QFN Footprint Paste Fix

Fix this issue: Footprint QFN50P600X600X100-41N-D for SOT618-1 uses a single full-area 4.25 x 4.25 mm F.Paste opening on exposed pad 41. NXP SOT618-1 recommended reflow footprint specifies a segmented 3x3 array of 0.60 x 0.60 mm paste apertures (2.40 x 2.40 mm overall) and a…

Thought for 19 sec

flux

This requires Agent mode to edit the footprint. I’ll replace pad 41’s full-area paste opening with the specified 3×3 array of 0.60 × 0.60 mm apertures, verify the geometry, and file a library-part quality report so the source footprint can be corrected.

Continue in Agent Mode

Thought for 17 sec

flux

I’ll inspect pad 41’s current footprint geometry, replace the single paste opening with the specified 3×3 aperture pattern, verify the result, and report the source-part defect.

Worked for 1 min 28 sec

flux

The full-area paste opening is suppressed and the 3×3 aperture array is in place. I’m checking the final geometry and pad validity now.

Thought for 19 sec

flux

The source-part defect report is filed. Final validation is checking that the nine apertures are correctly placed and do not create invalid-pad errors.

Worked for 44 sec

flux

Fixed the exposed-pad stencil pattern:

Suppressed pad 41’s original 4.25 × 4.25 mm paste opening.
Added a centered 3×3 array of 0.60 × 0.60 mm apertures at 0.90 mm pitch, spanning 2.40 × 2.40 mm.
Preserved the full exposed-pad copper and solder-mask geometry.
Filed an internal quality report for correction of the source library footprint.

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PN5321A3HN/C106,51