Part Review and Datasheet Update


Completed the ASM330LHHXTR part review and updated the Datasheet URL to the official ST datasheet: https://www.st.com/resource/en/datasheet/asm330lhhx.pdf.
Open items:
  • Symbol pin numbering/names match the datasheet.
  • Main issues flagged: package naming should be LGA-14L rather than VFLGA-14, pin descriptions are sparse, NC pin handling should be clarified, and the footprint inspection shows a unit-display anomaly even though the pad values appear dimensionally correct.
  • Full review report is in project file: asm330lhhxtr-part-review.
Suggested next steps:
  1. Update package/description metadata to use ST’s LGA-14L 2.5 × 3.0 × 0.86 mm naming.
  2. Add detailed Pin Description properties for alternate functions and NC handling.
  3. Verify footprint dimensions directly in the footprint editor before publishing.
Fix the package metadata, add detailed pin descriptions, and verify the footprint dimensions.
I’ll update the package metadata to ST’s LGA-14L naming, add datasheet-based descriptions to each terminal, then re-check the footprint pad/body dimensions against the datasheet.
Package details and all 14 pin descriptions are updated; I’m now verifying the footprint geometry against the ST LGA-14L package data.
Completed the requested fixes: package metadata now uses ST’s LGA-14L, 2.5 × 3.0 × 0.86 mm max naming, all 14 pins have datasheet-based descriptions, and the footprint dimensions were verified against the ST datasheet/TN0018 guidance.
Open items:
  • The dedicated project Package or Case Code field is non-standard here, so the corrected package is stored under Implementation Details.
  • Footprint is dimensionally correct; the embedded KiCad footprint confirms 0.575 × 0.350 mm lands and matching mask openings.
Suggested next steps:
  1. Publish/reuse the part now that symbol, metadata, and footprint checks pass.
  2. Optionally add application-circuit notes for required decoupling and I²C pull-ups.
Add notes and checks
Add application notes
Run full review
Check BOM metadata
Export verification report

Name
Pin #
Type
Part Type
Pin Description
Terminal Order
SDO/SA0
1
Bi-Directional
Terminal
Pin 1: SPI 4-wire serial data output (SDO); I2C/MIPI I3C least significant address bit (SA0).
MSDA
2
Bi-Directional
Terminal
Pin 2: Mode 1 connect to VDD_IO or GND; Mode 2 I2C master serial data (MSDA).
MSCL
3
Input
Terminal
Pin 3: Mode 1 connect to VDD_IO or GND; Mode 2 I2C master serial clock (MSCL).
INT1
4
Output
Terminal
Pin 4: Programmable interrupt output in I2C and SPI; sampled at power-up for I2C/I3C coexistence mode.
VDD_IO
5
Power In
Terminal
Pin 5: I/O power supply, 1.62 V to 3.6 V; recommended 100 nF decoupling capacitor.
NC
6
Passive
Terminal
Pin 6: NC; may be connected to VDD_IO or GND or left unconnected per datasheet.
GND
7
Power In
Terminal
Pin 7: Ground / 0 V supply return.
VDD
8
Power In
Terminal
Pin 8: Main power supply, 1.71 V to 3.6 V; recommended 100 nF plus 10 uF decoupling capacitors.
INT2
9
Output
Terminal
Pin 9: Programmable interrupt 2 (INT2) / data enable (DEN); Mode 2 also I2C master external sync signal (MDRDY).
NC
10
Passive
Terminal
Pin 10: NC; leave electrically unconnected and solder pad to PCB per datasheet.
NC
11
Passive
Terminal
Pin 11: NC; leave electrically unconnected and solder pad to PCB per datasheet.
CS
12
Input
Terminal
Pin 12: I2C/MIPI I3C/SPI mode selection; high enables SPI idle/I2C/I3C, low selects SPI communication.
SCL
13
Input
Terminal
Pin 13: I2C/MIPI I3C serial clock (SCL); SPI serial port clock (SPC).
SDA
14
Bi-Directional
Terminal
Pin 14: I2C/MIPI I3C serial data (SDA); SPI serial data input (SDI); 3-wire SPI serial data output (SDO).

ASM330LHHXTR