The power of Raspberry Pi 4 in a compact form factor for deeply embedded applications. Raspberry Pi Compute Module 4 incorporates a quad-core ARM Cortex-A72 processor, dual video output, and a wide selection of other interfaces. Available in 32 variants, with a range of RAM and eMMC Flash options, and with or without wireless connectivity. raspberry pi4 #rpi #pi

Compute Module 5 is a powerful and scalable system on module with a 64-bit Arm processor @ 2.4GHz, an I/O controller, video and PCIe interfaces, and a range of wireless, SDRAM and eMMC options. raspberry pi5 #rpi #pi

eMMC FEMDNN008G-08A39 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C601079 JLCPCB Part Class: undefined Manufactured by FORESEE(江波龙)

Zynq® UltraScale+™ Kria™ Embedded Module ARM® Cortex®-A53 Arm® Cortex®-R5F 533MHz, 1.333GHz 4GB 16GB eMMC, 64MB QSPI #CommonPartsLibrary #IntegratedCircuit #Embedded #Microcontroller #Microprocessor #FPGA-Module

BGA-565(15.5x14.4) Microcontrollers, Quad-core ARM Cortex-A55 processor The RK3566 is a high-performance, low-power 64-bit application processor developed by Rockchip for AIoT, industrial control, smart displays, tablets, embedded systems, and single-board computers. It integrates a quad-core ARM Cortex-A55 CPU, Mali-G52 GPU, AI acceleration engine (NPU), advanced multimedia processing, and a rich set of connectivity interfaces, making it suitable for Linux- and Android-based applications requiring efficient performance and multimedia capabilities. Key Features Quad-core 64-bit ARM Cortex-A55 processor operating up to 2.0 GHz. ARM Mali-G52 2EE GPU with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1. Integrated NPU delivering up to 1 TOPS AI computing performance. Supports DDR3, DDR3L, DDR4, LPDDR3, LPDDR4, and LPDDR4X memory. Hardware video decoding up to 4K@60fps for H.264, H.265, and VP9 formats. Hardware video encoding up to 1080p@60fps for H.264 and H.265. Built-in 8MP ISP with HDR image processing support. Multiple display interfaces including HDMI 2.0, eDP, MIPI-DSI, LVDS, RGB, and E-Ink. High-speed connectivity with USB 3.0, USB 2.0, PCIe, SATA, Gigabit Ethernet, SDIO, and eMMC 5.1. Rich peripheral support including UART, SPI, I²C, PWM, ADC, I²S, PDM, and GPIO. Optimized for Android, Linux, industrial HMI, smart home, edge computing, and AIoT applications. Manufactured using a 22 nm process for improved power efficiency. #RK3566 #Rockchip #ARMCortexA55 #MaliG52 #AIoT #EmbeddedSystems #SingleBoardComputer #Linux #Android #IndustrialControl #SmartDisplay #EdgeComputing #SoC #Processor #NPU #4KVideo #IoT #Electronics #HardwareDesign #PCBDesign

FLASH - NAND (TLC) Memory IC 256Gbit eMMC 153-FBGA (11.5x13) #CommonPartsLibrary #IntegratedCircuit #memory #EMMC32G

The NanoPi NEO Core is a small, bare-bones single-board computer (SBC) designed to be a core component in larger systems. It's based on the Allwinner H3 system-on-chip (SoC) and features 256MB or 512MB of DDR3 RAM. It's characterized by its small size, GPIO-accessible interfaces, and optional eMMC storage. #Module #part

eMMC FEMDNN064G-58K72 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C719492 JLCPCB Part Class: undefined Manufactured by FORESEE(江波龙)

eMMC MKEMF032GZ1E-C VFBGA-153_L13.0-W11.5-P0.50-BL_ISSI_IS2XES0XG-XXXX LCSC Part Number: C2895093 JLCPCB Part Class: undefined Manufactured by MK(米客方德)

16 GB eMMC Flash Memory IC – Embedded non-volatile NAND flash storage with an eMMC 5.1 interface, designed for embedded computing and digital systems requiring integrated mass storage. The Kingston EMMC16G-MW28-01E10 provides 16 GB NAND capacity, 200 MHz clock operation, 2.7–3.6 V supply, and an 8-bit memory interface. It uses TLC NAND flash technology in a 153-FBGA package (11.5 × 13 mm) and operates from −25°C to +85°C. #Kingston #EMMC16GMW2801E10 #eMMC #FlashMemory #NANDFlash #EmbeddedStorage #eMMC51 #MemoryIC #EmbeddedSystems #PCBComponents

eMMC FEMDRW032G-88A19 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C719926 JLCPCB Part Class: Extended Part Manufactured by FORESEE(江波龙)

eMMC SDINBDG4-64G-XI1 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C3446132 JLCPCB Part Class: Extended Part Manufactured by SANDISK(闪迪)

8GB 330/50 MB/s eMMC 5.1 FBGA-153(11.5x13) eMMC ROHS KLM8G1GETF-B041 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C499918 JLCPCB Part Class: Extended Part Manufactured by SAMSUNG(三星半导体)

32GB eMMC 5.1 FBGA-153 eMMC ROHS KLMBG2JETD-B041 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C2803245 JLCPCB Part Class: Extended Part Manufactured by SAMSUNG(三星半导体) embedded MultiMediaCard Ver. 5.1 compatible.  SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, HS200, HS400, Field Firmware Update. - Non-supported Features : Large Sector Size (4KB)  Full backward compatibility with previous Multi