GPS01-TD module is a quad-mode Mini GPS module that supports BDS/GPS/GLONASS/Galileo/QZSS/SBAS and fully supports BeiDou B3, which can provide users with high quality, strong anti-jamming and low-power positioning and navigation solutions.

8-Bit to 12-Bit Low-Power Angle Sensor with Integrated Wake-Up Angle Detection #ultralibrarian

The AP22916 is a small, low leakage, single P-channel power MOSFET designed for low-power consumption and load-switching applications. LOAD SWITCH X1-WLB0808-4 T&R 3K Power Switch/Driver 1:1 P-Channel 2A X1-WLB0808-4

Low-Power Rail-To-Rail Output 12-Bit Serial Input DAC SOT-23-8

The CH32V203 is an industrial-grade enhanced low-power general-purpose MCU based on 32-bit RISC-V core. RISC-V WCH MCU TSSOP*4.4x6.5mm*P0.65mm*

Humidity, Temperature 0 ~ 100% RH I2C ±1.8% RH 4 s Surface Mount The SHT41-AD1B-R3 is a high-precision digital humidity and temperature sensor developed by Sensirion. It integrates calibrated sensing elements, analog signal processing, and a digital communication interface within a compact surface-mount package optimized for space-constrained embedded applications. The device is designed for accurate environmental monitoring across industrial, consumer, HVAC, portable electronics, and IoT systems. The sensor utilizes Sensirion CMOSens® technology to provide stable long-term performance, fast response time, and excellent repeatability under varying environmental conditions. Factory calibration enables direct digital output without the need for external calibration circuitry. The integrated I²C interface simplifies system integration with microcontrollers and embedded processors. The SHT41-AD1B-R3 is engineered for low-power operation, making it suitable for battery-powered and energy-efficient designs. Its compact DFN package supports automated assembly processes and high-density PCB layouts. The device also incorporates advanced internal diagnostics and checksum protection to improve communication reliability and data integrity. Features High-accuracy relative humidity sensing High-accuracy temperature measurement Fully calibrated and linearized digital output I²C digital communication interface Low power consumption optimized for portable systems Fast response and measurement conversion time Excellent long-term stability and repeatability Integrated heater functionality for condensation mitigation Wide operating voltage range Compact surface-mount DFN package Factory-trimmed and tested performance High immunity to environmental stress and contamination Low drift over product lifetime Suitable for reflow soldering processes Electrical Characteristics Supply voltage supports low-voltage embedded systems Digital communication compatible with standard I²C hosts Low standby current consumption Optimized active measurement current Integrated CRC data protection for communication integrity Environmental Characteristics Wide operating temperature range Wide relative humidity operating range Designed for high reliability in industrial and consumer environments Resistant to moisture-induced performance degradation Supports long operational lifetime with stable calibration Package Information Compact DFN surface-mount package Moisture-sensitive device suitable for automated assembly RoHS compliant and halogen-free construction Tape-and-reel packaging configuration for production assembly Applications Environmental monitoring systems HVAC and climate control equipment Smart home and IoT devices Portable electronics Industrial automation systems Data loggers and instrumentation Weather monitoring equipment Indoor air quality monitoring Battery-powered sensor nodes Consumer electronic products #commonpartslibrary #sensor #temperature #humidity #environmentalsensor #i2c #embedded #industrial #iot #sensirion

1 MHz, Low-Power Op Amp 8-SOIC #CommonPartLibrary #IntegratedCircuits #Amplifiers #Instrumentation #OPAmp #BufferAmps #Linear #MCP6002

Female Header 38 Position 2.54mm Pitch Dual Row Through Hole -40℃~+105℃ X6521FV-2x19-C85D32 is a 2.54 mm pitch, dual-row female header connector manufactured by XKB Connection. It is designed for through-hole PCB mounting and provides a reliable board-to-board or wire-to-board interconnection solution in industrial, consumer, and embedded electronic applications. The connector features 38 positions (2×19) arranged in two rows and supports moderate power and signal transmission requirements. Key Features Connector Type: Female Header / Receptacle Number of Positions: 38 contacts (2×19 configuration) Pitch: 2.54 mm (0.1 inch) Row Spacing: 2.54 mm Mounting Type: Through-Hole (THT) Orientation: Top-entry Rated Current: 3 A per contact Rated Voltage: 250 V Contact Material: Brass Contact Plating: Gold-plated contacts for improved conductivity and corrosion resistance Insulator Height: 8.5 mm Operating Temperature Range: -40°C to +105°C Hole Type: Square socket contacts RoHS Compliant Typical Applications Microcontroller and development boards Industrial control systems Embedded electronics Board-to-board interconnections Prototyping and evaluation hardware Signal and low-power distribution connections #CommonPartsLibrary #Connector

High Performance and Low-power Processor for Digital Media Application #CommonPartsLibrary #IntegratedCircuits #Processor

BGA-565(15.5x14.4) Microcontrollers, Quad-core ARM Cortex-A55 processor The RK3566 is a high-performance, low-power 64-bit application processor developed by Rockchip for AIoT, industrial control, smart displays, tablets, embedded systems, and single-board computers. It integrates a quad-core ARM Cortex-A55 CPU, Mali-G52 GPU, AI acceleration engine (NPU), advanced multimedia processing, and a rich set of connectivity interfaces, making it suitable for Linux- and Android-based applications requiring efficient performance and multimedia capabilities. Key Features Quad-core 64-bit ARM Cortex-A55 processor operating up to 2.0 GHz. ARM Mali-G52 2EE GPU with support for OpenGL ES 3.2, OpenCL 2.0, and Vulkan 1.1. Integrated NPU delivering up to 1 TOPS AI computing performance. Supports DDR3, DDR3L, DDR4, LPDDR3, LPDDR4, and LPDDR4X memory. Hardware video decoding up to 4K@60fps for H.264, H.265, and VP9 formats. Hardware video encoding up to 1080p@60fps for H.264 and H.265. Built-in 8MP ISP with HDR image processing support. Multiple display interfaces including HDMI 2.0, eDP, MIPI-DSI, LVDS, RGB, and E-Ink. High-speed connectivity with USB 3.0, USB 2.0, PCIe, SATA, Gigabit Ethernet, SDIO, and eMMC 5.1. Rich peripheral support including UART, SPI, I²C, PWM, ADC, I²S, PDM, and GPIO. Optimized for Android, Linux, industrial HMI, smart home, edge computing, and AIoT applications. Manufactured using a 22 nm process for improved power efficiency. #RK3566 #Rockchip #ARMCortexA55 #MaliG52 #AIoT #EmbeddedSystems #SingleBoardComputer #Linux #Android #IndustrialControl #SmartDisplay #EdgeComputing #SoC #Processor #NPU #4KVideo #IoT #Electronics #HardwareDesign #PCBDesign

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

SDRAM - Mobile LPDDR4 Memory IC 48Gbit 2.133 GHz MT53E1536M32D4DT-046 WT:A is a high-density 48Gb (6GB) LPDDR4/LPDDR4X SDRAM memory device from Micron Technology. It is designed for high-performance, low-power applications requiring fast memory bandwidth and efficient power management. The device features a 32-bit data bus, supports data rates up to 4266 MT/s, and is packaged in a compact 200-ball FBGA, making it suitable for embedded computing, industrial systems, networking equipment, AI edge devices, automotive electronics, and mobile platforms. Key Features 48Gb (6GB) LPDDR4/LPDDR4X SDRAM Organized as 1.5G × 32 bits Data transfer rates up to 4266 MT/s Maximum clock frequency of 2133 MHz Low-power operation with 1.1V core supply 32-bit memory interface 200-ball FBGA package JEDEC LPDDR4-compliant architecture Per-bank refresh support Temperature-compensated refresh Self-refresh and deep power-down modes Partial-array self-refresh capability High bandwidth with reduced power consumption Optimized for compact embedded designs Operating temperature range: –30°C to +85°C Typical Applications Embedded Linux computers Single-board computers (SBCs) AI and edge computing platforms Industrial automation systems Networking and telecommunications equipment Automotive infotainment and control systems Tablets and mobile devices FPGA and SoC-based designs #commonpartslibrary #integratedcircuit #memory #dram #sdram #lpddr4 #lpddr4x #mobiledram #micron #embeddedsystems #embeddedcomputing #industrialelectronics #automotiveelectronics #edgecomputing #artificialintelligence #networking #telecommunications #highspeedmemory #lowpowerdesign #computerhardware #electroniccomponents #semiconductor #datasheet #fbga #memorychip #electronicsdesign #pcbdesign #hardwareengineering #electronicengineering #systemonchip #fpga #iot #internetofthings #computermemory #digitalelectronics #surfaceMount #smt #bga #storage #highperformancecomputing #hpc #mobiledevices #industrialautomation #electronicdesign #componentlibrary #fluxlibrary #parametricpart #eda #schematic #pcb #electronicdesignautomation #chipdesign #embeddedhardware #memorymodule #lowpowerelectronics #highbandwidthmemory #electronics #hardwaredevelopment #engineering #electricalengineering

137 MHz to 1020 MHz Low Power Long Range Transceiver, spreading factor from 6 to 12, LoRA, QFN-28 low-power lora transceiver QFN*1EP*6x6mm*P0.65mm*

220 Ohms ±5% 0.25W, 1/4W Through Hole Resistor Axial Automotive AEC-Q200 Carbon Film This component is a fixed-value carbon film resistor intended for general-purpose electronic circuits. It is designed to provide stable resistance with reliable performance under typical operating conditions. The resistor is suitable for applications requiring moderate precision and dependable thermal characteristics, making it appropriate for use in consumer electronics, control circuits, and signal conditioning. Its construction ensures consistent electrical behavior, good noise performance, and durability over time. Electrical Characteristics The nominal resistance value is two hundred twenty ohms. Tolerance is within a standard general-purpose range, suitable for non-critical precision applications. The resistor exhibits stable performance across typical ambient temperature variations, with predictable resistance drift characteristics inherent to carbon film technology. Power Rating The device is rated for low-power dissipation applications, consistent with standard small-form-factor through-hole resistors used in printed circuit board assemblies. Construction and Materials The resistor element is formed from a deposited carbon film on a ceramic substrate, providing a balance between cost, stability, and noise performance. Leads are axial and suitable for through-hole mounting. The body is coated for insulation and environmental protection. Environmental and Reliability Considerations The component is designed to operate reliably under standard environmental conditions, including moderate temperature and humidity ranges. It demonstrates acceptable long-term stability for general electronic use, with resistance changes remaining within specified tolerance limits over time. Applications Suitable for voltage division, current limiting, biasing, and general signal conditioning in analog and digital circuits where high precision is not critical. #CommonPartLibrary #ThroughHole #Resistor #Axial

Flat, 5 mm 2 Form C, 2 A, relays Telecom Relay DPDT (2 Form C) Surface Mount The TQ2SA-L2-3V-Z is a compact surface-mount DPDT (2 Form C) telecom/signal relay from Panasonic Industry designed for low-power switching applications. It features a dual-coil latching mechanism, allowing the relay to maintain its state without continuous coil power, making it suitable for battery-powered and energy-efficient systems. This relay is commonly used in telecommunications equipment, industrial controls, measurement devices, and embedded electronic systems. Key Features DPDT (2 Form C) contact configuration 3V DC dual-coil latching relay Low power consumption: approximately 140 mW Compact SMD package: only 5.6 mm height Surface-mount gull-wing terminals Sealed construction for automatic washing compatibility High switching capability: up to 2 A Wide switching voltage range: up to 125 VAC / 220 VDC Fast operate/release time: approx. 4 ms High dielectric strength and surge resistance Wide operating temperature: −40°C to +85°C Gold-clad AgNi contacts for reliable low-level signal switching Tape-and-reel packaging (“Z” suffix) for automated assembly #CommonPartsLibrary #relay

STN1110-IMM General Description The STN1110-IMM is a multiprotocol OBD-II to UART interpreter integrated circuit designed for automotive diagnostic, telematics, and vehicle communication applications. The device translates OBD-II network traffic into a UART serial data stream for communication with external microcontrollers, embedded processors, and host systems. It supports all legislated OBD-II protocols and provides compatibility with ELM327-based software while offering enhanced processing performance, expanded memory resources, advanced message filtering, firmware upgrade capability, and low-power operation. The device is intended for use in automotive diagnostic tools, fleet management systems, vehicle monitoring equipment, data acquisition systems, and embedded automotive communication products. Engineering Specification Part Number: STN1110-IMM Component Type: OBD-II to UART Interpreter Integrated Circuit Device Category: Automotive Communication Interface IC Package Type: QFN Mounting Type: Surface Mount Device (SMD) Interface Type: * UART * OBD-II Supported Protocols: * ISO 15765-4 CAN * ISO 14230-4 KWP2000 * ISO 9141-2 * SAE J1850 PWM * SAE J1850 VPW Key Features: * Multiprotocol OBD-II support * ELM327 command compatibility * Enhanced ST command extensions * High-speed UART communication * Advanced message filtering * Firmware upgrade capability * Large message buffering * Low-power operation * Automotive diagnostic interface functionality Applications: * OBD-II Scan Tools * Vehicle Diagnostics * Automotive Telematics * Fleet Management Systems * Data Logging Equipment * Embedded Automotive Controllers * Emissions Monitoring Systems * Vehicle Communication Gateways Tags #commonpartslibrary #integratedcircuit #ic #automotive #automotiveelectronics #automotivediagnostics #obdii #obd #uart #vehiclecommunication #telematics #embeddedsystems #communicationinterface #diagnosticinterface #scantool #canbus #kwp2000 #saej1850 #iso9141 #surfaceMount #smd #qfn #electroniccomponent #semiconductor #vehicleelectronics #microcontrollerinterface #datalogging #fleetmanagement #embeddedhardware #hardwaredesign

Precision, 10-MHz, Low-Noise, Low-Power, RRIO, CMOS Operational Amplifier, SOIC-8 dual opamp SOIC*3.9x4.9mm*P1.27mm*

Hongfa Europe GMBH PCB Mount Power Relay, 5V dc Coil, 5A Switching Current, SPS The HF49FD/005-1H11TF is part of the Hongfa HF49FD series, which consists of compact, high-sensitivity power relays. It operates using a 5 V DC coil and provides electrical isolation between the control circuit and the load, allowing low-power signals (e.g., from a microcontroller) to switch higher voltages or currents. Key Characteristics Type: Electromagnetic relay (non-latching) Contact Configuration: SPST-NO (1 Form A, normally open) Coil Voltage: 5 V DC Switching Current: up to 5 A Switching Voltage: 250 VAC 30 VDC Mounting Type: Through-hole / PCB mount Size: ~20 × 5 × 12.5 mm (slim design) Coil Power Consumption: ~120 mW (low power) Dielectric Strength: up to 3 kV isolation Functional Overview Uses a coil + mechanical contacts: When 5 V is applied → coil energizes → contacts close When removed → contacts open Provides electrical isolation between: control side (low voltage) load side (higher voltage/current) #Relay

dsPIC dsPIC™ 33CK, Functional Safety (FuSa) Microcontroller IC 16-Bit 100MHz 256KB (256K x 8) FLASH 48-UQFN (6x6) 28/36/48/64/80-Pin Digital Signal Controllers with High-Resolution PWM and CAN Flexible Data (CAN FD) Operating Conditions • 3.0V to 3.6V, -40°C to +125°C, DC to 100 MIPS • 3.0V to 3.6V, -40°C to +150°C, DC to 70 MIPS Core: 16-Bit dsPIC33CK CPU • 32-256 Kbytes of Program Flash with ECC and 8-24K RAM • Fast 6-Cycle Divide • LiveUpdate • Code Efficient (C and Assembly) Architecture • 40-Bit Wide Accumulators • Single-Cycle (MAC/MPY) with Dual Data Fetch • Single-Cycle, Mixed-Sign MUL Plus Hardware Divide • 32-Bit Multiply Support • Four Sets of Interrupt Context Saving Registers which Include Accumulator and STATUS for Fast Interrupt Handling • Zero Overhead Looping • RAM Memory Built-In Self-Test (MBIST) Clock Management • Internal Oscillator • Programmable PLLs and Oscillator Clock Sources • Reference Clock Output • Fail-Safe Clock Monitor (FSCM) • Fast Wake-up and Start-up • Backup Internal Oscillator Power Management • Low-Power Management Modes (Sleep, Idle, Doze) • Integrated Power-on Reset and Brown-out Reset High-Speed PWM • Eight PWM Pairs • Up to 250 ps PWM Resolution • Dead Time for Rising and Falling Edges • Dead-Time Compensation • Clock Chopping for High-Frequency Operation • PWM Support for: - DC/DC, AC/DC, inverters, PFC, lighting - BLDC, PMSM, ACIM, SRM motors • Fault and Current Limit Inputs • Flexible Trigger Configuration for ADC Triggering Timers/Output Compare/Input Capture • One General Purpose Timer • Peripheral Trigger Generator (PTG): - Up to 15 trigger sources to other peripheral modules - CPU independent state machine-based instruction sequencer • Nine MCCP/SCCP modules which Include Timer, Capture/Compare and PWM: - One MCCP - Eight SCCPs - 16 or 32-bit time base - 16 or 32-bit capture - 4-deep capture buffer • Fully Asynchronous Operation, Available in Sleep Modes #CommonPartsLibrary #IntegratedCircuit #Microcontroller #DSPIC33CK256MP

16 Position Header Connector 0.100" (2.54mm) Through Hole, Right Angle Gold The PPPC082LJBN-RC is a dual-row, right-angle pin header connector intended for through-hole PCB mounting. It uses a standard 2.54 mm pitch with a 2×8 pin configuration and is commonly used for board-to-board or board-to-cable connections. The connector provides stable mechanical support and reliable electrical performance, making it suitable for prototyping, embedded systems, and general-purpose electronic designs. Mechanical Specifications Connector Type: Pin Header Mounting Type: Through-Hole, Right Angle Number of Positions: 16 (2×8) Pitch: 2.54 mm Row Spacing: 2.54 mm Contact Orientation: Right Angle Termination Style: Solder Housing Material: Thermoplastic (UL94V-0 rated) Contact Material: Brass Electrical Specifications Current Rating: Typically up to 3 A per contact Voltage Rating: Typically 250 V Contact Resistance: ≤ 20 mΩ Insulation Resistance: ≥ 1000 MΩ Dielectric Withstanding Voltage: ~500 VAC Environmental Specifications Operating Temperature Range: -40°C to +105°C Flammability Rating: UL94V-0 RoHS Compliance: Yes Plating Contact Plating: Gold flash over nickel (typical) Tail Plating: Tin over nickel Applications PCB interconnections Embedded systems and microcontroller boards Industrial control interfaces Consumer electronics prototyping Signal and low-power connections Mating Compatibility Compatible with standard 2.54 mm pitch female headers and IDC connectors #commonpartslibrary #connector #header