Cellular EDGE, GPRS, GSM, HSPA+, LTE, UMTS Transceiver Module 900MHz, 1.8GHz Antenna Not Included Surface Mount The SIM7600E-H is a multi-mode LTE module that supports: LTE (4G) Cat-4 with up to 150 Mbps download / 50 Mbps upload 3G (UMTS/HSPA+) 2G (GSM/GPRS/EDGE) fallback for global network compatibility It is built in a compact SMT/LCC package (about 30 × 30 mm) and is widely used for embedded devices that need mobile internet and GNSS positioning Key Features Network support LTE-FDD / LTE-TDD (global bands depending on variant) UMTS/HSPA+ GSM/GPRS/EDGE fallback Data speed LTE Cat-4: up to 150 Mbps downlink 3G/2G fallback for lower-speed connectivity GNSS built-in GPS / GLONASS / other satellite positioning support Interfaces USB 2.0 UART GPIO I2C ADC PCM (audio support) SIM card interface Software / protocols AT command control TCP/IP, UDP, HTTP, HTTPS, FTP, DNS Driver support for Windows, Linux, Android Power supply ~3.4V to 4.2V typical operating range Operating temperature -40°C to +85°C (industrial grade) Typical Applications IoT devices GPS trackers Smart metering Industrial routers / gateways Remote monitoring systems Vehicle telematics Point-of-sale terminals #commonpartslibrary #rf #wireless #transceiver #module

BGA-565(15.5x14.4) Microcontrollers, Quad-core ARM Cortex-A55 processor The RK3566 is a high-performance, low-power 64-bit application processor developed by Rockchip for AIoT, industrial control, smart displays, tablets, embedded systems, and single-board computers. It integrates a quad-core ARM Cortex-A55 CPU, Mali-G52 GPU, AI acceleration engine (NPU), advanced multimedia processing, and a rich set of connectivity interfaces, making it suitable for Linux- and Android-based applications requiring efficient performance and multimedia capabilities. Key Features Quad-core 64-bit ARM Cortex-A55 processor operating up to 2.0 GHz. ARM Mali-G52 2EE GPU with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1. Integrated NPU delivering up to 1 TOPS AI computing performance. Supports DDR3, DDR3L, DDR4, LPDDR3, LPDDR4, and LPDDR4X memory. Hardware video decoding up to 4K@60fps for H.264, H.265, and VP9 formats. Hardware video encoding up to 1080p@60fps for H.264 and H.265. Built-in 8MP ISP with HDR image processing support. Multiple display interfaces including HDMI 2.0, eDP, MIPI-DSI, LVDS, RGB, and E-Ink. High-speed connectivity with USB 3.0, USB 2.0, PCIe, SATA, Gigabit Ethernet, SDIO, and eMMC 5.1. Rich peripheral support including UART, SPI, I²C, PWM, ADC, I²S, PDM, and GPIO. Optimized for Android, Linux, industrial HMI, smart home, edge computing, and AIoT applications. Manufactured using a 22 nm process for improved power efficiency. #RK3566 #Rockchip #ARMCortexA55 #MaliG52 #AIoT #EmbeddedSystems #SingleBoardComputer #Linux #Android #IndustrialControl #SmartDisplay #EdgeComputing #SoC #Processor #NPU #4KVideo #IoT #Electronics #HardwareDesign #PCBDesign

The TDK InvenSense ICM-20948 is the world's lowest power 9-axis MotionTracking™ device, optimized for Smartphones, Tablets, Wearable Sensors, and IoT applications. This highly integrated component features a 3-axis gyroscope, 3-axis accelerometer, and 3-axis compass, all housed within a compact 3 mm x 3 mm x 1 mm 24-pin QFN package. The ICM-20948 includes an onboard Digital Motion Processor™ (DMP™) that offloads motion processing algorithms from the host processor, thereby enhancing overall system power performance. It supports both I2C and high-speed SPI communication interfaces and operates within a voltage range of 1.71V to 3.6V. The device is fully compliant with Google's latest Android release and supports EIS FSYNC. Additional features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and programmable interrupts, making it an ideal choice for applications requiring precise motion tracking and low power consumption.

SMD,24x24mm RF Transceiver Modules and Modems RoHS A7670C-LASE is a compact LTE Cat 1 wireless communication module from SIMCom Wireless Solutions designed for IoT and M2M applications. It supports 4G LTE and 2G fallback connectivity, providing reliable cellular data communication for industrial, automotive, security, POS, and remote monitoring systems. The module uses a compact 24 mm × 24 mm LGA+LCC package, making it suitable for space-constrained designs. Key Features LTE Cat 1 cellular module with up to 10 Mbps downlink and 5 Mbps uplink data rates. Supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE networks. Compact 24 mm × 24 mm LGA+LCC package for easy migration from 2G, NB-IoT, and Cat-M designs. Operating voltage range of 3.4 V to 4.2 V. Multiple interfaces including: USB 2.0 UART I²C SPI GPIO ADC Integrated TCP/IP protocol stack for internet connectivity. Supports major operating systems including Windows, Linux, and Android through USB drivers. Firmware Over-The-Air update (FOTA/DFOTA) support. Supports LBS (Location Based Service) positioning. TLS/SSL security protocol support for secure communications. AT command compatible cellular modem architecture. Typical Applications Vehicle telematics and fleet management Industrial IoT gateways and routers POS terminals Security and surveillance systems Remote monitoring and telemetry Healthcare and telemedicine devices

3D accelerometer and 3D gyroscope The LSM6DS3TR-C is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.90 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DS3TR-C supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DS3TR-C has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DS3TR-C the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DS3TR-C is available in a plastic land grid array (LGA) package. Features  “Always-on” experience with low power consumption for both accelerometer and gyroscope  Power consumption: 0.90 mA in combo highperformance mode  Smart FIFO up to 4 kbyte based on features set  Android M compliant  Hard, soft ironing for external magnetic sensor corrections  ±2/±4/±8/±16 g full scale  ±125/±250/±500/±1000/±2000 dps full scale  Analog supply voltage: 1.71 V to 3.6 V  Independent IO supply (1.62 V)  Compact footprint, 2.5 mm x 3 mm x 0.83 mm  SPI & I2C serial interface with main processor data synchronization feature  Pedometer, step detector and step counter  Significant motion and tilt function  Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click  Embedded temperature sensor  ECOPACK®, RoHS and “Green” compliant #CommonPartsLibrary #Sensor