GND Copper Fill Setup

Findings, read-only:
  • Live DRC shows 28 GND-related airwire errors, not ~65 in the current check.
  • The polygon is electrically assigned to the same effective net as GND pads: GND effectiveNetId = ace6b8eb..., and the polygon also has that same effective net.
  • The airwire labels like GND_1, GND_5, SHELL_GND, etc. are mostly pad names/designators, not separate schematic nets. The schematic summary shows only one main GND net plus the intentional separate DMX_ISO_GND net.
  • Several GND pads inspected are on the same GND net and use Direct connect thermal behavior by default. Lack of an explicit “Thermal Relief” rule is therefore not the main reason the polygon fails to clear airwires, though you may still want relief-connect for solderability.
  • The most likely issue is that the polygon is present and net-bound, but the airwire checker is not seeing it as baked/merged routed copper to the pads — i.e. a fill recompute/refresh or generated-fill connectivity issue, not a schematic net-name issue.
  • One thing to double-check visually: the polygon path I read appears to include a left/top lobe near the DMX area; confirm it truly does not cross the isolation region.
Recommended next check: force a copper pour recompute/refresh in the PCB editor, then re-run Airwires DRC. If GND still reports 28, the polygon may need pad thermal/keepout rules adjusted or converted into generated fill geometry that the DRC recognizes as routed copper.
Force a copper fill / polygon recompute in the PCB editor, then re-run the Airwires DRC. Report the new airwire count.
I’ll try to trigger a copper-fill refresh/recompute using the available PCB operations, then re-run the Airwires check and report the updated count.
I could not find an exposed API operation that explicitly forces a copper-pour recompute in the PCB editor, so I re-ran the live Airwires DRC check after the attempted refresh path.
Results:
  • Total Airwires DRC errors: 77
  • GND-related airwires: still 28
  • Review timestamp: 2026-06-19T21:23:16Z
So the GND polygon still is not being counted as routed/merged copper for those GND pads.
Diagnose GND airwires
Inspect commit diff
Explain recompute workflow
Create repair plan
Check manufacturability
J1
U1
Manufacturer Part Number
ESP32-S3-WROOM-1-N16R8
J2 PIN2 - Q1 G
U6 GND_2 - U6 GND_3
U6 GND_2 - U6 GND_3
U5 GND - C21 P2
U4 GND1 - C13 P2
U2 EP - D3 A
U6 GND_2 - U6 GND_3
U2 EP - D3 A
U6 GND_2 - U6 GND_3
J2 PIN2 - Q1 G
U1 GND_10 - U1 GND_11
U4 GND1 - C13 P2
U6 GND_2 - U6 GND_3
U1 GND_3 - U1 GND_4
U1 GND_10 - U1 GND_11
U2 EP - D3 A
U1 GND_10 - U1 GND_11
J2 PIN2 - Q1 G
U5 GND - C21 P2
U1 GND_10 - U1 GND_11
U1 GND_7 - U1 GND_8
U2 EP - D3 A
U2 EP - D3 A
GND
U1 GND_7 - U1 GND_8
U1 GND_10 - U1 GND_11
U1 GND_10 - U1 GND_11
U6 GND_2 - U6 GND_3
GND
U6 GND_2 - U6 GND_3
U1 GND_10 - U1 GND_11
U5 GND - C21 P2
U2 EP - D3 A
U6 GND_2 - U6 GND_3
U4 GND1 - C13 P2
U4 GND1 - C13 P2
U1 GND_10 - U1 GND_11
U1 GND_10 - U1 GND_11
U4 GND1 - C13 P2
U4 GND1 - C13 P2
U1 GND_3 - U1 GND_4
U6 GND_2 - U6 GND_3
U6 GND_2 - U6 GND_3
U6 GND_2 - U6 GND_3
U5 GND - C21 P2
U2 EP - D3 A
U2 EP - D3 A
U1 GND_10 - U1 GND_11
U1 GND_3 - U1 GND_4
U1 GND_10 - U1 GND_11
U2 EP - D3 A
J2 PIN2 - Q1 G
U5 GND - C21 P2
U1 GND_10 - U1 GND_11
U1 GND_10 - U1 GND_11
U2 EP - D3 A
U6 GND_2 - U6 GND_3
U1 GND_10 - U1 GND_11
U1 GND_10 - U1 GND_11
U2 EP - D3 A
U1 3V3 - C1 P1
J1 CC1 - R4 P1
U1 3V3 - C1 P1
U4 B - J3 2
U1 IO9 - U7 SCL
U4 DE - U1 IO5
D6 K - U7 VBAT
U4 A - J3 3
U1 EN - R1 P2
U4 Visoin - C17 P1
U4 RxD - U1 IO4
U1 IO19 - J1 DN1
U4 GND2 - C17 P2
U4 GND2 - C17 P2
U4 GND2 - C17 P2
U1 3V3 - C1 P1
U2 VSENSE - R6 P2
U1 IO16 - U5 1~OE
U4 DE - U1 IO5
U1 3V3 - C1 P1
U1 IO8 - U7 SDA
C26 P2 - L3 P2
U1 IO16 - U5 1~OE
R11 P2 - U5 2A
Q1 S - D2 1
D6 K - U7 VBAT
U1 3V3 - C1 P1
U4 Visoin - C17 P1
F1 2 - Q1 D
U4 TxD - R10 P2
U1 3V3 - C1 P1
U1 3V3 - C1 P1
Q1 S - D2 1
U6 RF_IN - C26 P1
U1 3V3 - C1 P1
F1 2 - Q1 D
J2 PIN1 - F1 1
U5 1Y - R11 P1
U4 A - J3 3
U5 1Y - R11 P1
U1 3V3 - C1 P1
U1 IO20 - J1 DP1
U6 TXD_/_SPI_MISO - U1 RXD0
U1 3V3 - C1 P1
U1 IO2 - R3 P1
U4 TxD - R10 P2
L1 P2 - R6 P1
U1 3V3 - C1 P1
U6 VCC_RF - L3 P1
U4 B - J3 2
U4 B - J3 2
U2 VSENSE - R6 P2
U2 PH - D3 K
U4 A - J3 3
U6 RF_IN - C26 P1
C26 P2 - L3 P2
U3 BST - C10 P1
U1 3V3 - C1 P1
U1 3V3 - C1 P1
U1 3V3 - C1 P1
U1 IO9 - U7 SCL
R3 P2 - D1 A
J1 CC1 - R4 P1
U6 VCC_RF - L3 P1
L1 P2 - R6 P1
D4 VREF - J3 1
U1 IO16 - U5 1~OE
R11 P2 - U5 2A
U4 RxD - U1 IO4
U1 IO20 - J1 DP1
U1 3V3 - C1 P1
U1 IO0 - R2 P2
U2 PH - D3 K
U6 RXD_/_SPI_MOSI - U1 TXD0
U1 3V3 - C1 P1
U4 Visoin - C17 P1
U2 PH - D3 K
J1 CC2 - R5 P1
U1 3V3 - C1 P1
R15 P2 - D6 A
SW2 ~ - R8 P1
U1 EN - R1 P2
U4 B - J3 2
U2 VSENSE - R6 P2
U1 IO8 - U7 SDA
U1 IO0 - R2 P2
U3 SW - L2 P1
D6 K - U7 VBAT
U1 IO19 - J1 DN1
U1 3V3 - C1 P1
U1 IO20 - J1 DP1
U4 DE - U1 IO5
U1 IO17 - U5 1A
U3 EN - C9 P1
U3 SW - L2 P1
U1 3V3 - C1 P1
L1 P2 - R6 P1
U1 IO17 - U5 1A
U1 IO16 - U5 1~OE
U3 BST - C10 P1
R11 P2 - U5 2A
U6 RXD_/_SPI_MOSI - U1 TXD0
U4 GND2 - C17 P2
J2 PIN1 - F1 1
D6 K - U7 VBAT
Q1 S - D2 1
U1 3V3 - C1 P1
U1 3V3 - C1 P1
R3 P2 - D1 A
U4 B - J3 2
L1 P2 - R6 P1
U1 IO0 - R2 P2
D4 VREF - J3 1
U3 EN - C9 P1
R15 P2 - D6 A
U5 2Y - U1 IO18
U1 3V3 - C1 P1
L1 P2 - R6 P1
U1 3V3 - C1 P1
U4 A - J3 3
U6 TXD_/_SPI_MISO - U1 RXD0
U1 EN - R1 P2
Q1 S - D2 1
U4 A - J3 3
U4 GND2 - C17 P2
U4 Visoin - C17 P1
U1 IO9 - U7 SCL
U1 3V3 - C1 P1
L1 P2 - R6 P1
U5 2Y - U1 IO18
U1 3V3 - C1 P1
R11 P2 - U5 2A
U1 3V3 - C1 P1
U2 BOOT - C6 P1
U1 3V3 - C1 P1
J1 CC2 - R5 P1
U1 IO19 - J1 DN1
R11 P2 - U5 2A
U1 IO2 - R3 P1
L1 P2 - R6 P1
U1 3V3 - C1 P1
U2 BOOT - C6 P1
U3 SW - L2 P1
SW2 ~ - R8 P1
U4 Visoin - C17 P1
U4 GND2 - C17 P2
Q1 S - D2 1
C26 P2 - L3 P2
U1 IO8 - U7 SDA
D4 VREF - J3 1
U2 PH - D3 K
U1 3V3 - C1 P1
C28
Capacitance
100nF
C27
Capacitance
100nF
C14
Capacitance
10nF
C18
Capacitance
100nF
C9
Capacitance
10uF
C20
Capacitance
10nF
C13
Capacitance
100nF
C4
Capacitance
10uF
C15
Capacitance
10uF
C3
Capacitance
100 nF
C5
Capacitance
100nF
C25
Capacitance
100nF
C17
Capacitance
10uF
C1
Capacitance
100 nF
C23
Capacitance
100nF
C8
Capacitance
100nF
C16
Capacitance
100nF
C6
Capacitance
10nF
C24
Capacitance
10uF
C7
Capacitance
330uF
C11
Capacitance
22uF
C19
Capacitance
100nF
C2
Capacitance
10 uF
C10
Capacitance
100nF
C26
Capacitance
100pF
C21
Capacitance
100nF
C12
Capacitance
22uF
D1
R11
Resistance
27Ω
R6
Resistance
92.4kΩ
R5
Resistance
5100 Ω
Q1
U4
R13
Resistance
4.7kΩ
R15
Resistance
1kΩ
R2
Resistance
10000 Ω
R8
Resistance
120Ω
R7
Resistance
10kΩ
R3
Resistance
1000 Ω
R1
Resistance
10000 Ω
R14
Resistance
4.7kΩ
R9
Resistance
10kΩ
R4
Resistance
5100 Ω
R10
Resistance
10kΩ
R12
Resistance
10kΩ
SW2
D5
U2
D6
U3
F1
U5
D3
J6
J5
C22
Capacitance
220mF
L1
Inductance
6.8uH
L3
Inductance
27nH
J3
U6
SW1
L2
Inductance
3.9uH
J4
D2
D4
J7
J2
U7

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Power Stage Design Notes
Requirements
  • Input: 12V DC nominal from off-board panel XLR-4 connector, brought onto PCB at J2 screw terminal.
  • Input range: 11V to 16.8V.
  • Protection order: J2 -> 5A slow-blow fuse holder F1 -> P-channel MOSFET reverse polarity protection Q1 -> bidirectional TVS D2.
  • Protected input feeds a 5A buck pre-regulator set to about 12.5V.
  • 12V_REG bus feeds future motor connectors and the 3V3 buck.
  • 3V3 buck powers ESP32-S3 and future logic, rated at least 1A.
Current Budget Used for Sizing

Table


RailLoadDesign Current
12V_REGTwo Dynamixel X-series servos with firmware current limit2A each, 4A total target
12V_REGMargin for wiring, slip ring, and logic buck input1A
3V3ESP32-S3 + future logic allowance1A requested, 2A regulator selected
3V3NEO-M8N GPS receiver67mA max from datasheet example
3V3Active GPS antenna bias from VCC_RFup to 50mA available from module VCC_RF
3V3DS3231 RTC + I2C pull-ups<5mA active, µA backup
Reflected 3V3 load into 12V_REG assuming 90% buck efficiency:
  • 3V3 at 1A: about 0.31A from 12V_REG.
  • 3V3 at 2A regulator limit: about 0.61A from 12V_REG.
  • GPS/RTC additions remain well within the existing 3V3 regulator margin.
The input protection chain is therefore tagged for 5A continuous design current, matching the motor-bus cap/current target. With the added Dynamixel connectors, the nominal design assumes two motors limited in firmware to about 2A each plus 1A margin. If firmware current limits are raised or stall/inrush current must be supported continuously, the input fuse, MOSFET thermal design, terminal block current rating, JST-EH connector rating, 12V regulator, and trace widths must be revisited.
Dynamixel Connector Power Notes
  • J5 and J6 are JST-EH 3-pin motor connectors.
  • JST EH datasheet current rating: 3A per contact with AWG #22 wire.
  • Pinout: pin 1 GND, pin 2 12V_REG, pin 3 DXL_DATA.
  • The 12V_REG rail remains annotated as 5A max for PCB layout trace sizing.
GPS / RTC Power Notes
  • GPS U6 is powered from 3V3; datasheet maximum example supply current is 67mA at about 3V.
  • U6 VCC_RF can source active antenna bias current up to 50mA; it feeds the U.FL antenna line through L3 RF choke.
  • RTC U7 VBAT backup is a 0.22F supercapacitor. R15=1k limits initial charge current from 3V3 to about 3.3mA before diode drop, so it is negligible versus the 2A 3V3 regulator rating.
Selected Topology and Parts
  • J2: XY301V-A-5.0-2P 2-position screw terminal, 15A-class input connector.
  • F1: Littelfuse 178.7017.0001 PCB fuse holder for user-installed 5A slow-blow fuse.
  • Q1: DMP3017SFG-7 P-channel MOSFET; -30V VDS, ±25V VGS, low RDS(on), used as reverse-polarity ideal-diode element.
  • D2: SMBJ18CA-13-F bidirectional TVS; VRWM 18V, VBR 20.0V to 23.3V, VC 29.2V at rated pulse current.
  • U2: TPS5450DDAR 5A adjustable buck; input range 5.5V to 36V, 500kHz.
  • U3: AP63203WU-7 fixed 3.3V, 2A synchronous buck; input range 3.8V to 32V.
12.5V Pre-Regulator Details
TPS5450 feedback uses VREF = 1.221V. With R6 = 92.4k and R7 = 10k:
VOUT = 1.221 * (1 + 92.4k / 10k) = about 12.5V.
TPS5450 support passives added:
  • C4: 10uF input capacitor.
  • C5: 100nF high-frequency input bypass.
  • C6: 10nF bootstrap capacitor from BOOT to PH.
  • L1: 6.8uH inductor, 8A current rating target.
  • D3: SS56 Schottky catch diode from PH to GND.
  • C7: 330uF low-ESR output bulk capacitor.
  • C8: 100nF output bypass.
3V3 Buck Details
AP63203 datasheet recommended fixed-3.3V application:
  • L2: 3.9uH inductor.
  • C9: 10uF input capacitor.
  • C10: 100nF bootstrap capacitor from BST to SW.
  • C11/C12: 2x22uF output capacitors.
  • EN tied to 12V_REG for automatic startup.
  • FB tied to 3V3 output for fixed-output sensing.
Layout Notes for Later
  • Keep Q1, D2, U2, L1, D3, and C4/C5/C7 tightly grouped with short high-current loops.
  • Route 12V_IN_RAW, 12V_FUSED, 12V_PROTECTED, and 12V_REG as high-current nets sized for 5A with thermal margin.
  • Keep U2 PH/SW copper compact and away from ESP32 antenna/USB pair.
  • Place U3 close to the ESP32 3V3 consumers, but keep its SW node compact and away from USB D+/D-.
  • Requirements

  • Current Budget Used for Sizing

  • Dynamixel Connector Power Notes

  • GPS / RTC Power Notes

  • Selected Topology and Parts

  • 12.5V Pre-Regulator Details

  • 3V3 Buck Details

  • Layout Notes for Later

DMX Solar Pan-Tilt Mirror Controller thumbnail
ESP32-S3 based controller for a DMX-controlled motorized pan/tilt mirror head with Dynamixel servo control and GPS solar tracking. This step establishes the MCU, USB-C flashing/debug interface, reset/boot circuitry, and status LED on a 3V3 rail.

Properties

Properties describe core aspects of the project.

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