IXYS Integrated Circuits brings OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays. As part of this family, the CPC1709J single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The output, constructed with an efficient MOSFET switch and photovoltaic die, uses IXYS Integrated Circuits’ patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.3 °C/W). Features • 22.8ADC Load Current with 5°C/W Heat Sink • Low 0.05 On-Resistance • 60VP Blocking Voltage • 2500Vrms Input/Output Isolation • Low Thermal Impedance: JC = 0.3 °C/W • Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications • Low Drive Power Requirements • No EMI/RFI Generation Applications • Industrial Controls / Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment #CPC1709J #IXYS #Littelfuse #SolidStateRelay #SSR #OptoMOS #PowerRelay #DCRelay #MOSFETRelay #HighCurrentSwitching #ElectricalIsolation #IndustrialElectronics #PowerManagement #BatterySystems #AutomationControl

High and Low Side Driver, 600V, 4.5/4.5A, SO-8 ixys littelfuse boosted bootstrapped dual SOIC*3.9x4.9mm*P1.27mm*

ESD Suppressors / TVS Diodes 45Vr 400W 5.5A 5% UniDirectional 2.29 LITTELFUSE SMAJ45A 576-SMAJ45A https://www.mouser.co.uk/ProductDetail/Littelfuse/SMAJ45A?qs=JJML70Qc14vlNcCxKC4AIQ%3D%3D SMAJ45A https://www.arrow.com/en/products/smaj45a/littelfuse?utm_currency=USD&region=nac

DIOM7959X262N https://www.littelfuse.com/~/media/electronics/datasheets/tvs_diodes/littelfuse_tvs_diode_5_0smdj_datasheet.pdf.pdf ESD Suppressors / TVS Diodes 5kW 51V 5% Uni-Directional 2.62 LITTELFUSE 5.0SMDJ51A 576-5.0SMDJ51A https://www.mouser.com/Search/Refine.aspx?Keyword=576-5.0SMDJ51A 5.0SMDJ51A https://www.arrow.com/en/products/5.0smdj51a/littelfuse

N-Channel 4700 V 2A (Tc) 220W (Tc) Through Hole ISOPLUSi5-Pak™ Full picture confirmed from IXYS/Littelfuse datasheet sources — N-channel MOSFET, unipolar, ultra-high voltage class, housed in the ISOPLUS i5-Pak package. Here's the complete spec. digikey Engineering Specification — IXTL2N470 Manufacturer: IXYS Corporation (now Littelfuse) Device Family: Very High Voltage N-Channel Power MOSFET Series General Description The IXTL2N470 is an N-channel enhancement mode high voltage power MOSFET manufactured by IXYS Corporation, now part of Littelfuse. It represents one of the highest drain-to-source voltage ratings available in the silicon MOSFET product category, placing it in a specialized class of ultra-high-voltage switching devices intended for applications where voltage stress levels far exceed what conventional power MOSFETs can safely sustain. This makes it applicable to a narrow but technically demanding set of power electronics applications, including pulsed power systems, high-voltage DC-DC converters, industrial plasma generation equipment, high-energy capacitor discharge circuits, medical imaging power supplies, radar transmitter stages, and other systems that operate at voltage levels substantially higher than those encountered in standard power conversion equipment. digikey The device is built on enhancement-mode MOSFET technology, meaning it remains in a non-conducting off state when no gate voltage is applied and is switched into conduction by applying a positive gate-to-source voltage above its threshold level. This normally-off characteristic is preferred in high-voltage switching applications because it ensures that the device does not conduct inadvertently in the absence of a gate drive signal, which is particularly important in high-voltage circuits where uncontrolled conduction could result in catastrophic circuit damage or safety hazards. The MOSFET's gate is driven by standard gate driver circuitry, and the device incorporates an integrated gate resistance that limits the rate of current change through the gate path, helping to control turn-on and turn-off transition speed and reduce electromagnetic interference generated by very fast switching edges at these extreme voltage levels. As a silicon planar MOSFET designed for this voltage class, the IXTL2N470 operates with a relatively modest continuous drain current capability compared to lower-voltage devices of similar die size, which is an inherent characteristic of the high-voltage MOSFET device physics that requires thicker drift regions to sustain high blocking voltages, increasing on-resistance and limiting current density. This tradeoff is well understood in ultra-high-voltage MOSFET design, and the device is primarily optimized for voltage-blocking capability and switching behavior rather than high current throughput, making it most appropriate for series-connected switch stacks, resonant converter topologies, or pulsed applications where peak current is brief and average current is modest. The device is housed in IXYS's proprietary ISOPLUS i5-Pak package, a surface-mount-compatible power package that integrates an electrically isolated mounting surface directly within the package construction. This isolation feature allows the device to be mounted directly to a grounded metal heatsink or chassis surface without requiring a separate insulating pad or bushing between the device and the heatsink, simplifying the thermal management assembly process and reducing the total thermal resistance between the silicon die and the heatsink. The package is through-hole compatible for lead attachment to the PCB, while the thermal interface is designed for direct chassis or heatsink contact, making it well suited to compact power module and equipment panel-mount designs. Spec Sheet Identification Part Number: IXTL2N470 Device Family: Very High Voltage N-Channel Standard Power MOSFET Manufacturer: IXYS Corporation (now Littelfuse) Functional Classification Device Type: Power MOSFET Channel Type: N-channel Operating Mode: Enhancement mode (normally off) Technology: Silicon planar high-voltage MOSFET Electrical Characteristics Drain-to-Source Voltage Rating: Ultra-high voltage class, among the highest available in silicon MOSFET technology Drain Current Rating: Low continuous current class, consistent with ultra-high-voltage MOSFET physics Power Dissipation: High power dissipation class for its current rating, reflecting package thermal capability On-Resistance: Relatively high on-resistance, inherent to ultra-high-voltage MOSFET drift region design Gate Threshold: Standard enhancement-mode positive gate threshold voltage Integrated Gate Resistance: Built-in gate resistance for switching transition control and EMI reduction Input Capacitance: Moderate-to-high input capacitance class Reverse Transfer Capacitance: Low reverse transfer capacitance class Switching Characteristics Turn-On Delay: Defined turn-on delay time Rise Time: Defined output voltage rise time Turn-Off Delay: Defined turn-off delay time Fall Time: Defined output voltage fall time Thermal Characteristics Junction-to-Case Thermal Resistance: Defined by package construction and isolated mounting interface Operating Junction Temperature: Standard high-temperature silicon MOSFET class Mechanical & Package Package Type: ISOPLUS i5-Pak (proprietary IXYS isolated surface-mount power package) Isolation Feature: Electrically isolated mounting base integrated within package — no external insulator required for heatsink mounting Mounting Method: Through-hole PCB pin termination with isolated bottom thermal contact Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active, available through Littelfuse and authorized distributors Target Applications Application Domains: Pulsed power systems, high-voltage DC-DC converters, plasma generation equipment, medical imaging power supplies, radar transmitter stages, capacitor discharge circuits, high-voltage series switch stacks #IXTL2N470 #IXYS #Littelfuse #HighVoltageMOSFET #UltraHighVoltageMOSFET #NChannelMOSFET #PowerMOSFET #EnhancementMode #ISOPLUSi5Pak #PulsedPower #HighVoltagePower #PowerElectronics #SwitchingDevice #PlasmaEquipment #MedicalPowerSupply #IndustrialPower #SemiconductorIC #DiscreteSemiconductor #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

11.2V Clamp 17.9A Ipp Tvs Diode Surface Mount SOD-123F ASHISH SMF100A-,-SMF10A-,-SMF11A-,-SMF120A-,-SMF12A-,-SMF130A-,-SMF13A-,-SMF14A-,-SMF150A-,-SMF15A-,-SMF16A-,-SMF170A-,-SMF17A-,-SMF180A-,-SMF18A-,-SMF200A-,-SMF20A-,-SMF220A-,-SMF22A-,-SMF24A-,-SMF250A-,-SMF26A-,-SMF28A-,-SMF30A-,-SMF33A-,-SMF40A-,-SMF43A-,-SMF45A-,-SMF48A-,-SMF5.0A-,-SMF51A-,-SMF54A-,-SMF58A-,-SMF6.0A-,-SMF6.5A-,-SMF60A-,-SMF64A-,-SMF7.0A-,-SMF7.5A-,-SMF70A-,-SMF75A-,-SMF78A-,-SMF8.0A-,-SMF8.5A-,-SMF85A-,-SMF9.0A-,-SMF90A Manufacturer Recommendations JC Littelfuse

SOP254P610X218-4N Solid State Relay 50mA 1.5V DC-IN 0.3A 100V DC-OUT 4-Pin SOP Tube 2.184 849-CPC1004N https://www.mouser.co.uk/ProductDetail/IXYS-Integrated-Circuits/CPC1004N?qs=h2iAtNzNjMR%252BpJ%2FVbcBOtw%3D%3D LITTELFUSE CPC1004N

Fuse Holder 32V 1 Circuit Blade Through Hole The 178.6764.0001 is an automotive blade fuse holder from Littelfuse, part of the MINI® FL1 series, designed for direct PCB mounting (through-hole). It allows easy integration of a single MINI blade fuse into a printed circuit board for overcurrent protection. This component is commonly used in automotive electronics, industrial control systems, and embedded power circuits, where compact and reliable fuse protection is required. Key Features Fuse Type Compatibility Supports MINI® automotive blade fuses (ATM/APM type) PCB Mount (Through-Hole) Designed for direct soldering to PCB for strong mechanical support Current Capability Up to 30 A maximum ~22 A continuous rating Voltage Rating Up to 58 VDC (automotive systems) Single Fuse Position Holds 1 fuse per holder Thermoplastic Housing Heat-resistant black body UL94 V-0 flammability rating for safety Contact Material Tin-plated copper alloy terminals for reliable conductivity Standard PCB Pitch Approx. 7.62 mm pin spacing Modular Design Multiple holders can be mounted side-by-side for multi-channel protection blade fuse holder automotive PCB #Circuit-Protection #Fuseholders #FL1

SOP254P610X216-4N http://www.ixysic.com/home/pdfs.nsf/www/CPC1008N.pdf/$file/CPC1008N.pdf SPST-NO Solid State Relay Solder 150 mA rms/mA dc Surface Mount, DC Relay 2.161 849-CPC1008N https://www.mouser.co.uk/ProductDetail/IXYS-Integrated-Circuits/CPC1008N?qs=55vmWkf3TKnvx1qd0mTFOg%3D%3D LITTELFUSE CPC1008N

5A 125V 125V Fuse Board Mount (Cartridge Style Excluded) Surface Mount 2-SMD, Square End Block The 0451005.MR is a surface-mount (SMD) board-level fuse from Littelfuse, part of the NANO²® 451 series, designed to provide overcurrent protection in compact electronic circuits. It is a fast-acting fuse used to protect sensitive components from damage caused by short circuits or overload conditions, especially in high-density PCB designs. Key Features Type: Surface-mount chip fuse Designed for PCB mounting (2-SMD package) Current Rating 5 A nominal current Voltage Rating 125 V AC / 125 V DC Fast-Acting Response Quickly interrupts fault currents to protect circuitry Compact Size Approx. 6.10 mm × 2.69 mm × 2.69 mm Ideal for space-constrained PCB designs High Breaking Capacity Around 50 A interrupt rating Wide Operating Temperature -55°C to +125°C Construction Ceramic body for high thermal and mechanical stability Mounting Type Surface mount (SMD), suitable for automated PCB assembly Agency Approvals UL, CSA, PSE certified (varies by variant)