2 Position Header, Male Blades Connector Solder 0.295" (7.50mm) Through Hole, Right Angle 46007-1102 0460071102 is a 2-position right-angle PCB header from the Molex Sabre power connector family, designed for high-current wire-to-board power applications. It features a 7.50 mm pitch, through-hole mounting, and a shrouded housing for secure mating and enhanced safety. The connector is commonly used in power supplies, industrial equipment, appliances, and other systems requiring reliable high-power connections. It is glow-wire capable and complies with UL1977 finger-proof access requirements. Key Features 2-circuit male header from the Molex Sabre series 7.50 mm pitch power connector Right-angle through-hole PCB mounting Shrouded and polarized design for secure mating Locking ramp retention feature Tin-plated brass contacts Nylon housing with UL94V-0 flammability rating Glow-wire capable for appliance applications Operating temperature range: -40°C to +105°C Supports wire-to-board power connections Complies with UL1977 finger-proof safety requirements #CommonPartsLibrary #Connector #Molex #SabreConnector #PowerConnector #WireToBoard #PCBHeader #RightAngleConnector #ThroughHole #IndustrialElectronics #PowerDistribution #HighCurrentConnector

60V Independent Type 700mV@5A 5A SMA(DO-214AC) Schottky Diodes ROHS The MDD SS56 is a Schottky barrier rectifier diode in a compact SMA (DO-214AC) surface-mount package, designed for high-efficiency power rectification in low-voltage, high-current applications such as DC-DC converters, power supplies, and polarity protection circuits. It uses a Schottky metal-semiconductor junction, which enables low forward voltage drop and fast switching performance, making it more efficient than standard PN junction diodes in switching power designs. Key Features Schottky technology for low forward voltage drop (~0.7 V at 5 A typical) Maximum repetitive reverse voltage: 60 V Average forward current: 5 A High surge current capability: up to 125 A (8.3 ms half-sine) Low power loss / high efficiency operation Fast switching (no significant reverse recovery delay) Low reverse leakage current (~1 mA at 60 V typical) High junction temperature rating: up to ~150°C Surface-mount SMA (DO-214AC) package for compact PCB design Typical Applications DC-DC converters (buck / boost converters) Power rectification in SMPS (switch-mode power supplies) Reverse polarity protection Freewheeling / flyback diode in inductive loads Battery-powered and portable electronics High-efficiency power management circuits #CommonPartsLibrary #Diode

10 µH Shielded Molded Inductor 3.9A 69.5mOhm Max 1616 (4040 Metric) The XGL4030-103MEC is a shielded surface-mount power inductor from the XGL4030 series by Coilcraft. It uses a molded composite core construction designed for high-current DC/DC converters, power management circuits, automotive electronics, and industrial applications. The component offers ultra-low DC resistance (DCR), low AC losses, and soft saturation characteristics for improved efficiency and thermal performance in compact designs. Key Features 10 µH inductance with ±20% tolerance Shielded molded inductor construction Low DCR: 69.5 mΩ max High current capability: 3.1 A saturation current 3.9 A RMS current Composite metal core for low core losses Compact 4.0 mm × 4.0 mm SMD package Wide operating temperature range: –40°C to +165°C AEC-Q200 qualified for automotive applications RoHS compliant and halogen-free Optimized for switching regulators and power conversion systems #CommonPartsLibrary #Inductor #XGL4030

N-Channel 30 V 161A (Tc) 140W (Tc) Surface Mount TO-252AA (DPAK) The IRLR7843TRPBF is an N-channel power MOSFET built on Infineon's HEXFET technology platform, originally developed by International Rectifier. It is designed as a low-voltage, high-current switching device intended for applications where minimizing conduction loss and maximizing efficiency are primary design goals. The part is particularly well suited to synchronous switching topologies, where pairs or arrays of MOSFETs alternately conduct to regulate power flow with minimal energy dissipation. This device targets high-density power conversion applications where board space is limited but current demands are substantial, such as notebook computer power delivery, point-of-load converters used in servers, and advanced telecom and datacom equipment. It is commonly found supporting synchronous buck converter stages that step down a higher input rail to a lower output voltage suitable for powering processors, memory, and other low-voltage digital logic. Its low on-resistance characteristic allows it to carry significant current while generating comparatively little resistive heating, which is essential in compact enclosures with constrained thermal budgets. The transistor is fabricated using a refined trench gate process that improves upon earlier HEXFET generations, offering reduced gate charge and lower switching losses alongside its low conduction resistance. This combination makes it effective in both the high-side and low-side positions of a synchronous switching cell, where fast, clean transitions reduce overlap losses and improve overall converter efficiency. The device also offers well-characterized avalanche energy ratings, giving designers confidence in its ruggedness when exposed to transient overvoltage events that can occur during switching, and it presents a very low gate impedance, allowing it to be driven efficiently by standard gate driver circuitry. Mechanically, the part is housed in a surface-mount power package with an exposed tab for enhanced thermal conduction to the host PCB, allowing heat generated during operation to be efficiently transferred away from the silicon die. This package style is widely used in power-dense designs where through-hole packages would be impractical. The device is supplied in a tape-and-reel format suitable for automated assembly and is compliant with RoHS material restrictions, reflecting current environmental and regulatory standards for electronic components. Spec Sheet Identification Part Number: IRLR7843TRPBF Device Family: HEXFET Power MOSFET Manufacturer: Infineon Technologies Functional Classification Device Type: Power MOSFET Channel Type: N-channel Technology: Trench-gate HEXFET (IR MOSFET legacy technology) Logic Level Compatibility: Logic-level gate drive compatible Electrical Characteristics Drain-to-Source Voltage Rating: Low-voltage class, optimized for sub-30V rail applications On-Resistance: Ultra-low on-resistance class Drain Current Capability: High continuous current class Gate Charge: Low gate charge, optimized for fast switching Gate Impedance: Ultra-low gate impedance Avalanche Characteristics: Fully characterized avalanche voltage and current rating Switching & Application Behavior Primary Application: Synchronous buck converter switching stages Suitable Position: High-side and low-side switch positions Target Use Cases: Point-of-load conversion, notebook power delivery, telecom/datacom power systems Thermal & Mechanical Package Type: Surface-mount power package with exposed thermal tab (DPAK-style) Mounting: Surface mount technology (SMT) Thermal Path: Tab-based conduction to PCB for heat dissipation Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active production Packaging Format Supply Format: Tape-and-reel, per part suffix designation #IRLR7843 #Infineon #HEXFET #PowerMOSFET #NChannelMOSFET #SynchronousBuck #PowerElectronics #DCDCConverter #PointOfLoad #PowerConversion #DPAK #SMTPackage #RoHSCompliant #SemiconductorIC #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #PowerDensity #LowRDSon #DiscreteSemiconductor #commonpartslibrary #transistor

Power Management Specialized - PMIC Automotive 2.8-V to 5.5-V PMIC The TPS6593C3A0RWERQ1 is an automotive-grade power management integrated circuit (PMIC) designed by Texas Instruments for advanced processor and system-on-chip power architectures. The device integrates multiple high-efficiency DC/DC buck converters, low-dropout regulators, power sequencing, safety monitoring, and diagnostic functions into a single compact package. It is optimized for use in automotive ADAS, digital cockpit, gateway, radar, vision, and domain controller applications requiring functional safety compliance and high power density. The device supports complex multi-rail power management for high-performance processors and includes configurable startup and shutdown sequencing, voltage monitoring, watchdog functionality, error signaling, and fault protection mechanisms. Integrated communication interfaces enable configuration and monitoring by an external host processor. The PMIC is qualified for automotive applications and supports operation across extended temperature ranges suitable for harsh automotive environments. Key Features Automotive AEC-Q100 qualified power management IC for processor power systems Integrated multi-phase step-down buck converters for high-current rails Integrated low-dropout linear regulators for analog and auxiliary rails Programmable power sequencing and rail management Functional safety support suitable for ASIL-oriented system architectures Integrated watchdog timer and safety monitoring functions Voltage supervision and fault detection for all major rails I2C and SPI communication interface support Power-good outputs and interrupt signaling Thermal shutdown and overtemperature protection Overcurrent and short-circuit protection Undervoltage and overvoltage monitoring Configurable GPIO functionality Low-power standby and sleep mode support Optimized for automotive SoCs and processors High-efficiency switching regulator architecture Compact VQFN package with thermal enhancement Electrical Characteristics Input supply voltage range supports automotive battery-powered systems Multiple programmable buck converter output voltages Integrated LDO outputs for precision analog and digital domains High switching frequency operation for reduced external component size Wide operating junction temperature range suitable for automotive environments Low shutdown current for standby operation High-current capability for processor core supplies Accurate voltage regulation and monitoring Protection and Safety Features Thermal shutdown protection Buck converter cycle-by-cycle current limiting Short-circuit protection on power rails Undervoltage lockout protection Power sequencing fault management Watchdog monitoring for processor supervision Diagnostic interrupt and fault reporting capability Safe-state transition support during fault conditions Package Information Package type: VQFN Package option: RWE Automotive-grade Q1 qualified device RoHS compliant Surface-mount package optimized for thermal performance Typical Applications Automotive domain controllers ADAS processing modules Digital cockpit systems Automotive gateway and networking platforms Radar and vision systems Processor and FPGA power management Industrial high-performance embedded systems #commonpartslibrary #integratedcircuit #powermanagement

Plug Power Connectors The XT60U-M is a high-current 2-pin male DC power connector from the XT60 series, commonly manufactured by AMASS. It is widely used in RC batteries, drones, e-bikes, battery packs, power distribution systems, and other applications that require reliable high-current connections. The connector uses gold-plated brass contacts and a flame-retardant polyamide housing to provide low contact resistance, durability, and safe operation under high loads. Key Features Connector Type: XT60 series male plug Number of Pins: 2 Rated Current: 30 A continuous Rated Voltage: 500 V DC Contact Material: Gold-plated brass Housing Material: Polyamide (PA), UL94 V-0 flame-retardant Wire Size Support: Up to 12 AWG Mounting Method: Cable mount, solder termination Mechanical Life: Approximately 1000 mating cycles Operating Temperature Range: −20 °C to +120 °C Low Contact Resistance for efficient power transfer Polarized Design prevents reverse connection and incorrect mating Compact and Lightweight construction for battery-powered systems Typical Applications RC LiPo battery packs Drones and UAVs Electric bicycles and scooters Robotics projects Portable power systems Battery chargers and power distribution modules #CommonPartsLibrary #Connector

3W 10mΩ Patch Current Sensing Resistors ±1% 2512 Current Sense Resistors / Shunt Resistors The HoJLR2512-3W-10mR-1% is a surface-mount current-sense (shunt) resistor manufactured by Milliohm Electronics. It features an ultra-low resistance value of 10 mΩ (0.01 Ω) in a 2512 package and is designed for high-current applications where accurate current measurement and low power loss are required. The resistor uses a metal element construction, providing excellent stability, low inductance, and reliable performance in power management, battery monitoring, motor control, and DC-DC converter applications. Key Features Resistance: 10 mΩ (0.01 Ω) Tolerance: ±1% for accurate current sensing Power Rating: 3 W Package Size: 2512 (6.4 mm × 3.2 mm) SMD package Metal Element Construction for low resistance drift and high reliability Current Sense Optimized for power monitoring and overcurrent protection circuits Non-Inductive Design suitable for high-frequency switching applications Moisture Resistant construction for improved environmental robustness Temperature Coefficient: ±50 ppm/°C typical Operating Temperature Range: −50°C to +170°C RoHS Compliant Typical Applications Battery management systems (BMS) Power supplies and DC-DC converters Motor control and drive systems Current monitoring circuits Overcurrent protection circuits Industrial and automotive electronics (where qualification requirements permit) #CommonPartsLibrary #Resistor

Buffers / Drivers SN74HCT125DRE4 SOIC-14_L8.6-W3.9-P1.27-LS6.0-BL LCSC Part Number: C2675588 JLCPCB Part Class: Extended Part Manufactured by TI(德州仪器) Texas Instruments SN74HCT125/SN54HCT125 quadruple bus buffer IC with 3-state outputs, contains four independent non-inverting buffers with TTL-compatible inputs, positive logic function Y=A, 4.5V to 5.5V operating voltage range, high-current outputs capable of driving up to 15 LSTTL loads, ±6mA output drive at 5V, low input current, typical 12ns propagation delay, suitable for bus line driving, memory address buffering and digital logic interface applications, available in SOIC-14 and PDIP-14 packages. Search Keywords: SN74HCT125, SN54HCT125, Texas Instruments SN74HCT125, TI SN74HCT125, SN74HCT125 buffer, 74HCT125 buffer, quad bus buffer, quadruple bus buffer, 3-state buffer IC, tri-state buffer IC, non-inverting buffer IC, TTL-compatible CMOS buffer, HCT logic buffer, bus line driver, memory address buffer, SN74HCT125D, SN74HCT125N, SOIC-14 buffer, PDIP-14 buffer, SN74HCT125 datasheet Hashtags: #SN74HCT125 #SN54HCT125 #74HCT125 #TexasInstrumentsSN74HCT125 #TIBufferIC #BusBuffer #QuadBusBuffer #TriStateBuffer #3StateBuffer #NonInvertingBuffer #HCTLogic #TTLCompatibleInput #LogicBufferIC #BusLineDriver #AddressBuffer #SOIC14 #PDIP14

Infrared (IR) Emitter 840nm~870nm 1.4V~1.8V 700mA 60° Surface Mount,3.9x3.9mm The SE03-EMC3838A-B60 is a high-power surface-mount infrared (IR) LED emitter designed for applications requiring efficient 850 nm infrared illumination. It uses a compact black EMC package for improved thermal performance and reliability, making it suitable for SMT assembly and high-current operation. This component is commonly used in surveillance camera IR illumination, infrared sensing, and IR data transmission systems. Key Features 850 nm peak infrared wavelength (840–870 nm range) High-efficiency IR emission Surface-mount 2-SMD no-lead package Wide 60° viewing angle Typical forward voltage: 1.6 V Supports up to 700 mA forward current Black EMC package for enhanced heat dissipation Operating temperature range: -30°C to +85°C Suitable for automated SMT reflow assembly Compact approximately 3.9 mm × 3.9 mm footprint #commonpartslibrary #led #Infrared

Connector Header Through Hole 4 position 0.118" (3.00mm) 2242460430 is a Molex Micro-Fit+ Versa Color Vertical Header, a 4-circuit, dual-row, through-hole wire-to-board power connector designed for reliable power and signal connections in industrial, consumer, and power distribution applications. It features a 3.00 mm pitch, shrouded housing, polarized mating interface, and high-current copper alloy contacts for secure and robust connectivity. The connector supports up to 12.5 A per contact and 600 V AC/DC operation, making it suitable for compact high-power designs. Key Features 4-position dual-row vertical PCB header 3.00 mm pitch (Micro-Fit+ Versa series) Through-hole mounting with solder termination Male pin contacts with tin plating Up to 12.5 A current rating per contact Up to 600 V AC/DC voltage rating Shrouded and polarized design for mating protection Locking and keying features for secure connection High-strength copper alloy contacts Glass-filled LCP housing, UL94 V-0 rated Operating temperature range: -40°C to +125°C Glow-wire capable construction Suitable for power and wire-to-board applications #Molex #MicroFitPlus #WireToBoard #PowerConnector #PCBHeader #ThroughHole #IndustrialElectronics #HighCurrentConnector #Connector #ElectronicsDesign