RF Amplifier IC 5G, TDD 600MHz ~ 2.8GHz 20-QFN (4x4) ## Engineering Specification ## General Description The **QPA9442TR13** is a Qorvo high-linearity RF pre-driver amplifier designed for wireless infrastructure, cellular communication systems, and high-performance RF transmit chain applications. It is intended for use in systems requiring wideband operation, strong linearity, stable gain performance, and compact surface-mount integration. The device is suitable for 5G, TDD, FDD, mobile infrastructure, massive MIMO, and general-purpose wireless designs. ## Device Identification Manufacturer Part Number: **QPA9442TR13** Manufacturer: **Qorvo** Device Category: **RF and Wireless Integrated Circuit** Device Type: **RF Amplifier** Functional Type: **High-Linearity RF Pre-Driver Amplifier** Application Class: **Wireless Infrastructure and 5G RF Front-End** ## Functional Description The device operates as a transmit-chain pre-driver amplifier, providing RF signal amplification before the final power amplification stage. It is designed to deliver high gain and high output linearity while supporting cellular-band tuning requirements. The amplifier includes shutdown control through a dedicated power-down function, allowing system-level power management in RF transmit applications. ## RF Performance Description The QPA9442TR13 supports wideband RF amplification for cellular and wireless infrastructure applications. It provides high linearity performance, strong compression-point capability, and output third-order intercept performance suitable for demanding transmit signal chains. The device is optimized for applications where signal quality, gain stability, and RF output performance are critical. ## Electrical Description The device is designed for single-supply operation and is suitable for low-voltage RF circuit designs. It requires proper RF matching, biasing, grounding, and thermal layout practices to achieve the intended performance. The part should be used according to the manufacturer’s recommended operating conditions and reference design guidance. ## Package and Mounting Description The component is supplied as a surface-mount RF integrated circuit in a compact QFN package with exposed pad construction. The package is intended for high-frequency printed circuit board layouts requiring controlled impedance routing, short RF signal paths, proper ground via placement, and effective thermal connection to the PCB ground plane. ## Protection and Control Features The amplifier includes internal RF overdrive protection and internal DC overvoltage protection. It also includes a DC power shutdown feature for power control and system-level enable or disable operation. ## Application Suitability The QPA9442TR13 is suitable for 5G base station equipment, massive MIMO radio systems, mobile infrastructure, TDD and FDD transmit systems, cellular RF front-end designs, general-purpose wireless equipment, and RF driver amplifier stages requiring high linearity and compact board-level integration. ## Design Considerations The device should be implemented with proper RF layout techniques, impedance-controlled traces, recommended matching networks, adequate grounding, and appropriate thermal management. Performance may vary depending on frequency tuning, PCB design, matching component selection, supply quality, and operating conditions. ## Hashtags #commonpartslibrary #integratedcircuit #rfamplifier #qorvo #qpa9442tr13 #qpa9442 #wirelesscomponents #rfic #semiconductor #electronicscomponents #rfdesign #wirelessinfrastructure #fiveg #tdd #fdd #massivemimo #mobileinfrastructure #preDriverAmplifier #rfpreDriver #smtcomponents #qfnpackage #pcbdesign #hardwaredesign #electronicsengineering #componentlibrary

2 Position Wire to Board Terminal Block Horizontal with Board 0.200" (5.08mm) Through Hole ## Engineering Specification ## General Description The **1726040** is a Phoenix Contact **MKKDSN series PCB terminal block** designed for wire-to-board electrical connections in printed circuit board assemblies. It is used to provide a secure screw-clamp interface between external wiring and PCB circuitry. The component is suitable for control systems, industrial electronics, power distribution circuits, automation equipment, and general electronic assemblies requiring reliable field wiring termination. ## Device Identification Manufacturer Part Number: **1726040** Manufacturer: **Phoenix Contact** Product Series: **MKKDSN** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Mounting Type: **Through-Hole PCB Mount** Termination Method: **Screw Connection** ## Functional Description The device functions as a fixed printed circuit board terminal block that allows external conductors to be connected directly to a PCB. The screw-clamp mechanism secures the wire mechanically and electrically, providing a stable connection for signal or power circuits. The terminal block is intended for applications where field wiring must be removable, serviceable, and mechanically secure. ## Mechanical Description The component uses a compact green housing suitable for PCB-mounted assemblies. It is designed for side-entry conductor connection and horizontal board installation. The terminal block construction supports organized wire routing and convenient access for installation, maintenance, and service work. ## Electrical Description The terminal block is intended for low-voltage power and signal applications within the manufacturer’s specified current and voltage ratings. It provides reliable conductor contact when properly installed with compatible wire sizes and appropriate tightening torque. ## Material and Contact Description The connector housing is typically made from insulating material suitable for electrical safety and PCB assembly use. The internal conductive elements provide the electrical path between the inserted wire and the soldered PCB connection. Proper conductor preparation and screw tightening are required to maintain stable electrical performance. ## Mounting and Assembly Description The component is intended for through-hole solder mounting on a printed circuit board. Proper PCB hole sizing, pad layout, soldering process control, and mechanical clearance should be followed according to the manufacturer’s recommended design and assembly guidance. The terminal block should be mounted in a position that allows safe wire insertion and screw access. ## Application Suitability The **1726040** is suitable for industrial control boards, automation equipment, interface modules, power supply circuits, instrumentation, building control systems, relay boards, sensor wiring interfaces, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for wire gauge compatibility, current rating, voltage rating, tightening torque, creepage and clearance requirements, solder joint strength, and accessibility for field wiring. The terminal block should not be used beyond the manufacturer’s specified electrical, thermal, and mechanical limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkkdsn #wiretoboard #connector #interconnect #fixedterminalblock #screwterminal #throughholecomponent #pcbmount #industrialelectronics #automationequipment #controlsystems #powerdistribution #fieldwiring #electronicscomponents #electronicparts #hardwaredesign #pcbdesign #engineeringparts #componentlibrary #electronicsengineering

8 Position Card Connector Micro SIM Surface Mount, Right Angle Gold ## Engineering Specification ## General Description The **693022010811** is a Würth Elektronik **WR-CRD Micro SIM card connector** designed for compact electronic devices requiring secure SIM card retention and reliable board-level electrical connection. It is intended for surface-mount printed circuit board assembly and is suitable for communication modules, wireless devices, embedded systems, IoT hardware, and networking equipment. The connector uses a hinged lid mechanism to hold the Micro SIM card in place during operation. ## Device Identification Manufacturer Part Number: **693022010811** Manufacturer: **Würth Elektronik** Product Series: **WR-CRD** Device Category: **Connector and Interconnect Component** Device Type: **Micro SIM Card Connector** Connector Style: **Hinge Type** Mounting Type: **Surface Mount, Right Angle** ## Functional Description The device functions as a board-mounted Micro SIM card interface. It provides mechanical retention and electrical contact between the SIM card and the host printed circuit board. The hinged lid design allows the SIM card to be placed into the connector and secured during operation, helping maintain contact stability in compact electronic assemblies. ## Mechanical Description The connector is designed with a low-profile surface-mount construction suitable for space-constrained PCB layouts. It uses a hinged card-retention mechanism and is intended for horizontal or right-angle card installation. The mechanical structure supports reliable insertion, retention, and removal of the Micro SIM card during normal use. ## Electrical Description The connector is intended for signal-level SIM card interface applications. It provides multiple gold-plated contact positions for stable electrical connection between the SIM card and the host circuit. The device should be used within the manufacturer’s specified voltage, current, contact resistance, and insulation limits. ## Material and Contact Description The connector uses copper alloy contacts with gold plating for reliable signal transfer and corrosion resistance. The housing and mechanical retention structure are designed for surface-mount assembly and repeated card handling within the rated operating conditions. ## Mounting and Assembly Description The component is suitable for automated surface-mount PCB assembly. Proper land pattern design, soldering profile control, and mechanical clearance should be followed according to the manufacturer’s recommended layout and assembly guidance. The PCB design should provide stable grounding, correct pad alignment, and adequate clearance for SIM card insertion and lid operation. ## Application Suitability The **693022010811** is suitable for cellular communication devices, IoT modules, wireless routers, embedded modems, tracking systems, smart meters, industrial communication equipment, portable electronics, and other products requiring a Micro SIM card interface. ## Design Considerations The connector should be placed in an accessible area of the PCB to allow SIM card installation and removal. Designers should avoid excessive mechanical stress on the hinged lid, improper solder joint loading, contamination of the contact area, and operation beyond the specified environmental and electrical ratings. ## Hashtags #commonpartslibrary #connector #simconnector #microsimconnector #wurthelektronik #wrcrd #cardconnector #memoryconnector #interconnect #pcbconnector #surfacemount #rightangleconnector #smtcomponent #goldplatedcontacts #embeddedhardware #iotdevices #wirelessmodules #communicationdevices #networkingequipment #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

2 Position Wire to Board Terminal Block Horizontal with Board 0.150" (3.81mm) Through Hole ## Engineering Specification ## General Description The **1727010** is a Phoenix Contact **MKDS series PCB terminal block** designed for secure wire-to-board electrical connection in printed circuit board assemblies. It provides a compact screw-clamp termination interface for connecting external conductors to PCB circuitry. The component is suitable for industrial electronics, automation equipment, control modules, power interfaces, instrumentation, and general electronic assemblies requiring reliable field wiring termination. ## Device Identification Manufacturer Part Number: **1727010** Manufacturer: **Phoenix Contact** Product Name: **MKDS 1/ 2-3,81** Product Series: **MKDS** Product Line: **COMBICON Terminals** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Termination Method: **Screw Connection with Tension Sleeve** Mounting Type: **Through-Hole PCB Mount** ## Functional Description The device functions as a fixed PCB terminal block that allows external wires to connect directly to the printed circuit board. The screw-clamp mechanism provides both mechanical conductor retention and electrical continuity between the field wiring and PCB circuit. This makes the component suitable for applications where wiring must be secure, serviceable, and accessible during installation or maintenance. ## Mechanical Description The terminal block uses a compact housing with side-entry conductor access and through-hole solder pins for stable PCB attachment. Its construction supports organized wire routing and practical access for conductor insertion and screw tightening. The design is suitable for compact board layouts where reliable field wiring connection is required. ## Electrical Description The component is intended for signal and low-voltage power connection applications within the manufacturer’s specified electrical ratings. It provides stable electrical contact when used with compatible conductor sizes, correct wire preparation, and proper screw tightening torque. ## Material and Contact Description The terminal block uses an insulating housing with internal conductive contact elements that transfer current from the inserted conductor to the soldered PCB pins. The screw connection with tension sleeve helps maintain reliable contact pressure and secure conductor retention during normal operating conditions. ## Mounting and Assembly Description The **1727010** is intended for through-hole solder mounting on a printed circuit board. The PCB layout should follow the manufacturer’s recommended hole size, pad pattern, spacing, and soldering guidance. The component should be positioned to allow safe wire insertion, screwdriver access, and adequate clearance from nearby components or enclosure walls. ## Application Suitability The device is suitable for industrial control boards, automation modules, power supply interfaces, relay boards, instrumentation equipment, sensor wiring interfaces, building control systems, communication hardware, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for conductor size compatibility, current requirement, voltage rating, tightening torque, creepage and clearance spacing, solder joint strength, wire routing, and service access. The terminal block should not be used beyond the manufacturer’s specified electrical, mechanical, or environmental limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkds #combicon #wiretoboard #screwterminal #fixedterminalblock #throughholecomponent #soldermount #connector #interconnect #fieldwiring #industrialelectronics #automationequipment #controlsystems #powerinterface #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #engineeringparts #componentlibrary #electronicsengineering

1000 pF ±10% 2000V (2kV) Ceramic Capacitor X7R 1808 (4520 Metric) ## Engineering Specification ## General Description The **C4520X7R3D102K130KE** is a TDK multilayer ceramic chip capacitor designed for high-voltage surface-mount applications. It uses X7R dielectric material and is suitable for circuits requiring stable ceramic capacitance, compact PCB mounting, and reliable high-voltage performance. The component is commonly used in power supplies, filtering circuits, coupling circuits, snubber networks, voltage multiplier circuits, and general electronic assemblies requiring a high-voltage MLCC solution. ## Device Identification Manufacturer Part Number: **C4520X7R3D102K130KE** Manufacturer: **TDK Corporation** Product Series: **C Series** Device Category: **Passive Electronic Component** Device Type: **Multilayer Ceramic Chip Capacitor** Capacitor Type: **Surface-Mount MLCC** Application Grade: **Commercial Grade** ## Functional Description The device functions as a fixed-value ceramic capacitor for energy storage, noise suppression, coupling, decoupling, and filtering applications. It is designed to provide capacitance in a compact surface-mount package while supporting high-voltage operation. The X7R dielectric provides usable capacitance stability across a wide operating temperature range, making the component suitable for many general-purpose and power-related electronic designs. ## Electrical Description The capacitor has a nominal capacitance of **1000 pF** with **±10% tolerance** and a rated voltage of **2000 V DC**. It uses **X7R dielectric characteristics**, making it suitable for applications where moderate capacitance stability and high-voltage capability are required. The device should be operated within the manufacturer’s specified electrical limits to maintain reliability and performance. ## Mechanical Description The component is supplied in a **C4520 metric package**, equivalent to **EIA 1808** chip size. It is designed for surface-mount PCB installation using reflow soldering. The package includes soft termination construction, which helps reduce mechanical stress on the ceramic body and solder joints during board flexing or thermal cycling. ## Material and Construction Description The device is constructed as a multilayer ceramic capacitor using ceramic dielectric layers and internal electrode structures. The soft termination design improves board-level reliability by helping absorb mechanical strain between the PCB and capacitor body. This construction is useful in applications where vibration, thermal expansion, or board bending may affect component reliability. ## Mounting and Assembly Description The capacitor is intended for surface-mount assembly using reflow soldering. PCB land pattern, solder paste volume, component placement, and reflow profile should follow TDK recommendations. Proper spacing, voltage clearance, and creepage considerations should be applied because the component is used in high-voltage circuits. ## Application Suitability The **C4520X7R3D102K130KE** is suitable for high-voltage filtering, DC blocking, coupling, decoupling, power supply circuits, snubber circuits, inverter circuits, lighting equipment, industrial electronics, measurement equipment, and general PCB assemblies requiring a compact high-voltage ceramic capacitor. ## Design Considerations The design should account for rated voltage, capacitance tolerance, DC bias behavior, temperature characteristics, insulation resistance, soldering conditions, mechanical stress, board flex, creepage distance, and clearance distance. For high-voltage applications, PCB layout should provide adequate spacing and avoid contamination paths that may reduce insulation performance. The capacitor should not be used beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #capacitor #ceramiccapacitor #mlcc #tdk #tdkcapacitor #cseries #c4520 #x7r #highvoltagecapacitor #smdcapacitor #surfacemount #passivecomponent #electronicparts #electronicscomponents #pcbdesign #hardwaredesign #powersupply #filteringcircuit #snubbercircuit #decouplingcapacitor #industrialelectronics #componentlibrary #engineeringparts #electronicsengineering

MOSFET N-CH 20V 6.3A SOT-23 The IRLML6244TRPBF is an N-channel enhancement-mode power MOSFET from Infineon Technologies (originally International Rectifier HEXFET series). It is designed for low-voltage power switching applications such as load switching, DC-DC converters, and LED control. It comes in a compact SOT-23 (Micro3™) surface-mount package, making it suitable for space-constrained PCB designs while still handling relatively high current for its size. Key Features Drain-Source Voltage (VDS): 20 V Continuous Drain Current: up to ~6.3 A (at 25°C) Very low RDS(on): ~21 mΩ @ VGS = 4.5 V ~27 mΩ @ VGS = 2.5 V Low gate threshold voltage (~0.5–1.1 V typical range) (note: not a switching guarantee) Gate-to-source voltage rating: ±12 V Low power loss due to low on-resistance High efficiency switching for low-voltage systems Power dissipation: ~1.3 W (thermal limited in SOT-23 package) Fast switching performance (low gate charge ~8.9 nC) Operating temperature range: −55°C to +150°C RoHS compliant (lead-free, halogen-free) Typical Applications Low-side load switching (MCUs, GPIO control) LED strip / RGB LED drivers Battery-powered systems DC-DC converter switching Small motor or relay driving General-purpose power management in compact electronics Important Design Note Even though it has a low VGS(th), this MOSFET is not selected based on threshold voltage. What matters is the RDS(on) at your gate drive voltage (2.5 V / 3.3 V / 5 V) to ensure it fully turns on with minimal heating. #CommonPartsLibrary #Transistor #FET #IRLML6244 #MOSFET #NChannelMOSFET #PowerElectronics #SOT23 #Infineon #HEXFET #LEDDriver #LowSideSwitch #ElectronicsComponents

3.9 nH Unshielded Wirewound Inductor 700 mA 80mOhm Max 0603 (1608 Metric) ## Engineering Specification ## General Description The **0603CS-3N9XJRW** is a Coilcraft **0603CS series ceramic-core chip inductor** designed for RF, microwave, and high-frequency circuit applications. It provides low-value inductance in a compact surface-mount package and is suitable for impedance matching, RF filtering, tuning networks, resonant circuits, and general high-frequency signal-path designs. The component is commonly used in wireless modules, RF front-end circuits, communication equipment, test hardware, and compact printed circuit board assemblies requiring stable high-frequency inductive performance. ## Device Identification Manufacturer Part Number: **0603CS-3N9XJRW** Manufacturer: **Coilcraft** Product Series: **0603CS** Device Category: **Passive Electronic Component** Device Type: **Fixed Inductor** Inductor Type: **RF Chip Inductor** Construction Type: **Unshielded Wirewound Ceramic-Core Inductor** Mounting Type: **Surface Mount** ## Functional Description The device functions as a fixed-value RF inductor used to store magnetic energy and provide frequency-dependent impedance in electronic circuits. It is designed for high-frequency performance where low inductance value, compact size, and predictable RF behavior are required. The component can be used in matching networks, RF filters, oscillators, resonant circuits, and signal conditioning paths. ## Electrical Description The inductor has a nominal inductance of **three point nine nanohenries** with **five percent tolerance**. It is rated for **seven hundred milliamps** current and has a maximum DC resistance of **eighty milliohms**. The part provides a minimum self-resonant frequency of **six point nine gigahertz** and a minimum Q value suitable for RF circuit applications. It should be operated within the manufacturer’s specified current, temperature, and electrical limits. ## Mechanical Description The component is supplied in an **0603 surface-mount package**, also known as **1608 metric size**. It is designed for compact PCB layouts and automated pick-and-place assembly. The unshielded chip construction is suitable for high-frequency signal applications where board layout and nearby component placement are carefully controlled. ## Material and Construction Description The device uses a ceramic-core wirewound construction, which supports stable high-frequency inductance characteristics. The specified configuration includes RoHS-compliant matte tin over nickel over silver-platinum-glass frit termination, suitable for standard surface-mount soldering processes. ## Mounting and Assembly Description The **0603CS-3N9XJRW** is intended for surface-mount PCB assembly. Proper land pattern design, solder paste control, placement accuracy, and reflow soldering profile should follow Coilcraft recommendations. RF layout practices should be observed, including short trace lengths, controlled impedance routing, proper grounding, and minimized parasitic capacitance. ## Application Suitability The device is suitable for RF matching networks, wireless communication circuits, antenna tuning, filters, oscillators, resonant circuits, broadband RF designs, cellular modules, Wi-Fi and Bluetooth hardware, test equipment, and high-frequency embedded electronics. ## Design Considerations The design should account for inductance tolerance, Q factor, self-resonant frequency, DC resistance, current rating, operating temperature, layout parasitics, solder joint reliability, and interaction with nearby magnetic or conductive structures. For RF applications, the final performance should be validated in the actual PCB layout because trace geometry and component placement can affect impedance and resonance behavior. ## Hashtags #commonpartslibrary #inductor #rfinductor #chipinductor #coilcraft #coilcraftinductor #0603cs #0603component #smdinductor #surfacemount #wirewoundinductor #ceramiccoreinductor #passivecomponent #rfdesign #highfrequency #impedancematching #rffilter #wirelesshardware #communicationequipment #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

Connector Header Through Hole 18 position 0.100" (2.54mm) # TSW-118-07-G-S ## General Description The TSW-118-07-G-S is a through-hole board-to-board and wire-to-board interconnect header manufactured by Samtec. It belongs to the TSW series of standard terminal strip headers designed for reliable signal transmission in electronic assemblies, embedded systems, industrial controls, telecommunications equipment, instrumentation, and general-purpose printed circuit board applications. The component features precision-machined contacts, robust mechanical construction, and compatibility with a wide range of mating connectors. Its design supports secure electrical connections while maintaining excellent durability during repeated mating cycles and long-term operation in demanding environments. ## Key Features ### Mechanical Characteristics * Through-hole mounting configuration * Single-row terminal strip header design * Straight vertical orientation * Precision-machined contact system * High-reliability board-level interconnection ### Contact System * Gold-plated contact surface * Enhanced conductivity and signal integrity * Corrosion-resistant contact finish * Suitable for repeated insertion and removal cycles ### Electrical Characteristics * Low contact resistance * Reliable signal transmission * Suitable for low-power and signal-level applications * Stable electrical performance across operating conditions ### Material Construction * High-temperature thermoplastic insulator * Durable metallic contact structure * RoHS-compliant materials * Lead-free manufacturing compatibility ### Environmental Characteristics * Industrial-grade operating capability * Resistant to mechanical wear during mating cycles * Suitable for automated and manual assembly processes ### Application Areas * Embedded Systems * Microcontroller Development Boards * Industrial Automation Equipment * Telecommunications Hardware * Test and Measurement Instruments * Medical Electronics * Data Acquisition Systems * Prototyping Platforms * Consumer Electronic Devices * PCB Interconnection Applications ### Compliance * RoHS Compliant * Lead-Free Compatible * Industry-standard connector footprint ## Manufacturer Samtec Inc. ## Product Family TSW Series Terminal Strip Headers #Samtec #TSW11807GS #TerminalStripHeader #PCBConnector #BoardToBoardConnector #WireToBoardConnector #ElectronicsComponents #EmbeddedSystems #IndustrialElectronics #InterconnectSolutions #ThroughHoleConnector #ElectronicDesign #HardwareEngineering #PCBAssembly #CommonPartsLibrary #Connector #Header #TSW pin header 1x18 2.54mm

8 Position Wire to Board Terminal Block Horizontal with Board 0.200" (5.08mm) Through Hole ## Engineering Specification ## General Description The **1726202** is a Phoenix Contact **MKKDSN series PCB terminal block** designed for compact and reliable wire-to-board connection in printed circuit board assemblies. It is intended for applications that require secure field wiring, serviceable conductor termination, and stable electrical connection between external wiring and PCB circuitry. The component is suitable for industrial control systems, automation equipment, power interfaces, instrumentation, building controls, and general electronic hardware assemblies. ## Device Identification Manufacturer Part Number: **1726202** Manufacturer: **Phoenix Contact** Product Name: **MKKDSN 1,5/ 8-5,08** Product Family: **MKKDSN 1,5** Product Line: **COMBICON Terminals** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Termination Method: **Screw Connection with Tension Sleeve** Mounting Type: **Through-Hole PCB Mount** ## Functional Description The device functions as a fixed printed circuit board terminal block that allows external conductors to be connected directly to PCB circuits. The screw-clamp connection secures the conductor mechanically while maintaining electrical continuity through the terminal body and solder pins. This makes the component suitable for wiring interfaces that require durability, accessibility, and field-service capability. ## Mechanical Description The terminal block uses a compact green housing with a two-row terminal arrangement and side-access conductor entry. Its layout supports dense wiring connection on a printed circuit board while maintaining practical access for conductor insertion and screw tightening. The through-hole solder pins provide mechanical stability and electrical connection to the host PCB. ## Electrical Description The component is intended for low-voltage power and signal connection applications within the manufacturer’s specified current and voltage ratings. It supports conductor connection for typical industrial and control wiring requirements when used with compatible wire sizes, correct strip length, and proper tightening torque. ## Material and Contact Description The terminal block uses an insulating housing with internal conductive contact elements designed to transfer current from the inserted conductor to the PCB solder connection. The screw connection with tension sleeve helps maintain stable contact pressure and reliable conductor retention during normal operating conditions. ## Mounting and Assembly Description The **1726202** is intended for through-hole PCB soldering, including wave-solder assembly processes. The PCB layout should follow the manufacturer’s recommended hole size, pad pattern, spacing, and soldering guidelines. The component should be positioned to allow safe conductor insertion, screwdriver access, and adequate clearance from nearby parts or enclosure walls. ## Application Suitability The device is suitable for industrial control boards, automation modules, relay boards, power supply interfaces, building automation equipment, instrumentation systems, sensor wiring interfaces, signal distribution boards, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for conductor size compatibility, current carrying requirement, voltage rating, creepage and clearance spacing, tightening torque, solder joint strength, wire routing, and user access during installation or maintenance. The terminal block should not be used beyond the manufacturer’s specified electrical, thermal, or mechanical limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkkdsn #mkkdsnterminalblock #combicon #wiretoboard #screwterminal #fixedterminalblock #throughholecomponent #wavesoldering #soldermount #connector #interconnect #fieldwiring #industrialelectronics #automationequipment #controlsystems #powerinterface #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #engineeringparts #componentlibrary #electronicsengineering

5.6 nH Unshielded Wirewound Inductor 700 mA 75mOhm Max 0603 (1608 Metric) ## Engineering Specification ## General Description The **0603CS-5N6XJRW** is a Coilcraft **0603CS series ceramic-core chip inductor** designed for RF, microwave, and high-frequency electronic circuit applications. It provides low-value inductance in a compact surface-mount package and is suitable for impedance matching, RF filtering, tuning networks, resonant circuits, oscillators, and general high-frequency signal-path designs. The component is commonly used in wireless modules, communication equipment, RF front-end circuits, test hardware, and compact printed circuit board assemblies requiring stable inductive performance at high frequencies. ## Device Identification Manufacturer Part Number: **0603CS-5N6XJRW** Manufacturer: **Coilcraft** Product Series: **0603CS** Device Category: **Passive Electronic Component** Device Type: **Fixed Inductor** Inductor Type: **RF Chip Inductor** Construction Type: **Unshielded Wirewound Ceramic-Core Inductor** Mounting Type: **Surface Mount** ## Functional Description The device functions as a fixed-value RF inductor used to provide frequency-dependent impedance, energy storage, resonance control, and impedance transformation in electronic circuits. It is designed for high-frequency operation where compact size, low inductance value, and stable RF behavior are required. The component is suitable for use in matching networks, filters, resonant circuits, oscillators, and RF signal conditioning stages. ## Electrical Description The inductor has a nominal inductance of **five point six nanohenries** with **five percent tolerance**. It is rated for **seven hundred milliamps** current and has a maximum DC resistance of **seventy-five milliohms**. The device is intended for RF applications requiring low resistance, high self-resonant frequency, and predictable inductive behavior. It should be operated within the manufacturer’s specified electrical, thermal, and current limits. ## Mechanical Description The component is supplied in an **0603 surface-mount package**, also known as **1608 metric size**. Its compact chip construction supports dense PCB layouts and automated pick-and-place assembly. The unshielded construction is suitable for RF signal applications where board layout, component spacing, and parasitic effects are properly controlled. ## Material and Construction Description The device uses a ceramic-core wirewound construction to support stable high-frequency inductance characteristics. The termination system is designed for standard surface-mount soldering processes and is suitable for compact RF circuit board assemblies. ## Mounting and Assembly Description The **0603CS-5N6XJRW** is intended for surface-mount PCB assembly using standard reflow soldering processes. Proper land pattern design, solder paste control, placement accuracy, and reflow profile should follow Coilcraft recommendations. RF layout practices should be applied, including short trace lengths, controlled impedance routing, minimized parasitic capacitance, and appropriate spacing from nearby conductive or magnetic structures. ## Application Suitability The device is suitable for RF matching networks, antenna tuning, wireless communication circuits, RF filters, resonant circuits, oscillators, broadband RF designs, cellular modules, Wi-Fi and Bluetooth hardware, test equipment, and compact high-frequency embedded electronics. ## Design Considerations The design should account for inductance tolerance, Q factor, self-resonant frequency, DC resistance, current rating, operating temperature, PCB layout parasitics, solder joint reliability, and interaction with nearby components. For RF applications, final performance should be validated in the actual PCB layout because trace geometry, grounding, and component placement can affect impedance and resonance behavior. ## Hashtags #commonpartslibrary #inductor #rfinductor #chipinductor #coilcraft #coilcraftinductor #0603cs #0603component #smdinductor #surfacemount #wirewoundinductor #ceramiccoreinductor #passivecomponent #rfdesign #highfrequency #impedancematching #rffilter #antennatuning #wirelesshardware #communicationequipment #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #componentlibrary #engineeringparts #electronicsengineering

Digital Potentiometer 10k Ohm 4 Circuit 257 Taps I2C Interface 20-TSSOP # Engineering Specification ## Product Name MCP4461-103E/ST ## General Description MCP4461-103E/ST is a non-volatile digital potentiometer integrated circuit designed to provide electronically programmable resistance adjustment for analog and mixed-signal applications. The device enables precise digital control of resistance values through a serial communication interface, eliminating the need for manual potentiometer adjustments and enhancing system automation capabilities. The component integrates multiple resistor networks, non-volatile memory, and digital control logic within a compact package, making it suitable for signal conditioning, gain adjustment, calibration, offset trimming, volume control, and configuration management applications. The design supports reliable operation in embedded systems, industrial electronics, instrumentation equipment, communication devices, and consumer products requiring programmable analog control. The device is optimized for ease of integration, low power consumption, repeatable performance, and long-term reliability. Non-volatile memory functionality allows resistance settings to be retained during power interruptions, supporting consistent system behavior and simplified startup configuration. ## Functional Requirements ### Digital Resistance Control The device shall provide programmable resistance adjustment through a digital communication interface. ### Non-Volatile Memory Operation The device shall retain programmed resistance settings when power is removed and restore stored values upon power-up. ### Multi-Channel Adjustment The device shall support independent control of multiple resistance channels for flexible system configuration. ### Analog Signal Conditioning The device shall support use in gain control, calibration, bias adjustment, offset correction, and signal tuning applications. ## Electrical Requirements ### Power Supply Compatibility The device shall operate from standard low-voltage electronic power supply rails suitable for embedded and industrial systems. ### Digital Communication The device shall support serial communication for configuration, programming, and control of internal resistance networks. ### Resistance Network Performance The device shall provide repeatable and stable resistance adjustment characteristics throughout normal operating conditions. ### Low Power Operation The device shall minimize power consumption while maintaining functional performance and memory retention capability. ### Noise and Signal Integrity The design shall support accurate analog signal processing with minimal impact on system performance. ## Mechanical Requirements ### Package Construction The component shall be supplied in a surface-mount package suitable for automated PCB assembly processes. ### Board Integration The device shall support standard printed circuit board mounting practices and electronic manufacturing workflows. ### Structural Reliability The package shall maintain electrical and mechanical integrity during handling, assembly, and operational service. ## Environmental Requirements ### Operating Environment The device shall operate reliably within environmental conditions commonly encountered in commercial and industrial electronic equipment. ### Storage Conditions The component shall maintain functional and physical integrity during storage, transportation, and inventory management activities. ### Environmental Robustness The design shall support stable operation under expected temperature and humidity variations within specified application environments. ## Quality Requirements ### Reliability The device shall provide consistent long-term performance with stable resistance characteristics and memory retention capability. ### Verification Electrical functionality, communication performance, memory operation, and resistance adjustment behavior shall be validated through applicable testing procedures. ### Compliance The product shall conform to relevant semiconductor manufacturing, quality assurance, and electronic component standards. ## Documentation Requirements Technical documentation shall include device functionality, communication interface requirements, programming guidelines, application recommendations, electrical characteristics, package information, and reliability considerations. ## Classification Tags #MCP4461 #MCP4461103EST #DigitalPotentiometer #NonVolatileMemory #IntegratedCircuit #ICComponent #AnalogElectronics #MixedSignalDesign #SignalConditioning #GainControl #CalibrationCircuit #EmbeddedSystems #ElectronicComponents #ElectricalEngineering #PCBDesign #CircuitDesign #IndustrialElectronics #Instrumentation #CommonPartsLibrary #EngineeringSpecification #ComponentLibrary #TechnicalDocumentation #SystemIntegration #HardwareDevelopment #ReliabilityEngineering

Polymeric PTC Resettable Fuse 16V 3 A Ih Through Hole Radial, Disc # Engineering Specification ## Product Name RGEF300 ## General Description RGEF300 is a resettable polymeric positive temperature coefficient protection device designed to safeguard electronic circuits against overcurrent and fault conditions. The component is intended for use in power distribution systems, low-voltage DC rails, and electronic assemblies where temporary overload protection and automatic recovery are required. The device operates by increasing its internal resistance when subjected to excessive current or elevated temperature conditions, thereby limiting fault current and protecting downstream circuitry. Once the fault condition is removed and the device cools, it returns to a low-resistance state, allowing normal operation to resume without the need for manual replacement. RGEF300 is widely used in industrial electronics, consumer devices, automotive subsystems, communication equipment, and embedded systems where reliable overcurrent protection and system uptime are critical. Its radial-leaded configuration supports straightforward integration into through-hole PCB designs and legacy circuit architectures. The design emphasizes consistent trip behavior, stable reset characteristics, and long-term reliability under repeated fault conditions. It is suitable for applications requiring self-resetting protection elements that reduce maintenance requirements and improve system resilience. ## Functional Requirements ### Overcurrent Protection The device shall limit current flow during fault conditions by increasing resistance when exposed to excessive current. ### Automatic Reset The device shall return to a low-resistance state once normal operating conditions are restored and thermal conditions stabilize. ### Fault Isolation The device shall provide temporary isolation of downstream circuitry during overcurrent events. ### System Protection Support The component shall support use in electronic systems requiring reusable protection elements for power input and distribution paths. ## Electrical Requirements ### Normal Operation The device shall maintain low resistance under normal operating current conditions to minimize power loss. ### Trip Behavior The device shall transition to a high-resistance state when subjected to fault-level current conditions. ### Thermal Response The device shall respond to both electrical current and self-heating effects to initiate protective action. ### Recovery Characteristics The device shall restore normal conduction after fault clearance and thermal recovery. ## Mechanical Requirements ### Radial Leaded Construction The device shall be provided in a through-hole radial package suitable for PCB mounting. ### Structural Integrity The component shall maintain mechanical stability during soldering, handling, and operational thermal cycling. ### Board Integration The device shall be compatible with standard PCB layouts used in power protection circuits. ## Environmental Requirements ### Operating Conditions The device shall operate reliably in industrial, consumer, and embedded electronic environments. ### Thermal Performance The device shall tolerate repeated heating and cooling cycles associated with fault events. ### Storage and Handling The component shall maintain electrical and mechanical integrity during storage and transportation. ## Quality Requirements ### Reliability The device shall support repeated fault recovery cycles without permanent degradation under specified operating conditions. ### Verification Electrical trip behavior, resistance recovery, and thermal response shall be validated through standard qualification testing. ### Compliance The product shall conform to applicable safety and electronic component standards for resettable overcurrent protection devices. ## Documentation Requirements Technical documentation shall include application guidelines, derating considerations, PCB layout recommendations, fault behavior characteristics, and integration practices for circuit protection design. ## Classification Tags #RGEF300 #PTCResettableFuse #Polyfuse #PPTC #OvercurrentProtection #CircuitProtection #ResettableFuse #PowerProtection #FaultProtection #ThermalProtection #ElectronicComponents #ElectricalEngineering #PCBDesign #PowerDistribution #IndustrialElectronics #AutomotiveElectronics #EmbeddedSystems #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #ReliabilityEngineering #SelfResettingProtection

Isolated Module DC DC Converter 2 Output 12 ~ 15V -12 ~ -15V 125mA, 125mA 18V - 36V Input The CC3-2412DF-E is an isolated DC-DC converter module designed to provide efficient and reliable power conversion in industrial, telecommunications, instrumentation, and embedded electronic systems. The module converts a regulated DC input voltage into isolated dual-output DC supplies while maintaining electrical isolation between the input and output stages. Its compact encapsulated design simplifies PCB integration and enhances system reliability by reducing the need for external conversion circuitry. The device is optimized for applications requiring isolated power rails, noise reduction, and protection against ground loop interference. Engineering Specifications Manufacturer: TDK-Lambda Part Number: CC3-2412DF-E Device Type: Isolated DC-DC Converter Module Conversion Topology: Isolated Power Conversion Input Voltage: Nominal DC Input Operation Output Configuration: Dual Output Output Regulation: Regulated DC Output Isolation Type: Galvanic Isolation Efficiency: High-Efficiency Power Conversion Protection Features: Short Circuit Protection and Overload Tolerance Package Type: Encapsulated Through-Hole Module Mounting Style: Through-Hole Operating Temperature Range: Industrial Grade Reliability: Designed for Continuous Operation RoHS Compliant: Yes Applications: Industrial Automation, Telecommunications Equipment, Embedded Systems, Instrumentation, Data Acquisition Systems, Process Control Equipment, Power Distribution Circuits, Isolated Interface Designs Key Features Isolated input-to-output power conversion Dual regulated output architecture Compact PCB-mount package High efficiency operation Reduced electrical noise and ground loop interference Reliable performance in industrial environments Simplified power supply design integration Robust protection against abnormal operating conditions Suitable for mixed-signal and sensitive analog systems Long operational lifespan and stable output characteristics #CC32412DFE #TDKLambda #DCDCConverter #IsolatedPowerSupply #PowerModule #PowerElectronics #EmbeddedSystems #IndustrialElectronics #PowerConversion #GalvanicIsolation #Telecommunications #Instrumentation #AutomationSystems #PCBDesign #ElectronicComponents #DualOutput #PowerManagement #IndustrialAutomation #ElectricalEngineering #PowerSupplyDesign

10 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold The SFM-105-02-X-D-A is a high-reliability dual-row socket connector designed for board-to-board and mezzanine interconnection applications. Manufactured by Samtec, this connector provides a compact and durable solution for connecting printed circuit boards in embedded systems, industrial electronics, communications equipment, test instruments, and high-performance computing platforms. The connector features precision-machined contacts that ensure consistent electrical performance, excellent mating reliability, and long operational life. Its low-profile design and high-density contact arrangement make it suitable for applications requiring space-efficient interconnect solutions while maintaining signal integrity and mechanical robustness. Engineering Specifications Manufacturer: Samtec Part Number: SFM-105-02-X-D-A Series: SFM Series Connector Type: Board-to-Board Socket Connector Contact System: Precision Socket Contacts Row Configuration: Dual Row Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Temperature Thermoplastic Mating Compatibility: Standard Samtec Header Systems Electrical Performance: High-Reliability Signal Interconnection Mechanical Durability: High Mating Cycle Life Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Control Equipment, Communication Systems, Data Acquisition Platforms, Instrumentation, Test Equipment, Computing Hardware, PCB Interconnect Solutions Key Features High-density dual-row socket configuration Precision-machined contacts for reliable electrical performance Gold-plated contact interface for enhanced conductivity and durability Compact footprint for space-constrained designs Excellent mating alignment and retention characteristics High mechanical durability for repeated insertion cycles Suitable for board stacking and mezzanine interconnections Compatible with a wide range of Samtec header connectors Designed for industrial and commercial electronic systems Supports reliable signal transmission in high-performance applications #SFM10502XDA #Samtec #BoardToBoardConnector #SocketConnector #DualRowConnector #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #CommunicationSystems #Instrumentation #DataAcquisition #MezzanineConnector #ThroughHoleConnector #ElectronicComponents #PCBDesign #SignalIntegrity #HighReliability #ConnectorTechnology #EmbeddedHardware

Standard (General Purpose) Amplifier 4 Circuit Rail-to-Rail 14-TSSOP The ADA4096-4ARUZ-R7 is a precision quad operational amplifier designed for industrial, instrumentation, automotive, and general-purpose signal conditioning applications. It features rail-to-rail input and output operation, allowing accurate signal processing across a wide supply voltage range while maintaining low offset voltage, low bias current, and high stability. The device incorporates overvoltage protection on the inputs, enabling robust performance in harsh operating environments and fault-tolerant designs. Its combination of precision, low power consumption, and wide dynamic range makes it suitable for sensor interfaces, data acquisition systems, process control equipment, battery-powered devices, and measurement instrumentation. Engineering Specifications Manufacturer: Analog Devices Part Number: ADA4096-4ARUZ-R7 Device Type: Precision Operational Amplifier Amplifier Configuration: Quad Input Stage: Rail-to-Rail Output Stage: Rail-to-Rail Supply Voltage Range: Wide Operating Range Input Overvoltage Protection: Integrated Input Bias Current: Low Input Offset Voltage: Low Noise Performance: Low Noise Operation Gain Bandwidth Product: Optimized for Precision Signal Conditioning Slew Rate: Suitable for General-Purpose Analog Applications Power Consumption: Low Power Package Type: Thin Shrink Small Outline Package Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Sensor Interfaces, Data Acquisition Systems, Industrial Control, Instrumentation, Medical Electronics, Process Monitoring, Battery-Powered Equipment, Analog Signal Conditioning Key Features Rail-to-rail input and output architecture Input overvoltage protection for enhanced robustness Low offset voltage for precision measurements Low bias current for high-impedance sensor applications Stable operation across a wide supply range Suitable for single-supply and dual-supply designs Optimized for industrial and instrumentation environments #ADA4096 #ADA40964ARUZR7 #AnalogDevices #OperationalAmplifier #OpAmp #PrecisionAmplifier #RailToRail #SignalConditioning #InstrumentationAmplifier #IndustrialElectronics #DataAcquisition #SensorInterface #AnalogDesign #PCBDesign #EmbeddedSystems #SurfaceMount #LowPowerElectronics #ElectronicComponents

The 1N4148 SOD-323 is a high-speed switching diode designed for general-purpose signal switching, fast signal processing, and protection applications in compact electronic circuits. Utilizing fast recovery characteristics and low junction capacitance, this diode is widely used in digital circuits, communication equipment, consumer electronics, industrial control systems, and embedded devices. The device is optimized for high-speed switching performance, enabling rapid response to changing signal conditions while maintaining low power consumption. Its compact SOD-323 surface-mount package makes it ideal for space-constrained PCB layouts and high-density electronic assemblies. The 1N4148 SOD-323 is commonly employed for signal routing, logic circuit protection, voltage clamping, waveform shaping, and general-purpose switching functions where fast response and reliable operation are required. Features High-speed switching diode Fast reverse recovery characteristics Low forward voltage drop Low junction capacitance Low leakage current High reliability construction Compact SOD-323 surface-mount package Suitable for high-frequency applications Excellent switching performance RoHS-compliant construction available Compatible with automated assembly processes Wide operating temperature capability Electrical Characteristics Silicon switching diode technology Fast signal switching operation Low capacitance design Low reverse leakage performance High-speed recovery behavior Stable electrical characteristics Optimized for digital and analog signal applications Suitable for low-current switching circuits Applications Signal switching circuits Logic signal routing Communication equipment Embedded systems Consumer electronics Industrial control systems Protection circuits Waveform shaping networks Signal detection circuits High-frequency switching applications Test and measurement equipment General-purpose electronic designs Package Information Package Type: SOD-323 Surface-mount technology Compact PCB footprint Suitable for automated pick-and-place assembly High-density circuit integration capability Optimized for space-constrained applications #commonpartslibrary #semiconductor #diode #switchingdiode #signaldiode #highspeedswitching #circuitprotection #electronics #smd #sod323 #consumerelectronics #industrialelectronics #embeddedsystems #communicationelectronics #analogdesign #digitaldesign #pcbdesign #electroniccomponents

The TPS63802DLAR is a highly integrated synchronous buck-boost DC-DC converter designed to provide a regulated output voltage when the input voltage is either above, below, or equal to the desired output voltage. The device automatically transitions between buck and boost operating modes to maximize efficiency across a wide input range. It is optimized for battery-powered and portable electronic applications requiring high power conversion efficiency, low quiescent current, compact solution size, and stable operation under varying load conditions. The TPS63802DLAR is commonly used in wearable devices, IoT products, wireless modules, sensors, handheld electronics, and embedded systems. Engineering Specification Device Type Synchronous Buck-Boost DC-DC Converter Topology Automatic Buck and Boost Mode Operation Output Configuration Single Adjustable Output Control Method Current Mode Control Architecture Switching Operation High-Frequency Synchronous Switching Regulation Power Conversion Step-Up and Step-Down Voltage Regulation Efficiency Characteristics High Conversion Efficiency Across Wide Input and Load Conditions Quiescent Current Optimized for Low-Power and Battery-Operated Applications Protection Features Overcurrent Protection Thermal Shutdown Protection Short-Circuit Protection Undervoltage Lockout Protection Soft-Start Functionality Package Style VSON Surface-Mount Package Mounting Type Surface Mount Technology Input Source Compatibility Single-Cell and Multi-Cell Battery Systems USB Power Sources Portable Power Systems Applications Battery-Powered Electronics Wearable Devices Internet of Things Equipment Wireless Communication Modules Portable Medical Devices Handheld Consumer Electronics Embedded Control Systems Industrial Sensors Data Acquisition Systems Features Automatic Buck-Boost Transition Integrated Power Switches Low Quiescent Current Operation High Power Density Design Compact Footprint Fast Transient Response Wide Input Voltage Compatibility High Reliability Performance Optimized for Portable Applications RoHS Compliant Construction Manufacturer Texas Instruments #commonpartslibrary #integratedcircuit #powermanagement #dcdcconverter #buckboost #powersupply #voltageregulator #batterypowered #embeddedsystems #portableelectronics #iot #texasinstruments #powerelectronics #smps #electroniccomponents

Voltage Level Translator Bidirectional 1 Circuit 2 Channel 26Mbps 8-XSON (1.35x1) The TCA39416DTWR is a high-performance LED driver and multiplexer IC designed for precise control of multi-channel lighting applications. It integrates constant-current drivers, digital dimming capability, and multiplexing functionality to efficiently manage a large array of LEDs in industrial, automotive, display, and general-purpose lighting systems. The device supports high-speed operation and flexible channel configuration, ensuring uniform brightness control, low electromagnetic interference, and robust performance in space-constrained designs. Its compact surface-mount package and integrated control features make it ideal for embedded lighting solutions requiring reliable, accurate, and scalable LED management. Engineering Specifications Manufacturer: Texas Instruments Part Number: TCA39416DTWR Device Type: LED Driver and Multiplexer IC Channel Count: Multi-Channel LED Control Driver Type: Constant-Current LED Driver Dimming Control: Digital PWM Dimming Supported Multiplexing: Integrated Multiplexer Functionality Input Interface: Digital Control Inputs Output Configuration: Sinking LED Channels Supply Voltage Range: Wide Operating Range Switching Frequency: High-Speed LED Operation Thermal Management: Efficient Power Dissipation Design Package Type: TSSOP Surface-Mount Package Mounting Style: Surface Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Industrial LED Lighting, Automotive Light Arrays, Display Backlighting, Status Indicators, Embedded LED Systems, Digital Signage, Instrumentation Panels, Multi-Channel LED Control Key Features Multi-channel constant-current LED drivers Integrated digital dimming via PWM control Built-in multiplexing for efficient channel management Compact surface-mount package for PCB integration High-speed operation for flicker-free lighting Low power consumption and thermal optimization Reliable performance in industrial and automotive environments Uniform brightness control across channels Flexible configuration for scalable LED arrays Designed for embedded lighting and display applications #TCA39416DTWR #TexasInstruments #LEDDriver #MultiplexerIC #MultiChannelLED #PWMDimming #EmbeddedLighting #IndustrialElectronics #AutomotiveLighting #DisplayBacklight #LEDControl #SurfaceMountIC #ElectronicComponents #PCBDesign #LEDArray #HighSpeedLED #IndustrialGrade #SignalControl #PowerEfficient #LightingElectronics

64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black The PCIE-064-02-X-D-TH is a high-density PCI Express edge connector designed for reliable board-to-board and card-to-host connections in high-speed data communication applications. Manufactured by Samtec, this connector supports PCI Express signaling standards while providing robust mechanical and electrical performance for high-frequency, high-bandwidth systems. Its through-hole mounting and dual-row design ensure secure attachment to the PCB, high mating retention, and long operational life. The connector is ideal for computer peripherals, server systems, embedded computing platforms, networking devices, and industrial electronic equipment where signal integrity, mechanical reliability, and high-density interconnects are critical. Engineering Specifications Manufacturer: Samtec Part Number: PCIE-064-02-X-D-TH Series: PCI Express Edge Connector Connector Type: Board-to-Board / Card Edge Connector Contact Configuration: Dual-Row High-Density Contacts Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Surface Housing Material: High-Temperature Thermoplastic Signal Performance: PCI Express Standard Compliant Electrical Performance: High-Speed Data Transmission Mechanical Durability: High Mating Cycle Life Orientation: Right Angle / Standard Edge Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: PCI Express Expansion Cards, High-Speed Computing Systems, Server and Data Center Hardware, Embedded Platforms, Networking Equipment, Industrial Computing, High-Bandwidth Digital Interfaces, Board-Level Interconnects Key Features High-density dual-row PCIe edge contacts Through-hole mounting for robust PCB attachment Gold-plated contact interface for reliable signal transmission Supports high-speed PCI Express signaling Compact, high-density design for space-constrained PCBs Long mechanical life with repeated mating cycles Compatible with standard PCI Express cards and connectors Reliable operation in industrial and commercial environments Ideal for embedded computing, server, and networking applications Ensures signal integrity for high-bandwidth data communication #PCIE06402XDTH #Samtec #PCIeConnector #EdgeConnector #BoardToBoard #HighSpeedInterconnect #HighDensityConnector #ThroughHole #IndustrialElectronics #EmbeddedSystems #ServerHardware #NetworkingEquipment #ElectronicComponents #PCBDesign #HighBandwidth #DataCommunication #PCIExpress #ExpansionCardConnector #MechanicalReliability #ElectronicInterconnect