GND Copper Fill Setup
Worked for 1 min 48 sec
Findings, read-only:
- Live DRC shows 28 GND-related airwire errors, not ~65 in the current check.
- The polygon is electrically assigned to the same effective net as GND pads: GND effectiveNetId =
ace6b8eb..., and the polygon also has that same effective net. - The airwire labels like
GND_1,GND_5,SHELL_GND, etc. are mostly pad names/designators, not separate schematic nets. The schematic summary shows only one main GND net plus the intentional separate DMX_ISO_GND net. - Several GND pads inspected are on the same GND net and use Direct connect thermal behavior by default. Lack of an explicit “Thermal Relief” rule is therefore not the main reason the polygon fails to clear airwires, though you may still want relief-connect for solderability.
- The most likely issue is that the polygon is present and net-bound, but the airwire checker is not seeing it as baked/merged routed copper to the pads — i.e. a fill recompute/refresh or generated-fill connectivity issue, not a schematic net-name issue.
- One thing to double-check visually: the polygon path I read appears to include a left/top lobe near the DMX area; confirm it truly does not cross the isolation region.
Recommended next check: force a copper pour recompute/refresh in the PCB editor, then re-run Airwires DRC. If GND still reports 28, the polygon may need pad thermal/keepout rules adjusted or converted into generated fill geometry that the DRC recognizes as routed copper.
Thought for 7 sec
I’ll try to trigger a copper-fill refresh/recompute using the available PCB operations, then re-run the Airwires check and report the updated count.
Worked for 1 min 23 sec
I could not find an exposed API operation that explicitly forces a copper-pour recompute in the PCB editor, so I re-ran the live Airwires DRC check after the attempted refresh path.
Results:
- Total Airwires DRC errors: 77
- GND-related airwires: still 28
- Review timestamp: 2026-06-19T21:23:16Z
So the GND polygon still is not being counted as routed/merged copper for those GND pads.
Diagnose GND airwires
Inspect commit diff
Explain recompute workflow
Create repair plan
Check manufacturability
