QFN Footprint Paste Fix


Fix this issue: Footprint QFN50P600X600X100-41N-D for SOT618-1 uses a single full-area 4.25 x 4.25 mm F.Paste opening on exposed pad 41. NXP SOT618-1 recommended reflow footprint specifies a segmented 3x3 array of 0.60 x 0.60 mm paste apertures (2.40 x 2.40 mm overall) and a…
This requires Agent mode to edit the footprint. I’ll replace pad 41’s full-area paste opening with the specified 3×3 array of 0.60 × 0.60 mm apertures, verify the geometry, and file a library-part quality report so the source footprint can be corrected.
Continue in Agent Mode
I’ll inspect pad 41’s current footprint geometry, replace the single paste opening with the specified 3×3 aperture pattern, verify the result, and report the source-part defect.
The full-area paste opening is suppressed and the 3×3 aperture array is in place. I’m checking the final geometry and pad validity now.
The source-part defect report is filed. Final validation is checking that the nine apertures are correctly placed and do not create invalid-pad errors.
Fixed the exposed-pad stencil pattern:
  • Suppressed pad 41’s original 4.25 × 4.25 mm paste opening.
  • Added a centered 3×3 array of 0.60 × 0.60 mm apertures at 0.90 mm pitch, spanning 2.40 × 2.40 mm.
  • Preserved the full exposed-pad copper and solder-mask geometry.
  • Filed an internal quality report for correction of the source library footprint.

PN5321A3HN/C106,51