Pin groups, sections, and terminal ordering are absent
Thus the symbol does not identify Gate, Source, or Drain despite having the correct numeric pins. The rendered custom symbol is also a plain rectangular body rather than a recognizable N-MOSF symbol.
Footprint findings
Three rectangular SMD pads, logically associated with pins 1–3
Pad centers from footprint source:
1: (−1.062, −0.65) mm
2: (−1.062, +0.65) mm
3: (+1.062, 0) mm
Each pad: 0.500 × 0.525 mm, rotated 90°
Fabrication body outline: 1.6 × 2.0 mm
Courtyard: 2.95 × 2.30 mm
3D STEP model is present.
Datasheet package is approximately 2.1 × 2.0 × 0.85 mm, 0.65 mm pitch.
Datasheet land-pattern example specifies 0.4 × 0.6 mm lands. The stored 0.500 × 0.525 mm pads therefore do not match the recommended land geometry.
Flux pad labels display as ~; numbering is only recoverable through terminal UID association.
Mutation
Unattempted/not applicable: Datasheet update, because the property was already non-empty.
No symbol, footprint, or other properties were altered.
Safe to use as-is?
No. The numeric pin mapping appears recoverable and correct, but the unnamed/untyped symbol terminals create a substantial connection-error risk, and the footprint pad geometry differs from the official recommended land pattern. The part should be corrected and footprint-validated before production use.
The audit is complete: the datasheet was already present, and the main issues are unnamed/untyped symbol pins plus footprint lands that differ from onsemi’s recommendation. I’m recording the detailed findings now.
Audit complete. The datasheet was already populated, so it was not changed; metadata is broadly correct, but the symbol lacks Gate/Source/Drain names and types, and the footprint lands differ from onsemi’s recommendation. The part is not production-ready as-is, and I filed an internal quality report.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
N-Channel Power MOSFET – 30 V N-channel enhancement-mode MOSFET optimized for load switching, DC-DC converters, battery-powered devices, power management, motor control, and embedded switching applications. Features a 30 V drain-to-source voltage (VDS), 2 A continuous drain current, and 165 mΩ maximum RDS(on) at VGS = 4.5 V, with 1.8 V logic-level gate drive compatibility for low-voltage microcontroller interfaces. Offers 1.7 nC typical gate charge, 130 pF typical input capacitance, ultra-fast switching performance, and an integrated body diode for efficient power conversion. Rated for ±12 V gate-to-source voltage, 800 mW power dissipation, 150°C maximum junction temperature, and housed in a 3-pin MCPH3 (SC-70 / SOT-323) surface-mount package. This device is obsolete / not recommended for new designs.