I reviewed the current part project for HF49FD/005-1H11TF, checked the existing project metadata, inspected the symbol terminals and footprint pads, and cross-checked them against the official Hongfa datasheet. For part-project verification, the datasheet should be treated as the source of truth and the terminal count/pin numbers should match it exactly
I did not update the Datasheet property because it was already set. The current value points to an official Hongfa page, so your “only if missing” condition was not triggered.
Official datasheet source I verified
From Hongfa’s official product page, the underlying datasheet PDF resolves to:
The footprint has 4 pads, which is consistent with the relay having 4 terminals.
What I could not fully verify
The datasheet shows two PCB layout variants:
Version 1:5.08 mm, 10.16 mm, 2.54 mm
Version 2:7.62 mm, 7.62 mm, 2.54 mm
The current footprint data exposed to me only shows pad names for COM, NO, COIL_1, and COIL_2. It did not expose enough geometric detail for me to confirm whether your footprint matches version 1 or version 2.
Footprint concern
Because the symbol pin numbers are currently wrong, the footprint pin mapping is also at risk even if the pad spacing is correct. The main issue is not the pad count; it is the terminal numbering/map.
Refine Part Type from generic Electromechanical Components to Relay
Add Package or Case Code
Add Max Current = 2 A
Add Operating Temperature = -40 C to +85 C
Optionally replace the current Datasheet URL with the direct official PDF URL for cleaner downstream extraction
Bottom line
Good: MPN, manufacturer, datasheet presence, designator prefix, and 4-terminal count are all basically aligned.
Bad: The symbol pin numbering is incorrect versus the datasheet, and all pin types/descriptions are still missing.
Unverified: I could not conclusively prove whether the footprint geometry matches datasheet layout version 1 or version 2 with the data exposed from the current layout.
If you want, I can fix the terminal numbering, pin types, pin descriptions, and tidy the missing project properties next.