Part Review and Datasheet Update

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I’ll update the package metadata to ST’s LGA-14L naming, add datasheet-based descriptions to each terminal, then re-check the footprint pad/body dimensions against the datasheet.

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Package details and all 14 pin descriptions are updated; I’m now verifying the footprint geometry against the ST LGA-14L package data.

flux

Completed the requested fixes: package metadata now uses ST’s LGA-14L, 2.5 × 3.0 × 0.86 mm max naming, all 14 pins have datasheet-based descriptions, and the footprint dimensions were verified against the ST datasheet/TN0018 guidance.
Open items:
  • The dedicated project Package or Case Code field is non-standard here, so the corrected package is stored under Implementation Details.
  • Footprint is dimensionally correct; the embedded KiCad footprint confirms 0.575 × 0.350 mm lands and matching mask openings.
Suggested next steps:
  1. Publish/reuse the part now that symbol, metadata, and footprint checks pass.
  2. Optionally add application-circuit notes for required decoupling and I²C pull-ups.
Add notes and checks
Add application notes
Run full review
Check BOM metadata
Export verification report
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ASM330LHHXTR

ASM330LHHXTR thumbnail
Accelerometer, Gyroscope, Temperature, 6 Axis Sensor I2C, I3C, SPI Output
The ASM330LHHX is a 6-axis IMU featuring a 3-axis digital accelerometer and a 3‑axis digital gyroscope with an extended temperature range up to +105°C, designed to address automotive nonsafety applications. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer markets. The ASM330LHHX is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level. The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match the characteristics of the sensing element.
Features • AEC-Q100 qualified • Android Auto™ compliant and CarPlay® compliant • Extended temperature range from -40 to +105°C • Embedded compensation for high stability over temperature • Accelerometer user-selectable full scale up to ±16 g • Extended gyroscope range from ±125 to ±4000 dps • Dual operating modes: high-performance and low-power mode • I²C, MIPI I3C℠, and SPI serial interfaces • Six-channel synchronized output to enhance accuracy of dead-reckoning algorithms • Programmable finite state machine • Machine learning core • Smart programmable interrupts • Embedded 3 KB FIFO available to underload host processor • ECOPACK and RoHS compliant Applications • Dead reckoning (DR) • Vehicle-to-everything (V2X) • Telematics, e-tolling • Antitheft systems • Impact detection and crash reconstruction • Motion-activated functions • Driving comfort • Vibration monitoring and compensation
#ASM330LHHXTR #STMicroelectronics #IMU #MEMS #Accelerometer #Gyroscope #AutomotiveElectronics #MotionSensor #MachineLearning #SensorFusion #AECQ100 #EmbeddedSystems

Properties

Package: LGA-14L, 2.5 x 3.0 x 0.86 mm max height

ASM330LHHXTR

STMicroelectronics

Sensors

st.com/resource/en/datasheet/asm330lhhx.pdf

U

parametric-v1

creativecommons.org/licenses/by/4.0/

Pricing & Availability

DPN

Stock

Qty 1

4

0–7.3K

$5.536–$7.9569

1

2.4K

$9.81

3

2.4K–7.3K

$5.4407–$7.9799

Controls