ESP32 LCSC Part Verification

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Verification was limited because the active project data/index exposes only two properties: the Espressif ESP32-S3 datasheet URL and Symbol Style: parametric-v1. I could not retrieve an actual symbol terminal list, footprint pad list, pad mapping, BOM entry, or project-level LCSC/MPN metadata from the project, and the automated review endpoint reported the project as unavailable.
Issues found / recommended fixes:
  1. Missing part metadata
    • Expected LCSC part appears to be C2913192.
    • Expected MPN: ESP32-S3
    • Expected manufacturer: Espressif Systems / ESPRESSIF
    • Expected package: QFN-56-EP(7x7)
    • Add these explicitly to the part project metadata.
  2. Footprint/pad mapping must be verified or added
    • Datasheet package is QFN56, 7 mm × 7 mm, 56 perimeter pins plus exposed pad.
    • Exposed pad must be pad 57 = GND.
    • Confirm the footprint has pads 1–56 plus 57, not just 56 pads.
    • Confirm EPAD dimensions match the base ESP32-S3, not the special ESP32-S3FH4R2 variant, which has a different/larger EPAD.
  3. Pin mapping correction to use
    • Critical datasheet mapping around pins 43–57 is:
      • 43 VDDA
      • 44 GPIO38
      • 45 MTCK
      • 46 MTDO
      • 47 VDD3P3_CPU
      • 48 MTDI
      • 49 MTMS
      • 50 U0TXD
      • 51 U0RXD
      • 52 GPIO45
      • 53 GPIO46
      • 54 XTAL_N
      • 55 XTAL_P
      • 56 VDDA
      • 57 GND / exposed pad
    • If the project symbol has GPIO38 at pin 43 or shifts MTCK/MTDO/VDD3P3_CPU one pin early, that is incorrect.
  4. Electrical metadata to add/check
    • Supply voltage recommended range: 3.0 V to 3.6 V, typical 3.3 V.
    • Absolute max supply should not exceed 3.6 V.
    • Mark power pins correctly: VDD3P3, VDD3P3_RTC, VDD3P3_CPU, VDDA, VDD_SPI, and EPAD GND.
    • Strapping pins should be documented: GPIO0, GPIO3, GPIO45, GPIO46.
    • GPIO45 controls VDD_SPI voltage and should not be casually used without noting boot implications.
  5. Documentation gaps
    • Add a short part note stating this is the bare ESP32-S3 SoC, not an ESP32-S3 module.
    • Add a warning that RF matching, crystal, flash/PSRAM usage, boot strapping, decoupling, and antenna/RF layout are design-critical for the bare chip.
    • Add the LCSC URL/reference for C2913192.
Bottom line: the public datasheet/LCSC identity is clear, but the project appears incomplete or not fully indexed. The highest-priority fix is to add/verify the full 57-pad QFN footprint and exact datasheet pin mapping, especially pins 43–57 and exposed pad 57 = GND.
Fix metadata issues
Verify pin mapping
Check footprint pads
Use LCSC reference
Run part review
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ESP32-S3R8

ESP32-S3R8 thumbnail
IC RF TxRx + MCU Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 2.412GHz ~ 2.484GHz 56-VFQFN Exposed Pad
The ESP32-S3R8 is a high-performance wireless microcontroller system-on-chip manufactured by Espressif Systems. This device integrates dual-core processing, Wi-Fi connectivity, Bluetooth Low Energy communication, embedded memory resources, and advanced peripheral interfaces within a compact package optimized for embedded and IoT applications.
The microcontroller is based on the Xtensa LX7 architecture and is designed to support edge computing, wireless communication, human-machine interfaces, audio processing, AI acceleration, and low-power connected systems. The ESP32-S3R8 includes integrated flash and RAM resources, advanced security functions, vector instruction acceleration, and extensive GPIO/peripheral capability for modern embedded development.
The device is widely used in IoT devices, industrial automation systems, smart home equipment, wearable electronics, wireless sensor nodes, edge AI applications, USB-enabled embedded systems, and portable consumer electronics. Its integrated wireless functionality and high processing performance reduce external component count while simplifying system-level design for connected embedded platforms.
Engineering Specification Device Type
Wireless microcontroller system-on-chip
Processor Architecture
Dual-core Xtensa LX7 microcontroller architecture
Wireless Connectivity
Integrated Wi-Fi and Bluetooth Low Energy communication
Processing Features
High-performance embedded processing with vector instruction acceleration
Memory Resources
Integrated RAM and embedded memory architecture
Communication Interfaces
SPI I2C UART I2S USB PWM ADC GPIO interfaces
Wireless Features
Secure wireless networking and low-power communication support
USB Capability
Integrated USB communication and device functionality
AI and DSP Features
Vector instruction support for AI and digital signal processing workloads
Security Features
Hardware encryption and secure boot support
Power Characteristics
Low-power operating modes for battery-powered systems
Package Type
QFN surface-mount package
Mounting Style
Surface mount technology
Applications
IoT devices Wireless embedded systems Industrial automation Smart home electronics Edge AI applications Wearable devices Consumer electronics USB-enabled systems Sensor networks Embedded communication platforms
Manufacturer
Espressif Systems
#commonpartslibrary #esp32 #esp32s3 #wirelessmcu #microcontroller #iot #embeddedhardware #wifi #bluetoothlowenergy #espressif #surfaceountcomponents #electronicsdesign #edgeai #wirelesscommunication #consumerelectronics

Properties

ESPRESSIF(乐鑫)

U

ESP32-S3R8

C2913194

QFN-56_L7.0-W7.0-P0.40-TL-EP4.0

RF Transceiver ICs

Extended Part

2412MHz ~ 2484MHz

Hz

3V~3.6V

V

-40℃~+65℃

espressif.com/sites/default/files/documentation/esp32-s3_datasheet_en.pdf

parametric-v1

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