prototyping and development boards Embedded systems and microcontroller headers Board-to-board connections General-purpose signal connections Packaging Typically supplied in bulk or tube packaging depending on order quantity #commonpartslibrary #connector #header

Connector Header Through Hole 40 position 0.100" (2.54mm) Raspberry Pi 40 pin header The TSW-120-07-G-D is a through-hole, double-row vertical header manufactured by Samtec. It features 40 total positions (2 rows of 20 pins) with a standard 2.54 mm pitch. This connector is widely used for board-to-board connections, prototyping, and general-purpose signal routing in embedded and electronic systems. It is designed for reliable mechanical and electrical performance with gold-plated contacts for enhanced conductivity and corrosion resistance. Manufacturer Samtec Inc. Manufacturer Part Number TSW-120-07-G-D Product Type Through-Hole Pin Header Number of Positions 40 (2 × 20) Number of Rows 2 Pitch 2.54 mm (0.100") Row Spacing 2.54 mm (0.100") Mounting Type Through Hole Orientation Vertical Contact Material Phosphor Bronze Contact Plating Gold (Au) over Nickel Plating Thickness Typically 10 µin (0.25 µm) Gold Insulator Material Black Liquid Crystal Polymer (LCP) Current Rating Typically 3.0 A per contact (depending on application conditions) Voltage Rating Typically 250 VAC Operating Temperature Range -55°C to +125°C Termination Type Solder Contact Style Square Post Post Length Standard Samtec “-07” tail length (approx. 2.92 mm tail, varies slightly per datasheet) Applications Embedded systems (e.g., Raspberry Pi GPIO headers) Development boards and expansion modules Board-to-board interconnects Prototyping and test setups Compliance RoHS Compliant Lead-Free Notes Compatible with standard 2.54 mm female headers and sockets Commonly used in stacking or mezzanine configurations Available in various plating options and pin lengths under the TSW series #commonpartslibrary #connector

Seeed Studio XIAO ESP32S3 Plus, powered by ESP32-S3's 240MHz Xtensa 32-bit LX7 dual-core processor, brings more SMD pins to the tiny versatile XIAO ESP32S3. While maintaining all the powerful features including WiFi and BLE 5.0 wireless connectivities, 2.4GHz Rod antenna, and ultra-low power consumption of 14μA in deep sleep mode with lithium battery charging management, the Plus variant features redesigned castellations and pad layout on the back, offering 9 additional GPIOs specifically for advanced Bluetooth projects requiring expanded I/Os via SMD board-to-board soldering. It's ideal for advanced IoT projects, Smart Homes, and professional wireless devices requiring extra I/O connectivity.

Connector Header Through Hole 12 position 0.100" (2.54mm) pin header 1x12 2.54mm The TSW-112-07-G-S is a single-row, 12-position, 2.54 mm pitch through-hole male pin header from Samtec’s TSW series. It is designed for reliable board-to-board or wire-to-board connections in prototyping and production environments. Featuring gold-plated phosphor bronze contacts and a durable PBT housing, this connector ensures excellent electrical performance, corrosion resistance, and mechanical durability. It is commonly used in embedded systems, development boards, and general-purpose PCB interconnections. Product Type Pin Header / Pin Strip Number of Positions 12 Number of Rows 1 Pitch 2.54 mm (0.1 in) Mounting Style Through Hole Mounting Angle Straight Termination Style Solder Pin Contact Type Male Pin Contact Material Phosphor Bronze Contact Plating Gold Housing Material Polybutylene Terephthalate (PBT) Housing Color Black Flammability Rating UL 94 V-0 Current Rating 4.3 A to 6.3 A (application dependent) Voltage Rating Up to 550 VAC Packaging Bulk Country of Origin Vietnam RoHS Compliance Compliant #commonpartslibrary #connector #header

Seeed Studio XIAO nRF52840 Sense Plus, powered by Nordic chipset with FPU, brings more SMD pins to this tiny Bluetooth senor dev board. While maintaining all the capabilities of the standard version including onboard IMU and PDM microphone, Bluetooth 5.0, NFC, and low power consumption, this Plus variant features redesigned castellations and pad layout on the back, offering 9 additional GPIOs specifically for advanced Bluetooth projects requiring expanded I/Os via SMD board-to-board soldering. With native TensorFlow Lite, it's your ideal development platform for advanced embedded Machine Learning and AIoT projects.

12 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold Female header connector designed for board-to-board or wire-to-board interconnection using a 2.54 mm (0.100") pitch through-hole interface. The SSW-112-01-G-S is a single-row, 12-position socket strip with gold-plated contacts, rated for 2.9 A per contact and 550 VAC RMS operating voltage, and supports an operating temperature range of -55°C to +125°C. #Connector #Header #FemaleHeader #ThroughHole #Samtec

Connector Header Through Hole 10 position 0.100" (2.54mm) The TSW-105-07-G-D is part of the Samtec TSW series, which consists of 0.100″ (2.54 mm) pitch PCB header strips. It is a dual-row, 10-position (2×5) male pin header intended for through-hole mounting on printed circuit boards. This connector provides a simple and reliable way to connect PCBs or interface with cables and other connectors (e.g., female sockets or IDC connectors). Key Features Connector Type: Rectangular header (male pin) Mounting Type: Through-hole (THT) Pitch: 2.54 mm (0.100″ standard spacing) Number of Positions: 10 pins Rows: Dual-row (2×5 configuration) Contact Style: 0.025″ (0.635 mm) square posts Orientation: Vertical (straight header) Plating: Gold (indicated by “G”) for reliable contact Electrical & Mechanical Highlights Current Rating: up to ~6.3 A per contact (series typical) Voltage Rating: up to ~400–550 VAC Operating Temperature: approx. -55 °C to +125 °C High durability: supports multiple mating cycles (extended-life design) Typical Applications Microcontroller and development boards Board-to-board connections Prototyping systems (breadboard-compatible headers) Industrial and embedded electronics Cable-to-board interfaces #CommonPartsLibrary #Connector #Header #TSW

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold It is a 100-pin surface-mount receptacle connector used to connect two PCBs in a stacked configuration. The DF40HC series is known for ultra-fine pitch and high-speed signal capability, making it suitable for modern embedded and communication systems. Connector type: Board-to-board (mezzanine), receptacle Number of contacts: 100 positions (2-row layout) Pitch: 0.4 mm (very fine pitch for high-density routing) Stacking height: 3.0 mm (fixed mated height) Mounting: Surface-mount (SMT) Orientation: Straight Contact plating: Gold (for reliable conductivity and corrosion resistance) Rated current: 0.3 A per contact Rated voltage: 50 V AC/DC Contact resistance: ≤ 90 mΩ Withstanding voltage: 150 V max High-speed capability: up to 20 Gbps, supports interfaces like: USB 3.1 / USB 3.0 PCIe SATA MIPI Connector size: Length: ~22.6 mm Width: ~3.38 mm Height: ~2.9 mm Mating durability: ~30 cycles Operating temperature: -55°C to +85°C #CommonPartsLibrary #Connector #Mezzanine-connector #DF40

Jack Modular Connector 6p6c (RJ11, RJ12, RJ14, RJ25) 90° Angle (Right) Shielded Cat5 The 615006141121 is a board-to-board or wire-to-board connector component designed for reliable electrical interconnection in electronic assemblies. It is typically used in compact PCB layouts where secure mating, consistent contact performance, and durability are required. This connector is suited for applications in consumer electronics, industrial equipment, and embedded systems, offering dependable signal and power transmission. Key Features: Compact connector design for space-constrained applications High-reliability contact interface Designed for PCB mounting ապահով secure mating and retention Suitable for signal and low-power connections Mechanical Characteristics: Mounting Type: Through-hole or surface-mount (depending on variant) Orientation: Vertical or right-angle configuration Contact Configuration: Multi-position connector Pitch: Standard fine-pitch spacing typical for board-level connectors Housing Material: High-temperature thermoplastic Contact Material: Copper alloy with plated finish Electrical Characteristics: Contact Resistance: Low contact resistance for stable signal integrity Insulation Resistance: High insulation resistance Rated Voltage: Suitable for low-voltage applications Current Rating: Designed for signal-level or moderate current carrying Environmental Characteristics: Operating Temperature Range: Suitable for standard industrial temperature ranges RoHS Compliance: Yes Durability: Designed for multiple mating cycles Applications: Embedded systems Consumer electronics Industrial control boards Communication devices PCB interconnect solutions #commonpartslibrary #connector #jackmodular

Connector Header Through Hole 22 position 0.100" (2.54mm) PinHeader_1x22_P2.54mm_Vertical General Description The TSW-122-07-G-S is a through-hole vertical pin header manufactured by Samtec. It is part of the TSW series, designed for board-to-board or wire-to-board interconnections. This component features a single-row configuration with standard 2.54 mm pitch spacing, making it widely compatible with common prototyping and production PCB designs. It is commonly used in embedded systems, development boards, and general-purpose electronic assemblies requiring reliable and cost-effective connectivity. Key Features Single-row vertical pin header Through-hole mounting style Standard 2.54 mm pitch spacing Tin-plated contacts for reliable electrical connection Black thermoplastic insulator housing Designed for board-to-board or cable interfacing Compatible with standard mating connectors and sockets Electrical Characteristics Current rating suitable for signal-level and low-power applications Contact resistance designed for stable electrical performance Insulation resistance suitable for typical PCB environments Mechanical Characteristics Number of positions: twenty-two Row configuration: single row Mounting type: through-hole Orientation: vertical Contact material: copper alloy Contact plating: tin Housing material: high-temperature thermoplastic Environmental Characteristics Operating temperature range suitable for industrial and commercial electronics RoHS compliant Designed for durability under normal handling and soldering conditions Applications Microcontroller and development boards Prototyping platforms Board-to-board interconnections Embedded systems General electronic assemblies #commonpartslibrary #connector #header

20 Position Receptacle Connector 0.100" (2.54mm) Through Hole Tin The SSQ-110-03-T-D is a through-hole dual-row socket strip receptacle connector manufactured by Samtec, designed for board-to-board and pin header mating applications using the industry-standard pitch spacing that has been dominant in through-hole PCB interconnect design for decades. It belongs to Samtec's SSQ series, a family of square-post socket strip connectors that accept standard square-pin headers and are widely used across prototyping, instrumentation, test and measurement, embedded systems, industrial control, and general-purpose PCB stacking applications. As a socket strip of the receptacle gender, the SSQ-110-03-T-D is intended to receive a mating male pin header, creating a reliable and separable board-to-board or wire-to-board connection. The dual-row configuration provides a higher contact density within a given board length than a single-row socket, which is why dual-row socket strips in this pitch class are extensively used in applications such as microcontroller and single-board computer expansion connectors, module-to-baseboard interfaces, and other designs where a significant number of signal, power, or ground connections must be made across a single separable connector interface. The connector features square solder tails for through-hole PCB mounting, with the "-T" suffix in the part number designating the square post tail style, which provides a well-defined mechanical footprint and reliable solder joint formation in wave solder and hand-solder assembly processes. The "-D" suffix indicates the dual-row configuration. Contact material is phosphor bronze, a widely used spring-contact alloy chosen for its combination of good electrical conductivity, excellent spring properties that maintain consistent contact force across many mating cycles, and resistance to stress relaxation over time. The contacts are finished with matte tin plating over nickel underplate, providing a solderable, cost-effective contact surface suitable for the majority of general-purpose signal and low-power applications for which this connector class is typically used. The insulator body is molded from black liquid crystal polymer, a high-performance engineering thermoplastic that offers the high dimensional stability, excellent electrical insulation properties, and high-temperature resistance needed to withstand wave soldering and reflow-adjacent thermal exposure during PCB assembly. The material also carries a UL94 V-0 flammability rating, reflecting its self-extinguishing behavior in the event of an ignition source, which is required or preferred in many end-product regulatory compliance frameworks. The SSQ series is widely used in conjunction with Samtec's TSW series male pin headers as a complementary mating pair, and the connector is compatible with a broad range of standard square-pin headers from other manufacturers that conform to the same pitch and pin geometry, making it a versatile choice for general-purpose through-hole header applications. Spec Sheet Identification Part Number: SSQ-110-03-T-D Series: SSQ Manufacturer: Samtec, Inc. Connector Type / Configuration Type: Socket strip receptacle Gender: Female (receptacle) Row Configuration: Dual row Orientation: Straight, vertical Mounting Method: Through-hole, solder tail Contact & Material Properties Contact Material: Phosphor bronze Contact Finish — Mating Zone: Matte tin over nickel Contact Finish — Post/Tail: Tin Contact Type: Forked socket, square post acceptance Post/Tail Style: Square solder tail Mechanical Specifications Contact Pitch: Standard pitch class, widely used through-hole spacing Profile Height: Standard SSQ series mated height class Insulator Color: Black Insulator Material: Liquid crystal polymer (LCP) Flammability Rating: UL94 V-0 Body Orientation: Straight Electrical Ratings Current Rating Per Contact: Mid-range per-pin current class Voltage Rating: High AC and DC voltage rating class for general-purpose signal use Mating Cycles: Rated for repeated mate/unmate cycles Environmental & Qualification Operating Temperature Range: Extended range, suitable for industrial environments RoHS Compliance: Yes Export Classification: EAR99 Mating Compatibility Mates With: Samtec TSW series male pin headers and compatible standard square-pin headers from other manufacturers Application Note: Suitable for board-to-board stacking, module-to-baseboard interfaces, SBC expansion connectors, and general-purpose through-hole header applications Packaging Supply Format: Bulk packaging #SSQ110 #Samtec #SocketStrip #DualRowConnector #ThroughHoleConnector #PCBReceptacle #PinHeader #BoardToBoard #FemaleSockets #PhosphorBronze #LCP #UL94V0 #EmbeddedSystems #Prototyping #InstrumentationConnector #GeneralPurposeConnector #ConnectorDatasheet #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant #PCBDesign #CommonPartsLibrary #Connector #Header #Receptacle #Female-Socket #SSQ

SMB, Fakra Connector Plug, Male Pin 50 Ohms Through Hole, Right Angle Solder The FA1-NDRP-PCB-8 is a PCB-mounted connector component typically used for reliable board-to-board or cable-to-board electrical interconnections in electronic systems. It is designed to provide stable mechanical retention and dependable signal or power transfer in compact PCB assemblies. Components in this series are commonly used in industrial equipment, consumer electronics, embedded systems, and communication devices. Key Features PCB-mount connector design for easy integration into electronic assemblies Supports secure electrical and mechanical connection Compact form factor suitable for space-constrained designs Durable housing and contact structure for repeated mating cycles Designed for stable signal and/or power transmission Typically used in control boards, interface modules, and embedded electronics Compatible with automated PCB assembly processes depending on package style Typical Applications Industrial control equipment Consumer electronics Embedded and IoT devices Communication hardware Interface and expansion boards #Connector #RF-connector #Coaxial

30 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold #Commonpartslibrary #Connector #Array #Edgetype #Boardtoboard #Interconnects

22 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold The SSW-122-02-G-S is a surface-mount, single-row socket strip designed for reliable board-to-board or component interconnection in electronic assemblies. It is part of a standardized connector series intended for applications requiring compact form factor, consistent electrical performance, and ease of automated placement. The component features a low-profile design suitable for dense PCB layouts and is commonly used in prototyping, embedded systems, and production-level electronics. Design and Construction The connector is manufactured with precision-aligned contacts housed in a high-temperature thermoplastic body, enabling compatibility with standard reflow soldering processes. The contact system is engineered to ensure stable mechanical retention and consistent electrical conductivity, supporting repeated mating cycles without significant degradation. The materials used provide durability, resistance to thermal stress, and compliance with common industry standards for electronic components. Electrical Characteristics The device is intended to provide reliable signal transmission with minimal contact resistance. It supports low to moderate current applications typical of signal-level interconnections. The contact plating is designed to reduce oxidation and maintain stable electrical performance over time. Mechanical Features The connector is configured as a single-row socket with a defined pitch spacing suitable for standard header interfaces. Its surface-mount termination allows for secure attachment to printed circuit boards while minimizing required board space. The structure supports proper alignment during assembly and ensures consistent engagement with corresponding mating connectors. Applications This component is widely used in applications such as microcontroller boards, communication modules, sensor interfaces, and general-purpose electronic systems. It is suitable for both development environments and final product integration where dependable and space-efficient connectivity is required. Compliance and Reliability The SSW-122-02-G-S is designed to meet common industry requirements for environmental and mechanical reliability. It is typically compliant with RoHS standards and suitable for use in a variety of operating conditions encountered in commercial and industrial electronics. #commonpartslibrary #connector #header

BergStak 0.40mm, 100 position, Receptacle, 4mm stack height 100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold 10164227-1004A1RLF is a high-density board-to-board mezzanine connector from Amphenol ICC (FCI), part of the BergStak® 0.40 mm series. It is designed for compact electronic systems that require reliable high-speed signal interconnection between stacked PCBs. This component is a 100-position, surface-mount receptacle connector with center strip contacts. It uses a 0.40 mm pitch to support very high pin density in a small footprint. It is commonly used in applications like smartphones, industrial modules, embedded computing, and other space-constrained electronic assemblies. Key Features 100 positions for high-density signal routing 0.40 mm fine pitch for compact PCB designs Board-to-board mezzanine (receptacle type) Surface-mount (SMT) mounting for automated assembly Center strip contact design for stable mating Gold-plated contacts for improved conductivity and corrosion resistance Mated stacking height around 4 mm Low-profile design suitable for thin electronic devices Typical Applications Smartphones and mobile devices Wearable electronics Industrial control modules Embedded computing boards Communication and networking equipment #AmphenolICC #FCI #BergStak #BoardToBoardConnector #MezzanineConnector #0_40mmPitch #SurfaceMount #HighDensityConnector #100PositionConnector #ElectronicsComponents

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40C-100DS-0.4V(51) is a board-to-board and board-to-FPC receptacle connector manufactured by Hirose Electric. It belongs to the DF40 series, a family of fine-pitch stacking connectors intended for compact, high-density interconnect applications such as mobile devices, cameras, wearables, and other space-constrained electronics. The connector functions as the receptacle (socket) half of a mating pair, designed to stack with a corresponding DF40 plug header to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile vertical arrangement. This particular part number represents the full-position, low-profile variant within the series, configured without a reinforcing metal fitting and without a locating boss or mechanical holddown feature, meaning it relies on the contact array itself rather than additional structural hardware for mechanical retention during reflow and handling. The connector is supplied in straight, surface-mount form and is non-polarized, so it can be inserted in either orientation relative to its mating counterpart. Contacts are arranged in parallel rows along the connector body, with gold plating in the contact mating area to ensure reliable signal continuity and resistance to oxidation over repeated use. The series is positioned by Hirose as a general-purpose, high-speed-capable interconnect, suitable for a range of differential and single-ended signaling standards used in consumer and industrial electronics, with the broader DF40 family supporting interfaces such as USB, MIPI, SATA, and PCIe. Its low stacking height and fine contact pitch make it well suited to applications where board-to-board spacing must be minimized, such as camera modules, display modules, or stacked daughterboard architectures in handheld and wearable products. The connector is packaged on embossed carrier tape for automated pick-and-place assembly, and its construction is compliant with RoHS material restrictions. Mechanically, the connector body is built to support repeated mating cycles typical of consumer electronics assembly and rework, while maintaining stable electrical contact under vibration and thermal cycling across its rated environmental range. As a stacking-style connector rather than a card-edge or cable-mount type, it is intended to be soldered directly to a host PCB pad pattern, with the mating plug soldered to the corresponding board or FPC, allowing the two assemblies to be joined and separated as needed during manufacturing, test, or service operations. Spec Sheet Identification Part Number: DF40C-100DS-0.4V(51) Series: DF40 Variant: "C" type — without reinforcing metal fitting Connector Type / Configuration Type: Receptacle (socket), board-to-board / board-to-FPC Gender: Female Orientation: Straight Row Arrangement: Dual row Polarization: Non-polarized Locking/Retention Feature: None (no metal holddown or locating boss) Electrical Ratings Current Rating: Low-current signal class Voltage Rating: Standard signal-level rating typical of fine-pitch board-to-board connectors Applicable High-Speed Protocols: USB, MIPI, SATA, PCIe (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Stacking/Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics rework Contact & Material Properties Contact Material: Phosphor bronze Contact Plating (Mating Area): Gold Insulator Color: Black Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings Operating Temperature Range: Extended consumer/industrial range RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding DF40 series plug/header connector Application Note: Intended for mezzanine-style stacking between two PCBs or between a PCB and FPC #DF40 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #StackingConnector #CommonPartsLibrary #Connector #SMTConnector #FinePitchConnector #MezzanineConnector #ElectronicComponents #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #ConsumerElectronics #HighSpeedConnector #RoHSCompliant #ComponentLibrary

Archer: 2 Pos Plug SIL Straight SMT Connector 3mm pin (T+R) Connector Header Surface Mount 2 position 0.050" (1.27mm) The M50-3630242R is a compact 2-position surface-mount male header connector from the Archer M50 series by Harwin. It is designed for high-reliability board-to-board interconnection applications where space saving, durability, and reliable signal transmission are important. The connector features a 1.27 mm pitch, gold-plated contacts, and SMT mounting, making it suitable for compact embedded, industrial, communication, medical, and automotive electronics. Key Features 2-position male header connector 1.27 mm (0.05") pitch compact design Surface-mount (SMT) mounting style Board-to-board connection configuration Gold-plated mating contacts for improved conductivity and corrosion resistance Tin-plated SMT terminations 1 A current rating per contact Operating temperature: -40°C to +105°C Unshrouded single-row vertical header Pick-and-place compatible for automated assembly Polyamide (Nylon 9T) UL94 V-0 housing Brass contact material Compatible with multiple mating stack heights in the Archer M50 series #CommonPartsLibrary #Connector