Part Audit Review
Check this schematic component against the datasheet for [MPN] and assign the correct pin orientation, section, and terminal order without changing, replacing, renumbering, or remapping any pins. Remove the Pin Group property from all pins if it exists. Place Power pins first and Ground pins last. Within each section, distribute the pins as evenly as possible between the left and right sides; for example, split 10 pins as 5/5 and 11 pins as 5/6 or 6/5. If a section contains only one pin, leave it on the most appropriate side. Keep the symbol compact, balanced, and visually symmetrical. If a pin function is unclear, assign Unclear / Check datasheet, then apply all changes directly to the schematic component.
Thought for 9 sec
I’ll classify all 95 CMV2000-2E5M1LP pins from the official datasheet, then reorganize the symbol by section with power first, ground last, balanced left/right placement, and no pin renumbering or remapping.
Worked for 3 mins 52 sec
All 95 pins are reorganized and balanced by function. I’m doing a final read-back now to confirm pin numbers/mappings are untouched and Pin Group is absent everywhere.
Thought for 33 sec
Reorganized all 95 CMV2000-2E5M1LP terminals into seven datasheet-backed sections. Power is first, Ground last, and each section is evenly balanced left/right with unique terminal ordering.
- Pin Group removed from every terminal.
- No pins were renamed, replaced, renumbered, deleted, or remapped.
- All 95 package coordinates remain unchanged and unique.
- No unclear pin functions were found.
Fix symbol issues
Set terminal types
Add pin descriptions
Correct footprint outline
Run part review
Refine this doc
Ask about this doc
CMV2000-2E5M1LP Part Audit
Audit scope and source
Reviewed project metadata, all 95 schematic terminals, footprint pads and outlines, and attached assets. Cross-checked against the official ams OSRAM CMV2000 datasheet, DS000734 v8-00, 2025-07-07.
Datasheet property update
The Datasheet property now points to the current official ams OSRAM PDF:
https://look.ams-osram.com/m/3cb99f54c7bbd621/original/CMV2000-Global-shutter-CMOS-image-sensor-for-machine-vision.pdfUpdate commit:
#f9678e97.Metadata review
Table
| Field | Project value | Datasheet / assessment |
|---|---|---|
| MPN | CMV2000-2E5M1LP | Exact match |
| Ordering code | Not exposed as a standard property | Q65114A0009 |
| Manufacturer | OSRAM | Substantively correct; current publisher branding is ams OSRAM AG |
| Description | 2.2 MP, 2048 × 1088, 5.5 µm, global shutter, 95-pin LGA | Accurate |
| Part Type | Sensors | Broad but valid |
| Package property | Absent | Should identify ceramic 95-pad LGA |
| Pin/pad count | 95 | Correct |
| Designator prefix | IC | Acceptable |
Ordering suffix interpretation: version-2 sensor, 5 µm epi, monochrome, microlenses, plain glass, ceramic 95-pad LGA.
Key specifications
- 2048 × 1088 effective pixels; 5.5 µm square pixels; 2/3-inch optical format.
- Pipelined global shutter with correlated double sampling.
- 10-bit or 12-bit column ADC.
- 16 serial LVDS data outputs, up to 480 Mbit/s per channel.
- Up to approximately 340 fps full-resolution in 10-bit mode; approximately 70 fps in the cited full-resolution 12-bit/four-output mode.
- Master clock: 5–48 MHz; LVDS input clock: 50–480 MHz.
- Full well: 13.5 ke⁻; read noise: 13 e⁻ RMS; dynamic range: 60 dB.
- Sensitivity: 5.56 V/lux·s; responsivity 0.27 A/W at 550 nm; QE × fill factor 60% at 550 nm with microlenses.
- Dark current: 125 e⁻/s at 25 °C.
- Typical configuration-dependent power: approximately 550–1200 mW.
- Supply domains include VDD20 2.1 V, VDDPIX 3.0 V, and VDD33/Vres_H 3.3 V.
Schematic symbol and pin audit
- All 95 populated package coordinates are present and unique; A1 is correctly omitted from the 8 × 12 grid.
- Symbol-to-footprint mapping is complete: 95/95 terminals correspond to the correct footprint pad coordinates.
- Functional pin coverage includes LVDS data pairs, clock/control pairs, SPI/control, exposure signals, bias/reference nodes, supply rails, grounds, analog/test outputs, and test pins.
Symbol mismatches and quality issues
- All 95 terminals lack pin descriptions.
- All 95 terminals use
Pin Type = Unspecified; the datasheet classifies pins as bias, digital input, digital output, ground, LVDS input, LVDS output, supply, analog output, or test. - Several terminal names are nonliteral relative to the datasheet, including:
CMD_P__INVvsCMD_P_INVFRAME__REQvsFRAME_REQSYS__RES_NvsSYS_RES_NLVDS__CLK_P/NvsLVDS_CLK_P/NOUT_CLK_P/NvsOUTCLK_P/NOUT_CTR_P/NvsOUTCTR_P/NVTF_L1_vsVtf_l1- Repeated rails are uniquely suffixed (
GND_1…11,VDD20_1…5,VDD33_1…3,VDDPIX_1…3) rather than using the literal repeated datasheet names.
- The rendered custom symbol has poor/garbled text in places, reducing readability.
The double underscores may be an internal convention for active-low notation, and repeated-rail suffixes ensure unique terminal designators, but neither is a literal datasheet transcription.
Footprint audit
- 95 circular SMD pads, with A1 omitted.
- Pad diameter: 0.300 mm, matching the package land specification of Ø0.30 ±0.05 mm.
- Pitch: 1.270 mm in X and Y, matching the datasheet.
- Pad numbering, grid orientation, and symbol mapping are correct.
- The pin-orientation marker is adjacent to the missing-A1 / A2 corner and is consistent with the package grid orientation.
Footprint mismatch
The project fabrication/silkscreen rectangle is 13.50 × 18.65 mm, while the current official package drawing gives the principal body outline as 13.50 ±0.15 × 16.50 ±0.15 mm. The outline is therefore 2.15 mm too long on one axis, and the 15.50 × 20.65 mm courtyard inherits the excess length. Pad geometry itself remains correct.
The datasheet specifies package lands but does not provide a separate recommended PCB solder-land pattern; the footprint uses the nominal 0.30 mm package-land diameter directly as copper pad diameter, so assembly margin should be confirmed with the intended PCB assembler.
3D model
A STEP model (
CMV2000-2E5M1LP.stp) is attached to the footprint at origin, unit scale, and zero rotation. Attachment and transform are valid, but mesh dimensions, seating plane, and pin-one details could not be independently measured through structured inspection.Overall verdict
The part has the correct MPN, core description, 95-pad count, pad grid, pitch, pad size, orientation, and complete terminal-to-pad mapping. The main issues are missing package metadata, absent pin descriptions and electrical types on all terminals, noncanonical signal naming, symbol rendering quality, and a 2.15 mm footprint body-outline/courtyard length mismatch. Only the Datasheet property was changed during this audit.
Audit scope and source
Datasheet property update
Metadata review
Key specifications
Schematic symbol and pin audit
Symbol mismatches and quality issues
Footprint audit
Footprint mismatch
3D model
Overall verdict
